DESCRIPTION
HyperX HX313C9FBK2/16 is a kit of two 1G x 64-bit (8GB)
DDR3-1333 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory
modules, based on sixteen 512M x 8-bit DDR3 FBGA compo-
nents per module. Total kit capacity is 16GB. Each module kit
has been tested to run at DDR3-1333 at latency timing 9-9-9 at
1.5V. The JEDEC standard electrical and mechanical specifica-
tions are as follows:
Document No. 4806992-001.B00 04/23/15 Page 1
SPECIFICATIONS
selcyc 9)DDI(LC
Row Cycle Time (tRCmin) 49.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power TBD W* (per module)
0 - V 49gnitaR LU
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
FEATURES
•JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
•VDDQ = 1.5V (1.425V ~ 1.575V)
•667MHz fCK for 1333Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 9, 8, 7, 6
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95 ° C
•Asynchronous Reset
•Height 1.291” (32.80mm) w/heatsink, double sided
component
HX313C9FBK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-1333 CL9 240-Pin DIMM Kit
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