Computers & Peripherals
HDTV Equipment
DVD Players
A/V Equipment
Satellite Radio
Cell Phones
PDA’s
Digital Still Cameras
Digital Camcorders
MP3 / Multimedia Players
Set Top Boxes
External Storage
DSL Modems
High Speed Data Ports
USB 2.0
IEEE 1394
HDMI
DVI
High Speed Ethernet
Infiniband®
Applications
The PolySurg™ 0603ESDA-MLP ESD Suppressors
protect valuable high-speed data circuits from ESD
damage without distorting data signals as a result of
its ultra-low (0.05pF typical) capacitance.
Description Ordering Information
Features & Benefits
Ultra-low capacitance (0.05pF typ.) ideal for high
speed data applications
Provides ESD protection with fast response time
(<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
Single-line, bi-directional device for placement flexibility
Low profile 0603/1608 design for board space savings
Low leakage current (<0.1nA typ.) reduces power consumption
1.25
(0.05)
0.50
(0.02)
0.90
(0.035)
The location in the circuit for the MLP series has to be carefully determined. For better performance, the device should be placed
as close to the signal input as possible and ahead of anyother component. Due to the high current associated with an ESD
event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common
ground).
Design Considerations
Catalog Number Packaging
0603ESDA-MLP7 5,000 pieces in paper tape on
7" (178mm) reel
Product Dimensions: mm [inches] Solder Pad Recommendation:
mm [inches]
RoHS
2002/95/EC
0603ESDA-MLP
MLP Series ESD Suppressor
Electrical Characteristics
Characteristic Value
Rated Voltage 30VDC maximum
Clamping Voltage135V typical
Trigger Voltage2300V typical
Capacitance (@1MHz) 0.05pF typ., 0.15pF max.
Attenuation Change (0-6GHz) -0.2dB typical
Leakage Current (@12VDC) <0.1nA typical
ESD Capability
IEC61000-4-2 Direct Discharge 8kV typical
IEC61000-4-2 Air Discharge 15kV typical
ESD Pulse Withstand1>1000 typical
Notes:
1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A)
measured 30ns after initiation of pulse.
2. Trigger measurement made using Transmission Line Pulse
(TLP) method.
3. Minor shifting in characteristics may be observed over
multiple ESD pulses at very rapid rate.
Environmental Specifications:
Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000 hours
Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycles
Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles
Mechanical Shock: EIA/IS-722 Para. 4.9
Vibration: EIA/IS-722 Para. 4.10
Resistance to Solvent: EIA/IS-722 Para. 4.11
Operating & Storage Temperature Range: -55°C to +125°C
Soldering Recommendations
Compatible with lead and lead-free solder reflowprocesses
Peak reflow temperatures and durations:
IR Reflow=260°Cmax for 10 sec. max.
Wave Solder = 260°C max. for 10 sec. max.
Recommended IR ReflowProfile:
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-800-544-2570
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Visit us on the web at:
www.cooperbussmann.com
0603ESDA-MLP 3/07
© Cooper Electronic
Technologies 2007
North America Europe
0603ESDA-MLP
MLP Series ESD Suppressor