ISP1104WTM - ST-Ericsson - Product.Network

ISP1104

Advanced Universal Serial Bus transceiver

Rev. 02 — 14 October 2003 Product data

1. General description

The ISP1104 Universal Serial Bus (USB) transceiver is compliant with the

Universal

Serial Bus Speciﬁcation Rev. 2.0

. The ISP1104 can transmit and receive USB data at

full-speed (12 Mbit/s). It allows single and differential input modes selectable by a

MODE input.

It allows USB Application Speciﬁc Integrated Circuits (ASICs) and Programmable

Logic Devices (PLDs) with power supply voltages from 1.65 V to 3.6 V to interface

with the physical layer of the USB. It has an integrated 5 V-to-3.3 V voltage regulator

for direct powering via the USB supply line VBUS. It has an integrated voltage detector

to detect the presence of the VBUS line voltage (VCC(5.0)). When VBUS (VCC(5.0)) is lost,

the D+ and D− pins can be shared with other serial protocols.

The ISP1104 is available in HBCC16 package.

The ISP1104 is ideal for use in portable electronic devices, such as mobile phones,

digital still cameras, personal digital assistants and information appliances.

2. Features

■Complies with

Universal Serial Bus Speciﬁcation Rev. 2.0

■Supports full-speed (12 Mbit/s) serial data rate

■Integrated 5 V-to-3.3 V voltage regulator for powering via USB line VBUS

■VBUS voltage presence indication on pin VBUSDET

■Used as USB device transceiver or USB transceiver

■Stable RCV output during single-ended zero (SE0) condition

■Two single-ended receivers with hysteresis

■Low-power operation

■Supports I/O voltage range from 1.65 V to 3.6 V

■±12 kV ESD protection at pins D+, D-, VCC(5.0) and GND

■Full industrial operating temperature range from −40 °Cto+85 °C

■Available in HBCC16 lead-free and halogen-free package.

3. Applications

■Portable electronic devices, such as:

◆Mobile phone

◆Digital Still Camera (DSC)

◆Personal Digital Assistant (PDA)

◆Information Appliance (IA).

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 2 of 19

4. Ordering information

5. Block diagram

Table 1: Ordering information

Type

number Package

Name Description Version

ISP1104W HBCC16 plastic thermal enhanced bottom chip carrier;

16 terminals; body 3 ×3×0.65 mm SOT639-2

(1) Pin function depends on the device function, see Section 7.2.

Fig 1. Block diagram.

004aaa035

VCC(I/O) VCC(5.0)

VOLTAGE

REGULATOR

3.3 V

1.5 kΩ

33 Ω

(1%)

33 Ω

(1%)

LEVEL

SHIFTER

ISP1104

SOFTCON

MODE

Vreg(3.3)

GND

Vpu(3.3)

D+

D−

VMO/FSE0

(1)

VPO/VO

(1)

SUSPND

RCV

VBUSDET

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 3 of 19

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pin conﬁguration HBCC16.

004aaa036

Bottom view

ISP1104W

SOFTCON

Vpu(3.3)

RCV

D+

D−

VCC(I/O)

VPO/VO

SUSPND

MODE

VCC(5.0)

Vreg(3.3)

VMO/FSE0

141516

876

GND

(exposed diepad)

VBUSDET

Table 2: Pin description

Symbol[1] Pin Type Description

OE 1 I input for output enable (CMOS level with respect to

VCC(I/O), active LOW); enables the transceiver to transmit

data on the USB bus

input pad; push pull; CMOS

RCV 2 O differential data receiver output (CMOS level with respect

to VCC(I/O)); driven LOW when input SUSPND is HIGH;

the output state of RCV is preserved and stable during an

SE0 condition

output pad; push pull; 4 mA output drive; CMOS

VP 3 O single-ended D+ receiver output (CMOS level with

respect to VCC(I/O)); for external detection of SE0, error

conditions and speed of connected device; driven HIGH

when no supply voltage is connected to VCC(5.0) and

Vreg(3.3)

output pad; push pull; 4 mA output drive; CMOS

VM 4 O single-ended D− receiver output (CMOS level with

respect to VCC(I/O)); for external detection of SE0, error

conditions and speed of connected device; driven HIGH

when no supply voltage is connected to VCC(5.0) and

Vreg(3.3)

output pad; push pull; 4 mA output drive; CMOS

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 4 of 19

[1] Symbol names with an overscore (for example, NAME) indicate active LOW signals.

SUSPND 5 I suspend input (CMOS level with respect to VCC(I/O)); a

HIGH level enables low-power state while the USB bus is

inactive and drives output RCV to a LOW level

input pad; push pull; CMOS

MODE 6 I mode input (CMOS level with respect to VCC(I/O)); a HIGH

level enables the differential input mode (pins VPO and

VMO) whereas a LOW level enables a single-ended input

mode (pins VO and FSE0); see Table 4 and Table 5

input pad; push pull; CMOS

VCC(I/O) 7 - supply voltage for digital I/O pins (1.65 V to 3.6 V); when

VCC(I/O) is not connected, the pins D+ and D− are in

three-state; this supply pin is totally independent of

VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)

voltage

VBUSDET 8 O VBUS indicator output (CMOS level with respect to

VCC(I/O)); when VBUS > 4.1 V, then VBUSDET = HIGH and

when VBUS < 3.6 V, then VBUSDET = LOW

output pad; push pull; 4 mA output drive; CMOS

D−9 AI/O negative USB data bus connection (analog, differential)

D+10 AI/O positive USB data bus connection (analog, differential);

connect a 1.5 kΩ resistor to pin Vpu(3.3)

VPO/VO 11 I driver data input (CMOS level with respect to VCC(I/O),

Schmitt trigger); see Table 4 and Table 5

input pad; push pull; CMOS

VMO/FSE0 12 I driver data input (CMOS level with respect to VCC(I/O),

Schmitt trigger); see Table 4 and Table 5

input pad; push pull; CMOS

Vreg(3.3) 13 - regulated supply voltage output (3.0 V to 3.6 V); a

decoupling capacitor of at least 0.1 µF is required

VCC(5.0) 14 - supply voltage input (4.0 V to 5.5 V); can be connected

directly to the USB supply line VBUS

Vpu(3.3) 15 - pull-up supply voltage (3.3 V ±10 %); connect an external

1.5 kΩ resistor on pin D+ (full-speed); pin function is

controlled by input SOFTCON

SOFTCON = LOW — Vpu(3.3) ﬂoating (high impedance);

ensures zero pull-up current

SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally

connected to Vreg(3.3)

SOFTCON 16 I software controlled USB connection input; a HIGH level

applies 3.3 V to pin Vpu(3.3), which is connected to an

external 1.5 kΩ pull-up resistor; this allows USB connect

or disconnect signalling to be controlled by software

input pad; push pull; CMOS

GND exposed

die pad - ground supply; down bonded to the exposed die pad

(heatsink); to be connected to the PCB ground

Table 2: Pin description

…continued

Symbol[1] Pin Type Description

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 5 of 19

7. Functional description

7.1 Function selection

[1] Signal levels on pins D+ and D− are determined by other USB devices and external pull-up or

pull-down resistors.

[2] In the suspend mode (pin SUSPND = HIGH), the differential receiver is inactive and the output RCV is

always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP and VM.

7.2 Operating functions

[1] VP = VM = H indicates the sharing mode (VCC(5.0) is disconnected).

[2] RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable

during the SE0 period.

Table 3: Function table

SUSPND OE D+ and D−RCV VP/VM Function

L L driving/

receiving active active normal driving

(differential receiver active)

L H receiving[1] active active receiving

H L driving inactive[2] active driving during ‘suspend’

(differential receiver inactive)

H H high-Z[1] inactive[2] active low-power state

Table 4: Driving function using single-ended input data interface (pin OE = L and

pin MODE = L)

FSE0 VO Data

L L differential logic 0

L H differential logic 1

H L SE0

H H SE0

Table 5: Driving function using differential input data interface (pin OE = L and

pin MODE = H)

VMO VPO Data

L L SE0

L H differential logic 1

H L differential logic 0

H H illegal state

Table 6: Receiving function (pin OE=H)

D+ and D−RCV VP[1] VM[1]

differential logic 0 L L H

differential logic 1 H H L

SE0 RCV*[2] LL

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 6 of 19

7.3 Power supply conﬁgurations

The ISP1104 can be used with different power supply conﬁgurations, which can be

changed dynamically. Table 8 provides an overview of power supply conﬁgurations.

Normal mode — Both VCC(I/O) and VCC(5.0) are connected. For 5 V operation,

VCC(5.0) is connected to a 5 V source (4.0 V to 5.5 V). The internal voltage regulator

then produces 3.3 V for USB connections. VCC(I/O) is independently connected to a

voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external

circuit.

Disable mode — VCC(I/O) is not connected and VCC(5.0) is connected. In this mode,

the internal circuits of the ISP1104 ensure that the D+ and D− pins are in three-state

and the power consumption drops to the low-power (suspended) state level. Some

hysteresis is built into the detection of VCC(I/O) lost.

Sharing mode — VCC(I/O) is connected and VCC(5.0) < 3.6 V to differentiate between

the USB mode and other modes when sharing the VBUS. In this mode, pins D+ and

D− are made three-state and the ISP1104 allows external signals of up to 3.6 V to

share the D+and D− lines. The internal circuits of the ISP1104 ensure that virtually

no current (maximum 10 µA) is drawn via the D+and D− lines. The power

consumption through pin VCC(I/O) and pin VCC(5.0) drops to the low-power (suspended)

state level. Pins VP and VM are driven HIGH and pins VBUSDET and RCV are driven

LOW to indicate this mode. Some hysteresis is built into the detection of VCC(5.0) lost.

[1] High impedance or driven LOW.

[2] Vreg(3.3) may not be operational.

Table 7: Pin states in disable or sharing mode

Pin Disable mode Sharing mode

VCC(5.0) 5 V input <3.6 V

Vreg(3.3) 3.3 V output pulled-down

VCC(I/O) not present 1.65 V to 3.6 V input

Vpu(3.3) high impedance (off) high impedance (off)

D+, D−high impedance high impedance

VP, VM invalid[1] H

RCV invalid[1] L

VBUSDET invalid[1] L

VPO/VO, VMO/FSE0, MODE,

SUSPND, OE, SOFTCON high impedance high impedance

Table 8: Power supply conﬁguration overview

VCC(5.0) VCC(I/O) Conﬁguration Special characteristics

connected connected normal mode -

connected not connected disable mode D+, D− and Vpu(3.3) high impedance;

VP, VM, RCV: invalid[1][2]

not connected

or <3.6 V connected sharing mode D+, D− and Vpu(3.3) high impedance;

VP, VM driven HIGH; RCV driven

LOW; VBUSDET driven LOW; Vreg(3.3)

pulled-down

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 7 of 19

8. Electrostatic discharge (ESD)

8.1 ESD protection

The pins that are connected to the USB connector (D+, D−,V

CC(5.0) and GND) have a

minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test

equipment. Capacitors of 4.7 µF connected from Vreg(3.3) to GND and VCC(5.0) to GND

are required to achieve this ±12 kV ESD protection (see Figure 3).

The ISP1104 can withstand ±12 kV using the Human Body Model and ±5 kV using

the Contact Discharge Method as speciﬁed in

IEC 61000-4-2

8.2 ESD test conditions

A detailed report on test set-up and results is available on request.

Fig 3. Human Body ESD test model.

1 MΩ1500 Ω

HIGH VOLTAGE

DC SOURCE

4.7 µF

RCRD

VCC(5.0)

Vreg(3.3)

DEVICE UNDER

TEST

100 pF storage

capacitor

charge current

limit resistor discharge

resistance

GND

004aaa145

Philips Semiconductors ISP1104
Advanced USB transceiver
Product data Rev. 02 — 14 October 2003 8 of 19
9397 750 11229 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9. Limiting values
[1] Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3) (see Section 8).
[2] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
10. Recommended operating conditions
11. Static characteristics
Table 9: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC(5.0) supply voltage −0.5 +6.0 V
VCC(I/O) I/O supply voltage −0.5 +4.6 V
VIDC input voltage −0.5 VCC(I/O) + 0.5 V
Ilu latch-up current VI=−1.8 V to +5.4 V - 100 mA
Vesd electrostatic discharge voltage on pins D+,D−,V
CC(5.0)
and GND; ILI <1µA[1][2] −12000 +12000 V
on other pins; ILI <1µA−2000 +2000 V
Tstg storage temperature −40 +125 °C
Table 10: Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC(5.0) supply voltage 4.0 5.0 5.5 V
VCC(I/O) I/O supply voltage 1.65 - 3.6 V
VIinput voltage 0 - VCC(I/O) V
VI(AI/O) input voltage on AI/O pins pins D+ and D−0 - 3.6 V
Tamb ambient temperature −40 - +85 °C
Table 11: Static characteristics: supply pins
V
CC(5.0)
= 4.0 V to 5.5 V; V
CC(I/O)
= 1.65 V to 3.6 V; V
GND
=0V; T
amb
=
−
40
°
Cto
+
85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Vreg(3.3) regulated supply voltage output internal regulator option;
Iload ≤300 µA[1][2] 3.0 3.3 3.6 V
ICC operating supply current transmitting and receiving at
12 Mbit/s; CL= 50 pF on
pins D+ and D−
[3] -48mA
ICC(I/O) operating I/O supply current transmitting and receiving at
12 Mbit/s [3] -12mA
ICC(idle) supply current during full-speed
idle and SE0 idle: VD+> 2.7 V, VD−< 0.3 V;
SE0: VD+< 0.3 V, VD−< 0.3 V [4] - - 500 µA
ICC(I/O)(static) static I/O supply current idle, SE0 or suspend - - 20 µA
ICC(susp) suspend supply current SUSPND = H [4] - - 100 µA
ICC-I/O(dis) disable current from VCC to
VCC(I/O)
VCC(I/O) not connected [4] - - 100 µA
ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) not connected - - 20 µA

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 9 of 19

[1] Iload includes the pull-up resistor current via pin Vpu(3.3).

[2] The minimum voltage is 2.7 V in the suspend mode.

[3] Characterized only, not tested in production.

[4] Excluding any load current and Vpu(3.3) or Vsw source current to the 1.5 kΩ and 15 kΩpull-up and pull-down resistors (200 µA typ.).

IDx(sharing) sharing mode load current on

pins D+ and D−VCC(5.0) not connected;

SOFTCON = L; VDx = 3.6 V -- 10µA

VCC(5.0)th supply voltage detection

threshold 1.65 V ≤VCC(I/O) ≤3.6 V

supply lost - - 3.6 V

supply present 4.1 - - V

VCC(5.0)hys supply voltage detection

hysteresis VCC(I/O) = 1.8 V - 70 - mV

VCC(I/O)th I/O supply voltage detection

threshold Vreg(3.3) = 2.7 V to 3.6 V

supply lost - - 0.5 V

supply present 1.4 - - V

VCC(I/O)hys I/O supply voltage detection

hysteresis Vreg(3.3) = 3.3 V - 0.45 - V

Table 11: Static characteristics: supply pins

…continued

CC(5.0)

= 4.0 V to 5.5 V; V

CC(I/O)

= 1.65 V to 3.6 V; V

GND

=0V; T

amb

−

Cto

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 12: Static characteristics: digital pins

CC(I/O)

= 1.65 V to 3.6 V; V

GND

=0V; T

amb

−

Cto

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCC(I/O) = 1.65 V to 3.6 V

Input levels

VIL LOW-level input voltage - - 0.3VCC(I/O) V

VIH HIGH-level input voltage 0.6VCC(I/O) -- V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µAV

CC(I/O) −0.15 - - V

IOH = 2 mA VCC(I/O) −0.4 - - V

Leakage current

ILI input leakage current [1] −1-+1µA

Capacitance

CIN input capacitance pin to GND - - 10 pF

Example 1: VCC(I/O) = 1.8 V ±0.15 V

Input levels

VIL LOW-level input voltage - - 0.5 V

VIH HIGH-level input voltage 1.2 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 10 of 19

[1] If VCC(I/O) ≥Vreg(3.3), then the leakage current will be higher than the speciﬁed value.

VOH HIGH-level output voltage IOH = 100 µA 1.5 - - V

IOH = 2 mA 1.25 - - V

Example 2: VCC(I/O) = 2.5 V ±0.2 V

Input levels

VIL LOW-level input voltage - - 0.7 V

VIH HIGH-level input voltage 1.7 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 2.15 - - V

IOH = 2 mA 1.9 - - V

Example 3: VCC(I/O) = 3.3 V ±0.3 V

Input levels

VIL LOW-level input voltage - - 0.9 V

VIH HIGH-level input voltage 2.15 - - V

Output levels

VOL LOW-level output voltage IOL = 100 µA - - 0.15 V

IOL = 2 mA - - 0.4 V

VOH HIGH-level output voltage IOH = 100 µA 2.85 - - V

IOH = 2 mA 2.6 - - V

Table 12: Static characteristics: digital pins

…continued

CC(I/O)

= 1.65 V to 3.6 V; V

GND

=0V; T

amb

−

Cto

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 13: Static characteristics: analog I/O pins D+ and D−

CC(5.0)

= 4.0 V to 5.5 V; V

GND

=0V; T

amb

−

Cto

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Input levels

Differential receiver

VDI differential input sensitivity |VI(D+)−VI(D−)|0.2 - - V

VCM differential common mode

voltage includes VDI range 0.8 - 2.5 V

Single-ended receiver

VIL LOW-level input voltage - - 0.8 V

VIH HIGH-level input voltage 2.0 - - V

Vhys hysteresis voltage 0.4 - 0.7 V

Output levels

VOL LOW-level output voltage RL= 1.5 kΩ to +3.6 V - - 0.3 V

VOH HIGH-level output voltage RL=15kΩ to GND [1] 2.8 - 3.6 V

Leakage current

ILZ OFF-state leakage current −1- +1µA

Philips Semiconductors ISP1104
Advanced USB transceiver
Product data Rev. 02 — 14 October 2003 11 of 19
9397 750 11229 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[1] VOH(min) =V
reg(3.3) −0.2 V.
[2] Includes external resistors of 33 Ω±1 % on both pins D+ and D−.
[3] This voltage is available at pins Vreg(3.3) and Vpu(3.3).
[4] The minimum voltage is 2.7 V in the suspend mode.
12. Dynamic characteristics
Capacitance
CIN transceiver capacitance pin to GND - - 20 pF
Resistance
ZDRV driver output impedance steady-state drive [2] 34 39 44 Ω
ZINP input impedance 10 - - MΩ
RSW internal switch resistance at
pin Vpu(3.3)
--10Ω
Termination
VTERM termination voltage for
upstream port pull-up (Rpu)[3][4] 3.0 - 3.6 V
Table 13: Static characteristics: analog I/O pins D+ and D−
…continued
V
CC(5.0)
= 4.0 V to 5.5 V; V
GND
=0V; T
amb
=
−
40
°
Cto
+
85
°
C; unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Table 14: Dynamic characteristics: analog I/O pins D+ and D−
V
CC(5.0)
= 4.0 V to 5.5 V; V
CC(I/O)
= 1.65 V to 3.6 V; V
GND
=0V; T
amb
=
−
40
°
Cto
+
85
°
C; see Figure 8; unless otherwise
speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Driver characteristics
tFR rise time CL= 50 pF to 125 pF;
10%to90%of|VOH −VOL|;
see Figure 4
4 - 20 ns
tFF fall time CL= 50 pF to 125 pF;
90%to10%of|VOH −VOL|;
see Figure 4
4 - 20 ns
FRFM differential rise/fall time
matching (tFR/tFF)excluding the ﬁrst transition
from idle state 90 - 111.1 %
VCRS output signal crossover
voltage excluding the ﬁrst transition
from idle state; see Figure 5 [1] 1.3 - 2.0 V
Driver timing
tPLH(drv) driver propagation delay
(VPO/VO, VMO/FSE0 to
D+,D−)
LOW-to-HIGH; see Figure 5 --18ns
tPHL(drv) driver propagation delay
(VPO/VO, VMO/FSE0 to
D+,D−)
HIGH-to-LOW; see Figure 5 --18ns
tPHZ driver disable delay (OE to
D+, D−)HIGH-to-OFF; see Figure 6 --15ns
tPLZ driver disable delay
(OE to D+, D−)LOW-to-OFF; see Figure 6 --15ns

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 12 of 19

[1] Characterized only, not tested. Limits guaranteed by design.

tPZH driver enable delay

(OE to D+, D−)OFF-to-HIGH; see Figure 6 --15ns

tPZL driver enable delay

(OE to D+,D−)OFF-to-LOW; see Figure 6 --15ns

Receiver timings

Differential receiver

tPLH(rcv) propagation delay

(D+,D−to RCV) LOW-to-HIGH; see Figure 7 --15ns

tPHL(rcv) propagation delay

(D+,D−to RCV) HIGH-to-LOW; see Figure 7 --15ns

Single-ended receiver

tPLH(se) propagation delay

(D+,D−to VP, VM) LOW-to-HIGH; see Figure 7 --18ns

tPHL(se) propagation delay

(D+,D−to VP, VM) HIGH-to-LOW; see Figure 7 --18ns

Table 14: Dynamic characteristics: analog I/O pins D+ and D−

…continued

CC(5.0)

= 4.0 V to 5.5 V; V

CC(I/O)

= 1.65 V to 3.6 V; V

GND

=0V; T

amb

−

Cto

C; see Figure 8; unless otherwise

speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Fig 4. Rise and fall times. Fig 5. Timing of VPO/VO and VMO/FSE0 to D+ and D−.

Fig 6. Timing of OE to D+ and D−. Fig 7. Timing of D+ and D− to RCV, VP and VM.

MGS963

VOL

tFR, tLR tFF, tLF

VOH 90 %

10 % 10 %

90 %

MGS964

VOL

VOH

tPHL(drv)

tPLH(drv)

VCRS VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS966

VOL

VOH

tPZH

tPZL tPHZ

tPLZ

VOH −0.3 V

VOL +0.3 V

VCRS

0.9 V

1.65 V

0 V

logic input

differential

data lines

MGS965

VOL

VOH

tPHL(rcv)

tPHL(se)

tPLH(rcv)

tPLH(se)

VCRS VCRS

0.9 V

2.0 V

0.8 V

logic output

differential

data lines

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 13 of 19

13. Test information

Load capacitance CL= 50 pF (minimum or maximum timing).

Fig 8. Load on pins D+ and D−.

V = 0 V for tPZH and tPHZ.

V=V

reg(3.3) for tPZL and tPLZ.

Fig 9. Load on pins D+ and D− for enable and disable times.

Fig 10. Load on pins VM, VP and RCV.

004aaa037

test point

15 kΩ

D+/D−

Vpu(3.3)

1.5 kΩ

33 Ω

D.U.T.

test point

33 Ω

D.U.T. 500 Ω

50 pF

MBL142

MGS968

25 pF

test point

D.U.T.

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 14 of 19

14. Package outline

Fig 11. HBCC16 package outline.

2.5

UNIT DEhe1

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

01-11-13

03-03-12

IEC JEDEC JEITA

mm 0.8 0.10

0.05 0.7

0.6 3.1

2.9 1.45

1.35

3.1

2.9

1.45

1.35

0.33

0.27

DIMENSIONS (mm are the original dimensions)

SOT639-2 MO-217

0.33

0.27

0.38

0.32

0.38

0.32

2.45

0.23

0.17

0.5

we yy

0.1 0.05 0.2

2.5

2.45

0.08

0 2.5 5 mm

scale

SOT639-2

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

max.

detail X

y1C

113

1/2 e3

1/2 e4

terminal 1

index area

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 15 of 19

15. Packaging

The ISP1104W (HBCC16 package) is delivered on a type A carrier tape, see

Figure 12. The tape dimensions are given in Table 15.

The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not

designed for use in a baking process.

The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber

must not exceed 1 mm in 100 mm.

Fig 12. Carrier tape dimensions.

Table 15: Type A carrier tape dimensions for the ISP1104W

Dimension Value Unit

A0 3.3 mm

B0 3.3 mm

K0 1.1 mm

P1 8.0 mm

W 12.0 ±0.3 mm

dth

MLC338

Type B

Type A

4K0

elongated

sprocket hole

direction of feed

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 16 of 19

16. Additional soldering information

16.1 (H)BCC packages: footprint

The surface material of the terminals on the resin protrusion consists of a 4-layer

metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures

solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top

(0.5 µm min.) ensures effective wire bonding.

16.2 (H)BCC packages: reﬂow soldering proﬁle

The conditions for reﬂow soldering of (H)BCC packages are as follows:

•Preheating time: minimum 90 s at T = 145 to 155 °C

•Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C

•Peak temperature:

–Ambient temperature: Tamb(max) = 260 °C

–Device surface temperature: Tcase(max) = 255 °C.

Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages.

Fig 13. (H)BCC footprint and solder resist mask dimensions.

004aaa123

0.05

All dimensions in mm

For exact dimensions

see package outline

drawing (SOT639-2)

Normal

Terminal PCB land Solder resist mask Stencil mask

Solder land

Corner

0.05

0.1

(4×)

0.3 (8×)

0.05

Solder resist

Solder stencil

Stencil print thickness:

0.1 to 0.12 mm

Cavity

0.05

Philips Semiconductors ISP1104
Advanced USB transceiver
Product data Rev. 02 — 14 October 2003 17 of 19
9397 750 11229 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
17. Revision history
Table 16: Revision history
Rev Date CPCN Description
02 20031014 - Product data (9397 750 11229)
Modiﬁcations:
•Changed USB 1.1 reference to USB 2.0; also added data transfer rates
•Section 2: updated
•Figure 1,Figure 8 and Figure 9: removed the ﬁgure note on 33 Ω
•Table 2: updated the description for pin 8; added pad details
•Section 7.3 sharing mode: updated the ﬁrst sentence
•Table 8: updated
•Table 9: added a table note
•Table 11: changed ICC(dis) to ICC-I/O(dis); also, changed the description
•Table 13: removed ZDRV2, and also the relevant (old) table note 3.
01 20020826 - Product data (9397 750 09784)

9397 750 11229

Philips Semiconductors ISP1104

Advanced USB transceiver

Product data Rev. 02 — 14 October 2003 18 of 19

Contact information

For additional information, please visit http://www.semiconductors.philips.com.

For sales ofﬁce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.Fax: +31 40 27 24825

18. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

19. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

licence or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Level Data sheet status[1] Product status[2][3] Deﬁnition

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 October 2003 Document order number: 9397 750 11229
Contents
Philips Semiconductors ISP1104
Advanced USB transceiver
General description. . . . . . . . . . . . . . . . . . . . . .  1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Ordering information. . . . . . . . . . . . . . . . . . . . .  2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .  2
Pinning information. . . . . . . . . . . . . . . . . . . . . .  3
1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  3
Functional description  . . . . . . . . . . . . . . . . . . .  5
1 Function selection. . . . . . . . . . . . . . . . . . . . . . .  5
2 Operating functions. . . . . . . . . . . . . . . . . . . . . .  5
3 Power supply conﬁgurations. . . . . . . . . . . . . . .  6
Electrostatic discharge (ESD). . . . . . . . . . . . . .  7
1 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . .  7
2 ESD test conditions  . . . . . . . . . . . . . . . . . . . . .  7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  8
Recommended operating conditions. . . . . . . .  8
Static characteristics. . . . . . . . . . . . . . . . . . . . .  8
Dynamic characteristics . . . . . . . . . . . . . . . . .  11
Test information. . . . . . . . . . . . . . . . . . . . . . . .  13
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  14
Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
Soldering  . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
1 Introduction to soldering surface mount
 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16
2 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . .  16
3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . .  16
4 Manual soldering  . . . . . . . . . . . . . . . . . . . . . .  17
5 Package related soldering information . . . . . .  17
Additional soldering information . . . . . . . . . .  19
1 (H)BCC packages: footprint . . . . . . . . . . . . . .  19
2 (H)BCC packages: reﬂow soldering proﬁle. . .  19
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .  21
Deﬁnitions  . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .  21