AGLE600V5-FFG256I - Microsemi Corp.

October 2008 I

IGLOOe Low-Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

• 1.2 V to 1.5 V Core Voltage Support for Low Power

• Supports Single-Voltage System Operation

• Low-Power Active FPGA Operation

• Flash*Freeze Technology Enables Ultra-Low Power

Consumption while Maintaining FPGA Content

• Flash*Freeze Pin Allows Easy Entry to / Exit from Ultra-Low-

Power Flash*Freeze Mode

High Capacity

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Live-at-Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

•FlashLock

® to Secure FPGA Contents

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

Pro (Professional) I/O

• 700 Mbps DDR, LVDS-Capable I/Os

•1.2

V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—Up to 8 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II

• I/O Registers on Input, Output, and Enable Paths

• Programmable Output Slew Rate and Drive Strength

• Programmable Input Delay

• Schmitt Trigger Option on Single-Ended Inputs

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the IGLOO®e Family

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase Shift, Multiply/Divide, Delay

Capabilities, and External Feedback

• Wide Input Frequency Range (1.5 MHz up to 250 MHz)

Embedded Memory

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

ARM Processor Support in IGLOOe FPGAs

• M1 IGLOOe Devices—Cortex™-M1 Soft Processor Available

with or without Debug

IGLOOe Product Family

IGLOOe Devices AGLE600 AGLE3000

ARM-Enabled IGLOOe Devices M1AGLE3000

System Gates 600 k 3 M

VersaTiles (D-flip-flops) 13,824 75,264

Quiescent Current (typical) in Flash*Freeze Mode (µW) 49 137

RAM kbits (1,024 bits) 108 504

4,608-Bit Blocks 24 112

FlashROM Bits 1 k 1 k

Secure (AES) ISP Yes Yes

CCCs with Integrated PLLs 66

VersaNet Globals118 18

I/O Banks 88

Maximum User I/Os 270 620

Package Pins

FBGA FG256, FG484 FG484, FG896

Notes:

1. Refer to the Cortex-M1 Handbook for more information.

2. Six chip (main) and twelve quadrant global networks are available.

3. For devices supporting lower densities, refer to the IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology handbook.

v1.2

II v1.2

I/Os Per Package1

IGLOOe Devices AGLE600 AGLE3000

ARM-Enabled IGLOOe Devices M1AGLE3000

Package

I/O Types

Single-Ended

I/O1Differential

I/O Pairs

Single-Ended

I/O1Differential

I/O Pairs

FG256 165 79 – –

FG484 270 135 341 168

FG896 – – 620 310

Notes:

1. When considering migrating your design to a lower- or higher-density device, refer to the IGLOOe Low-Power Flash

FPGAs with Flash*Freeze Technology handbook to ensure compliance with design and board migration requirements.

2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.

3. For AGLE3000 devices, the usage of certain I/O standards is limited as follows:

– SSTL3(I) and (II): up to 40 I/Os per north or south bank

– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank

– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank

4. FG256 and FG484 are footprint-compatible packages.

5. When using voltage-referenced I/O standards, one I/O pin should be assigned as a voltage-referenced pin (VREF) per

minibank (group of I/Os). When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not as a regular

I/O, the number of single-ended user I/Os available is reduced by one.

6. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not as a regular I/O, the number of single-

ended user I/Os available is reduced by one.

7. "G" indicates RoHS-compliant packages. Refer to "IGLOOe Ordering Information" on page III for the location of the

"G" in the part number.

IGLOOe FPGAs Package Sizes Dimensions

Package FG256 FG484 FG896

Length × Width (mm × mm) 17 × 17 23 × 23 31 × 31

Nominal Area (mm2)289 529 961

Pitch (mm) 111

Height (mm) 1.6 2.23 2.23

IGLOOe Low-Power Flash FPGAs

v1.2 III

IGLOOe Ordering Information

Notes:

1. Marking Information: IGLOO V2 devices do not have V2 marking, but IGLOO V5 devices are marked accordingly.

2. The DC and switching characteristics for the –F speed grade targets are based only on simulation. The characteristics

provided for the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be

added and will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial

temperature range.

AGLE3000 FG

Part Number

Speed Grade

Blank = Standard

F = 20% Slower than Standard*

Package Type

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

896 I

Package Lead Count

Application (Temperature Range)

Blank = Commercial (0°C to +70°C Ambient Temperature)

I=Industrial (–40°C to +85°C Ambient Temperature)

PP = Pre-Production

ES = Engineering Sample (Room Temperature Only)

600,000 System Gates

AGLE600 =

3,000,000 System Gates

AGLE3000 =

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS-Compliant Packaging

IGLOOe Devices

3,000,000 System Gates

Supply Voltage

2 = 1.2 V to 1.5 V

5 = 1.5 V only

IGLOOe Devices with Cortex-M1

M1AGLE3000 =

IV v1.2

Temperature Grade Offerings

Speed Grade and Temperature Grade Matrix

References made to IGLOOe devices also apply to ARM-enabled IGLOOe devices. The ARM-enabled part numbers start with

M1 (Cortex-M1).

Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx.

Package

AGLE600 AGLE3000

M1AGLPE3000

FG256 C, I –

FG484 C, I C, I

FG896 –C, I

Note: C = Commercial temperature range: 0°C to 70°C ambient temperature.

I = Industrial temperature range: –40°C to 85°C ambient temperature.

Temperature Grade –F 1Std.

C 2✓✓

I 3–✓

Notes:

1. The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some

restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only

supported in the commercial temperature range.

2. C = Commercial temperature range: 0°C to 70°C ambient temperature.

3. I = Industrial temperature range: –40°C to 85°C ambient temperature.

v1.2 1-1

1 – IGLOOe Device Family Overview

General Description

The IGLOOe family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA,

a single-chip solution, small footprint packages, reprogrammability, and an abundance of

advanced features.

The Flash*Freeze technology used in IGLOOe devices enables entering and exiting an ultra-low-

power mode while retaining SRAM and register data. Flash*Freeze technology simplifies power

management through I/O and clock management with rapid recovery to operation mode.

The Low Power Active capability (static idle) allows for ultra-low-power consumption while the

IGLOOe device is completely functional in the system. This allows the IGLOOe device to control

system power management based on external inputs (e.g., scanning for keyboard stimulus) while

consuming minimal power.

Nonvolatile flash technology gives IGLOOe devices the advantage of being a secure, low power,

single-chip solution that is live at power-up (LAPU). IGLOOe is reprogrammable and offers time-to-

market benefits at an ASIC-level unit cost.

These features enable designers to create high-density systems using existing ASIC or FPGA design

flows and tools.

IGLOOe devices offer 1 kbit of on-chip, programmable, nonvolatile FlashROM storage as well as

clock conditioning circuitry based on 6 integrated phase-locked loops (PLLs). IGLOOe devices have

up to 3 million system gates, supported with up to 504 kbits of true dual-port SRAM and up to 620

user I/Os.

M1 IGLOOe devices support the high-performance, 32-bit Cortex-M1 processor developed by ARM

for implementation in FPGAs. Cortex-M1 is a soft processor that is fully implemented in the FPGA

fabric. It has a three-stage pipeline that offers a good balance between low-power consumption

and speed when implemented in an M1 IGLOOe device. The processor runs the ARMv6-M

instruction set, has a configurable nested interrupt controller, and can be implemented with or

without the debug block. Cortex-M1 is available for free from Actel for use in M1 IGLOOe FPGAs.

The ARM-enabled devices have Actel ordering numbers that begin with M1AGLE and do not

support AES decryption.

Flash*Freeze Technology

The IGLOOe device offers unique Flash*Freeze technology, allowing the device to enter and exit

ultra-low-power Flash*Freeze mode. IGLOOe devices do not need additional components to turn

off I/Os or clocks while retaining the design information, SRAM content, and registers. Flash*Freeze

technology is combined with in-system programmability, which enables users to quickly and easily

upgrade and update their designs in the final stages of manufacturing or in the field. The ability of

IGLOOe V2 devices to support a wide range of core voltage (1.2 V to 1.5 V) allows further reduction

in power consumption, thus achieving the lowest total system power.

When the IGLOOe device enters Flash*Freeze mode, the device automatically shuts off the clocks

and inputs to the FPGA core; when the device exits Flash*Freeze mode, all activity resumes and

data is retained.

The availability of low-power modes, combined with reprogrammability, a single-chip and single-

voltage solution, and availability of small-footprint, high pin-count packages, make IGLOOe

devices the best fit for portable electronics.

IGLOOe Device Family Overview

1-2 v1.2

Flash Advantages

Low Power

Flash-based IGLOOe devices exhibit power characteristics similar to those of an ASIC, making them

an ideal choice for power-sensitive applications. IGLOOe devices have only a very limited power-on

current surge and no high-current transition period, both of which occur on many FPGAs.

IGLOOe devices also have low dynamic power consumption to further maximize power savings;

power is even further reduced by the use of a 1.2 V core voltage.

Low dynamic power consumption, combined with low static power consumption and Flash*Freeze

technology, gives the IGLOOe device the lowest total system power offered by any FPGA.

Security

The nonvolatile, flash-based IGLOOe devices do not require a boot PROM, so there is no vulnerable

external bitstream that can be easily copied. IGLOOe devices incorporate FlashLock, which provides

a unique combination of reprogrammability and design security without external overhead,

advantages that only an FPGA with nonvolatile flash programming can offer.

IGLOOe devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed

intellectual property and configuration data. In addition, all FlashROM data in IGLOOe devices can

be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher

encryption standard. AES was adopted by the National Institute of Standards and Technology

(NIST) in 2000 and replaces the 1977 DES standard. IGLOOe devices have a built-in AES decryption

engine and a flash-based AES key that make them the most comprehensive programmable logic

device security solution available today. IGLOOe devices with AES-based security allow for secure,

remote field updates over public networks such as the Internet, and ensure that valuable IP

remains out of the hands of system overbuilders, system cloners, and IP thieves. The contents of a

programmed IGLOOe device cannot be read back, although secure design verification is possible.

Security, built into the FPGA fabric, is an inherent component of the IGLOOe family. The flash cells

are located beneath seven metal layers, and many device design and layout techniques have been

used to make invasive attacks extremely difficult. The IGLOOe family, with FlashLock and AES

security, is unique in being highly resistant to both invasive and noninvasive attacks. Your valuable

IP is protected and secure, making remote ISP possible. An IGLOOe device provides the most

impenetrable security for programmable logic designs.

Single Chip

Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,

the configuration data is an inherent part of the FPGA structure, and no external configuration

data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based

IGLOOe FPGAs do not require system configuration components such as EEPROMs or

microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB

area, and increases security and system reliability.

Live at Power-Up

The Actel flash-based IGLOOe devices support Level 0 of the LAPU classification standard. This

feature helps in system component initialization, execution of critical tasks before the processor

wakes up, setup and configuration of memory blocks, clock generation, and bus activity

management. The LAPU feature of flash-based IGLOOe devices greatly simplifies total system

design and reduces total system cost, often eliminating the need for CPLDs and clock generation

PLLs. In addition, glitches and brownouts in system power will not corrupt the IGLOOe device's

flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when

system power is restored. This enables the reduction or complete removal of the configuration

PROM, expensive voltage monitor, brownout detection, and clock generator devices from the PCB

design. Flash-based IGLOOe devices simplify total system design and reduce cost and design risk

while increasing system reliability and improving system initialization time.

IGLOOe Low-Power Flash FPGAs

v1.2 1-3

Reduced Cost of Ownership

Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike

SRAM-based FPGAs, Flash-based IGLOOe devices allow all functionality to be live at power-up; no

external boot PROM is required. On-board security mechanisms prevent access to all the

programming information and enable secure remote updates of the FPGA logic. Designers can

perform secure remote in-system reprogramming to support future design iterations and field

upgrades with confidence that valuable intellectual property cannot be compromised or copied.

Secure ISP can be performed using the industry-standard AES algorithm. The IGLOOe family device

architecture mitigates the need for ASIC migration at higher user volumes. This makes the IGLOOe

family a cost-effective ASIC replacement solution, especially for applications in the consumer,

networking/communications, computing, and avionics markets.

Firm-Error Immunity

Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,

strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the

configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.

These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be

a complete system failure. Firm errors do not exist in the configuration memory of IGLOOe flash-

based FPGAs. Once it is programmed, the flash cell configuration element of IGLOOe FPGAs cannot

be altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft) errors

occur in the user data SRAM of all FPGA devices. These can easily be mitigated by using error

detection and correction (EDAC) circuitry built into the FPGA fabric.

Advanced Flash Technology

The IGLOOe family offers many benefits, including nonvolatility and reprogrammability, through

an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS

design techniques are used to implement logic and control functions. The combination of fine

granularity, enhanced flexible routing resources, and abundant flash switches allows for very high

logic utilization without compromising device routability or performance. Logic functions within

the device are interconnected through a four-level routing hierarchy.

IGLOOe family FPGAs utilize design and process techniques to minimize power consumption in all

modes of operation.

Advanced Architecture

The proprietary IGLOOe architecture provides granularity comparable to standard-cell ASICs. The

IGLOOe device consists of five distinct and programmable architectural features (Figure 1-1 on

page 4):

• Flash*Freeze technology

• FPGA VersaTiles

• Dedicated FlashROM

• Dedicated SRAM/FIFO memory

• Extensive CCCs and PLLs

• Pro I/O structure

The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input

logic function, a D-flip-flop (with or without enable), or a latch by programming the appropriate

flash switch interconnections. The versatility of the IGLOOe core tile as either a three-input lookup

table (LUT) equivalent or a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric.

The VersaTile capability is unique to the Actel ProASIC® family of third-generation-architecture

flash FPGAs. VersaTiles are connected with any of the four levels of routing hierarchy. Flash

switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect

programming. Maximum core utilization is possible for virtually any design.

IGLOOe Device Family Overview

1-4 v1.2

In addition, extensive on-chip programming circuitry allows for rapid, single-voltage (3.3 V)

programming of IGLOOe devices via an IEEE 1532 JTAG interface.

Flash*Freeze Technology

The IGLOOe device has an ultra-low power static mode, called Flash*Freeze mode, which retains all

SRAM and register information and can still quickly return to normal operation. Flash*Freeze

technology enables the user to quickly (within 1 µs) enter and exit Flash*Freeze mode by activating

the Flash*Freeze pin while all power supplies are kept at their original values. In addition, I/Os and

global I/Os can still be driven and can be toggling without impact on power consumption, clocks

can still be driven or can be toggling without impact on power consumption, and the device retains

all core registers, SRAM information, and states. I/O states are tristated during Flash*Freeze mode

or can be set to a certain state using weak pull-up or pull-down I/O attribute configuration. No

power is consumed by the I/O banks, clocks, JTAG pins, or PLL in this mode.

Flash*Freeze technology allows the user to switch to active mode on demand, thus simplifying the

power management of the device.

The Flash*Freeze pin (active low) can be routed internally to the core to allow the user's logic to

decide when it is safe to transition to this mode. It is also possible to use the Flash*Freeze pin as a

regular I/O if Flash*Freeze mode usage is not planned, which is advantageous because of the

Figure 1-1 • IGLOOe Device Architecture Overview

4,608-Bit Dual-Port SRAM

or FIFO Block

VersaTile

RAM Block

CCC

Pro I/Os

4,608-Bit Dual-Port SRAM

or FIFO Block

RAM Block

ISP AES

Decryption*

User Nonvolatile

FlashRom

Flash*Freeze

Technology

Charge

Pumps

IGLOOe Low-Power Flash FPGAs

v1.2 1-5

inherent low power static and dynamic capabilities of the IGLOOe device. Refer to Figure 1-2 for an

illustration of entering/exiting Flash*Freeze mode.

VersaTiles

The IGLOOe core consists of VersaTiles, which have been enhanced beyond the ProASICPLUS® core

tiles. The IGLOOe VersaTile supports the following:

• All 3-input logic functions—LUT-3 equivalent

• Latch with clear or set

• D-flip-flop with clear or set

• Enable D-flip-flop with clear or set

Refer to Figure 1-3 for VersaTile configurations.

User Nonvolatile FlashROM

Actel IGLOOe devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM

can be used in diverse system applications:

• Internet protocol addressing (wireless or fixed)

• System calibration settings

• Device serialization and/or inventory control

• Subscription-based business models (for example, set-top boxes)

• Secure key storage for secure communications algorithms

• Asset management/tracking

• Date stamping

• Version management

The FlashROM is written using the standard IGLOOe IEEE 1532 JTAG programming interface. The

core can be individually programmed (erased and written), and on-chip AES decryption can be used

selectively to securely load data over public networks, as in security keys stored in the FlashROM for

a user design.

Figure 1-2 • IGLOOe Flash*Freeze Mode

Actel IGLOOe

FPGA

Flash*Freeze

Mode Control

Flash*Freeze Pin

Figure 1-3 • VersaTile Configurations

LUT-3

Data Y

CLK

Enable

CLR

D-FF

Data Y

CLK

CLR

D-FF

LUT-3 Equivalent D-Flip-Flop with Clear or Set Enable D-Flip-Flop with Clear or Set

IGLOOe Device Family Overview

1-6 v1.2

The FlashROM can be programmed via the JTAG programming interface, and its contents can be

read back either through the JTAG programming interface or via direct FPGA core addressing. Note

that the FlashROM can only be programmed from the JTAG interface and cannot be programmed

from the internal logic array.

The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-

byte basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8

banks and which of the 16 bytes within that bank are being read. The three most significant bits

(MSBs) of the FlashROM address determine the bank, and the four least significant bits (LSBs) of

the FlashROM address define the byte.

The Actel IGLOOe development software solutions, Libero® Integrated Design Environment (IDE)

and Designer, have extensive support for the FlashROM. One such feature is auto-generation of

sequential programming files for applications requiring a unique serial number in each part.

Another feature allows the inclusion of static data for system version control. Data for the

FlashROM can be generated quickly and easily using Actel Libero IDE and Designer software tools.

Comprehensive programming file support is also included to allow for easy programming of large

numbers of parts with differing FlashROM contents.

SRAM and FIFO

IGLOOe devices have embedded SRAM blocks along their north and south sides. Each variable-

aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18, 512×9,

1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that can be

configured with different bit widths on each port. For example, data can be sent through a 4-bit

port and read as a single bitstream. The embedded SRAM blocks can be initialized via the device

JTAG port (ROM emulation mode) using the UJTAG macro.

In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the

SRAM block to be configured as a synchronous FIFO without using additional core VersaTiles. The

FIFO width and depth are programmable. The FIFO also features programmable Almost Empty

(AEMPTY) and Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The

embedded FIFO control unit contains the counters necessary for generation of the read and write

address pointers. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations.

PLL and CCC

IGLOOe devices provide designers with very flexible clock conditioning capabilities. Each member

of the IGLOOe family contains six CCCs, each with an integrated PLL.

The six CCC blocks are located at the four corners and the centers of the east and west sides. One

CCC (center west side) has a PLL.

The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs

located near the CCC that have dedicated connections to the CCC block.

The CCC block has these key features:

• Wide input frequency range (fIN_CCC) = 1.5 MHz up to 250 MHz

• Output frequency range (fOUT_CCC) = 0.75 MHz up to 250 MHz

• 2 programmable delay types for clock skew minimization

• Clock frequency synthesis

Additional CCC specifications:

• Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output

divider configuration.

• Output duty cycle = 50% ± 1.5% or better

• Low output jitter: worst case < 2.5% × clock period peak-to-peak period jitter when single

global network used

• Maximum acquisition time is 300 µs

• Exceptional tolerance to input period jitter—allowable input jitter is up to 1.5 ns

• Four precise phases; maximum misalignment between adjacent phases of 40 ps × 250 MHz /

fOUT_CCC

IGLOOe Low-Power Flash FPGAs

v1.2 1-7

Global Clocking

IGLOOe devices have extensive support for multiple clocking domains. In addition to the CCC and

PLL support described above, there is a comprehensive global clock distribution network.

Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three

quadrant global networks. The VersaNets can be driven by the CCC or directly accessed from the

core via multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for

rapid distribution of high-fanout nets.

Pro I/Os with Advanced I/O Standards

The IGLOOe family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.2 V,

1.5 V, 1.8 V, 2.5 V, and 3.3 V). IGLOOe FPGAs support 19 different I/O standards, including single-

ended, differential, and voltage-referenced. The I/Os are organized into banks, with eight banks

per device (two per side). The configuration of these banks determines the I/O standards

supported. Each I/O bank is subdivided into VREF minibanks, which are used by voltage-referenced

I/Os. VREF minibanks contain 8 to 18 I/Os. All the I/Os in a given minibank share a common VREF line.

Therefore, if any I/O in a given VREF minibank is configured as a VREF pin, the remaining I/Os in that

minibank will be able to use that reference voltage.

Each I/O module contains several input, output, and enable registers. These registers allow the

implementation of the following:

• Single-Data-Rate applications (e.g., PCI 66 MHz, bidirectional SSTL 2 and 3, Class I and II)

Double-Data-Rate applications (e.g., DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point

communications, and DDR 200 MHz SRAM using bidirectional HSTL Class II).

IGLOOe banks support M-LVDS with 20 multi-drop points.

IGLOOe Device Family Overview

1-8 v1.2

Part Number and Revision Date

Part Number 51700096-001-3

Revised October 2008

List of Changes

The following table lists critical changes that were made in the current version of the document.

Previous Version Changes in Current Version (v1.2) Page

v1.1

(June 2008)

The Quiescent Current values in the "IGLOOe Product Family" table were

updated.

v1.0

(April 2008)

As a result of the Libero IDE v8.4 release, Actel now offers a wide range of

core voltage support. The document was updated to change 1.2 V / 1.5 V to

1.2 V to 1.5 V.

N/A

51700096-001-1

(March 2008)

This document was divided into two sections and given a version number,

starting at v1.0. The first section of the document includes features, benefits,

ordering information, and temperature and speed grade offerings. The

second section is a device family overview.

N/A

51700096-001-0

(January 2008)

The "Low Power" section was updated to change "1.2 V and 1.5 V Core

Voltage" to "1.2 V and 1.5 V Core and I/O Voltage." The text "(from 25 µW)"

was removed from "Low-Power Active FPGA Operation."

1.2_V was added to the list of core and I/O voltages in the "Pro (Professional)

I/O" and "Pro I/Os with Advanced I/O Standards" sections.

I, 1-7

Advance v0.4

(December 2007)

This document was previously in datasheet Advance v0.4. As a result of

moving to the handbook format, Actel has restarted the version numbers.

The new version number is 51700096-001-0.

N/A

Advance v0.3

(September 2007)

Table 1 • IGLOOe Product Family was updated to change the maximum

number of user I/Os for AGLE3000.

Table 2 • IGLOOe FPGAs Package Sizes Dimensions is new. Package

dimensions were removed from the "I/Os Per Package1" table. The number

of I/Os was updated for FG896.

A note regarding marking information was added to "IGLOOe Ordering

Information".

iii

Advance v0.2

(July 2007)

Cortex-M1 device information was added to Cortex-M1 device information

was added to Table 1 • IGLOOe Product Family, the "I/Os Per Package1"

table, "IGLOOe Ordering Information", and Temperature Grade Offerings.

i, ii, iii, iv

Advance v0.1 The words "ambient temperature" were added to the temperature range in

the "IGLOOe Ordering Information", "Temperature Grade Offerings", and

"Speed Grade and Temperature Grade Matrix" sections.

iii, iv

IGLOOe Low-Power Flash FPGAs

v1.2 1-9

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