KMA221 Programmable angle sensor Rev. 1 -- 16 July 2013 Product data sheet 1. Product profile 1.1 General description The KMA221 is a magnetic angle sensor module. The MagnetoResistive (MR) sensor bridges, the mixed signal Integrated Circuit (IC) and the required capacitors are integrated into a single package. This angular measurement module KMA221 is pre-programmed, pre-calibrated and therefore, ready to use. The KMA221 allows user-specific adjustments of angular range, zero angle and clamping voltages. The settings are stored permanently in a non-volatile memory. 1.2 Features and benefits High precision sensor for magnetic angular measurement Single package sensor module with integrated filters for improved ElectroMagnetic Compatibility (EMC) Automotive qualified in accordance with AEC-Q100 Rev-G Programmable user adjustments, including zero angle and angular range Fail-safe non-volatile memory with write protection using lock bit Independent from magnetic field strength above 35 kA/m Ready to use without external components High temperature range up to 160 C Analog ratiometric output voltage Overvoltage protection up to 16 V Programming via One-Wire Interface (OWI) User-programmable 32-bit identifier Magnet-loss, power-loss and broken bond wire detection Factory calibrated KMA221 NXP Semiconductors Programmable angle sensor 2. Pinning information Table 1. Pinning Pin Symbol Description 1 OUT/DATA analog output or data interface 2 GND ground 3 VDD supply voltage 4 n.c. not connected Simplified outline 1 2 3 4 3. Ordering information Table 2. KMA221 Product data sheet Ordering information Type number Package Name Description Version KMA221 SIL4 plastic, single in-line package SOT1188-1 All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 2 of 36 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x DIGITAL VOLTAGE REGULATOR ANALOG VOLTAGE REGULATOR (SWITCHING) POR UNDERVOLTAGE DETECTION/ POR POWER-LOSS DETECTION Cblock GND LOW-PASS FILTER LOW-PASS FILTER MULTIPLEXER (MUX) differential amplifier output buffer ADC OSCILLATOR OUT/DATA DAC ONE-WIRE INTERFACE GND CL NON-VOLATILE MEMORY TEST CONTROL CLOCK GENERATOR DEMUX Rev. 1 -- 16 July 2013 All information provided in this document is subject to legal disclaimers. POWER-LOSS DETECTION NXP Semiconductors ANALOG VOLTAGE REGULATOR (CLEAN) 4. Functional diagram KMA221 Product data sheet VDD DIGITAL FILTER AND AVERAGING OFFSET CORRECTION ANGLE CALCULATION ANGULAR RANGE ADJUSTMENT SERIAL INTERFACE GND MAGNETORESISTIVE SENSOR BRIDGES SIGNAL CONDITIONING INTEGRATED CIRCUIT INTEGRATED CAPACITANCES Functional diagram of KMA221 KMA221 3 of 36 (c) NXP B.V. 2013. All rights reserved. Fig 1. Programmable angle sensor 001aan661 KMA221 NXP Semiconductors Programmable angle sensor 5. Functional description The KMA221 amplifies two orthogonal differential signals from MR sensor bridges and converts them into the digital domain. The angle is calculated using the COordinate Rotation DIgital Computer (CORDIC) algorithm. After a digital-to-analog conversion, the analog signal is provided to the output as a linear representation of the angular value. Zero angle, clamping voltages and angular range are programmable. In addition, two 16-bit registers are available for customer purposes, such as sample identification. The KMA221 comprises a Cyclic Redundancy Check (CRC) and an Error Detection and Correction (EDC). It also has magnet-loss and broken bond wire detection to ensure a fail-safe operation. If either the supply voltage or the ground line of the mixed signal IC is interrupted, a power-loss detection circuit pulls the analog output to the remaining connection. After multiplexing the two MR Wheatstone bridge signals and their successive amplification, the signal is converted into the digital domain by an Analog-to-Digital Converter (ADC). Further processing is done within an on-chip state machine. This state machine controls offset cancelation, calculation of the mechanical angle using the CORDIC algorithm, as well as zero angle and angular range adjustment. The internal Digital-to-Analog Converter (DAC) and analog output stage are used for the conversion of the angle information into an analog output voltage, which is ratiometric to the supply voltage. The configuration parameters are stored in a user-programmable non-volatile memory. The OWI (accessible using pin OUT/DATA) is used for accessing the memory. In order to protect the memory content, a lock bit can be set. After locking the non-volatile memory, its content cannot be changed anymore. 5.1 Angular measurement directions The differential signals of the MR sensor bridges depend only on the direction of the external magnetic field strength Hext, which is applied parallel to the plane of the sensor. In order to obtain a correct output signal, exceed the minimum saturation field strength. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 4 of 36 KMA221 NXP Semiconductors Programmable angle sensor Hext 1 Fig 2. 2 3 4 008aaa276 Angular measurement directions Since the Anisotropic MR (AMR) effect is periodic over 180, the sensor output is also 180-periodic. The angle is calculated relative to a freely programmable zero angle. The dashed line indicates the mechanical zero degree position. 6. Analog output The KMA221 provides one analog output signal on pin OUT/DATA. The measured angle is converted linearly into a value, which is ratiometric to the supply voltage VDD. Either a positive or a negative slope is provided for this purpose. Table 3 describes the analog output behavior for a positive slope. For example, if a magnetic field angle, above the programmed maximum angle max but below the clamp switch angle sw(CL), is applied to the sensor, the analog output is set to the upper clamping voltage. If the magnetic field angle is larger than the clamp switch angle, the analog output switches from upper to lower clamping voltage. If there is a negative slope, the clamping voltages are changed. Table 3. Analog output behavior for a positive slope Magnetic field angle Analog output max < < sw(CL) V(CL)u sw(CL) < < ref + 180 V(CL)l The analog output voltage range encodes both angular and diagnostic information. A valid angle value is between the upper and lower clamping voltage. If the analog output is in the diagnostic range, that is below 4 %VDD or above 96 %VDD, an error condition has been detected. The analog output repeats every 180. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 5 of 36 KMA221 NXP Semiconductors Programmable angle sensor VO (%VDD) rng V(CL)u V(CL)I 0 ref (deg) max 180 sw(CL) ref + 180 001aag811 max = ref + rng Fig 3. Characteristic of the analog output 7. Diagnostic features The KMA221 provides several diagnostic features: 7.1 CRC and EDC supervision The KMA221 includes a supervision of the programmed data. At power-on, a CRC of the non-volatile memory is performed. Furthermore the memory is protected against bit errors. Every 16-bit data word is saved internally as a 22-bit word for this purpose. The protection logic corrects any single-bit error in a data word, while the sensor continues in normal operation mode. Furthermore the logic detects double-bit error per word and switches the output into diagnostic mode. 7.2 Magnet-loss detection If the applied magnetic field strength is not sufficient, the KMA221 can raise a diagnostic condition. In order to enter the diagnostic mode, due to magnet-loss, enable the detection first. The device can be programmed into active diagnostic mode, where the output is driven below 4 %VDD or above 96 %VDD. 7.3 Power-loss detection The power-loss detection circuit enables the detection of an interrupted supply or ground line of the mixed signal IC. If there is a power-loss condition, two internal switches in the sensor are closed, connecting the pin of the analog output to the supply voltage and the ground pins. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 6 of 36 KMA221 NXP Semiconductors Programmable angle sensor .0$ 9'' =2 SO 287'$7$ =2 SO *1' DDD Fig 4. Equivalent output circuit in a power-loss condition Table 4 describes the power-loss behavior and gives the resulting output voltage depending on the interrupted supply or ground line and the load resistance. Table 4. Power-loss behavior Load resistance Interrupted supply line Interrupted ground line RL(ext) > 5 k VO 4 %VDD VO 96 %VDD 7.4 Broken bond wire detection The broken bond wire detection circuit enables the detection of an interrupted supply or ground line of the MR sensor bridge. If there is a broken bond wire, the device goes into diagnostic mode and a status bit is set. 7.5 Low supply voltage detection and overvoltage protection If the supply voltage is below the switch-off threshold voltage, a status bit is set and the device goes into diagnostic mode. If the supply voltage is above the overvoltage switch-on threshold voltage, the device enters diagnostic mode. Table 5 describes the system behavior depending on the voltage range of the supply voltage. Table 5. System behavior Supply voltage State 0 V to 1.8 V start-up power The output buffer drives an active LOW or is powered down. The switches of the power-loss detection circuit are not fully opened and set the output to a level between ground and half the supply voltage. Description 1.8 V to VPOR power-on reset The power-loss charge pump is fully operational and turns the switches of the detection circuit off. The output buffer drives an active LOW and sets the output to the lower diagnostic level. During the reset phase, all circuits are in reset and/or Power-down mode. VPOR to Vth(on) or Vth(off) initialization The digital core and the oscillator are active. After reset, the content of the non-volatile memory is copied into the shadow registers. The output buffer drives an active LOW and sets the output to the lower diagnostic level. Vth(on) or Vth(off) to functional minimum VDD operation KMA221 Product data sheet All analog circuits are active and the measured angle is available at the analog output. Not all parameters are within the specified limits. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 7 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 5. System behavior ...continued Supply voltage State Description Minimum VDD to maximum VDD normal operation All analog circuits are active and the measured angle is available at the analog output. All parameters are within the specified limits. Maximum VDD to Vth(ov) functional operation All analog circuits are active and the measured angle is available at the analog output. Not all parameters are within the specified limits. Vth(ov) to 16 V overvoltage The digital core and the oscillator are active but all other circuits are in Power-down mode. The output is set to the lower diagnostic level. Table 6 describes the diagnostic behavior and the resulting output voltage depending on the error case. Furthermore the duration and termination condition to enter and leave the diagnostic mode are given, respectively. Table 6. Diagnostic behavior Diagnostic condition Duration Analog output Termination condition Low voltage 1 s < t < 10 s 4 %VDD functional or normal operation Overvoltage 1 s < t < 10 s 4 %VDD functional or normal operation Checksum error n/a 4 %VDD or 96 %VDD[2] power-on reset[1] Double-bit error n/a 4 %VDD or 96 %VDD[2] power-on reset[1] Magnet-loss 0.5 ms < t < 6 ms 4 %VDD or 96 %VDD[2] magnet present[1] Power-loss 2 ms Broken bond wire 0.2 ms < t < 1 ms 4 %VDD or 96 %VDD[2] power-on reset[1] 4 %VDD or 96 %VDD[2] power-on reset [1] Status bit stays set in command register until power-on reset. [2] Depending on the diagnostic level setting. 8. Limiting values Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDD supply voltage VO output voltage Min Max Unit 0.3 +16 V 0.3 +16 V Vth(ov) 16 V - 150 mA VO(ov) overvoltage output voltage Tamb < 140 C at t < 1 h Ir reverse current Tamb < 70 C Tamb ambient temperature 40 +160 C Tamb(pr) programming ambient temperature 10 70 C Tstg storage temperature 40 +125 C Tamb = 50 C 17 - year Tamb(pr) = 70 C 100 - cycle [1] Non-volatile memory tret(D) data retention time Nendu(W_ER) write or erase endurance [1] KMA221 Product data sheet Overvoltage on analog output and supply within the specified operating voltage range. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 8 of 36 KMA221 NXP Semiconductors Programmable angle sensor 9. Recommended operating conditions Table 8. Operating conditions In a homogenous magnetic field. Symbol Parameter Conditions [1] Min Typ Max Unit 4.5 5.0 5.5 V VDD supply voltage Tamb ambient temperature 40 - +160 C Tamb(pr) programming ambient temperature 10 - 70 C [1][2] 0 - 22 nF [2][3] 0 - 6.8 nF CL(ext) external load capacitance RL(ext) external load resistance Hext external magnetic field strength [4] 5 - k 35 - - kA/m [1] Normal operation mode. [2] Between ground and analog output. [3] Command mode. [4] Power-loss detection is only possible with a load resistance within the specified range connected to the supply or ground line. 10. Thermal characteristics Table 9. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Typ Unit 100 K/W 11. Characteristics Table 10. Mechanical characteristics Symbol Parameter Conditions Min Typ Max Unit Flead mechanical force to the leads Tamb = 25 C - - 10 N Ffin mechanical force to the fin holder Tamb = 25 C - - 15 N Unit Table 11. Supply current Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Ioff(ov) Product data sheet Conditions supply current IDD KMA221 Parameter overvoltage switch-off current Min Typ Max [1][2] 5 - 10.5 mA [3][4] - - 13 mA [5] - - 6 mA [1] Normal operation and diagnostic mode excluding overvoltage and undervoltage within the specified operating supply voltage range. [2] Without load current at the analog output. [3] Normal operation and diagnostic mode over full voltage range up to limiting supply voltage at steady state. [4] With minimum load resistance at the analog output. [5] Diagnostic mode for a supply voltage above the overvoltage threshold voltage up to the limiting supply voltage. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 9 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 12. Power-on reset Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Parameter Conditions Min Typ Max Unit Vth(on) switch-on threshold voltage analog output switches on, if VDD > Vth(on) - 4.30 4.45 V Vth(off) switch-off threshold voltage analog output switches off, if VDD < Vth(off) 3.90 4.10 - V Vhys hysteresis voltage Vhys = Vth(on) Vth(off) 0.1 0.2 - V VPOR power-on reset voltage IC is initialized - 3.3 3.6 V Vth(ov) overvoltage threshold voltage analog output switches off, if VDD > Vth(ov) 6.5 7.5 8.0 V Vhys(ov) overvoltage hysteresis voltage 0.1 0.3 - V Table 13. Module performance Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Parameter res angle resolution max maximum angle ref Min Typ Max Unit [1] - - 0.04 deg programmable angular range for V(CL)u V(CL)l 80 %VDD [2] 5 - 180 deg reference angle programmable zero angle [2] VO(nom) nominal output voltage at full supply operating range VO(udr) upper diagnostic range output voltage VO(ldr) V(CL)u V(CL)l Conditions 0 - 180 deg 5 - 95 %VDD [3][4][5] 96 - 100 %VDD lower diagnostic range output voltage [3][4][5] 0 - 4 %VDD upper clamping voltage [4][5][6] 40 - 95 %VDD lower clamping voltage [4][5][6] 5 - 30.5 %VDD 0.3 - +0.3 %VDD V(CL) clamping voltage variation deviation from programmed value [4][5] Vn(o)(RMS) RMS output noise voltage equivalent power noise [1][4] - 0.4 2.5 mV temperature range 40 C to +160 C [4][7] 1.2 - +1.2 deg temperature range 40 C to +140 C [4][7] 1 - +1 deg temperature range 40 C to +160 C [1][4][7] - - 0.8 deg temperature range 40 C to +140 C [1][4][7] - - 0.65 deg temperature range 40 C to +160 C [7][8][9] - - 0.65 deg temperature range 40 C to +140 C [7][8][9] - - 0.55 deg referred to input [4][7] - - 0.09 deg referred to input [4][7] 0.1 - +0.1 deg lin temp tempRT hys lin linearity error temperature drift error temperature drift error at room temperature hysteresis error microlinearity error KMA221 Product data sheet [8] [8] All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 10 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 13. Module performance ...continued Characteristics are valid for the operating conditions, as specified in Section 9. Symbol ang Parameter Conditions angular error temperature range 40 C to +160 C [4][7] temperature range 40 C to +140 C [4][7] Typ Max Unit 1.35 - +1.35 deg 1.1 - +1.1 deg - - 0.04 deg/deg - - 210 [10] [10] [4][7] slope of angular error mang Min [10] ZO(pl) power-loss output impedance impedance to remaining supply line in case of lost supply voltage or lost ground [1] At a nominal output voltage between 5 %VDD and 95 %VDD and a maximum angle of max = 180. [2] In steps of resolution < 0.022. [3] Activation is dependent on the programmed diagnostic mode. [4] At a low-pass filtered analog output with a cut-off frequency of 0.7 kHz. [5] Settling to these values is limited by 0.7 kHz low-pass filtering of analog output. [6] In steps of 0.02 %VDD. [7] Definition of errors is given in Section 12. [8] Based on a 3 standard deviation. [9] Room temperature is given for an ambient temperature of 25 C. [10] Graph of angular error is shown in Figure 5. 1.40 1.35 |ang| (deg) 1.10 (1) (2) 0.75 0.65 0 -20 -16 -12.25 -1 0 1 12.25 20 16 1 - 0 (deg) 001aal765 (1) 40 C to +160 C (2) 40 C to +140 C Fig 5. Envelope curve for the magnitude of angular error KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 11 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 14. Dynamics Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Parameter Conditions Min Typ Max Unit until first valid result - - 5 ms 2.4 3.125 - kHz - - 1.8 ms ton turn-on time fupd update frequency ts settling time tcmd(ent) enter command mode time after power-on 20 - 30 ms trec(ov) overvoltage recovery time - - 4 ms Min Typ Max Unit after an ideal mechanical angle step of 45, until 90 % of the final value is reached after overvoltage Table 15. Digital interface Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Parameter Conditions VIH HIGH-level input voltage 80 - - %VDD VIL LOW-level input voltage - - 20 %VDD VOH HIGH-level output voltage IO = 2 mA 80 - - %VDD VOL LOW-level output voltage IO = 2 mA - - 20 %VDD Iod overdrive current absolute value for overdriving the output buffer - - 20 mA tstart start time LOW level before rising edge 5 - - s tstop stop time HIGH level before falling edge 5 - - s Tbit bit period the load capacitance limits the minimum period 10 - 100 s Tbit bit period deviation deviation between received clock and sent clock 0.8Tbit 1Tbit 1.2Tbit s tw0 pulse width 0 0.175Tbit 0.25Tbit 0.375Tbit s tw1 pulse width 1 0.625Tbit 0.75Tbit 0.825Tbit s tto time-out time communication reset guaranteed after maximum tto - - 220 s ttko(slv) slave takeover time duration of LOW level for slave takeover 1 - 5 s ttko(mas) master takeover time duration of LOW level for master takeover 0Tbit - 0.5Tbit s tprog programming time for a single memory address 20 - - ms tcp charge pump time waiting time after enabling the non-volatile memory charge pump clock 1 - - ms Table 16. Internal capacitances Characteristics are valid for the operating conditions, as specified in Section 9. Symbol Parameter Min Typ Max Unit Cblock blocking capacitance [1] 50 100 150 nF CL load capacitance [1] 1.1 2.2 3.3 nF [1] Conditions Measured at 1 MHz. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 12 of 36 KMA221 NXP Semiconductors Programmable angle sensor 12. Definition of errors 12.1 General Angular measurement errors by the KMA221 result from linearity errors, temperature drift errors and hysteresis errors. Figure 6 shows the output signal of an ideal sensor, where the measured angle meas corresponds ideally to the magnetic field angle . This curve represents the angle reference line ref() with a slope of 0.5 %VDD/degree. meas (deg) ref() 180 (deg) 001aag812 Fig 6. Definition of the reference line The angular range is set to max = 180 and the clamping voltages are programmed to V(CL)l = 5 %VDD and V(CL)u = 95 %VDD for a valid definition of errors. 12.2 Hysteresis error The device output performs a positive (clockwise) rotation and negative (counter clockwise) rotation over an angular range of 180 at a constant temperature. The maximum difference between the angles defines the hysteresis error hys. meas (deg) hys 180 (deg) 001aag813 Fig 7. Definition of the hysteresis error Equation 1 gives the mathematical description for the hysteresis value hys: hys() = meas( 180 ) - meas( 0 ) KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (1) (c) NXP B.V. 2013. All rights reserved. 13 of 36 KMA221 NXP Semiconductors Programmable angle sensor 12.3 Linearity error The KMA221 output signal deviation from a best straight line BSL, with the same slope as the reference line, is defined as linearity error. The magnetic field angle is varied at fixed temperatures for measurement of this linearity error. The output signal deviation from the best straight line at the given temperature is the linearity error lin. It is a function of the magnetic field angle and the temperature of the device Tamb. meas (deg) BSL(, Tamb) ref() lin(, Tamb) 180 (deg) 001aag814 Fig 8. Definition of the linearity error 12.4 Microlinearity error is the magnetic field angle. If = 1, the microlinearity error lin is the device output deviation from 1. meas (deg) ref() meas = 1 + lin() = 1 (deg) 001aag815 Fig 9. Definition of the microlinearity error KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 14 of 36 KMA221 NXP Semiconductors Programmable angle sensor 12.5 Temperature drift error The temperature drift temp is defined as the envelope over the deviation of the angle versus the temperature range. It is considered as the pure thermal effect. meas (deg) Ty Tx temp 180 (deg) 001aag816 Fig 10. Definition of the temperature drift error Equation 2 gives the mathematical description for temperature drift value temp: temp() = meas( , T x) - meas( , T y) (2) with: Tx: temperature for maximum meas at angle Ty: temperature for minimum meas at angle The deviation from the value at room temperature tempRT describes the temperature drift of the angle, compared to the value, which the sensor provides at room temperature: temp RT( , T amb) = meas( , T amb) - meas( , T RT) (3) with: TRT: room temperature (25 C) 12.6 Angular error The angular error ang is the difference between mechanical angle and sensor output during a movement from 0 to 1. Here 0 and 1 are arbitrary angles within the angular range. The customer initially programs the angle measurement at 0 at room temperature and zero hour upon production. The angle measurement at 1 is made at any temperature within the ambient temperature range: ang = meas( 1 , T amb) - meas( 0 , T RT) - 1 - 0 (4) with: 0, 1: arbitrary mechanical angles within the angular range meas(0, TRT): programmed angle at 0, TRT = 25 C and zero hour upon production meas(1, Tamb): the sensor measures angle at 1 and any temperature within Tamb KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 15 of 36 KMA221 NXP Semiconductors Programmable angle sensor This error comprises non-linearity and temperature drift related to the room temperature. |ang| mang |ang(peak)| |lin + temp|RT| -* 0 - 1 0 + 1 0 +* 1 001aal766 Fig 11. Envelope curve for the magnitude of angular error Figure 11 shows the envelope curve for the magnitude of angular error |ang| versus 1 for all angles 0 and all temperatures Tamb within the ambient temperature range. If 1 is in the range of 1 around 0, |ang| has its minimum. Here only the microlinearity error lin and the temperature drift related to the room temperature |tempRT| occurs. If 1 deviates from 0 by more than 1 in either direction, |ang| can increase. Slope mang defines the gradient. Equation 5 to Equation 8 express the angular error: for |1 0| 1 ang = lin + temp (5) RT for 1 < |1 0| < * ang = lin + temp RT + m ang 1 - 0 - 1 (6) RT (7) for |1 0| * ang = lin 2 + temp 2 with: ang(peak) - lin + temp RT = ----------------------------------------------------------------------------------- + 0 + 1 m ang KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (8) (c) NXP B.V. 2013. All rights reserved. 16 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13. Programming 13.1 General description The KMA221 provides an OWI to enable programming of the device which uses pin OUT/DATA bidirectionally. In general the device runs in analog output mode, the normal operation mode. The embedded programming data configures this mode. After a power-on reset once time ton has elapsed,it starts. In this mode, the magnetic field angle is converted into the corresponding output voltage. A second mode, the command mode enables programming. In this mode, the customer can adjust all required parameters (for example zero angle and angular range) to meet the application requirements. After enabling the internal charge pump and waiting for tcp, the data is stored in the non-volatile memory. After changing the contents of the memory, recalculate and write the checksum (see Section 13.4). In order to enter the command mode, send a specific command sequence after a power-on reset and during the time slot tcmd(ent). The external source used to send the command sequence must overdrive the output buffers of the KMA221. In doing so, it provides current Iod. During communication, the KMA221 is always the slave and the external programming hardware is always the master. Figure 12 illustrates the structure of the OWI data format. write IDLE START COMMAND DATA BYTE 1 DATA BYTE 2 STOP IDLE read IDLE START COMMAND HANDOVER DATA BYTE 1 DATA BYTE 2 TAKEOVER STOP IDLE 001aag742 Fig 12. OWI data format The master provides the start condition, which is a rising edge after a LOW level. Then a command byte which can be either a read or a write command is sent. Depending on the command, the master or the slave has to send the data immediately after the command sequence. If there is a read command, an additional handover or takeover bit is inserted before and after the data bytes. The master must close each communication with a stop condition. If the slave does not receive a rising edge for a time longer than tto, a time-out condition occurs. The bus is reset to the idle state and waits for a start condition and a new command. This behavior can be used to synchronize the device regardless of the previous state. All communication is based on this structure (see Figure 12), even for entering the command mode. The customer can access the non-volatile memory, CTRL1, TESTCTRL0 and SIGNATURE registers (described in Section 13.5). Only a power-on reset leaves the command mode. A more detailed description of the programming is given in the next sections. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 17 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.2 Timing characteristics As described in the previous section, a start and stop condition is necessary for communication. The LOW-level duration before the rising edge of the start condition is defined as tstart. The HIGH-level duration after the rising edge of the stop condition is defined as tstop. These parameters, together with all other timing characteristics are shown in Table 15. tstart tstop 001aag817 Fig 13. OWI start and stop condition Figure 14 shows the coding of a single bit with a HIGH level of VIH and a LOW level of VIL. Here the pulse width tw1 or tw0 represents a logic 1 or a logic 0 of a full bit period Tbit, respectively. bit = 0 bit = 1 Tbit 0.175 Tbit 0.375 0.625 tw0 0.825 tw1 0.25 0.75 001aag818 Fig 14. OWI timing 13.3 Sending and receiving data The master has to control the communication during sending or receiving data. The command byte defines the region, address and type of command the master requests. Read commands need an additional handover or takeover bit. Insert this bit before and after the two data bytes (see Figure 12). However the OWI is a serial data transmission, whereas the Most Significant Byte (MSB) send at first. Table 17. Format of a command byte 7 6 5 4 3 2 1 0 CMD7 CMD6 CMD5 CMD4 CMD3 CMD2 CMD1 CMD0 Table 18. Command byte bit description Bit Symbol Description 7 to 5 CMD[7:5] region bits 000 = 16-bit non-volatile memory 001 to 011 = reserved 100 = 16-bit register 101 to 111 = reserved KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 18 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 18. Command byte bit description ...continued Bit Symbol Description 4 to 1 CMD[4:1] address bits 0 CMD0 read/write 0 = write 1 = read A more detailed description of all customer accessible registers is given in Section 13.5. Both default value and the complete command including the address and write or read request are also listed. 13.3.1 Write access To write data to the non-volatile memory, enable the internal charge pump. Set bits CP_CLOCK_EN and WRITE_EN and wait for tcp enables the internal charge pump. Perform the following procedure for write access: 1. Start condition: The master drives a rising edge after a LOW level 2. Command: The master sends a write command (CMD0 = 0) 3. Data: The master sends two data bytes 4. Stop condition: The master drives a rising edge after a LOW level Figure 15 shows the write access of the digital interface. The signal OWI represents the data on the bus from the master or slave. The signals: master output enable and slave output enable indicate when the master or the slave output is enabled or disabled, respectively. START CMD7 CMD0 WDATA15 WDATA0 STOP IDLE master output enable OWI (2) slave output enable (1) 001aag743 (1) Missing rising edges generate a time-out condition and the written data is ignored. (2) If the master does not drive the bus, the bus-pull defines the bus. Fig 15. OWI write access Note: As already mentioned in Section 13.1, use the write procedure to enter the command mode. If command mode is not entered, communication is not possible and the sensor operates in normal operation mode. After changing an address, the time tprog must elapse before changing another address. After changing the contents of the non-volatile memory, recalculate and write the checksum (see Section 13.4). KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 19 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.3.2 Read access To read data from the sensor, perform the following procedure: 1. Start condition: The master drives a rising edge after a LOW level 2. Command: The master sends a read command (CMD0 = 1) 3. Handover: The master sends a handover bit, that is a logic 0 and disables the output after a three-quarter bit period 4. Takeover: The slave drives a LOW level after the falling edge for ttko(slv) 5. Data: The slave sends two data bytes 6. Handover: The slave sends a handover bit, that is a logic 0 and disables the output after a three-quarter bit period 7. Takeover: The master drives a LOW level after the falling edge for ttko(mas) 8. Stop condition: The master drives a rising edge after a LOW level Figure 16 shows the read access of the digital interface. The signal OWI represents the data on the bus from the master or slave. The signals: master output enable and slave output enable indicate when the master or the slave output is enabled or disabled, respectively. START CMD7 CMD0 HANDSHAKE RDATA15 RDATA0 HANDSHAKE STOP IDLE master output enable (3) OWI (5) (1) slave output enable (2) (2) (4) 001aag744 (1) Duration of LOW level for slave takeover ttko(slv). (2) The master output enable and the slave output enable overlap, because both drive a LOW level. However this behavior ensures the independency from having a pull-up or pull-down on the bus. In addition, it improves the EMC robustness, because all levels are actively driven. (3) Duration of LOW level for master takeover ttko(mas). (4) If the master does not take over, the pull-up generates the stop condition. Otherwise a time-out is generated if there is a pull-down and the slave waits for a rising edge as start condition. (5) If the master does not drive the bus, the bus-pull defines the bus. Fig 16. OWI read access KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 20 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.3.3 Entering the command mode After a power-on reset, the sensor provides a time slot tcmd(ent) for entering the command mode. Send a specific command sequence (see Figure 17). If command mode is not entered, the sensor starts in the normal operation mode. If the sensor stays in the diagnostic mode, the master can write the signature without a power-on reset. During the command mode sequence, the analog output is enabled. The external programming hardware has to overdrive the output with current Iod. If command mode is activated, the analog output is disabled and pin OUT/DATA operates as a digital interface. tcmd(ent) VDD OWI START 94h command 16h F4h STOP signature 008aaa263 Fig 17. OWI command mode procedure 13.4 Cyclic redundancy check As already mentioned in Section 7, there is an 8-bit checksum for the non-volatile memory data. To calculate this value, the MSB of the memory data word generates the CRC at first over all corresponding addresses in increasing order. Read out all addresses from 8h to Fh for calculating the checksum. The Least Significant Byte (LSB) of address Fh which contains the previous checksum must be overwritten with 0h before the calculation can be started. Setting bits CP_CLOCK_EN and WRITE_EN (see Section 13.5.1) and waiting for tcp enables the internal charge pump for programming. The generator polynomial for the calculation of the checksum is: 8 2 G(x) = x + x + x + 1 (9) With a start value of FFh and the data bits are XOR at the x8 point. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 21 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.4.1 Software example in C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 #include <stdio.h.> // calc_crc accepts unsigned 16-bit data in data int calc_crc(int crc, unsigned int data) { const int gpoly = 0x107; // generator polynomial int i; //index variable for (i = 15; i >= 0; i--) { crc <<= 1; //shift left crc = (int) ((data & (1u<<i))>>i); // XOR of with generator polynomial when MSB(9) = HIGH if (crc & 0x100) crc ^= gpoly; } return crc; } int main(void) { int crc, crc_res, i; // 8 LSB are CRC field filled with 0 unsigned int data_seq[] = {0x0000, 0xFFC1, 0x0400, 0x0100, 0x1300, 0x0000, 0x0000, 0x0000}; // calculate checksum over all data crc = 0xFF; // start value of crc register printf("Address\tValue\n"); for (i = 0; i <= 7; i++) { printf("0x%1X\t0x%04X\n", i, data_seq[i]); crc = calc_crc(crc, data_seq[i]); } crc_res = crc; // crc_res = 0xA9 printf("\nChecksum\n0x%02X\n", crc_res); // check procedure for preceding data sequence crc = 0xFF; for (i = 0; i <= 6; i++) crc = calc_crc(crc, data_seq[i]); // last word gets crc inserted crc = calc_crc(crc, data_seq[i] crc_res); printf("\nCheck procedure for data sequence: must be 0x00 is 0x%02X.\n", crc); return 1; } The checksum of this data sequence is A9h. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 22 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.5 Registers 13.5.1 Command registers To enter the command mode, write the signature given in Table 19 into the specific register using the OWI. Do this procedure as described in Section 13.3.3, with a write command, the signature follows it, but after a power-on reset and not later than tcmd(ent). Table 19. Command registers Command Register write/read Bit Access Field Description 82h/83h 15 R IN_DIAG_MODE shows if there is a diagnostic condition present; the setting of register field FORCE_DIAG_OFF does not affect this bit 14 W FORCE_DIAG_OFF force diagnostic mode off; default: 0b 13 - - reserved 12 R LOW_VOLTAGE_DET low voltage condition detected 11 R/W CP_CLOCK_EN charge pump clock enabled (must be set after setting write enable signal for writing to non-volatile memory); default: 0b 10 and 9 - - reserved 8 R ERR_CORRECT single-bit error of non-volatile memory has been detected and corrected; updated every memory readout; remains set until the diagnostic condition disappears and a power-on reset is done 7 R UNCORR_ERR double-bit error of non-volatile memory has been detected; updated every memory readout; remains set until the diagnostic condition disappears and a power-on reset is done 6 R MAGNET_LOSS_DET magnet-loss detected; bit remains set until the diagnostic condition disappears and a power-on reset is done; enable magnet-loss detection for entering diagnostic mode 5 R BROKEN_BOND_DET broken bond wire detected; bit remains set until the diagnostic condition disappears and a power-on reset is done 4 R CRC_BAD checksum error detected; updated every start-up 3 to 0 - - reserved CTRL1 94h/- SIGNATURE 15 to 0 W SIGNATURE to enter command mode, write signature 16F4h within tcmd(ent); for more details, see Section 13.3.3 96h/97h TESTCTRL0 15 to 12 - - reserved 11 W WRITE_EN write enable signal; set before writing to non-volatile memory; default: 0b 10 to 0 - - reserved KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 23 of 36 KMA221 NXP Semiconductors Programmable angle sensor 13.5.2 Non-volatile memory registers The device includes several internal registers which are used for customization and identification. The initial signature allows read access to all areas but only write access to customer registers. Write accesses to reserved areas are ignored. Since these registers are implemented as non-volatile memory cells, writing to the registers needs a specific time tprog after each write access to complete. As there is no check for the programming time, make sure that no other accesses to the non-volatile memory are made during the programming cycle. Do not address the non-volatile memory during the time tprog. Note: Before data can be stored in the non-volatile memory, switch on the internal charge pump for the programming duration by setting register CTRL1, bit 11 CP_CLOCK_EN and register TESTCTRL0, bit 11 WRITE_EN. To calculate the checksum, read out and consult register addresses 8h to Fh. Table 20. Non-volatile memory registers Address Command Register write/read Bit Description Default MSB/LSB 0h -/01h reserved - addresses are reserved for calibration purposes [1] 1h -/03h 2h -/05h 3h -/07h 4h -/09h 5h -/0Bh 6h -/0Dh 7h -/0Fh 8h 10h/11h ZERO_ANGLE 15 to 0 mechanical zero degree position; see Table 21 00h/00h 9h 12h/13h ANG_RNG_MULT_MSB 15 to 6 CLAMP_SW_ANGLE; when the measured angle is bigger than CLAMP_SW_ANGLE the output switches to CLAMP_LO for a positive slope; see Table 26 FFh/C1h 5 to 0 Ah 14h/15h ANG_RNG_MULT_MSB; most significant bits of the angular range multiplicator; see Table 24 ANG_RNG_MULT_LSB 15 and 14 DIAGNOSTIC_LEVEL; diagnostic level behavior of the analog output; see Table 25 04h/00h 00b -- active LOW (in lower diagnostic range) with driver strength of the analog output 01b -- active HIGH (in upper diagnostic range) with driver strength of the analog output 10b -- reserved 11b -- reserved 13 SLOPE_DIR; slope of analog output 0b -- rising (not inverted) 1b -- falling (inverted) 12 to 0 KMA221 Product data sheet ANG_RNG_MULT_LSB; least significant bits of the angular range multiplicator All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 24 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 20. Non-volatile memory registers ...continued Address Command Register write/read Bit Description Default MSB/LSB Bh 15 0b -- reserved 01h/00h 14 and 13 undefined[2] 16h/17h Ch 18h/19h CLAMP_LO CLAMP_HI 12 to 0 lower clamping level; see Table 22 15 to 13 undefined[2] 12 to 0 upper clamping level; see Table 23 13h/00h Dh 1Ah/1Bh ID_LO 15 to 0 lower 16 bits of identification code 00h/00h Eh 1Ch/1Dh ID_HI 15 to 0 upper 16 bits of identification code 00h/00h Fh 1Eh/1Fh CTRL_CUST 15 LOCK; irreversible write protection of non-volatile 00h/[1] memory 14 to 8 MAGNET_LOSS; magnet-loss detection 1b -- enabled 00h -- disabled 49h -- enabled 7 to 0 [1] Variable and individual for each device. [2] Undefined; write as zero for default. CRC; checksum (see Section 13.4) Table 21. ZERO_ANGLE - mechanical zero degree position (address 8h) bit allocation Data format: unsigned fixed point; resolution: 216. Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Value 21 22 23 24 25 26 27 28 29 210 211 212 213 214 215 216 Mechanical angular range 0000h = 0 to FFFFh = 180 1 LSB. Examples: * Mechanical zero angle 0 = 0000h * Mechanical zero angle 10 = 0E38h * Mechanical zero angle 45 = 4000h Table 22. CLAMP_LO - lower clamping level (address Bh) bit allocation Data format: unsigned integer (DAC values 256 to 4864); resolution: 20. Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Value 0 U[1] U[1] 212 211 210 29 28 27 26 25 24 23 22 21 20 [1] Undefined; write as zero for default; returns any value when read. Values 0 to 255 are reserved. It is not permitted to use such values. Examples: * 100 %VDD = 5120 (reserved) * 10 %VDD = 512 * 5 %VDD = 256 KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 25 of 36 KMA221 NXP Semiconductors Programmable angle sensor Table 23. CLAMP_HI - upper clamping level (address Ch) bit allocation Data format: unsigned integer (DAC values 256 to 4864); resolution: 20. Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Value U[1] U[1] U[1] 212 211 210 29 28 27 26 25 24 23 22 21 20 [1] Undefined; write as zero for default; returns any value when read. Values 4865 to 5120 are reserved. It is not permitted to use such values. Examples: * 100 %VDD = 5120 (reserved) * 95 %VDD = 4864 * 90 %VDD = 4608 Table 24. ANG_RNG_MULT_MSB - most significant bits of angular range multiplicator (address 9h) bit allocation Data format: unsigned fixed point; resolution: 21. Bit 15 14 13 Value 12 11 10 9 8 7 6 CLAMP_SW_ANGLE 5 4 3 2 1 0 24 23 22 21 20 21 CLAMP_HI - CLAMP_LO 180 ANG_RNG_MULT = ------------------------------------------------------------------- --------------------------------------------------8192 ANGULAR_RANGE (10) Examples: * 4864 - 256 180 ANG_RNG_MULT = --------------------------- ----------- = 0.5625 8192 180 * 4864 - 256 180 ANG_RNG_MULT = --------------------------- ----------- = 1.125 8192 90 Table 25. ANG_RNG_MULT_LSB - least significant bits of angular range multiplicator (address Ah) bit allocation Data format: unsigned fixed point; resolution: 214. Bit 15 Value [1] 14 V[1] 13 12 11 10 9 8 7 6 5 4 3 2 1 0 V[1] 22 23 24 25 26 27 28 29 210 211 212 213 214 Variable; depending on the setting of diagnostic level and slope of analog output. CLAMP_HI - CLAMP_LO 180 ANG_RNG_MULT = ------------------------------------------------------------------- --------------------------------------------------8192 ANGULAR_RANGE (11) Table 26. CLAMP_SW_ANGLE - clamp switch angle (address 9h) bit allocation Data format: unsigned fixed point; resolution: 210. Bit 15 14 13 12 11 10 9 8 7 6 Value 21 22 23 24 25 26 27 28 29 210 5 4 3 2 1 0 ANG_RNG_MULT_MSB Mechanical angular range 0000h = 0 to 3FFh = 180 1 LSB. 1 CLAMP_HI - CLAMP_LO 1 CLAMP_SW_ANGLE = --- 1 + -------------------------------------------------------------------- ----------------------------------------------- 2 8192 ANG_RNG_MULT (12) If the magnetic field angle is larger than the CLAMP_SW_ANGLE, the output switches to CLAMP_LO for a positive slope. Program the value of CLAMP_SW_ANGLE, which can be calculated from other non-volatile memory constants. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 26 of 36 KMA221 NXP Semiconductors Programmable angle sensor 14. Electromagnetic compatibility EMC is verified in an independent and certified test laboratory. 14.1 Emission (CISPR 25) Tests according to CISPR 25 were fulfilled. 14.1.1 Conducted radio disturbance Test of the device according to CISPR 25, third edition (2008-03), Chapter 6.2. Classification level: 5. 14.1.2 Radiated radio disturbance Test of the device according to CISPR 25, third edition (2008-03), Chapter 6.4. Classification level: 5 (without addition of 6 dB in FM band). 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) The common understanding of the requested function is that an effect is tolerated as described in Table 27 during the disturbance. The reachable values are setup-dependent and differ from the final application. Table 27. Failure condition for radiated disturbances Parameter Comment Min Max Unit Variation of output signal in analog output mode value measured relative to the output at test start - 0.9 %VDD 14.2.1 Absorber lined shielded enclosure Tests according to ISO 11452-2, second edition (2004-11), were fulfilled. Test level: 200 V/m; extended up to 4 GHz. State: A. 14.2.2 Bulk-current injection Tests according to ISO 11452-4, third edition (2005-04), were fulfilled. Test level: 200 mA. State: A. 14.2.3 Strip line Tests according to ISO 11452-5, second edition (2002-04), were fulfilled. Test level: 200 V/m; extended up to 1 GHz. State: A. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 27 of 36 KMA221 NXP Semiconductors Programmable angle sensor 14.2.4 Immunity against mobile phones Tests according to ISO 11452-2, second edition (2004-11), were fulfilled. State: A. Definition of Global System for Mobile Communications (GSM) signal: * Pulse modulation: per GSM specification (217 Hz; 12.5 % duty cycle) * Modulation grade: 60 dB * Sweep: linear 800 MHz to 3 GHz (duration 10 s at 890 MHz, 940 MHz and 1.8 GHz band) * Antenna polarization: vertical, horizontal * Field strength: 200 V/m during on-time [calibration in Continuous Wave (CW)] In deviation of ISO 11452-2, a GSM signal instead of an AM signal was used. 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] The common understanding of the requested function is that an effect is tolerated as described in Table 28 during the disturbance. Table 28. Failure condition for electrical transient transmission Parameter Comment Variation of output signal in analog value measured relative to the output mode output at test start Min Max Unit - 0.9 %VDD Tests according to ISO 7637-3 were fulfilled. Test level: IV (for 12 V electrical system). Classification level: B for pulse Fast a, B for pulse Fast b. 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) The KMA221 is protected up to 8 kV, according to the human body model at 100 pF and 1.5 k. This protection is ensured at all pins. Classification level: H3B. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 28 of 36 KMA221 NXP Semiconductors Programmable angle sensor 15.2 Human metal model (ANSI/ESD SP5.6-2009) The KMA221 is protected up to 8 kV, according to the human metal model at 150 pF and 330 inside the ESD gun. This test utilizes waveforms of the IEC 61000-4-2 standard on component level. Apply the contact discharge in an unsupplied state at pins OUT/DATA and VDD referred to GND which is connected directly to the ground plane. Test setup: A. Test level: 5. 15.3 Machine model (AEC-Q100-003) The KMA221 is protected up to 400 V, according to the machine model. This protection is ensured at all pins. Classification level: M4. All pins have latch-up protection. 15.4 Charged-device model (AEC-Q100-011) The KMA221 is protected up to 750 V, according to the charged-device model. This protection is ensured at all pins. Classification level: C4. 16. Application information 9'' 9'' 5/ H[W .0$ ),/7(5 IJ N+] VWRUGHU 287'$7$ *1' 287'$7$ &/ H[W *1' .0$ HOHFWURQLFFRQWUROXQLW DDD (1) Power-loss detection is only possible with a load resistance within the specified range connected to the supply or ground line. (2) The load capacitance between ground and analog output can be used to improve the electromagnetic immunity of the device. A blocking capacitance to suppress noise on the supply line of the device is integrated into the package and thus not required externally. Fig 18. Application diagram of KMA221 KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 29 of 36 KMA221 NXP Semiconductors Programmable angle sensor 17. Test information 17.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. 18. Marking $ % & ' .0$ 111111 ;<<<= &%96 SLQLQGH[ DDD A: leading letters of type name B: batch number C: date code X: product manufacturing code; m for manufacturing Manila [Assembly Plant Philippines (APP)] YYY: day of year Z: year of production (last figure) D: additional marking C: capacitor type (T: TDK) B: burn-in information (0: without burn-in; 1: with burn-in) V: IC version (1, 2, 3, ...) S: development status (X: development; C: validated; blank: released) Fig 19. Marking KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 30 of 36 KMA221 NXP Semiconductors Programmable angle sensor 19. Package information 19.1 Reading point position % $ $ % UHDGLQJSRLQW DDD Dimensions in mm Fig 20. Reading point position 19.2 Terminals Lead frame material: CuZr with 99.9 % Cu and 0.1 % Zr. KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 31 of 36 KMA221 NXP Semiconductors Programmable angle sensor 20. Package outline SIL4: plastic, single in-line package SOT1188-1 B E1 E E2 q p A C HE2 HE1 p1 Q A (D5) D3 (2) D4 alignment area(6) D2 D (D6 ) D1 pin 1 index HE gate area(1) (1) (2) (L) 1 4 e (3x) b (4x) w B z C 0 5 mm C 10 mm scale Dimensions Unit burr side A max 2.05 nom 1.95 min 1.85 b C(3) D D1 D2(1) D3 0.85 0.80 0.75 0.30 0.27 0.24 11.15 11.00 10.85 10.62 10.47 10.32 7.81 1.7 1.6 1.5 D4 D5(4, ref) D6(ref) E 2.05 1.95 1.85 0.27 E1(5,6) E2 7.5 12.93 7.4 7.3 8.05 8.00 7.95 e 7.9 7.8 1.8 7.7 References IEC JEDEC JEITA SOT1188-1 --- --- --- s 0.95 0.90 0.85 0.2 HE HE1 HE2 L(ref) 20.7 20.5 20.3 5.85 5.80 5.75 6.20 Note 1. Gate area, up to 0.2 mm protrusion possible at both sides. 2. Terminal and plastic uncontrolled in this area. 3. Burr not included. 4. Measured at the cutting edge of the fin radius. 5. Measured along the straight edge of the package above note 1. 6. Alignment area, up to 1.5 mm long rim break outs can reduce E1 dimension. Outline version q 7.9 w z 0.2 0.8 p p1 Q 1.05 1.00 0.95 4.05 4.00 3.95 0.95 0.90 0.85 sot1188-1_po European projection Issue date 12-05-14 12-08-20 Fig 21. Package outline SOT1188-1 (SIL4) KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 32 of 36 KMA221 NXP Semiconductors Programmable angle sensor 21. Handling information 5 P LQ DDD Dimensions in mm (1) No bending allowed. (2) Plastic body and interface plastic body - leads: application of bending forces not allowed. Fig 22. Bending recommendation 22. Solderability information The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering process for leaded devices is wave soldering. The maximum soldering temperature is 260 C for maximum 5 s. Device terminals are compatible with laser and electrical welding. 23. Revision history Table 29. Revision history Document ID Release date Data sheet status Change notice Supersedes KMA221 v.1 20130716 Product data sheet - - KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 33 of 36 KMA221 NXP Semiconductors Programmable angle sensor 24. Legal information 24.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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All rights reserved. 34 of 36 KMA221 NXP Semiconductors Programmable angle sensor No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 24.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 25. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com KMA221 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 16 July 2013 (c) NXP B.V. 2013. All rights reserved. 35 of 36 KMA221 NXP Semiconductors Programmable angle sensor 26. Contents 1 1.1 1.2 2 3 4 5 5.1 6 7 7.1 7.2 7.3 7.4 7.5 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Angular measurement directions . . . . . . . . . . . 4 Analog output. . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Diagnostic features . . . . . . . . . . . . . . . . . . . . . . 6 CRC and EDC supervision . . . . . . . . . . . . . . . . 6 Magnet-loss detection . . . . . . . . . . . . . . . . . . . 6 Power-loss detection . . . . . . . . . . . . . . . . . . . . 6 Broken bond wire detection . . . . . . . . . . . . . . . 7 Low supply voltage detection and overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Recommended operating conditions. . . . . . . . 9 10 Thermal characteristics . . . . . . . . . . . . . . . . . . 9 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Definition of errors. . . . . . . . . . . . . . . . . . . . . . 13 12.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.2 Hysteresis error . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 Linearity error . . . . . . . . . . . . . . . . . . . . . . . . . 14 12.4 Microlinearity error . . . . . . . . . . . . . . . . . . . . . 14 12.5 Temperature drift error . . . . . . . . . . . . . . . . . . 15 12.6 Angular error. . . . . . . . . . . . . . . . . . . . . . . . . . 15 13 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.1 General description . . . . . . . . . . . . . . . . . . . . 17 13.2 Timing characteristics . . . . . . . . . . . . . . . . . . . 18 13.3 Sending and receiving data . . . . . . . . . . . . . . 18 13.3.1 Write access . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13.3.2 Read access . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13.3.3 Entering the command mode . . . . . . . . . . . . . 21 13.4 Cyclic redundancy check . . . . . . . . . . . . . . . . 21 13.4.1 Software example in C . . . . . . . . . . . . . . . . . . 22 13.5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 13.5.1 Command registers . . . . . . . . . . . . . . . . . . . . 23 13.5.2 Non-volatile memory registers . . . . . . . . . . . . 24 14 Electromagnetic compatibility . . . . . . . . . . . . 27 14.1 Emission (CISPR 25) . . . . . . . . . . . . . . . . . . . 27 14.1.1 Conducted radio disturbance . . . . . . . . . . . . . 27 14.1.2 Radiated radio disturbance. . . . . . . . . . . . . . . 27 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5). . . . . . . . . . . . . . . . . . . . . . 14.2.1 Absorber lined shielded enclosure. . . . . . . . . 14.2.2 Bulk-current injection . . . . . . . . . . . . . . . . . . . 14.2.3 Strip line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.2.4 Immunity against mobile phones . . . . . . . . . . 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ElectroStatic Discharge (ESD) . . . . . . . . . . . . 15.1 Human body model (AEC-Q100-002) . . . . . . 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003). . . . . . . . . . 15.4 Charged-device model (AEC-Q100-011) . . . . 16 Application information . . . . . . . . . . . . . . . . . 17 Test information . . . . . . . . . . . . . . . . . . . . . . . 17.1 Quality information . . . . . . . . . . . . . . . . . . . . . 18 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Package information. . . . . . . . . . . . . . . . . . . . 19.1 Reading point position . . . . . . . . . . . . . . . . . . 19.2 Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 21 Handling information . . . . . . . . . . . . . . . . . . . 22 Solderability information . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information . . . . . . . . . . . . . . . . . . . . . . 24.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 24.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 24.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information . . . . . . . . . . . . . . . . . . . . 26 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 27 27 27 28 28 28 28 29 29 29 29 30 30 30 31 31 31 32 33 33 33 34 34 34 34 35 35 36 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 July 2013 Document identifier: KMA221