SFH 4000
Schnelle IR-Luminesze nzdi ode
High Speed Infrared Emitter
2004-01-28 1
Wesentliche Merkmale
• Hohe Ausgangsleistung: 35mW
• Sehr kleines Gehäuse:
(LxBxH) 1,7 mm x 0,8 mm x 0,65 mm
• Sehr kurze Schaltzeiten (10ns)
• Hohe Impulsbelastbarkeit
• IR Reflow Löten geeignet
• Gegurtet lieferbar
Anwendungen
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb, Lochstreifenleser
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Sensorik
• Alarm- und Sicherungssysteme
• IR-Freiraumübertragung
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms)
Radiant intensity grouping 1)
Ie (mW/sr)
1) gemessen bei einem Raumwink el Ω = 0. 01 s r / measu red at a solid ang le of Ω = 0.01 sr
SFH 4000 Q62702P5524 > 1.6 (typ. 4.4)
Features
• High output power: 35mW
• Very small package:
(LxWxH) 1.7 mm x 0.8 mm x 0.65 mm
• Very short switching times (10ns)
• High pulse handling capability
• Suitable for IR reflow soldering
• Available on tape and reel
Applications
• Miniature photointerrupters
• Industrial electronics
• For drive and control circuits
• Sensor technology
• Alarm and safety equipment
• IR free air transmission
2004-01-28 2
SFH 4000
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 …+ 100 °C
Sperrspannung
Reverse voltage VR3V
Durchlaßstrom
Forward current IF100 mA
Stoßstrom, τ = 10 µs, D = 0
Surge current IFSM 2.2 A
Verlustleistung
Power dissipation Ptot 180 mW
Wärmewiderstand Sperrschic ht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
450
≈ 250
K/W
K/W
SFH 4000
2004-01-28 3
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 m A
∆λ 40 nm
Abstrahlwinkel
Half angle ϕ± 80 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area L×B
L×W0.3 ×0.3 mm
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching tim es, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf10 ns
Kapazität,
Capacitance
VR = 0 V, f = 1 MHz
Co15 pF
Durchlaßspannung,
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µsVF
VF
1.5 (≤ 1.8)
3.2 (≤ 4.3) V
V
Sperrstrom,
Reverse current
VR = 3 V
IR0.01 (≤ 1) µA
Gesamtstrahlungsfluß,
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe35 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
TCI– 0.44 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 1.5 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ+ 0.2 nm/K
2004-01-28 4
SFH 4000
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
1.6
4.4 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ 20 mW/sr
SFH 4000
2004-01-28 5
Relati ve Sp ectral Emission
Irel = f (λ)
Forward Cu rrent
IF = f (VF) single pulse, tp = 20 µs
Radiation Characteristics Irel = f (ϕ)
OHF00777
nm800
Ιerel
λ
0
850 900 950 1000 1100
20
40
60
80
100
OHF00784
10
-3
V
mA
0
Ι
F
V
F
0.5 11.5 22.5 33.5 4.5
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
OHF00614
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse , tp = 20 µs
Permissible Pulse Ha ndl i ng
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ιe
Ιe 100 mA = f (IF)
e
e (100 mA)
mA
OHF00809
F
Ι
ΙΙ
10 40
10 10 110 23
10
10
-3
10
-2
10
10
-1
0
10
2
OHF00040
10
-5
F
I
T
P
t
=
D
P
t
T
p
t
F
I
0.005
0.01
0.02
0.05
D
10
-4
10
-3
10
-2
10
-1
10
0
10
1 2
10s
0.1
0.2
0.5
1
=
-1
10
5
1
10
10
0
5
A
Max. Permissible Forward Current
IF = f (TA)
2004-01-28
OHR00883
0
F
Ι
0
20
40
60
80
100
120
20 40 60 80 100 120
mA
˚C
TA
RthjA = 450 K/W
2004-01-28 6
SFH 4000
Maßzeichnung
Package Outlines
Maße werden wi e fo lgt angegeben: mm (inch) / Dimensio ns are s pecified as follow s: m m (inc h).
Package Epoxy, SmartLED (SCD 80)
Colour colourless, light diffused
Package marking Anode
GPLY6089
0.8 (0.031)
±0.1 (0.004)
Package
0.3 (0.012)
+0.05 (0.002)
-0.03 (0.001)
0.125 (0.005)
1.7 (0.067)
±0.1 (0.004)
7˚ max
+0.02 (0.001)
-0.05 (0.002)
0.65 (0.026)
5˚
1.3 (0.051)
±0.1 (0.004)
marking marking
Package
SFH 4000
2004-01-28 7
IR-Reflow Lötprofil (nach I PC 9501)
IR Reflow Soldering profile (acc. to IPC 9501)
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describe s the type of compon ent and shall not be considered as assur ed c haracteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Compo nents use d in life-support de vices or syste ms must be express ly authorize d for such purp ose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted
to cause t he fail ure of tha t life -suppo rt dev ice or s ystem, or to affe ct i ts saf ety or effecti venes s of t hat device o r sy stem.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assume th at the health of the user may be endangered.
OHLA0685
0:00
0
T
t
˚C
min
50
100
150
200
250
0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 5:30
2-3 K/s
2-3 K/s
T
= 183 ˚C = 70 s
t
max
T
= 245 ˚C
