TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
features
D
Dual-Input, Single-Output MOSFET Switch
With No Reverse Current Flow (No Parasitic
Diodes)
D
IN1 . . . 250-mΩ, 500-mA N-Channel;
14-µA Supply Current
D
IN2 . . . 1.3-Ω, 100-mA P-Channel;
0.75-µA Supply Current (VAUX Mode)
D
Advanced Switch Control Logic
D
CMOS and TTL Compatible Enable Input
D
Controlled Rise, Fall, and Transition Times
D
2.7 V to 4 V Operating Range
D
SOT-23-5 and SOIC-8 Package
D
–40°C to 70°C Ambient Temperature Range
D
2-kV Human Body Model, 750-V Charged
Device Model, 200-V Machine-Model
ESD Protection
typical applications
D
Notebook and Desktop PCs
D
Cell phone, Palmtops, and PDAs
D
Battery Management
description
The TPS2102 and TPS2103 are dual-input, single-output power switches designed to provide uninterrupted
output voltage when transitioning between two independent power supplies. Both devices combine one
n-channel (250 mΩ) and one p-channel (1.3 Ω) MOSFET with a single output. The p-channel MOSFET (IN2)
is used with auxiliary power supplies that deliver lower current for standby modes. The n-channel MOSFET
(IN1) is used with a main power supply that delivers higher current required for normal operation. Low
on-resistance makes the n-channel the ideal path for higher main supply current when power-supply regulation
and system voltage drops are critical. When using the p-channel MOSFET, quiescent current is reduced to
0.75 µA to decrease the demand on the standby power supply. The MOSFETs in the TPS2102 and TPS2103
do not have the parasitic diodes, typically found in discrete MOSFETs, thereby preventing back-flow current
when the switch is off.
DBV PACKAGE
(TOP VIEW)
GND
IN2
IN1
OUT
EN
GND
IN2
IN1
OUT
EN
DBV PACKAGE
(TOP VIEW)
TPS2102
TPS2103
NC – No internal connection
Figure 2. VAUX CardBus Implementation
PCI12xx / PCI14xx
CardBus Controller
PCI Bus VAUX 3.3 V
VGA TPS210x
VCC D3-STAT
1
2
3
4
8
7
6
5
IN2
GND
EN
NC
OUT
OUT
NC
IN1
D PACKAGE
(TOP VIEW)
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
IN2
GND
EN
NC
OUT
OUT
NC
IN1
1
2
3
5
4
1
2
3
5
4
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Figure 1. Typical Dual-Input Single-Output
Application
TPS2102
IN1
IN2
EN
3.3 V VCC
3.3 V VAUX
D3 or PME Status
Control Signal Holdup
Capacitor
Controller
(CardBus,
1394,
PCI,
et al.)
3.3 V
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Selection Guide, VAUX Power-Distribution Switches
DEVICE ENABLE OPERATING
VOLTAGE RANGE
(V)
MAXIMUM INPUT
CURRENT, IN1
(mA)
MAXIMUM INPUT
CURRENT, IN2
(mA)
AMBIENT
TEMPERATURE RANGE
(°C)
TPS2100 EN 2.7 to 4 500 10 –40 to 70
TPS2101 EN 2.7 to 4 500 10 –40 to 70
TPS2102 EN 2.7 to 4 500 100 –40 to 70
TPS2103 EN 2.7 to 4 500 100 –40 to 70
TPS2104 EN 2.7 to 5.5 500 100 –40 to 85
TPS2105 EN 2.7 to 5.5 500 100 –40 to 85
AVAILABLE OPTIONS FOR TPS2102, TPS2103
PACKAGED DEVICES
TADEVICE ENABLE SOT-23-5
(DBV)†SOIC-8
(D)
40
°
C to 70
°
C
TPS2102 EN TSP2102DBV†TPS2102D
–
40°C
to
70°C
TPS2103 EN TPS2103DBV†TPS2103D
Both packages are available left-end taped and reeled. Add an R suffix to the D device type
(e.g., TPS2103DR).
†Add T (e.g., TPS2102DBVT) to indicate tape and reel at order quantity of 250 parts.
Add R (e.g., TPS2102DBVR) to indicate tape and reel at order quantity of 3000 parts.
Function Tables
TPS2102 TPS2103
VIN1 VIN2 EN OUT VIN1 VIN2 EN OUT
0 V 0 V XX GND 0 V 0 V XX GND
0 V 3.3 V L GND 0 V 3.3 V H GND
3.3 V 0 V L VIN1 3.3 V 0 V H VIN1
3.3 V 3.3 V L VIN1 3.3 V 3.3 V H VIN1
0 V 3.3 V H VIN2 0 V 3.3 V L VIN2
3.3 V 0 V H VIN2 3.3 V 0 V L VIN2
3.3 V 3.3 V H VIN2 3.3 V 3.3 V L VIN2
XX = don’t care
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPS2102 functional block diagram
VCC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3 Ω
SW1
250 mΩ
Pullup
Circuit
Driver
IN1
EN
IN2
Discharge
Circuit
TPS2103 functional block diagram
VCC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3 Ω
SW1
250 mΩ
Driver
IN1
EN
IN2
Pulldown
Circuit
Discharge
Circuit
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NO.
DESCRIPTION
NAME TPS2102 TPS2103 I/O
DESCRIPTION
DBV D DBV D
EN 1 3 I Active-high enable for IN1-OUT switch
EN 1 3 I Active-low enable for IN1-OUT switch
GND 2 2 2 2 I Ground
IN1†5 5 5 5 I Main Input voltage, NMOS drain (250 mΩ), require 0.22 µF bypass
IN2†3 1 3 1 I Auxilliary input voltage, PMOS drain (1.3 Ω), require 0.22 µF bypass
OUT 47, 8 47, 8 OPower switch output
NC 4, 6 4, 6 No connection
†Unused INx should not be grounded.
detailed description
power switches
n-channel MOSFET
The IN1-OUT n-channel MOSFET power switch has a typical on-resistance of 250 mΩ at 3.3-V input voltage,
and is configured as a high-side switch.
p-channel MOSFET
The IN2-OUT p-channel MOSFET power switch has a typical on-resistance of 1.3 Ω at 3.3-V input voltage and
is configured as a high-side switch. When operating, the p-channel MOSFET quiescent current is reduced to
typically 0.75 µA.
charge pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
very little supply current.
driver
The driver controls the gate voltage of the IN1-OUT and IN2-OUT power switches. To limit large current surges
and reduce the associated electromagnetic interference (EMI) produced, the drivers incorporate circuitry that
controls the rise times and fall times of the output voltage.
enable
The logic enable will turn on the IN2-OUT power switch when a logic high is present on EN (TPS2102) or logic
low is present on EN (TPS2103). A logic low input on EN (TPS2102) or logic high on EN (TPS2103) restores
bias to the drive and control circuits and turns on the IN1-OUT power switch. The enable input is compatible
with both TTL and CMOS logic levels.
the VAUX application for CardBus controllers
The PC Card specification requires the support of VAUX to the CardBus controller as well as to the PC Card
sockets. Both are 3.3-V requirements; however the CardBus controller’s current demand from the V AUX supply
is limited to 10 µA, whereas the PC Card may consume as much as 200 mA. In either implementation, if support
of a wake-up event is required, the controller and the socket will transition from the 3.3-V VCC rail to the 3.3-V
VAUX rail when the equipment moves into a low power mode such as D3. The transition from VCC to VAUX needs
to be seamless in order to maintain all memory and register information in the system. If V AUX is not supported,
the system will lose all register information when it transitions to the D3 state.
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Input voltage range, VI(IN1) (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI(IN2) (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI at EN or EN (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.3 V to 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO(IN1) 700 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO(IN2) 140 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See dissipation rating table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, TJ –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (ESD) protection: Human body model 2 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Machine model 200 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged device model 750 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: All voltages are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE TA < 25°C
POWER RATING DERATING F ACTOR
ABOVE TA = 25°CTA = 70°C
POWER RATING TA = 85°C
POWER RATING
DBV 309 mW 3.1 mW/°C170 mW 123 mW
D568 mW 5.7 mW/°C313 mW 227 mW
recommended operating conditions
MIN MAX UNIT
Input voltage, VI(INx) 2.7 4 V
Input voltage, VI at EN and EN 0 4 V
Continuous output current, IO(IN1) 500 mA
Continuous output current, IO(IN2) 100‡mA
Operating virtual junction temperature, TJ–40 85 °C
‡The device can deliver up to 220 mA at IO(IN2). However, operation at the higher current levels will result in greater voltage drop across the device,
and greater voltage droop when switching between IN1 and IN2.
electrical characteristics over recommended operating junction temperature range,
VI(IN1) = V(IN2) = 3.3 V, IO = rated current (unless otherwise noted)
power switch
PARAMETER TEST
CONDITIONS†MIN TYP MAX UNIT
IN1 OUT
TJ = 25°C 250
mΩ
rDS( )
On state resistance
IN1
-
OUT
TJ = 85°C 300 375
mΩ
r
DS(on)
On
-
state
resistance
IN2 OUT
TJ = 25°C 1.3
Ω
IN2
-
OUT
TJ = 85°C 1.5 2.1
Ω
†Pulse-testing techniques maintain junction temperature close to ambient termperature; thermal ef fects must be taken into account separately .
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating junction temperature range,
VI(IN1) = V(IN2) = 3.3 V, IO = rated current (unless otherwise noted) (continued)
enable input (EN and EN)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH High-level input voltage 2.7 V ≤ VI(INx) ≤ 4 V 2 V
VIL Low-level input voltage 2.7 V ≤ VI(INx) ≤ 4 V 0.8 V
II
In
p
ut current
TPS2102 EN = 0 V or EN = VI(INx) –0.5 0.5 µA
I
I
Inp
u
t
c
u
rrent
TPS2103 EN = 0 V or EN = VI(INx) –0.5 0.5 µA
supply current
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EN = H
,
TJ = 25°C 0.75
µA
TPS2102
EN
H,
IN2 selected –40°C ≤TJ ≤85°C 1.5 µ
A
TPS2102
EN = L
,
TJ = 25°C 14
µA
II
Su
pp
ly current
EN
L,
IN1 selected –40°C ≤TJ ≤85°C 24 µ
A
I
I
S
u
ppl
y
c
u
rrent
EN = L, TJ = 25°C 0.75
µA
TPS2103
,
IN2 selected –40°C ≤TJ ≤85°C 1.5 µ
A
TPS2103
EN = H, TJ = 25°C 14
µA
,
IN1 selected –40°C ≤TJ ≤85°C 24 µ
A
switching characteristics, TJ = 25°C, VI(IN1) = VI(IN2) = 3.3 V (unless otherwise noted)†
PARAMETER TEST CONDITIONS†MIN TYP MAX UNIT
CL = 1 µF, IL = 500 mA 440
IN1-OUT VI(IN2) = 0 CL = 10 µF, IL = 500 mA 440
t
Out
p
ut rise time
()
CL = 1 µF, IL = 100 mA 370
µs
t
r
O
u
tp
u
t
rise
time
CL = 1 µF, IL = 100 mA 4.6 µ
s
IN2-OUT VI(IN1) = 0 CL = 10 µF, IL = 100 mA 50
()
CL = 1 µF, IL = 10 mA 4.6
CL = 1 µF, IL = 500 mA 5
IN1-OUT VI(IN2) = 0 CL = 10 µF, IL = 500 mA 100
tf
Out
p
ut fall time
()
CL = 1 µF, IL = 100 mA 13
µs
t
f
O
u
tp
u
t
fall
time
CL = 1 µF, IL = 100 mA 68 µ
s
IN2-OUT VI(IN1) = 0 CL = 10 µF, IL = 100 mA 680
()
CL = 1 µF, IL = 10 mA 720
tPLH
Pro
p
agationdelaytime low to highout
p
ut
IN1-OUT VI(IN2) = 0
CL=10µF
IL= 100 mA
80
µs
t
PLH
Propagation
dela
y
time
,
lo
w-
to
-
high
o
u
tp
u
t
IN2-OUT VI(IN1) = 0
C
L =
10
µ
F
,
I
L =
100
mA
2µ
s
tPHL
Pro
p
agationdelaytime high to lowout
p
ut
IN1-OUT VI(IN2) = 0
CL=10µF
IL= 100 mA
3
µs
t
PHL
Propagation
dela
y
time
,
high
-
to
-
lo
w
o
u
tp
u
t
IN2-OUT VI(IN1) = 0
C
L =
10
µ
F
,
I
L =
100
mA
40 µ
s
†All timing parameters refer to Figure 3.
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
tPLH tPHL
EN or EN
VO
EN or EN
VO
50%
10%
VI
GND
GND
VI90%
50%
90%
10%
VOGND
VI
trtf
Propagation Delay Time, Low-to-High-Level Output Propagation Delay Time, High-to–Low-Level Output
Rise/Fall Time
ton toff
EN or EN
VO
EN or EN
VO
50%
10%
VI
GND
GND
VI
90%
50%
Turn-on T ransition Time Turn-off T ransition Time
WAVEFORMS
OUT
CLIO
LOAD CIRCUIT
Figure 3. Test Circuit and Voltage Waveforms
Table of Timing Diagrams†
FIGURE
Propagation Delay and Rise Time With 0.1-µF Load, IN1 4
Propagation Delay and Rise T ime With 0.1-µF Load, IN2 5
Propagation Delay and Fall T ime With 0.1-µF Load, IN1 6
Propagation Delay and Fall T ime With 0.1-µF Load, IN2 7
Propagation Delay and Rise T ime With 1-µF Load, IN1 8
Propagation Delay and Rise T ime With 1-µF Load, IN2 9
Propagation Delay and Fall T ime With 1-µF Load, IN1 10
Propagation Delay and Fall T ime With 1-µF Load, IN2 11
†W aveforms shown in Figures 4–11 refer to TPS2102 at TJ = 25°C
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Figure 4. Propagation Delay and Rise Time
With 0.1-µF Load, IN1 Turnon
EN
(
2 V/div)
t – Time – 200 µs/div
VO
(
2 V/div)
VI(IN1) = 3.3 V
VI(IN2) = 0 V
CL = 0.1 µF
RL = 33 Ω
Figure 5. Propagation Delay and Fall Time
With 0.1-µF Load, IN2 Turnon
EN
(2 V/div)
t – Time – 2 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 3.3 V
CL = 0.1 µF
RL = 33 Ω
Figure 6. Propagation Delay and Fall Time
With 0.1-µF Load, IN1 Turnoff
EN
(2 V/div)
t – Time – 5 µs/div
VO
(2 V/div)
VI(IN1) = 3.3 V
VI(IN2) = 0 V
CL = 0.1 µF
RL = 33 Ω
Figure 7. Propagation Delay and Fall Time
With 0.1-µF Load, IN2 Turnoff
EN
(2 V/div)
t – Time – 5 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 3.3 V
CL = 0.1 µF
RL = 33 Ω
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
EN
(2 V/div)
t – Time – 200 µs/div
VO
(2 V/div)
VI(IN1) = 3.3 V
VI(IN2) = 0 V
CL = 1 µF
RL = 33 Ω
Figure 8. Propagation Delay and Rise Time
With 1-µF Load, IN1 Turnon Figure 9. Propagation Delay and Rise Time
With 1-µF Load, IN2 Turnon
EN
(2 V/div)
t – Time – 2 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 3.3 V
CL = 1 µF
RL = 33 Ω
Figure 10. Propagation Delay and Fall Time
With 1-µF Load, IN1 Turnoff
EN
(2 V/div)
t – Time – 10 µs/div
VO
(2 V/div)
VI(IN1) = 3.3 V
VI(IN2) = 0 V
CL = 1 µF
RL = 33 Ω
Figure 11. Propagation Delay and Fall Time
With 1-µF Load, IN2 Turnoff
EN
(2 V/div)
t – Time – 50 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 3.3 V
CL = 1 µF
RL = 33 Ω
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IN1 Switch Rise T ime vs Output Current 12
IN2 Switch Fall T ime vs Output Current 13
IN1 Switch Fall T ime vs Output Current 14
IN2 Switch Fall T ime vs Output Current 15
Output Voltage Droop vs Output Current When Output Is Switched From IN2 to IN1 16
Inrush Current vs Output Capacitance 17
IN1 Supply Current vs Junction Temperature (IN1 Enabled) 18
IN1 Supply Current vs Junction Temperature (IN1 Disabled) 19
IN2 Supply Current vs Junction Temperature (IN2 Enabled) 20
IN2 Supply Current vs Junction Temperature (IN2 Disabled) 21
IN1-OUT On-State Resistance vs Junction Temperature 22
IN2-OUT On-State Resistance vs Junction Temperature 23
Figure 12
380
340
300
0.01 0.1 1 10
– Rise Time –
420
IN1 SWITCH RISE TIME
vs
OUTPUT CURRENT
460
100 1000
CL = 100 µF
CL = 47 µF
CL = 10 µF
CL = 1 µF
CL = 0.1 µF
IO – Output Current – mA
trsµ
VI(IN1) = 3.3 V
VI(IN2) = 0 V
TJ = 25°C
Figure 13
10
1
0.1 0 102030405060
100
IN2 SWITCH RISE TIME
vs
OUTPUT CURRENT
1000
70 80 90 100
– Rise Time –
CL = 100 µF
CL = 47 µF
CL = 10 µF
CL = 1 µF
CL = 0.1 µF
IO – Output Current – mA
trsµ
VI(IN1) = 0 V
VI(IN2) = 3.3 V
TJ = 25°C
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 14
100
10
0.1
0.01 0.1 1 10
1000
IN1 SWITCH FALL TIME
vs
OUTPUT CURRENT
10000
100 1000
– Fall Time –
CL = 100 µF
CL = 47 µF
CL = 10 µF
CL = 1 µF
CL = 0.1 µF
IO – Output Current – mA
tfsµ
VI(IN1) = 3.3 V
VI(IN2) = 0 V
TJ = 25°C
1
Figure 15
10
1
0.001
0.01 0.1
100
IN2 SWITCH FALL TIME
vs
OUTPUT CURRENT
1000
1 100
– Output Fall Time – ms
CL = 100 µF
CL = 10 µF
CL = 1 µF
CL = 0.1 µF
IO – Output Current – mA
tf
VI(IN1) = 0 V
VI(IN2) = 3.3 V
TJ = 25°C
CL = 47 µF
10
0.1
0.01
Figure 16
0.4
0.2
0
0.01 0.1
0.6
0.8
1
1 100
– Output Voltage Droop – V
OUTPUT VOLTAGE DROOP
vs
OUTPUT CURRENT WHEN OUTPUT
IS SWITCHED FROM IN2 TO IN1†
VO
CL = 100 µF
CL = 10 µF
CL = 1 µF
CL = 0.1 µF
IO – Output Current – mA
VI(IN1) = 3.3 V
VI(IN2) = 3.3 V
TJ = 25°C
CL = 47 µF
10
CL = 220 µF
Figure 17
1
00 100 200 300
Inrush Current – A
1.5
2
INRUSH CURRENT
vs
OUTPUT CAPACITANCE
2.5
400 500
0.5
Co – Output Capacitance – µF
VI(IN1) = 3.3 V
VI(IN2) = 0 V
RL = 6.6 Ω
TJ = 25°C
†If switching from IN1 to IN2, the voltage droop is much smaller. Therefore, the load capacitance should be chosen according to the curves in
Figure 16.
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 18
– Supply Current –ICC Aµ
15
13
9
–40 –10 20 50
17
IN1 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN1 ENABLED)
21
11080
VI(IN1) = 4 V
TJ – Junction Temperature – °C
19
VI(IN1) = 3.3 V
11 VI(IN1) = 2.7 V
Figure 19
– Supply Current –ICC Aµ
0.25
–40 –10 20 50
IN1 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN1 DISABLED)
0.35
11
0
80
VI(IN1) = 4 V
TJ – Junction Temperature – °C
VI(IN1) = 2.7 V
0.33
0.31
0.29
0.27
VI(IN1) = 3.3 V
– Supply Current –ICC Aµ
0.35
–40 –10 20 50
IN2 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN2 ENABLED)
0.59
11080
VI(IN2) = 4 V
TJ – Junction Temperature – °C
VI(IN2) = 2.7 V
0.53
0.47
0.41
VI(IN2) = 3.3 V
Figure 20 Figure 21
– Supply Current –ICC Aµ
0.15
–40 –10 20 50
IN2 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN2 DISABLED)
0.25
11
0
80
VI(IN2) = 4 V
TJ – Junction Temperature – °C
VI(IN2) = 2.7 V
0.23
0.21
0.19
0.17
VI(IN2) = 3.3 V
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 22
280
240
200
–40 –10 20 50
– IN1-OUT On-State Resistance –
320
IN1-OUT ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
360
80 110
ron mΩ
VI(IN1) = 4 V
VI(IN1) = 3.3 V
VI(IN1) = 2.7 V
TJ – Junction Temperature – °C
Figure 23
2
1.5
1
0.5
–40 –10 20 50
IN2-OUT ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
2.5
80 110
VI(IN2) = 4 V
VI(IN2) = 3.3 V
VI(IN2) = 2.7 V
TJ – Junction Temperature – °C
– IN1-OUT On-State Resistance –
ron mΩ
APPLICATION INFORMATION
EN
IN1
IN2
OUT
GND
3.3 V VAUX
3.3 V VCC
CardBus or System Controller TPS2102
0.22 µF
0.22 µF0.1 µF xx µF
3.3 V
Figure 24. Typical Application
power-supply considerations
A 0.22-µF ceramic bypass capacitor between IN and GND, close to the device is recommended. The output
capacitor should be chosen based on the size of the load during the transition of the switch. A 220-µF capacitor
is recommended for 100 mA loads. Typical output capacitors (xx µF, shown in Figure 24) required for a given
load can be determined from Figure 16 which shows the output voltage droop when output is switched from IN2
to IN1. The output voltage droop is insignificant when output is switched from IN1 to IN2. Additionally, bypassing
the output with a 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
power supply considerations (continued)
switch transition
The n-channel MOSFET on IN1 uses a charge pump to create the gate-drive voltage, which gives the IN1 switch
a rise time of approximately 0.5 ms. The p-channel MOSFET on IN2 has a simpler drive circuit that allows a
rise time of approximately 5 µs. Because the device has two switches and a single enable pin, these rise times
are seen as transition times, from IN1 to IN2, or IN2 to IN1, by the output. The controlled transition times help
limit the surge currents seen by the power supply during switching.
thermal protection
Thermal protection provided on the IN1 switch prevents damage to the IC when heavy-overload or short-circuit
faults are present for extended periods of time. The increased dissipation causes the junction temperature to
rise to dangerously high levels. The protection circuit senses the junction temperature of the switch and shuts
it off at approximately 145°C (TJ). The switch remains off until the junction temperature has dropped
approximately 10°C. The switch continues to cycle in this manner until the load fault or input power is removed.
undervoltage lockout
An undervoltage lockout function is provided to ensure that the power switch is in the off state at power-up.
Whenever the input voltage falls below approximately 2 V, the power switch quickly turns off. This function
facilitates the design of hot-insertion systems that may not have the capability to turn off the power switch before
input power is removed. Upon reinsertion, the power switch will be turned on with a controlled rise time to reduce
EMI and voltage overshoots.
power dissipation and junction temperature
The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass
large currents. The thermal resistances of these packages are high compared to that of power packages; it is
good design practice to check power dissipation and junction temperature. First, find ron at the input voltage,
and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and
read ron from Figure 22 or Figure 23. Next calculate the power dissipation using:
PD
+
ron
I2
Finally, calculate the junction temperature:
TJ
+
PD
R
q
JA
)
TA
Where:
TA = Ambient temperature
RθJA = Thermal resistance
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation using the calculated value as the new estimate. Two or three iterations are generally
sufficient to obtain a reasonable answer.
ESD protection
All TPS2102 and TPS2103 terminals incorporate ESD-protection circuitry designed to withstand a 2-kV
human-body-model, 750-V CDM, and 200-V machine-model discharge as defined in MIL-STD-883C.
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE
0,10
M
0,20
0,95
0°–8°
0,25
0,35
0,55
Gage Plane
0,15 NOM
4073253-4/E 05/99
2,60
3,00
0,50
0,30
1,50
1,70
45
31
2,80
3,00
0,95
1,45 0,05 MIN
Seating Plane
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
TPS2102, TPS2103
VAUX POWER-DISTRIBUTION SWITCHES
SLVS234A – SEPTEMBER 1999 – REVISED APRIL 2000
16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
4040047/D 10/96
0.228 (5,80)
0.244 (6,20)
0.069 (1,75) MAX 0.010 (0,25)
0.004 (0,10)
1
14
0.014 (0,35)
0.020 (0,51)
A
0.157 (4,00)
0.150 (3,81)
7
8
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
PINS **
0.008 (0,20) NOM
A MIN
A MAX
DIM
Gage Plane
0.189
(4,80)
(5,00)
0.197
8
(8,55)
(8,75)
0.337
14
0.344
(9,80)
16
0.394
(10,00)
0.386
0.004 (0,10)
M
0.010 (0,25)
0.050 (1,27)
0°–8°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS2102D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2102DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2102DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2102DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2102DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2102DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2103DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2103DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2103DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2103DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Dec-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2102DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2102DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2103DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2103DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS2102DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS2102DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TPS2103DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS2103DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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