1
LCC
Top View
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
A12
A7
A6
A5
NC
NC
NC
A4
A3
A2
A1
A13
A8
A9
A11
NC
NC
NC
NC
OE
A10
CE
6
5
4
3
2
1
44
43
42
41
40
18
19
20
21
22
23
24
25
26
27
28
A0
I/O0
I/O1
I/O2
VSS
NC
I/O3
I/O4
I/O5
I/O6
I/O7
A15
A16
A18
NC
NC
NC
VCC
WE
NC
A17
A14
Features
Read Access Time - 200 ns
Automatic Page Write Operation
Internal Address and Data Latches for 256 Bytes
Internal Control Timer
Fast Write Cycle Time
Page Write Cycle Time - 10 ms Maximum
1 to 256 Byte Page Write Operation
Low Power Dissipation
80 mA Active Current
Hardware and Software Data Protection
DATA Polling for End of Write Detection
High Reliability CMOS Technology
Enduran ce: 10,000 Cyc le s
Data Retention: 10 Years
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-Wide Pinout
Description
The AT28C040 is a hi gh-performance e lectrically erasable a nd programmab le read
only memory (EEPROM). Its 4 megabits of memory is organized as 524,288 words by
8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device
offers access times to 200 ns with power dissipation of just 440 mW.
Rev. 0542B–10/98
Pin Configurations
Pin Name Function
A0 - A18 Addresses
CE Chip Enable
OE Output Enable
WE Write Enable
I/O0 - I/O7 Data Inputs/Outputs
NC No Connect SIDE BRAZE,
FLATPACK
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
VCC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
(continued)
4-Megabit
(512K x 8)
Paged Parallel
EEPROMs
AT28C040
AT28C040
2
The AT28C040 is accessed like a static RAM for the read
or write cycle without the need for external components.
The devi ce c ontai ns a 256-by te pa ge regi ster to a llow writ-
ing of u p to 256 b yt es simul tan eou sl y. Dur in g a wr it e cyc le ,
the address and 1 to 256 bytes of data are internally
latched, freeing the address and data bus for other opera-
tions. Following the initiation of a write cycle, the device will
automatically write the latched data using an internal con-
trol timer. The end of a write cycle can be detected by
DATA POLLING of I/O7. Once th e end of a write cy cle has
been detected, a new access for a read or write can begin.
Atmel's AT28C040 has add itional features to ensure high
quality and manufacturability. The device utilizes internal
error correction for extended endurance and improved data
retention characteristics. An optional software data protec-
tion mechanism is available to guard against inadvertent
writes. The device also includes an extra 256 bytes of
EEPROM for device identification or tracking.
Bloc k Diagram
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause per manent dam-
age to the device . This is a stress ra ting onl y and
funct ion al ope ration of the device at these or an y
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditi ons f or e xtended p eriods ma y af fect dev ice
reliability.
Storage Temperature..................................... -65°C to +150°C
All Input Voltages
(including NC pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground.............................-0.6V to VCC + 0.6V
Voltage on OE and A9
with Respect to Ground...................................-0.6V to +13.5V
AT28C040
3
Device Operation
READ: The AT28C040 is accessed like a static RAM.
When CE and OE are low and WE is high, the data stored
at the memory l ocation determined by the address pins is
asserted on the outputs. The outputs are put in the high
impedance state when either CE or OE is high. This dual-
line control gives designers flexibility in preventing bus con-
tention in thei r systems.
BYTE WRITE: A lo w pulse on the W E or CE input with CE
or WE lo w (r espe c tive ly ) and OE high initiates a write cycle.
The address is latched on the fallin g edge of CE or WE ,
whichever occurs last. The data is latched by the first rising
edge of CE or WE. Onc e a byte w rite has been started, i t
will automatically time itself to completion. Once a pro-
grammin g operatio n has be en initi ated and for the du ration
of tWC, a read operation will effectively be a polling opera-
tion.
PAGE WR ITE: The page write oper ation of the AT28C040
allows 1 to 256 by tes of data to be written into the d evice
during a single internal programming per iod. A page write
operation is initiated in the same manner as a byte write;
the firs t byte wri tten can then be followe d by 1 to 255 addi-
tional bytes. Each successive byte must be written within
150 µs (tBLC) of the previous byte. If the tBLC limit is
exceed ed, the AT28C 040 will c ease accept ing data an d
commence the internal programming operation. All bytes
during a page write operation must reside on the same
page as d efined by the s tate of the A8 - A18 inputs. F or
each WE high to low transition during the page write opera-
tion, A8 - A18 must be the same.
The A0 to A7 inputs specify which bytes within the page are
to be written. The bytes may be loaded in any order and
may be altered within the same load period. Only bytes
which are specified for writing will be written; unnecessary
cycling of other bytes within the page does not occur.
DATA POLLING: The AT28C040 featu res DATA Polling to
indicate the end of a write cycle. During a byte or page
write cycle an attempted read of the last byte written will
result in the complement of the written data to be presented
on I/O7. Once the write cycle has been completed, true
data is valid on all outputs, and the next write cycle may
begin. D ATA Polling ma y beg in at anyt im e durin g the writ e
cycle.
TOGGLE BIT: In ad diti on to DATA Polling, the AT28C040
provid es a noth er m etho d for d ete rm ining the end of a wr it e
cycle. During the write operation, successive attempts to
read data from the device will result in I/O6 toggling
between one and zero. Once the write has completed, I/O6
will s top togglin g and valid dat a will be read. Re ading th e
toggle bit may begin at any time during the write cycle.
DATA PROTECTION: If precautions are not taken, inad-
verte nt writes may occur duri ng transi tions of th e host sys-
tem power s upply. Atmel has inco rporated both h ardware
and software features that will protect the memory against
inadvertent writes.
HARDWARE PR OTECTION: Hardware features protect
against inadvertent writes to the AT28C040 in the following
ways: (a) VCC sense - if VCC is below 3.8V (typical) the write
function is inhibited; (b) VCC power-on delay - once VCC has
reached 3.8V the device will automatically time out 5 ms
(typical) before allowing a write: (c) write inhibit - holding
any one of OE low, CE high or WE high inhibits write
cycles; (d) noise filter - pulses of less than 15 ns (typical)
on the WE or CE inputs will not initiate a write cycle.
SOFTWARE DATA PROTECTION: A software controlled
data protection feature has been implemented on the
AT28C040. When enabled, the software data protection
(SDP), will prevent inadvertent writes. The SDP feature
may be enabled or disabled by the user; the AT28C040 is
shipped from Atmel with SDP disabled.
SDP is enabled when the host system issues a series of
three write commands; three specific bytes of data are writ-
ten to three specific addresses (refer to Software Data Pro-
tection Algorithm). After writing the 3-byte command
sequenc e and after t WC, the entire AT 28C040 will be pro-
tected against inadvertent write o perations. It should be
noted th at on ce protec ted, the h ost c an sti ll perfor m a b yte
or page write to the AT28C040 . To do so, the same 3-by te
command sequence used to enable SDP must precede the
data to be written.
Once se t, SDP will remain ac tive unless the disabl e com-
mand seq uen ce is i ssue d. P owe r trans iti ons d o not disabl e
SDP, and SDP will p rote ct th e AT2 8C040 during powe r-up
and power-d own c ond iti ons . A ll com man d s eque nc es mus t
conform to the page write timing specifications. The data in
the enable and disable command sequences is not writ ten
to the device, and the memory addresses used in the
sequenc e may be written with d ata in eit her a byte or page
write operation.
After setting SDP, any attempt to write to the device without
the 3-byte comm and sequence will star t the internal write
timer s. No data will be wr itten to the de vice; h oweve r, for
the duration of tWC, read operations will effectively be poll-
ing operations.
DEVICE IDENTIFICATION: An extra 256 bytes of
EEPROM memory are available to the user for device iden-
tification. By raising A9 to 12V ± 0.5V and using address
locations 7FF80H to 7FFFFH, the bytes may be written to
or read from in the same manner as the regular memory
array.
OPTIONAL CHIP ERASE MODE: The entire device can
be er ased using a 6 -byte sof tware er ase c ode. Plea se see
Software Chip Erase application note for details.
AT28C040
4
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
DC and AC Oper ating Range
AT28C040-20 AT28C040-25
Operation Operation
Read Program Read Program
Operating
Temperature
(Case)
Commercial 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C
Industrial -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C
Extended -55°C - 125°C -40°C - 85°C -55°C - 125°C -40°C - 85°C
VCC Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%
Operating Modes
Mode CE OE WE I/O
Read VIL VIL VIH DOUT
Write(2) VIL VIH VIL DIN
Standby/Write Inhibit VIH X(1) X High Z
Write Inhibit X X VIH
Write Inhibit X VIL X
Output Disable X VIH X High Z
DC Characteristics
Symbol Parameter Condition Min Max Units
ILI Input Load Current VIN = 0V to VCC + 1V 10 µA
ILO Output Leakage Current VI/O = 0V to VCC 10 µA
ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC + 1V 3 mA
ISB2 VCC Standby Current TTL CE = 2.0V to VCC + 1V 3 mA
ICC VCC Active Current f = 5 MHz; IOUT = 0 mA 80 mA
VIL Input Low Voltage 0.8 V
VIH Input High Voltage 2.0 V
VOL Output Low Voltage IOL = 2.1 mA 0.45 V
VOH1 Output High Voltage IOH = -400 µA2.4V
V
OH2 Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V
AT28C040
5
AC Read Waveforms(1)(2)(3)(4)
Note: 1. CE May be delayed up to tACC - tCE after the address transition wihtout impact on tACC.
2. OE may be delayed up to tCE - tOE afte r the f alli ng edge of CE without impact on t CE or by tACC - tOE after an ad dre ss c han ge
withou t impa ct on tACC.
3. tDF is specified from OE or CE, whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Measurement Level
tR, tF < 5 ns
Output Test Load
Note: 1. This parameter is characterized and is not 100% tested.
AC Read Characteristics
Symbol Parameter
AT28C040-20 AT28C040-25
UnitsMin Max Min Max
tACC Address to Output Delay 200 250 ns
tCE(1) CE to Output Delay 200 250 ns
tOE(2) OE to Output Delay 0 55 0 55 ns
tDF(3)(4) CE or OE to Output Float 0 55 0 55 ns
tOH Output Hold from OE, CE or Address, whichever occurred first 0 0 ns
Pin Capacitance
f = 1 MHz, T = 2 5°C(1)
Symbol Typ Max Units Conditions
CIN 410pFV
IN = 0V
COUT 812pFV
OUT = 0V
AT28C040
6
AC Write Waveforms
WE Controlled
CE Controlled
AC Write Characteristics
Symbol Parameter Min Max Units
tAS, tOES Address, OE Set-up Time 0 ns
tAH Address Hold Time 50 ns
tCS Chip Select Set-up Time 0 ns
tCH Chip Select Hold Time 0 ns
tWP Write Pulse Width (WE or CE) 100 ns
tDS Data Set-up Time 50 ns
tDH, tOEH Data, OE Hold Time 0 ns
AT28C040
7
Page Mode Write Waveforms(1)(2)
Notes: 1. A8 through A18 must specify the page address during each high to low transition of WE (or CE).
2. OE must be high only when WE and CE are both low.
Page Mode Characteristics
Symbol Parameter Min Max Units
tWC Write Cycle Time 10 ms
tAS Address Set-up Time 0 ns
tAH Address Hold Time 50 ns
tDS Data Set-up Time 50 ns
tDH Data Hold Time 0 ns
tWP Write Pulse Width 100 ns
tBLC Byte Load Cycle Time 150 µs
tWPH Write Pulse Width High 50 ns
AT28C040
8
Software Data
Protection Enable Algorithm(1)
Notes: 1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write
even if no other data is loaded.
3. Write Protec t state will be d eactivat ed at end of write
period even if no other data is loaded.
4. 1 to 256 by tes of data are loaded.
Software Data
Protection Disable Algorithm(1)
Software Protected Program Cycle Waveform(1)(2)(3)
Notes: 1. A0 - A14 must conform to the addressing sequence for the first 3 bytes as shown above.
2. After the com mand sequen ce has been iss ued and a page write op eration f ol low s, the page ad dress inpu ts (A8 - A18) must
be the same for each high to low transition of WE (or CE).
3. OE must be high only when WE and CE are both low.
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD LAST BYTE
TO
LAST ADDRESS ENTER DATA
PROTECT STATE
WRITES ENABLED(2)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 20
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD LAST BYTE
TO
LAST ADDRESS
LOAD DATA 55
TO
ADDRESS 2AAA
EXIT DATA
PROTECT STATE(3)
AT28C040
9
Notes: 1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
Data Polling Wavefo rms
Notes: 1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
Data Polling Characteristics(1)
Symbol Parameter Min Typ Max Units
tDH Data Hold Time 10 ns
tOEH OE Hold Time 10 ns
tOE OE to Output Delay(2) ns
tWR Write Recovery Time 0 ns
Toggle Bit Characteristics(1)
Symbol Parameter Min Typ Max Units
tDH Data Hold Time 10 ns
tOEH OE Hold Time 10 ns
tOE OE to Output Delay(2) ns
tOEHP OE High Pulse 150 ns
tWR Write Recovery Time 0 ns
AT28C040
10
Note: 1. See Valid Part Numbers.
Order ing In formation(1)
tACC
(ns)
ICC (mA)
Ordering Code Pa ckage Operation RangeActive Standby
200 80 3 AT28C040-20BC
AT28C040-20FC
AT28C040-20LC
32B
32F
44L
Commercial
(0° to 70°C)
80 3 AT28C040-20BI
AT28C040-20FI
AT28C040-20LI
32B
32F
44L
Industrial
(-40° to 85°C)
80 3 AT28C040-20BI SL703
AT28C040-20FI SL703
AT28C040-20LI SL703
32B
32F
44L
Extended
(See DC and AC Operating
Range Table)
250 80 3 AT28C040-25BC
AT28C040-25FC
AT28C040-25LC
32B
32F
44L
Commercial
(0° to 70°C)
80 3 AT28C040-25BI
AT28C040-25FI
AT28C040-25LI
32B
32F
44L
Industrial
(-40° to 85°C)
80 3 AT28C040-25BI SL703
AT28C040-25FI SL703
AT28C040-25LI SL703
32B
32F
44L
Extended
(See DC and AC Operating
Range Table)
Valid Part Numbers
The following table lists standard Atmel products that can be ordered.
Device Numbers Speed Package and Temperature Combinations
AT28C040 20 BC, BI, FC, FI, LC, LI, BI SL703, FI SL703, LI SL703
AT28C040 25 BC, BI, FC, FI, LC, LI, BI SL703, FI SL703, LI SL703
Die Products
Reference Section: Parallel EEPROM Die Products
Packag e Type
32B 32-Lead, 0.600" Wide, Ceramic Side Braze Dual Inline (Side Braze)
32F 32-Lead, Non- Windowed, Ceramic Bottom-Brazed Flat Package (Fl atpack)
44L 44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
AT28C040
11
Packaging Information
PIN #1 ID .370(9.40)
.270(6.86)
.019(.482)
.015(.381)
.050(1.27) BSC
.045(1.14) MAX
.120(3.05)
.098(2.49)
.045(1.14)
.026(.660)
.072(1.82)
.030(0.76)
.408(10.4)
.355(9.02)
.006(.152)
.004(.101)
.488(12.4)
.472(12.0)
.829(21.1)
.811(20.6)
*Ceramic lid standard unless specified.
32B, 32-Lead, 0.600" Wide, Ceramic Side Braze
Dual Inline (Side Braze)
Dimensions in Inches and (Millimeters)
32F, 32-Lead, Non-Windowed, Ceramic Bottom-
Brazed Flat Package (Flatpack)
Dimension in Inches and (Millimeters)
JEDEC OUTLINE MO-115
44L, 44-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-5
© Atmel Corporation 1998.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Companys standard war-
ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for
any errors which may appear in this document, reserves the r ight to change devices or specifications detailed herein at any time without
notice, and does not make any com mitment to update the infor mation contained herein. No licenses to patents or other intellectual prop-
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not authorized for use as cr itical components in life suppor t devices or systems.
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Ter ms and product names in this document may be trademarks of others.
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0542B–10/98/xM