1#
Product Family Data Sheet Rev. 2.1 2016.6.20
High Voltage LED Series
Chip on Board
- Small LES COB line-up -
LCo20C
Small LES COBs are well-suited for compact spot light system
Featur
es & Benefits
Suitable for luminaires with narrow beam angle such as shop lighting
Maximize Center Beam Candle Power(CBCP)
Reduce lighting system cost with smaller optical component
High reliability without wire-bonding
Applications
Spotlight / Downlight
LED Retrofit Bulbs
2
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Ambient / Operating Temperature
Ta
-40 ~ +105
ºC
Storage Temperature
Tstg
-40 ~ +120
ºC
Case Temperature
Tc
105
ºC
LED Junction Temperature
TJ
140
ºC
Forward Current
IF
810
mA
Minimum Current
IF_min
20
mA
ESD (HBM)
-
±2
kV
Notes:
1) Refer to 4. Outline Drawing & Dimension for Tc point.
2) Refer to the Derating curve for proper driving current that maintained below Maximum junction temperature.
b) Electro-optical Characteristics (IF = 540 mA, TJ = 85 ºC)
Item
Unit
Min.
Typ.
Max.
Forward Voltage (VF) *1, *2
V
32.5
34.5
38.5
Color Rendering Index (Ra) *1, *2
80
-
-
90
-
-
Thermal Resistance (Junction to Tc point)
ºC/W
-
1.6
1.9
Beam Angle
º
-
115
-
Notes:
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Forward Voltage = ±5 %, CRI = ±1
3
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
2
H
D
N
C
0
5
Y
H
V
3
C
1
Digit
PKG Information
Code
Specification
1 2 3
Samsung Package High Power
SPH
4 5
Color
WH
White
6
Product Version
2
Version
7 8
Form Factor
HD
COB
9
Lens Type
N
No lens
10
Internal Code
C
LC020C
11
Chip Type
0
Minor version
12
CRI & Sorting Temperature
5
Min. 80
7
Min. 90
13 14
Forward Voltage (V)
YH
32.5~38.5
15
CCT (K)
W
2700 K
:
V
3000 K
U
3500 K
T
4000 K
R
5000 K
Q
5700 K
16
MacAdam / ANSI
2
MacAdam 2-step
3
MacAdam 3-step
T
ANSI bin
17 18
Luminous Flux
Ra min.80
2700K
C3, B3, A3
3000K
D3, C3, B3
3500K
E3, D3, C3
4000K
E3, D3, C3
C1
5000K
F3, E3, D3
5700K
F3, E3, D3
Ra min.90
2700K
K2, H2, G2
3000K
L2, K2, H2
3500K
A3, L2, K2
4000K
B3, A3, L2
4
a) 20W Luminous Flux Characteristics (IF = 540 mA)
CRI (Ra)
Lumen Flux
Sorting1) @ TJ = 85 °C (lm)
CCT
Min.
Rank
Min.
Max.
2700K
3000K
3500K
4000K
5000K
5700K
80
G
3
2900
3110
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
F
2
1380
1480
CRI (Ra)
Lumen Flux
Sorting1) @ TJ = 85 °C (lm)
CCT
Min.
Rank
Min.
Max.
2700K
3000K
3500K
4000K
90
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
F
2
1380
1480
Notes:
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
b) Binning Structure (IF = 540 mA, TJ = 85 ºC)
CRI
(Ra)
Nominal
Product Code
VF
Color
Color
Flux
Flux
(lm)
Flux
Flux Range (Φv, lm)
Min.
CCT (K)
Rank
Rank
Bin
Rank
Typ.
Bin
Min.
Max.
80
2700
SPHWH2HDNC05YHW2C1
YH
W2
WB
C1
2140
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
SPHWH2HDNC05YHW3C1
YH
W3
WA, WB
C1
2140
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
3000
SPHWH2HDNC05YHV2C1
YH
V2
VB
C1
2230
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
SPHWH2HDNC05YHV3C1
YH
V3
VA, VB
C1
2230
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
3500
SPHWH2HDNC05YHU2C1
YH
U2
UB
C1
2320
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
SPHWH2HDNC05YHU3C1
YH
U3
UA, UB
C1
2320
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
4000
SPHWH2HDNC05YHT2C1
YH
T2
TB
C1
2380
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
SPHWH2HDNC05YHT3C1
YH
T3
TA, TB
C1
2380
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
5000
SPHWH2HDNC05YHR3C1
YH
R3
RA
C1
2520
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
SPHWH2HDNC05YHRTC1
YH
RT
RW, RX,
RY, RZ
C1
2520
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
5700
SPHWH2HDNC05YHQTC1
YH
QT
QW, QX,
QY, QZ
C1
2520
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
6
b) Binning Structure (IF = 540 mA, TJ = 85 ºC)
CRI
(Ra)
Nominal
Product Code
VF
Color
Color
Flux
Flux
(lm)
Flux
Flux Range (Φv, lm)
Min.
CCT (K)
Rank
Rank
Bin
Rank
Typ.
Bin
Min.
Max.
90
2700
SPHWH2HDNC07YHW2C1
YH
W2
WB
C1
1600
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
SPHWH2HDNC07YHW3C1
YH
W3
WA, WB
C1
1600
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
3000
SPHWH2HDNC07YHV2C1
YH
V2
VB
C1
1730
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
SPHWH2HDNC07YHV3C1
YH
V3
VA, VB
C1
1730
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
3500
SPHWH2HDNC07YHU2C1
YH
U2
UB
C1
1850
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
SPHWH2HDNC07YHU3C1
YH
U3
UA, UB
C1
1850
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
4000
SPHWH2HDNC07YHT2C1
YH
T2
TB
C1
1950
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
SPHWH2HDNC07YHT3C1
YH
T3
TA, TB
C1
1950
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
7
c) Chromaticity Region & Coordinates (TJ = 85 ºC)
MacAdam Ellipse (WA, WB)
MacAdam Ellipse (VA, VB)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.4030
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
MacAdam Ellipse (UA, UB)
MacAdam Ellipse (TA, TB)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (RA)
Step
CIE x
CIE y
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
Note : Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
CIE x,y
8
0.31
0.32
0.33
0.34
0.35
0.36
0.37
0.38
0.39
0.31 0.32 0.33 0.34 0.35 0.36 0.37
CIE y
CIE x
CIE 1931 x,y Chromaticity Diagram
5000K
5700K
RY
RZ
RW
RX
QY
QW
ANSI bin
Blackbody
Locus
QZ
QX
c) Chromaticity Region & Coordinates (TJ = 85 ºC)
Region
CIE x
CIE y
Region
CIE x
CIE y
Region
CIE x
CIE y
Region
CIE x
CIE y
R rank (5000 K)
Q rank (5700 K)
RW
0.3376
0.3616
RY
0.3463
0.3687
QW
0.3207
0.3462
QY
0.3290
0.3538
0.3463
0.3687
0.3551
0.3760
0.3290
0.3538
0.3376
0.3616
0.3451
0.3554
0.3533
0.3620
0.3290
0.3417
0.3371
0.3490
0.3371
0.3490
0.3451
0.3554
0.3215
0.3350
0.3290
0.3417
RX
0.3371
0.3490
RZ
0.3451
0.3554
QX
0.3215
0.3350
QZ
0.3290
0.3417
0.3451
0.3554
0.3533
0.3620
0.3290
0.3417
0.3371
0.3490
0.3440
0.3428
0.3515
0.3487
0.3290
0.3300
0.3366
0.3369
0.3366
0.3369
0.3440
0.3428
0.3222
0.3243
0.3290
0.3300
Note : Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
9
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 540 mA, TJ = 85 ºC)
CRI Ra 80+ CRI Ra 90+
b) Forward Current Characteristics (TJ = 85 ºC)
c) Temperature Characteristics (IF = 540 mA)
0%
20%
40%
60%
80%
100%
120%
350 400 450 500 550 600 650 700 750 800
Relative Intensity
Wavelength [nm]
2700K
3000K
3500K
4000K
0%
20%
40%
60%
80%
100%
120%
350 400 450 500 550 600 650 700 750 800
Relative Intensity
Wavelength [nm]
2700K
3000K
3500K
4000K
5000K
5700K
28
29
30
31
32
33
34
35
36
37
38
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90
Forward Voltage (V)
Forward Current (A)
Forward Voltage vs. Forward Current
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90
Relative Luminous Flux (a.u.)
Forward Current (A)
Relative Luminous Flux vs. Forward Current
32.5
33
33.5
34
34.5
35
35.5
36
36.5
37
37.5
020 40 60 80 100 120
Forward Voltage (V)
Tj (℃)
Forward Voltage vs. Tj
0.90
0.95
1.00
1.05
1.10
1.15
020 40 60 80 100 120
Relative Luminous Flux (a.u.)
Tj (℃)
Relative Luminous Flux vs. Tj
10
d) Color Shift Characteristics TJ = 85℃ IF = 540 mA
e) Derating Characteristics
Case temperature vs. Allowable Forward Current
f) Beam Angle Characteristics (IF = 540 mA, Ta = 25 ºC)
-0.004
-0.002
0
0.002
0.004
0.006
0.008
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90
Δ CIE x, Δ CIE y
Forward Current (A)
Δ CIE x, Δ CIE y vs. Forward Current
Δ CIE x
Δ CIE y
-0.004
-0.002
0
0.002
0.004
0.006
020 40 60 80 100 120
Δ CIE x, Δ CIE y
Tj (℃)
Δ CIE x, Δ CIE y vs. Tj
Δ CIE x
Δ CIE y
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
020 40 60 80 100 120
Allowable forward current (A)
Tc (℃)
Derating curve
0
0.2
0.4
0.6
0.8
1
1.2
-90 -60 -30 0 30 60 90
Relative luminous intensity (a.u.)
Angle (°)
Radiation diagram
11
4. Outline Drawing & Dimension
Note : Tc point : The Center of the back side of substrate.
Item
Dimension
Tolerance
Unit
Length
±0.20
mm
Width
±0.20
mm
Height
±0.20
mm
Light Emitting Surface (LES) Diameter
±0.15
mm
1. Unit: mm
2. Tolerance: ± 0.20 mm
1. Unit: mm
2. Tolerance: ± 0.2 mm
12
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC 810 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Thermal Cycle
-45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min
800 cycles
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
ESD (HBM)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
3 times
ESD (MM)
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.2 kV
3 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C, 75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Limit
Min.
Max.
Forward Voltage
VF
IF = 540 m A
L.S.L. * 0.9
U.S.L. * 1.1
Luminous Flux
Φv
IF = 540 m A
L.S.L * 0.7
U.S.L * 1.3
13
6. Label Structure
a) Label Structure
Note: Denoted rank code and product code above is only an example (see description on page 6)
Rank Code:
ⓐⓑ: Forward Voltage rank (refer to page 3)
ⓒⓓ: Chromaticity bin (refer to page 5-6)
ⓔⓕ: Luminous Flux bin (refer to page 4)
Aluminum Bag & Inner Box Outer Box
SPHWH2HDNC05YHV3C4 YHV3C1
SPHWH2HDNC05YHV3C4 YHV3C1
YHV3C1
YHV3C1
14
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
●
: Production site (S: Giheung, Korea, G: Tianjin, China)
◎
: L (LED)
◇
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
◆
: Year (Y: 2014, Z: 2015 , A: 2016, …)
□
: Month (1~9, A, B, C)
■
: Day (1~9, A, B~V)
△△△
: Product serial number (001 ~ 009)
▲▲▲
: Tray number (001 ~ 999)
15
7. Packing Structure
Packing material
Max. quantity
in pcs of COB
Dimension (mm)
Length
Width
Height
Tolerance
Tray
78
322.6
135.9
11
0.25
Aluminum Bag
624 (8 trays)
450
230
-
10
PE Foam Pad
-
280
130
10
2
Inner Box
624 (1 aluminum bag)
338
148
55
2
Outer Box
2,496 (4 inner boxes)
351
308
120
5
Pallet
139,776 (56 outer boxes)
1000
1000
970
10
a) Packing Structure for 8 trays inside Aluminum Bag
1BAG = 78pcs / tray, 8(9)tray / 624pcs/BAG
1 BOX = 4 BAG (2,496 pcs)
16
b) Packing Structure for <8 trays inside Aluminum Bag
c) Tray
1BAG = 78pcs / tray
PE foam pad is used as buffer for
< 8 trays inside an aluminum bag
17
d) Aluminum Vinyl Packing Bag
e) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag
18
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9) In case of driving the LC020C around the minimum current level (If_min), chips might exhibit different brightness due to
the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
For more information, please refer to Application Note ‘LED Handling Guide’.
Handling
Area
Resin
Area
Legal and additional information.
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Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered
trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
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Giheung-gu
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KOREA
www.samsungled.com