CYRF69103
Programmable Radio on Chip Low Power
Cypress Semiconductor Corporation 198 Champion Court San Jose,CA 95134-1709 408-943-2600
Document #: 001-07611 Rev *F Revised February 26, 2010
1. PRoC™ LP Features
Single Device, Two Functions
8-bit Flash based MCU function and 2.4 GHz radio
transceiver function in a single device.
Flash Based Microcontroller Function
M8C based 8-bit CPU, optimized for Human Interface
Devices (HID) applications
256 Bytes of SRAM
8 Kbytes of Flash memory with EEPROM emulation
In-System reprogrammable
CPU speed up to 12 MHz
16-bit free running timer
Low power wakeup timer
12-bit Programmable Interval Timer with interrupts
Watchdog timer
Industry leading 2.4 GHz Radio Transceiver Function
Operates in the unlicensed worldwide Industrial, Scientific,
and Medical (ISM) band (2.4 GHz to 2.483 GHz)
DSSS data rates of up to 250 Kbps
GFSK data rate of 1 Mbps
–97 dBm receive sensitivity
Programmable output power up to +4 dBm
Auto Transaction Sequencer (ATS)
Framing CRC and Auto ACK
Received Signal Strength Indication (RSSI)
Automatic Gain Control (AGC)
Component Reduction
Integrated 1.8V boost converter
GPIOs that require no external components
Operates off a single crystal
Flexible I/O
2 mA source current on all GPIO pins. Configurable 8 mA
or 50 mA/pin current sink on designated pins
Each GPIO pin supports high impedance inputs,
configurable pull up, open drain output, CMOS/TTL inputs,
and CMOS output
Maskable interrupts on all I/O pins
Operating Voltage from 1.8V to 3.6V DC
Operating Temperature from 0 to 70°C
Pb-free 40-Pin QFN Package
Advanced Development Tools based on Cypress’s PSoC®
Tools
2. Logic Block Diagram
Microcontroller
Function
Radio
Function
RFn
RFp
RFbias
Xtal
12 MHz
VReg
VBat0
RESV
Vdd
470 nF
P0_1,3,4,7
P1_0:2,6:7
P2_0:1
470nF
GND
. . . . . . .
IRQ/GPIO
MISO/GPIO
XOUT/GPIO
PACTL/GPIO
GND
VCC
VDD_MICRO
P1.5/MOSI
P1.4/SCK
P1.3/nSS
RST
MOSI
SCK
nSS
VBat1
VBat2
VCC1
VCC2
VCC3
VIO
GND
. . . . .
2
5
4
L/D
10 µF
47µF
VCC
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CYRF69103
Document #: 001-07611 Rev *F Page 2 of 68
3. Contents
PRoC™ LP Features......................................................... 1
Logic Block Diagram........................................................ 1
Contents ............................................................................ 2
Applications ...................................................................... 3
Functional Description..................................................... 3
Functional Overview ......................................................... 3
2.4 GHz Radio Function .............................................. 3
Data Transmission Modes........................................... 3
Microcontroller Function .............................................. 3
Backward Compatibility ............................................... 4
DDR Mode................................................................... 4
SDR Mode.................................................................. 5
Pinouts .............................................................................. 6
Functional Block Overview.............................................. 7
2.4 GHz Radio............................................................. 7
Frequency Synthesizer................................................ 7
Baseband and Framer................................................. 7
Packet Buffers and Radio Configuration Registers ..... 8
Auto Transaction Sequencer (ATS) ............................ 8
Interrupts ..................................................................... 9
Clocks.......................................................................... 9
GPIO Interface ............................................................ 9
Power On Reset/Low Voltage Detect.......................... 9
Timers ......................................................................... 9
Power Management .................................................... 9
Low Noise Amplifier (LNA) and Received
Signal Strength Indication (RSSI) ............................... 11
SPI Interface.................................................................... 11
3-Wire SPI Interface.................................................. 11
4-Wire SPI Interface.................................................. 11
SPI Communication and Transactions ...................... 12
SPI I/O Voltage References ...................................... 12
SPI Connects to External Devices ............................ 12
CPU Architecture............................................................ 12
CPU Registers........................................................... 13
Flags Register ........................................................... 13
Accumulator Register ................................................ 13
Index Register ........................................................... 14
Stack Pointer Register............................................... 14
CPU Program Counter High Register ....................... 14
CPU Program Counter Low Register ........................ 14
Addressing Modes ..........................................................15
Source Immediate ..................................................... 15
Source Direct .............................................................15
Source Indexed ......................................................... 15
Destination Direct ...................................................... 15
Destination Indexed................................................... 16
Destination Direct Source Immediate........................ 16
Destination Indexed Source Immediate .....................16
Destination Direct Source Direct ............................... 16
Source Indirect Post Increment................................. 17
Destination Indirect Post Increment .......................... 17
Instruction Set Summary............................................... 18
Memory Organization................................................. 19
Flash Program Memory Organization ....................... 19
Data Memory Organization ....................................... 20
Flash.......................................................................... 20
SROM........................................................................ 20
SROM Function Descriptions.................................... 21
Clocking .......................................................................... 24
SROM Table Read Description................................. 25
Clock Architecture Description .................................. 26
CPU Clock During Sleep Mode ................................. 30
Reset................................................................................. 31
Power On Reset........................................................ 32
Watchdog Timer Reset.............................................. 32
Sleep Mode...................................................................... 32
Sleep Sequence ........................................................ 32
Low Power in Sleep Mode......................................... 33
Wakeup Sequence.................................................... 33
Low Voltage Detect Control........................................... 35
POR Compare State ................................................. 36
ECO Trim Register.................................................... 36
General Purpose I/O Ports............................................. 37
Port Data Registers................................................... 37
GPIO Port Configuration ........................................... 38
GPIO Configurations for Low Power Mode ............... 43
Serial Peripheral Interface (SPI)................................ 44
SPI Data Register...................................................... 45
SPI Configure Register.............................................. 45
SPI Interface Pins...................................................... 47
Timer Registers .............................................................. 47
Registers ................................................................... 47
Interrupt Controller......................................................... 50
Architectural Description ............................................ 50
Interrupt Processing .................................................. 51
Interrupt Latency ....................................................... 51
Interrupt Registers..................................................... 51
Microcontroller Function Register Summary ............. 55
Radio Function Register Summary............................... 57
Absolute Maximum Ratings .......................................... 58
DC Characteristics (T = 25×C)....................................... 58
AC Characteristics ........................................................ 60
RF Characteristics.......................................................... 64
Ordering Information...................................................... 66
Package Handling........................................................... 66
Package Diagram............................................................ 66
Document History Page................................................. 67
Sales, Solutions, and Legal Information ...................... 68
Worldwide Sales and Design Support....................... 68
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4. Applications
The CYRF69103 PRoC LP is targeted for the following
applications:
Wireless HID devices:
Mice
Remote Controls
Presenter tools
Barcode scanners
POS terminal
General purpose wireless applications:
Industrial applications
Home automation
White goods
Consumer electronics
Toys
5. Functional Description
PRoC LP devices are integrated radio and microcontroller
functions in the same package to provide a dual-role single-chip
solution.
Communication between the microcontroller and the radio is
through the radio’s SPI interface.
6. Functional Overview
The CYRF69103 is a complete Radio System-on-Chip device,
providing a complete RF system solution with a single device and
a few discrete components. The CYRF69103 is designed to
implement low cost wireless systems operating in the worldwide
2.4 GHz Industrial, Scientific, and Medical (ISM) frequency band
(2.400 GHz to 2.4835 GHz).
6.1 2.4 GHz Radio Function
The SoC contains a 2.4 GHz 1 Mbps GFSK radio transceiver,
packet data buffering, packet framer, DSSS baseband controller,
Received Signal Strength Indication (RSSI), and SPI interface
for data transfer and device configuration.
The radio supports 98 discrete 1 MHz channels (regulations may
limit the use of some of these channels in certain jurisdictions).
In DSSS modes the baseband performs DSSS
spreading/despreading, while in GFSK Mode (1 Mb/s - GFSK)
the baseband performs Start of Frame (SOF), End of Frame
(EOF) detection, and CRC16 generation and checking. The
baseband may also be configured to automatically transmit
Acknowledge (ACK) handshake packets whenever a valid
packet is received.
When in receive mode, with packet framing enabled, the device
is always ready to receive data transmitted at any of the
supported bit rates, except SDR, enabling the implementation of
mixed-rate systems in which different devices use different data
rates. This also enables the implementation of dynamic data rate
systems, which use high data rates at shorter distances and/or
in a low moderate interference environment, and change to lower
data rates at longer distances and/or in high interference
environments.
The radio meets the following worldwide regulatory
requirements:
Europe:
ETSI EN 301 489-1 V1.4.1
ETSI EN 300 328-1 V1.3.1
North America:
FCC CFR 47 Part 15
Japan:
ARIB STD-T66
6.2 Data Transmission Modes
The radio supports four different data transmission modes:
In GFSK mode, data is transmitted at 1 Mbps, without any
DSSS
In 8DR mode, 1 byte is encoded in each PN code symbol
transmitted
In DDR mode, 2 bits are encoded in each PN code symbol
transmitted
In SDR mode, a single bit is encoded in each PN code symbol
transmitted
Both 64-chip and 32-chip data PN codes are supported. The four
data transmission modes apply to the data after the Start of
Packet (SOP). In particular, the packet length, data and CRC are
all sent in the same mode.
6.3 Microcontroller Function
The MCU function is an 8-bit Flash-programmable
microcontroller. The instruction set is optimized specifically for
HID and a variety of other embedded applications.
The MCU function has up to 8 Kbytes of Flash for user’s code
and up to 256 bytes of RAM for stack space and user variables.
In addition, the MCU function includes a Watchdog timer, a
vectored interrupt controller, a 16-bit Free Running Timer, and
12-bit Programmable Interrupt Timer.
The microcontroller has 15 GPIO pins grouped into multiple
ports. With the exception of the four radio function GPIOs, each
GPIO port supports high impedance inputs, configurable pull up,
open drain output, CMOS/TTL inputs and CMOS output. Up to
two pins support programmable drive strength of up to 50 mA.
Additionally, each I/O pin can be used to generate a GPIO
interrupt to the microcontroller. Each GPIO port has its own GPIO
interrupt vector with the exception of GPIO Port 0. GPIO Port 0
has two dedicated pins that have independent interrupt vectors
(P0.3 - P0.4).
The microcontroller features an internal oscillator.
The PRoC LP includes a Watchdog timer, a vectored interrupt
controller, a 12-bit programmable interval timer with configurable
1 ms interrupt and a 16-bit free running timer.
In addition, the CYRF69103 IC has a Power Management Unit
(PMU), which enables direct connection of the device to any
battery voltage in the range 1.8V to 3.6V. The PMU conditions
the battery voltage to provide the supply voltages required by the
device and may supply external devices.
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6.4 Backward Compatibility
The CYRF69103 IC is fully interoperable with the main modes of
the first generation Cypress radios namely the CYWUSB6934
-LS and CYWWUSB6935-LR devices. The 62.5 kbps mode is
supported by selecting 32 chip DDR mode. Similarly, the
15.675 kbps mode is supported by selecting 64 chip SDR mode
In this method, a suitably configured CYRF69103 IC device may
transmit data to or receive data from a first generation device, or
both. Backwards compatibility requires disabling the SOP,
length, and CRC16 fields.
This section provides the different configurations of the registers
and firmware that enable a new generation radio to communicate
with a first generation radio. There are two possible modes: SDR
and DDR mode (8-DR and GFSK modes are not present in the
first generation radio). The second generation radio must be
initialized using the RadioInitAPI of the LP radio driver and then
the following registers’ bits need to be configured to the given
Byte values. Essentially, the following deactivates the added
features of the second generation radio and takes it down to the
level of the first generation radio. The data format, data rates,
and the PN codes used are recognizable by the first generation
radio.
6.5 DDR Mode
Table 6-1. DDR Mode
Register Value Description
TX_CFG_ADR 0X16 32 chip PN Code, DDR, PA = 6
RX_CFG_ADR 0X4B AGC is enabled. LNA and attenuator are disabled. Fast turnaround is disabled, the
device uses high side receive injection and Hi-Lo is disabled. Overwrite to receive
buffer is enabled and the RX buffer is configured to receive eight bytes maximum.
XACT_CFG_ADR 0X05 AutoACK is disabled. Forcing end state is disabled. The device is configured to
transition to Idle mode after a Receive or Transmit. ACK timeout is set to 128 µs.
FRAMING_CFG_ADR 0X00 All SOP and framing features are disabled. Disable LEN_EN=0 if EOP is needed.
TX_OVERRIDE_ADR 0X04 Disable Transmit CRC-16.
RX_OVERRIDE_ADR 0X14 The receiver rejects packets with a zero seed. The Rx CRC-16 Checker is disabled
and the receiver accepts bad packets that do not match the seed in CRC_seed
registers. This helps in communication with the first generation radio that does not
have CRC capabilities.
ANALOG_CTRL_ADR 0X01 Set ALL SLOW. When set, the synthesizer settle time for all channels is the same
as the slow channels in the first generation radio.
DATA32_THOLD_ADR 0X03 Sets the number of allowed corrupted bits to 3.
EOP_CTRL_ADR 0x01 Sets the number of consecutive symbols for non-correlation to detect end of packet.
PREAMBLE_ADR 0xAAAA05 AAAA are the two preamble bytes. Any other byte can also be written into the
preamble register file. Recommended counts of the preamble bytes to be sent must
be >4.
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6.6 SDR Mode
Table 6-2. SDR Mode
Register Value Description
TX_CFG_ADR 0X3E 64 chip PN code, SDR mode, PA = 6
RX_CFG_ADR 0X4B AGC is enabled. LNA and attenuator are disabled. Fast turnaround is disabled,
the device uses high side receive injection and Hi-Lo is disabled. Overwrite to
receive buffer is enabled and RX buffer is configured to receive eight bytes
maximum. Enables RXOW to allow new packets to be loaded into the receive
buffer. This also enables the VALID bit which is used by the first generation
radio’s error correction firmware.
XACT_CFG_ADR 0X05 AutoACK is disabled. Forcing end state is disabled. The device is configured to
transition to Idle mode after Receive or Transmit. ACK timeout is set to 128 µs.
FRAMING_CFG_ADR 0X00 All SOP and framing features are disabled. Disable LEN_EN=0 if EOP is
needed.
TX_OVERRIDE_ADR 0X04 Disable Transmit CRC-16.
RX_OVERRIDE_ADR 0X14 The receiver rejects packets with a zero seed. The RX CRC-16 checker is
disabled and the receiver accepts bad packets that do not match the seed in
the CRC_seed registers. This helps in communication with the first generation
radio that does not have CRC capabilities.
ANALOG_CTRL_ADR 0X01 Set ALL SLOW. When set, the synthesizer settle time for all channels is the
same as the slow channels in the first generation radio, for manual ACK
consistency
DATA64_THOLD_ADR 0X07 Sets the number of allowed corrupted bits to 7 which is close to the recom-
mended 12% value.
EOP_CTRL_ADR 0xA1 Sets the number of consecutive symbols for non-correlation to detect end of
packet.
PREAMBLE_ADR 0xAAAA09 AAAA are the two preamble bytes. Any other byte can also be written into the
preamble register file. Recommended counts of the preamble bytes to be sent
must be >8.
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7. Pinouts
Figure 7-1. Pin Diagram
RFBIAS
VBAT2
XTAL
P2.1
VCC
VBAT1
P0.4
VCC
P0.1
P0.3
VREG
P0.7
P1.6
VBAT0
L/D
P1.7
PACTL / GPIO
VIO
VDD_1.8
RST
RFN
NC
P2.0
VCC
NC
NC
RESV
NC
GND
RFP
VDD_Micro
P1.3 / SS
P1.4 / SCK
IRQ / GPIO
P1.5 / MOSI
MISO / GPIO
XOUT / GPIO
P1.2
P1.1
P1.0
* E-PAD Bottom Side
21
22
23
24
25
26
27
28
29
30
11
12
13
14
15
16
17
18
19
20
10
9
8
7
6
5
4
3
2
40
39
38
37
36
35
34
33
32
31
1
CYRF69103
WirelessUSB LP
Corner
tabs
Table 7-1. Pin Definitions
Pin Name Description
1 P0.4 Individually configured GPIO
2 XTAL 12 MHz crystal
3, 7, 16 VCC 2.4V to 3.6V supply. Connected to pin 40 (0.047 μF bypass)
4 P0.3 Individually configured GPIO
5 P0.1 Individually configured GPIO
6V
bat1 Connect to 1.8V to 3.6V power supply, through 47 ohm series/1 μF shunt C
8 P2.1 GPIO. Port 2 Bit 1
9V
bat2 Connected to1.8V to 3.6V main power supply, through 0.047 μF bypass C
10 RFbias RF pin voltage reference
11 RFpDifferential RF to or from antenna
12 GND GND
13 RFnDifferential RF to or from antenna
14, 17, 18, 20 NC
15 P2.0 GPIO
19 RESV Reserved. Must connect to GND
21 P1.0 GPIO
22 P1.1 GPIO
23 VDD_micro MCU supply connected to pin 40, max CPU 12 MHz
24 P1.2 GPIO
25 P1.3 / nSS Slave Select
26 P1.4 / SCK SPI Clock
27 IRQ Radio Function Interrupt output, configure High, Low or as Radio GPIO
28 P1.5 / MOSI MOSI pin from microcontroller function to radio function
29 MISO 3-wire SPI mode configured as Radio GPIO. In 4-wire SPI mode sends data to MCU function
30 XOUT Buffered CLK, PACTL_n or Radio GPIO
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CYRF69103
Document #: 001-07611 Rev *F Page 7 of 68
8. Functional Block Overview
All the blocks that make up the PRoC LP are presented in this
section.
8.1 2.4 GHz Radio
The radio transceiver is a dual conversion low IF architecture
optimized for power and range/robustness. The radio employs
channel matched filters to achieve high performance in the
presence of interference. An integrated Power Amplifier (PA)
provides up to +4 dBm transmit power, with an output power
control range of 34 dB in seven steps. The supply current of the
device is reduced as the RF output power is reduced.
8.2 Frequency Synthesizer
Before transmission or reception may commence, it is necessary
for the frequency synthesizer to settle. The settling time varies
depending on channel; 25 fast channels are provided with a
maximum settling time of 100 μs.
The “fast channels” (<100 μs settling time) are every 3rd
frequency, starting at 2400 MHz up to and including 2472 MHz
(that is, 0,3,6,9…….69 and 72).
8.3 Baseband and Framer
The baseband and framer blocks provide the DSSS encoding
and decoding, SOP generation and reception and CRC16
generation and checking, and EOP detection and length field.
8.3.1 Data Transmission Modes and Data Rates
The SoC supports four different data transmission modes:
In GFSK mode, data is transmitted at 1 Mbps, without any
DSSS.
In 8DR mode, 8 bits are encoded in each DATA_CODE_ADR
derived code symbol transmitted.
In DDR mode, 2 bits are encoded in each DATA_CODE_ADR
derived code symbol transmitted (as in the CYWUSB6934 DDR
mode).
In SDR mode, 1 bit is encoded in each DATA_CODE_ADR
derived code symbol transmitted (as in the CYWUSB6934
standard modes).
Both 64-chip and 32-chip DATA_CODE_ADR codes are
supported. The four data transmission modes apply to the data
after the SOP. In particular the length, data, and CRC16 are all
sent in the same mode. In general, lower data rates reduces
packet error rate in any given environment.
The CYRF69103 IC supports the following data rates:
1000 kbps (GFSK)
250 kbps (32-chip 8DR)
125 kbps (64-chip 8DR)
62.5 kbps (32-chip DDR)
31.25 kbps (64-chip DDR)
15.625 kbps (64-chip SDR)
Lower data rates typically provide longer range and/or a more
robust link.
31 PACTL Control for external PA or Radio GPIO
32 P1.6 GPIO
33 VIO 1.8V to 3.6V to main power supply rail for Radio I/O
34 RST Radio Reset. Connected to pin 40 with 0.47 μF. Must have a R S T = H I G H event the very first time
power is applied to the radio otherwise the state of the radio control registers is unknown
35 P1.7 GPIO
36 VDD1.8 Regulated logic bypass. Connected to 0.47 μF to GND
37 L/D Inductor/Diode connection for Boost. When Internal PMU is not being used connect L/D to GND.
38 P0.7 GPIO
39 Vbat0 Connected to1.8V to 3.6V main power supply, through 0.047 μF bypass C
40 VREG Boost regulator output voltage feedback
41 E-pad Must be connected to ground
42 Corner Tabs Do Not connect corner tabs
Table 7-1. Pin Definitions (continued)
Pin Name Description
Table 8-1. Internal PA Output Power Step Table
PA Setting Typical Output Power (dBm)
7+4
60
5–5
4 –10
3 –15
2 –20
1 –25
0 –30
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8.3.2 Link Layer Modes
The CYRF69103 IC device supports the following data packet
framing features:
SOP – Packets begin with a 2-symbol Start of Packet (SOP)
marker. This is required in GFSK and 8DR modes, but is optional
in DDR mode and is not supported in SDR mode. If framing is
disabled then an SOP event is inferred whenever two successive
correlations are detected. The SOP_CODE_ADR code used for
the SOP is different from that used for the “body” of the packet,
and if desired may be a different length. SOP must be configured
to be the same length on both sides of the link.
EOP – There are two options for detecting the end of a packet.
If SOP is enabled, then a packet length field may be enabled.
GFSK and 8DR must enable the length field. This is the first
8 bits after the SOP symbol, and is transmitted at the payload
data rate. If the length field is enabled, an End of Packet (EOP)
condition is inferred after reception of the number of bytes
defined in the length field, plus two bytes for the CRC16 (if
enabled). The alternative to using the length field is to infer an
EOP condition from a configurable number of successive non
correlations; this option is not available in GFSK mode and is
only recommended when using SDR mode.
CRC16 – The device may be configured to append a 16-bit
CRC16 to each packet. The CRC16 uses the USB CRC
polynomial with the added programmability of the seed. If
enabled, the receiver verifies the calculated CRC16 for the
payload data against the received value in the CRC16 field. The
starting value for the CRC16 calculation is configurable, and the
CRC16 transmitted may be calculated using either the loaded
seed value or a zero seed; the received data CRC16 is checked
against both the configured and zero CRC16 seeds.
CRC16 detects the following errors:
Any one bit in error
Any two bits in error (no matter how far apart, which column,
and so on)
Any odd number of bits in error (no matter where they are)
An error burst as wide as the checksum itself
Figure 8-1. shows an example packet with SOP, CRC16 and
lengths fields enabled.
Figure 8-1. Example Default Packet Format
8.4 Packet Buffers and Radio Configuration Registers
Packet data and configuration registers are accessed through
the SPI interface. All configuration registers are directly
addressed through the address field in the SPI packet (as in the
CYWUSB6934). Configuration registers are provided to allow
configuration of DSSS PN codes, data rate, operating mode,
interrupt masks, interrupt status, and others.
8.4.1 Packet Buffers
All data transmission and reception use the 16-byte packet
buffers: one for transmission and one for reception.
The transmit buffer allows a complete packet of up to 16 bytes of
payload data to be loaded in one burst SPI transaction, and then
transmitted with no further MCU intervention. Similarly, the
receive buffer allows an entire packet of payload data up to 16
bytes to be received with no firmware intervention required until
packet reception is complete.
The CYRF69103 IC supports packet length of up to 40 bytes;
interrupts are provided to allow an MCU to use the transmit and
receive buffers as FIFOs. When transmitting a packet longer
than 16 bytes, the MCU can load 16 bytes initially, and add
further bytes to the transmit buffer as transmission of data
creates space in the buffer. Similarly, when receiving packets
longer than 16 bytes, the MCU must fetch received data from the
FIFO periodically during packet reception to prevent it from
overflowing.
8.5 Auto Transaction Sequencer (ATS)
The CYRF69103 IC provides automated support for
transmission and reception of acknowledged data packets.
When transmitting a data packet, the device automatically starts
the crystal and synthesizer, enters transmit mode, transmits the
packet in the transmit buffer, and then automatically switches to
receive mode and waits for a handshake packet—and then
automatically reverts to sleep mode or idle mode when either an
ACK packet is received, or a time out period expires.
Similarly, when receiving in transaction mode, the device waits
in receive mode for a valid packet to be received, then automat-
ically transitions to transmit mode, transmits an ACK packet, and
then switches back to receive mode to await the next packet. The
contents of the packet buffers are not affected by the trans-
mission or reception of ACK packets.
In each case, the entire packet transaction takes place without
any need for MCU firmware action; to transmit data the MCU
simply needs to load the data packet to be transmitted, set the
length, and set the TX GO bit. Similarly, when receiving packets
in transaction mode, firmware simply needs to retrieve the fully
received packet in response to an interrupt request indicating
reception of a packet.
PSOP 1 SOP 2 Length CRC 16
Payload Data
Pream ble
n x 16us
1st Framing
Symbol*
2nd Framing
Symbol*
Packet
length
1 Byte
Period
*Note:32 or 64us
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8.6 Interrupts
The radio function provides an interrupt (IRQ) output, which is
configurable to indicate the occurrence of various different
events. The IRQ pin may be programmed to be either active high
or active low, and be either a CMOS or open drain output.
The radio function features three sets of interrupts: transmit,
receive, and system interrupts. These interrupts all share a
single pin (IRQ), but can be independently enabled/disabled. In
transmit mode, all receive interrupts are automatically disabled,
and in receive mode all transmit interrupts are automatically
disabled. However, the contents of the enable registers are
preserved when switching between transmit and receive modes.
If more than one radio interrupt is enabled at any time, it is
necessary to read the relevant status register to determine which
event caused the IRQ pin to assert. Even when a given interrupt
source is disabled, the status of the condition that would
otherwise cause an interrupt can be determined by reading the
appropriate status register. It is therefore possible to use the
devices without making use of the IRQ pin by polling the status
register(s) to wait for an event, rather than using the IRQ pin.
8.7 Clocks
A 12 MHz crystal (30 ppm or better) is directly connected
between XTAL and GND without the need for external capac-
itors. A digital clock out function is provided, with selectable
output frequencies of 0.75, 1.5, 3, 6, or 12 MHz. This output may
be used to clock an external microcontroller (MCU) or ASIC. This
output is enabled by default, but may be disabled.
The requirements for the crystal to be directly connected to XTAL
pin and GND are:
Nominal Frequency: 12 MHz
Operating Mode: Fundamental Mode
Resonance Mode: Parallel Resonant
Frequency Initial Stability: ±30 ppm
Series Resistance: <60 ohms
Load Capacitance: 10 pF
Drive Level: l00 μW
The MCU function features an internal oscillator. The clock
generator provides the 12 MHz and 24 MHz clocks that remain
internal to the microcontroller.
8.8 GPIO Interface
The MCU function features up to 15 general purpose I/O (GPIO)
pins.The I/O pins are grouped into three ports (Port 0 to 2). The
pins on Port 0 and Port 1 may each be configured individually
while the pins on Port 2 may only be configured as a group. Each
GPIO port supports high-impedance inputs, configurable pull up,
open drain output, CMOS/TTL inputs, and CMOS output with up
to two pins that support programmable drive strength of up to
50 mA sink current. Additionally, each I/O pin can be used to
generate a GPIO interrupt to the microcontroller. Each GPIO port
has its own GPIO interrupt vector with the exception of GPIO
Port 0. GPIO Port 0 has three dedicated pins that have
independent interrupt vectors (P0.1, P0.3–P0.4).
8.9 Power On Reset/Low Voltage Detect
The power on reset circuit detects logic when power is applied
to the device, resets the logic to a known state, and begins
executing instructions at Flash address 0x0000. When power
falls below a programmable trip voltage, it generates reset or
may be configured to generate interrupt. There is a low voltage
detect circuit that detects when VCC drops below a
programmable trip voltage. It may be configurable to generate an
LVD interrupt to inform the processor about the low voltage
event. POR and LVD share the same interrupt. There is not a
separate interrupt for each. The Watchdog timer can be used to
ensure the firmware never gets stalled in an infinite loop.
8.10 Timers
The free running 16-bit timer provides two interrupt sources: the
programmable interval timer with 1-μs resolution and the 1.024
ms outputs. The timer can be used to measure the duration of an
event under firmware control by reading the timer at the start and
at the end of an event, then calculating the difference between
the two values.
8.11 Power Management
The operating voltage of the device is 1.8V to 3.6V DC, which is
applied to the VBAT pin. The device can be shut down to a fully
static sleep mode by writing to the FRC END = 1 and
END STATE = 000 bits in the XACT_CFG_ADR register over the
SPI interface. The device enters sleep mode within 35 μs after
the last SCK positive edge at the end of this SPI transaction.
Alternatively, the device may be configured to automatically
enter sleep mode after completing packet transmission or
reception. When in sleep mode, the on-chip oscillator is stopped,
but the SPI interface remains functional. The device wakes from
sleep mode automatically when the device is commanded to
enter transmit or receive mode. When resuming from sleep
mode, there is a short delay while the oscillator restarts. The
device may be configured to assert the IRQ pin when the oscil-
lator has stabilized.
The output voltage (VREG) of the Power Management Unit
(PMU) is configurable to several minimum values between 2.4V
and 2.7V. VREG may be used to provide up to 15 mA (average
load) to external devices. It is possible to disable the PMU, and
to provide an externally regulated DC supply voltage to the
device in the range 2.4V to 3.6V. The PMU also provides a
regulated 1.8V supply to the logic.
The PMU has been designed to provide high boost efficiency
(74–85% depending on input voltage, output voltage and load)
when using a Schottky diode and power inductor, eliminating the
need for an external boost converter in many systems where
other components require a boosted voltage. However,
reasonable efficiencies (69–82% depending on input voltage,
output voltage and load) may be achieved when using low-cost
components such as SOT23 diodes and 0805 inductors.
The current through the diode must stay within the linear
operating range of the diode. For some loads the SOT23 diode
is sufficient, but with higher loads it is not and a SS12 diode must
be used to stay within this linear range of operation. Along with
the diode, the inductor used must not saturate its core. In higher
loads, a lower resistance/higher saturation coil like the inductor
from Sumida must be used.
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The PMU also provides a configurable low battery detection
function which may be read over the SPI interface. One of seven
thresholds between 1.8V and 2.7V may be selected. The
interrupt pin may be configured to assert when the voltage on the
VBAT pin falls below the configured threshold. LV IRQ is not a
latched event. Battery monitoring is disabled when the device is
in sleep mode.
The following three figures show different examples of how to
use PRoC LP with and without the PMU. Figure 8-2. shows the
most common circuit making use of the PMU to boost battery
voltage up to 2.7V. Figure 8-3. is an example of the circuit used
when the supply voltage is always above 2.7V. This could be
three 1.5V battery cells in series along with a linear regulator, or
some similar power source. Figure 8-4. shows an example of
using the PRoC LP with its PMU disabled and an external boost
to supply power to the device. This might be required when the
load is much greater than the 15 mA average load that PRoC can
support.
Figure 8-2. PMU Enabled
Figure 8-3. PMU Disabled - Linear Regulator
Figure 8-4. PMU Disabled - External Boost Converter
PRoC LP
L/D
10 µF 6.3V
VCC
100 µF 10V
VBat
BAT400D10 µH
VReg
VBat0
VBat1
VBat2
VCC1
VCC2
VCC3
VIO
VCC
VBat
0.047 µF
0.047 µF
0.047 µF
0.047 µF
0.047 µF
10 µF
6.3V
1 µF
6.3V
0.047µF
1 Ohm 1%
47 Ohm
VDD_MICRO
VDD
0.1µF
PRoC LP
VReg
VBat0
VBat1
VBat2
VCC1
VCC2
VCC3
L/D VIO
VCC
0.047µF
0.047µF
0.047µF
0.047µF
0.047µF
0.047µF
0.047µF
0.047µF
VDD_MICRO
VDD
0.1µF
[+] Feedback
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8.12 Low Noise Amplifier (LNA) and Received
Signal Strength Indication (RSSI)
The gain of the receiver may be controlled directly by clearing
the AGC EN bit and writing to the Low Noise Amplifier (LNA) bit
of the RX_CFG_ADR register. When the LNA bit is cleared, the
receiver gain is reduced by approximately 20 dB, allowing
accurate reception of very strong received signals (for example
when operating a receiver very close to the transmitter). An
additional 20 dB of receiver attenuation can be added by setting
the Attenuation (ATT) bit; this allows data reception to be limited
to devices at very short ranges. Disabling AGC and enabling
LNA is recommended unless receiving from a device using
external PA.
The RSSI register returns the relative signal strength of the
on-channel signal power.
When receiving, the device may be configured to automatically
measure and store the relative strength of the signal being
received as a 5-bit value. When enabled, an RSSI reading is
taken and may be read through the SPI interface. An RSSI
reading is taken automatically when the start of a packet is
detected. In addition, a new RSSI reading is taken every time the
previous reading is read from the RSSI register, allowing the
background RF energy level on any given channel to be easily
measured when RSSI is read when no signal is being received.
A new reading can occur as fast as once every 12 μs.
9. SPI Interface
The SPI interface between the MCU function and the radio
function is a 3-wire SPI Interface. The three pins are MOSI
(Master Out Slave In), SCK (Serial Clock), SS (Slave Select).
There is an alternate 4-wire MISO Interface that requires the
connection of two external pins. The SPI interface is controlled
by configuring the SPI Configure Register. (SPICR Addr: 0x3D).
9.1 3-Wire SPI Interface
The radio function receives a clock from the MCU function on the
SCK pin. The MOSI pin is multiplexed with the MISO pin. Bidirec-
tional data transfer takes place between the MCU function and
the radio function through this multiplexed MOSI pin. When using
this mode the user firmware must ensure that the MOSI pin on
the MCU function is in a high impedance state, except when the
MCU is actively transmitting data. Firmware must also control the
direction of data flow and switch directions between MCU
function and radio function by setting the SWAP bit [Bit 7] of the
SPI Configure Register. The SS pin is asserted before initiating
a data transfer between the MCU function and the radio function.
The IRQ function may be optionally multiplexed with the MOSI
pin; when this option is enabled the IRQ function is not available
while the SS pin is low. When using this configuration, user
firmware must ensure that the MOSI function on MCU function
is in a high-impedance state whenever SS is high.
Figure 9-1. 3-Wire SPI Mode
9.2 4-Wire SPI Interface
The 4-wire SPI communications interface consists of MOSI,
MISO, SCK, and SS.
The device receives SCK from the MCU function on the SCK pin.
Data from the MCU function is shifted in on the MOSI pin. Data
to the MCU function is shifted out on the MISO pin. The active
low SS pin must be asserted for the two functions to commu-
nicate. The IRQ function may be optionally multiplexed with the
MOSI pin; when this option is enabled the IRQ function is not
available while the SS pin is low. When using this configuration,
user firmware must ensure that the MOSI function on MCU
function is in a high-impedance state whenever SS is high.
Figure 9-2. 4-Wire SPI Mode
MCU Function
P1.5/MOSI
P1.4/SCK
P1.3/nSS
MOSI
SCK
nSS
Radio Function
MOSI
SCK
nSS
MOSI/MISO multiplexed
on one MOSI pin
MCU Function
P1.5/MOSI
P1.4/SCK
P1.3/nSS
P1.6/MISO
MOSI
SCK
nSS
Radio Function
MISO
MOSI
SCK
nSS
This connection is external to the PRoC LP Chip
[+] Feedback
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9.3 SPI Communication and Transactions
The SPI transactions can be single byte or multi-byte. The MCU
function initiates a data transfer through a Command/Address
byte. The following bytes are data bytes. The SPI transaction
format is shown in Figure 9-1.
The DIR bit specifies the direction of data transfer. 0 = Master
reads from slave. 1 = Master writes to slave.
The INC bit helps to read or write consecutive bytes from
contiguous memory locations in a single burst mode operation.
If Slave Select is asserted and INC = 1, then the master MCU
function reads a byte from the radio, the address is incremented
by a byte location, and then the byte at that location is read, and
so on.
If Slave Select is asserted and INC = 0, then the MCU function
reads/writes the bytes in the same register in burst mode, but if
it is a register file then it reads/writes the bytes in that register file.
The SPI interface between the radio function and the MCU is not
dependent on the internal 12 MHz oscillator of the radio.
Therefore, radio function registers can be read from or written
into while the radio is in sleep mode.
9.4 SPI I/O Voltage References
The SPI interfaces between MCU function and the radio and the
IRQ and RST have a separate voltage reference VIO. For
CYRF69103 VIO is normally set to VCC.
9.5 SPI Connects to External Devices
The three SPI wires, MOSI, SCK, and SS are also drawn out of
the package as external pins to allow the user to interface their
own external devices (such as optical sensors and others)
through SPI. The radio function also has its own SPI wires MISO
and IRQ, which can be used to send data back to the MCU
function or send an interrupt request to the MCU function. They
can also be configured as GPIO pins.
10. CPU Architecture
This family of microcontrollers is based on a high-performance,
8-bit, Harvard architecture microprocessor. Five registers control
the primary operation of the CPU core. These registers are
affected by various instructions, but are not directly accessible
through the register space by the user.
The 16-bit Program Counter Register (CPU_PC) allows for direct
addressing of the full eight Kbytes of program memory space.
The Accumulator Register (CPU_A) is the general-purpose
register that holds the results of instructions that specify any of
the source addressing modes.
The Index Register (CPU_X) holds an offset value that is used
in the indexed addressing modes. Typically, this is used to
address a block of data within the data memory space.
The Stack Pointer Register (CPU_SP) holds the address of the
current top-of-stack in the data memory space. It is affected by
the PUSH, POP, LCALL, CALL, RETI, and RET instructions,
which manage the software stack. It can also be affected by the
SWAP and ADD instructions.
The Flag Register (CPU_F) has three status bits: Zero Flag bit
[1]; Carry Flag bit [2]; Supervisory State bit [3]. The Global
Interrupt Enable bit [0] is used to globally enable or disable inter-
rupts. The user cannot manipulate the Supervisory State status
bit [3]. The flags are affected by arithmetic, logic, and shift opera-
tions. The manner in which each flag is changed is dependent
upon the instruction being executed (for example, AND, OR,
XOR). See Table 13-1 on page 18.
Table 9-1. SPI Transaction Format
Byte 1 Byte 1+N
Bit # 7 6 [5:0] [7:0]
Bit Name DIR INC Address Data
Table 10-1. CPU Registers and Register Name
Register Register Name
Flags CPU_F
Program Counter CPU_PC
Accumulator CPU_A
Stack Pointer CPU_SP
Index CPU_X
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11. CPU Registers
11.1 Flags Register
The Flags Register can only be set or reset with logical instruction.
11.2 Accumulator Register
Table 11-1. CPU Flags Register (CPU_F) [R/W]
Bit # 76543210
Field Reserved XIO Super Carry Zero Global IE
Read/Write R/W R RW RW RW
Default 00000010
Bits 7:5 Reserved
Bit 4 XIO
Set by the user to select between the register banks.
0 = Bank 0
1 = Bank 1
Bit 3 Super
Indicates whether the CPU is executing user code or Supervisor Code (This code cannot be accessed directly by
the user).
0 = User Code
1 = Supervisor Code
Bit 2 Carry
Set by CPU to indicate whether there has been a carry in the previous logical/arithmetic operation.
0 = No Carry
1 = Carry
Bit 1 Zero
Set by CPU to indicate whether there has been a zero result in the previous logical/arithmetic operation.
0 = Not Equal to Zero
1 = Equal to Zero
Bit 0 Global IE
Determines whether all interrupts are enabled or disabled.
0 = Disabled
1 = Enabled
Note This register is readable with explicit address 0xF7. The OR F, expr and AND F, expr must be used to set and clear the
CPU_F bits.
Table 11-2. CPU Accumulator Register (CPU_A)
Bit # 76543210
Field CPU Accumulator [7:0]
Read/Write ––––––––
Default 00000000
Bits 7:0 CPU Accumulator [7:0]
8-bit data value holds the result of any logical/arithmetic instruction that uses a source addressing mode.
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11.3 Index Register
11.4 Stack Pointer Register
11.5 CPU Program Counter High Register
11.6 CPU Program Counter Low Register
Table 11-3. CPU X Register (CPU_X)
Bit # 76543210
Field X [7:0]
Read/Write ––––––––
Default 00000000
Bits 7:0 X [7:0]
8-bit data value holds an index for any instruction that uses an indexed addressing mode.
Table 11-4. CPU Stack Pointer Register (CPU_SP)
Bit # 76543210
Field Stack Pointer [7:0]
Read/Write ––––––––
Default 00000000
Bits 7:0 Stack Pointer [7:0]
8-bit data value holds a pointer to the current top-of-stack.
Table 11-5. CPU Program Counter High Register (CPU_PCH)
Bit # 76543210
Field Program Counter [15:8]
Read/Write ––––––––
Default 00000000
Bits 7:0 Program Counter [15:8]
8-bit data value holds the higher byte of the program counter.
Table 11-6. CPU Program Counter Low Register (CPU_PCL)
Bit # 76543210
Field Program Counter [7:0]
Read/Write ––––––––
Default 00000000
Bit 7:0 Program Counter [7:0]
8-bit data value holds the lower byte of the program counter.
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12. Addressing Modes
Examples of the different addressing modes are discussed in
this section and example code is given.
12.1 Source Immediate
The result of an instruction using this addressing mode is placed
in the A register, the F register, the SP register, or the X register,
which is specified as part of the instruction opcode. Operand 1
is an immediate value that serves as a source for the instruction.
Arithmetic instructions require two sources. Instructions using
this addressing mode are two bytes in length.
Examples
12.2 Source Direct
The result of an instruction using this addressing mode is placed
in either the A register or the X register, which is specified as part
of the instruction opcode. Operand 1 is an address that points to
a location in either the RAM memory space or the register space
that is the source for the instruction. Arithmetic instructions
require two sources; the second source is the A register or X
register specified in the opcode. Instructions using this
addressing mode are two bytes in length.
Examples
12.3 Source Indexed
The result of an instruction using this addressing mode is placed
in either the A register or the X register, which is specified as part
of the instruction opcode. Operand 1 is added to the X register
forming an address that points to a location in either the RAM
memory space or the register space that is the source for the
instruction. Arithmetic instructions require two sources; the
second source is the A register or X register specified in the
opcode. Instructions using this addressing mode are two bytes
in length.
Examples
12.4 Destination Direct
The result of an instruction using this addressing mode is placed
within either the RAM memory space or the register space.
Operand 1 is an address that points to the location of the result.
The source for the instruction is either the A register or the X
register, which is specified as part of the instruction opcode.
Arithmetic instructions require two sources; the second source is
the location specified by Operand 1. Instructions using this
addressing mode are two bytes in length.
Examples
Table 12-1. Source Immediate
Opcode Operand 1
Instruction Immediate Value
ADD A, 7 In this case, the immediate value of 7 is
added with the Accumulator, and the result
is placed in the Accumulator.
MOV X, 8 In this case, the immediate value of 8 is
moved to the X register.
AND F, 9 In this case, the immediate value of 9 is
logically ANDed with the F register and the
result is placed in the F register.
Table 12-2. Source Direct
Opcode Operand 1
Instruction Source Address
ADD A, [7] In this case, the value in the RAM
memory location at address 7 is
added with the Accumulator, and the
result is placed in the Accumulator.
MOV X, REG[8] In this case, the value in the register
space at address 8 is moved to the X
register.
Table 12-3. Source Indexed
Opcode Operand 1
Instruction Source Index
ADD A, [X+7] In this case, the value in the
memory location at address X + 7
is added with the Accumulator,
and the result is placed in the
Accumulator.
MOV X, REG[X+8] In this case, the value in the
register space at address X + 8 is
moved to the X register.
Table 12-4. Destination Direct
Opcode Operand 1
Instruction Destination Address
ADD [7], A In this case, the value in the
memory location at address 7 is
added with the Accumulator, and
the result is placed in the memory
location at address 7. The
Accumulator is unchanged.
MOV REG[8], A In this case, the Accumulator is
moved to the register space
location at address 8. The
Accumulator is unchanged.
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12.5 Destination Indexed
The result of an instruction using this addressing mode is placed
within either the RAM memory space or the register space.
Operand 1 is added to the X register forming the address that
points to the location of the result. The source for the instruction
is the A register. Arithmetic instructions require two sources; the
second source is the location specified by Operand 1 added with
the X register. Instructions using this addressing mode are two
bytes in length.
Example
12.6 Destination Direct Source Immediate
The result of an instruction using this addressing mode is placed
within either the RAM memory space or the register space.
Operand 1 is the address of the result. The source for the
instruction is Operand 2, which is an immediate value. Arithmetic
instructions require two sources; the second source is the
location specified by Operand 1. Instructions using this
addressing mode are three bytes in length.
Examples
12.7 Destination Indexed Source Immediate
The result of an instruction using this addressing mode is placed
within either the RAM memory space or the register space.
Operand 1 is added to the X register to form the address of the
result. The source for the instruction is Operand 2, which is an
immediate value. Arithmetic instructions require two sources; the
second source is the location specified by Operand 1 added with
the X register. Instructions using this addressing mode are three
bytes in length.
Examples
12.8 Destination Direct Source Direct
The result of an instruction using this addressing mode is placed
within the RAM memory. Operand 1 is the address of the result.
Operand 2 is an address that points to a location in the RAM
memory that is the source for the instruction. This addressing
mode is only valid on the MOV instruction. The instruction using
this addressing mode is three bytes in length.
Example
Table 12-5. Destination Indexed
Opcode Operand 1
Instruction Destination Index
ADD [X+7], A In this case, the value in the memory
location at address X+7 is added with
the Accumulator, and the result is
placed in the memory location at
address x+7. The Accumulator is
unchanged.
Table 12-6. Destination Direct Source Immediate
Opcode Operand 1 Operand 2
Instruction Destination Address Immediate Value
ADD [7], 5 In this case, value in the memory
location at address 7 is added to the
immediate value of 5, and the result is
placed in the memory location at
address 7.
MOV REG[8], 6 In this case, the immediate value of 6
is moved into the register space
location at address 8.
Table 12-7. Destination Indexed Source Immediate
Opcode Operand 1 Operand 2
Instruction Destination Index Immediate Value
ADD [X+7], 5 In this case, the value in the
memory location at address X+7
is added with the immediate
value of 5 and the result is placed
in the memory location at
address X+7.
MOV REG[X+8], 6 In this case, the immediate value
of 6 is moved into the location in
the register space at address
X+8.
Table 12-8. Destination Direct Source Direct
Opcode Operand 1 Operand 2
Instruction Destination Address Source Address
MOV [7], [8] In this case, the value in the memory
location at address 8 is moved to the
memory location at address 7.
[+] Feedback
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12.9 Source Indirect Post Increment
The result of an instruction using this addressing mode is placed
in the Accumulator. Operand 1 is an address pointing to a
location within the memory space, which contains an address
(the indirect address) for the source of the instruction. The
indirect address is incremented as part of the instruction
execution. This addressing mode is only valid on the MVI
instruction. The instruction using this addressing mode is two
bytes in length. Refer to the PSoC Designer: Assembly
Language User Guide for further details on MVI instruction.
Example
12.10 Destination Indirect Post Increment
The result of an instruction using this addressing mode is placed
within the memory space. Operand 1 is an address pointing to a
location within the memory space, which contains an address
(the indirect address) for the destination of the instruction. The
indirect address is incremented as part of the instruction
execution. The source for the instruction is the Accumulator. This
addressing mode is only valid on the MVI instruction. The
instruction using this addressing mode is two bytes in length.
Example
Table 12-9. Source Indirect Post Increment
Opcode Operand 1
Instruction Source Address Address
MVI A, [8] In this case, the value in the memory
location at address 8 is an indirect
address. The memory location pointed to
by the indirect address is moved into the
Accumulator. The indirect address is then
incremented.
Table 12-10. Destination Indirect Post Increment
Opcode Operand 1
Instruction Destination Address Address
MVI [8], A In this case, the value in the memory
location at address 8 is an indirect
address. The Accumulator is moved
into the memory location pointed to
by the indirect address. The indirect
address is then incremented.
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13. Instruction Set Summary
The instruction set is summarized in Table 13-1 numerically and serves as a quick reference. If more information is needed, the
Instruction Set Summary tables are described in detail in the PSoC Designer Assembly Language User Guide (available on
www.cypress.com).
Table 13-1. Instruction Set Summary Sorted Numerically by Opcode Order[1, 2]
Opcode Hex
Cycles
Bytes
Instruction Format Flags
Opcode Hex
Cycles
Bytes
Instruction Format Flags
Opcode Hex
Cycles
Bytes
Instruction Format Flags
00 15 1SSC 2D 8 2 OR [X+expr], A Z5A 5 2MOV [expr], X
01 4 2 ADD A, expr C, Z 2E 9 3 OR [expr], expr Z5B 4 1MOV A, X Z
02 6 2 ADD A, [expr] C, Z 2F 10 3OR [X+expr], expr Z5C 4 1MOV X, A
03 7 2 ADD A, [X+expr] C, Z 30 9 1HALT 5D 6 2MOV A, reg[expr] Z
04 7 2 ADD [expr], A C, Z 31 4 2XOR A, expr Z5E 7 2MOV A, reg[X+expr] Z
05 8 2 ADD [X+expr], A C, Z 32 6 2XOR A, [expr] Z5F 10 3MOV [expr], [expr]
06 9 3 ADD [expr], expr C, Z 33 7 2XOR A, [X+expr] Z60 5 2MOV reg[expr], A
07 10 3ADD [X+expr], expr C, Z 34 7 2XOR [expr], A Z61 6 2MOV reg[X+expr], A
08 4 1PUSH A 35 8 2XOR [X+expr], A Z62 8 3MOV reg[expr], expr
09 4 2 ADC A, expr C, Z 36 9 3XOR [expr], expr Z63 9 3MOV reg[X+expr], expr
0A 6 2 ADC A, [expr] C, Z 37 10 3XOR [X+expr], expr Z64 4 1ASL A C, Z
0B 7 2 ADC A, [X+expr] C, Z 38 5 2ADD SP, expr 65 7 2ASL [expr] C, Z
0C 7 2 ADC [expr], A C, Z 39 5 2CMP A, expr if (A=B) Z=1
if (A<B) C=1
66 8 2ASL [X+expr] C, Z
0D 8 2 ADC [X+expr], A C, Z 3A 7 2CMP A, [expr] 67 4 1ASR A C, Z
0E 9 3 ADC [expr], expr C, Z 3B 8 2CMP A, [X+expr] 68 7 2ASR [expr] C, Z
0F 10 3ADC [X+expr], expr C, Z 3C 8 3CMP [expr], expr 69 8 2ASR [X+expr] C, Z
10 4 1PUSH X 3D 9 3CMP [X+expr], expr 6A 4 1RLC A C, Z
11 4 2SUB A, expr C, Z 3E 10 2MVI A, [ [expr]++ ] Z6B 7 2RLC [expr] C, Z
12 6 2SUB A, [expr] C, Z 3F 10 2MVI [ [expr]++ ], A 6C 8 2RLC [X+expr] C, Z
13 7 2SUB A, [X+expr] C, Z 40 4 1NOP 6D 4 1RRC A C, Z
14 7 2SUB [expr], A C, Z 41 9 3AND reg[expr], expr Z6E 7 2RRC [expr] C, Z
15 8 2SUB [X+expr], A C, Z 42 10 3AND reg[X+expr], expr Z6F 8 2RRC [X+expr] C, Z
16 9 3SUB [expr], expr C, Z 43 9 3OR reg[expr], expr Z70 4 2AND F, expr C, Z
17 10 3SUB [X+expr], expr C, Z 44 10 3OR reg[X+expr], expr Z71 4 2OR F, expr C, Z
18 5 1POP A Z45 9 3XOR reg[expr], expr Z72 4 2XOR F, expr C, Z
19 4 2SBB A, expr C, Z 46 10 3XOR reg[X+expr], expr Z73 4 1CPL A Z
1A 6 2SBB A, [expr] C, Z 47 8 3TST [expr], expr Z74 4 1INC A C, Z
1B 7 2SBB A, [X+expr] C, Z 48 9 3TST [X+expr], expr Z75 4 1INC X C, Z
1C 7 2SBB [expr], A C, Z 49 9 3TST reg[expr], expr Z76 7 2INC [expr] C, Z
1D 8 2SBB [X+expr], A C, Z 4A 10 3TST reg[X+expr], expr Z77 8 2INC [X+expr] C, Z
1E 9 3SBB [expr], expr C, Z 4B 5 1SWAP A, X Z78 4 1DEC A C, Z
1F 10 3SBB [X+expr], expr C, Z 4C 7 2SWAP A, [expr] Z79 4 1DEC X C, Z
20 5 1POP X 4D 7 2SWAP X, [expr] 7A 7 2DEC [expr] C, Z
21 4 2AND A, expr Z4E 5 1SWAP A, SP Z7B 8 2DEC [X+expr] C, Z
22 6 2AND A, [expr] Z4F 4 1 MOV X, SP 7C 13 3LCALL
23 7 2AND A, [X+expr] Z50 4 2 MOV A, expr Z7D 7 3 LJMP
24 7 2AND [expr], A Z51 5 2 MOV A, [expr] Z7E 10 1RETI C, Z
25 8 2AND [X+expr], A Z52 6 2 MOV A, [X+expr] Z7F 8 1RET
26 9 3AND [expr], expr Z53 5 2 MOV [expr], A 8x 5 2 JMP
27 10 3AND [X+expr], expr Z54 6 2 MOV [X+expr], A 9x 11 2CALL
28 11 1ROMX Z55 8 3MOV [expr], expr Ax 5 2 JZ
29 4 2OR A, expr Z56 9 3MOV [X+expr], expr Bx 5 2 JNZ
2A 6 2OR A, [expr] Z57 4 2MOV X, expr Cx 5 2 JC
2B 7 2OR A, [X+expr] Z58 6 2MOV X, [expr] Dx 5 2 JNC
2C 7 2 OR [expr], A Z59 7 2MOV X, [X+expr] Ex 7 2 JACC
Fx 13 2INDEX Z
Notes
1. Interrupt routines take 13 cycles before execution resumes at interrupt vector table.
2. The number of cycles required by an instruction is increased by one for instructions that span 256-byte boundaries in the Flash memory space.
[+] Feedback
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Document #: 001-07611 Rev *F Page 19 of 68
14. Memory Organization
14.1 Flash Program Memory Organization
Figure 14-1. Program Memory Space with Interrupt Vector Table
after reset Address
16-bit PC 0x0000 Program execution begins here after a reset
0x0004 POR/LVD
0x0008 Reserved
0x000C SPI Transmitter Empty
0x0010 SPI Receiver Full
0x0014 GPIO Port 0
0x0018 GPIO Port 1
0x001C INT1
0x0020 Reserved
0x0024 Reserved
0x0028 Reserved
0x002C Reserved
0x0030 Reserved
0x0034 1 ms Interval Timer
0x0038 Programmable Interval Timer
0x003C Reserved
0x0040 Reserved
0x0044 16-bit Free Running Timer Wrap
0x0048 INT2
0x004C Reserved
0x0050 GPIO Port 2
0x0054 Reserved
0x0058 Reserved
0x005C Reserved
0x0060 Reserved
0x0064 Sleep Timer
0x0068 Program Memory begins here (if below interrupts not used,
program memory can start lower)
0x1FFF
[+] Feedback
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Document #: 001-07611 Rev *F Page 20 of 68
14.2 Data Memory Organization
The MCU function provides up to 256 bytes of data RAM.
Figure 14-2. Data Memory Organization
14.3 Flash
This section describes the Flash block of the CYRF69103. Much
of the user visible Flash functionality, including programming and
security, are implemented in the M8C Supervisory Read Only
Memory (SROM). CYRF69103 Flash has an endurance of 1000
cycles and 10-year data retention.
14.3.1 Flash Programming and Security
All Flash programming is performed by code in the SROM. The
registers that control the Flash programming are only visible to
the M8C CPU when it is executing out of SROM. This makes it
impossible to read, write, or erase the Flash by bypassing the
security mechanisms implemented in the SROM.
Customer firmware can only program the Flash through SROM
calls. The data or code images can be sourced by way of any
interface with the appropriate support firmware. This type of
programming requires a ‘bootloader—a piece of firmware
resident on the Flash. For safety reasons, this bootloader must
not be over written during firmware rewrites.
The Flash provides four auxiliary rows that are used to hold Flash
block protection flags, boot time calibration values, configuration
tables, and any device values. The routines for accessing these
auxiliary rows are documented in the SROM section. The
auxiliary rows are not affected by the device erase function.
14.3.2 In-System Programming
CYRF69103 enables this type of in-system programming by
using the P1.0 and P1.1 pins as the serial programming mode
interface. This allows an external controller to cause the
CYRF69103 to enter serial programming mode and then to use
the test queue to issue Flash access functions in the SROM.
14.4 SROM
The SROM holds code that is used to boot the part, calibrate
circuitry, and perform Flash operations (Table 14-1 lists the
SROM functions). The functions of the SROM may be accessed
in normal user code or operating from Flash. The SROM exists
in a separate memory space from user code. The SROM
functions are accessed by executing the Supervisory System
Call instruction (SSC), which has an opcode of 00h. Before
executing the SSC, the M8C’s accumulator needs to be loaded
with the desired SROM function code from Table 14-1.
Undefined functions causes a HALT if called from user code. The
SROM functions are executing code with calls; therefore, the
functions require stack space. With the exception of Reset, all of
the SROM functions have a parameter block in SRAM that must
be configured before executing the SSC. Table 14-2 on page 21
lists all possible parameter block variables. The meaning of each
parameter, with regards to a specific SROM function, is
described later in this section.
after reset Address
8-bit PSP 0x00 Stack begins here and grows upward
Top of RAM Memory 0xFF
Table 14-1. SROM Function Codes
Function Code Function Name Stack Space
00h SWBootReset 0
01h ReadBlock 7
02h WriteBlock 10
03h EraseBlock 9
05h EraseAll 11
06h TableRead 3
07h CheckSum 3
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 21 of 68
Two important variables that are used for all functions are KEY1
and KEY2. These variables are used to help discriminate
between valid SSCs and inadvertent SSCs. KEY1 must always
have a value of 3Ah, while KEY2 must have the same value as
the stack pointer when the SROM function begins execution.
This is the Stack Pointer value when the SSC opcode is
executed, plus three. If either of the keys do not match the
expected values, the M8C halts (with the exception of the
SWBootReset function). The following code puts the correct
value in KEY1 and KEY2. The code starts with a halt, to force the
program to jump directly into the setup code and not run into it.
halt
SSCOP: mov [KEY1], 3ah
mov X, SP
mov A, X
add A, 3
mov [KEY2], A
The SROM also features Return Codes and Lockouts.
14.4.1 Return Codes
Return codes aid in the determination of success or failure of a
particular function. The return code is stored in KEY1’s position
in the parameter block. The CheckSum and TableRead functions
do not have return codes because KEY1’s position in the
parameter block is used to return other data.
Read, write, and erase operations may fail if the target block is
read or write protected. Block protection levels are set during
device programming.
The EraseAll function overwrites data in addition to leaving the
entire user Flash in the erase state. The EraseAll function loops
through the number of Flash macros in the product, executing
the following sequence: erase, bulk program all zeros, erase.
After all the user space in all the Flash macros are erased, a
second loop erases and then programs each protection block
with zeros.
14.5 SROM Function Descriptions
All SROM functions are described in the following sections.
14.5.1 SWBootReset Function
The SROM function, SWBootReset, is the function that is
responsible for transitioning the device from a reset state to
running user code. The SWBootReset function is executed
whenever the SROM is entered with an M8C accumulator value
of 00h; the SRAM parameter block is not used as an input to the
function. This happens, by design, after a hardware reset,
because the M8C's accumulator is reset to 00h or when user
code executes the SSC instruction with an accumulator value of
00h. The SWBootReset function does not execute when the
SSC instruction is executed with a bad key value and a nonzero
function code. A CYRF69103 device executes the HALT
instruction if a bad value is given for either KEY1 or KEY2.
The SWBootReset function verifies the integrity of the calibration
data by way of a 16-bit checksum, before releasing the M8C to
run user code.
14.5.2 ReadBlock Function
The ReadBlock function is used to read 64 contiguous bytes
from Flash—a block.
The first thing this function does is to check the protection bits
and determine if the desired BLOCKID is readable. If read
protection is turned on, the ReadBlock function exits setting the
accumulator and KEY2 back to 00h. KEY1 has a value of 01h,
indicating a read failure. If read protection is not enabled, the
function reads 64 bytes from the Flash using a ROMX instruction
and store the results in SRAM using an MVI instruction. The first
of the 64 bytes are stored in SRAM at the address indicated by
the value of the POINTER parameter. When the ReadBlock
completes successfully, the accumulator, KEY1 and KEY2, all
have a value of 00h.
14.5.3 WriteBlock Function
The WriteBlock function is used to store data in the Flash. Data
is moved 64 bytes at a time from SRAM to Flash using this
function. The first thing the WriteBlock function does is to check
the protection bits and determine if the desired BLOCKID is
writable. If write protection is turned on, the WriteBlock function
exits, setting the accumulator and KEY2 back to 00h. KEY1 has
a value of 01h, indicating a write failure. The configuration of the
WriteBlock function is straightforward. The BLOCKID of the
Flash block, where the data is stored, must be determined and
stored at SRAM address FAh.
Table 14-2. SROM Function Parameters
Variable Name SRAM Address
Key1/Counter/Return Code 0,F8h
Key2/TMP 0,F9h
BlockID 0,FAh
Pointer 0,FBh
Clock 0,FCh
Mode 0,FDh
Delay 0,FEh
PCL 0,FFh
Table 14-3. SROM Return Codes
Return Code Description
00h Success
01h Function not allowed due to level of protection
on block
02h Software reset without hardware reset
03h Fatal error, SROM halted
Table 14-4. ReadBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value, when SSC is
executed
BLOCKID 0,FAh Flash block number
POINTER 0,FBh First of 64 addresses in SRAM
where returned data must be stored
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 22 of 68
The SRAM address of the first of the 64 bytes to be stored in
Flash must be indicated using the POINTER variable in the
parameter block (SRAM address FBh). Finally, the CLOCK and
DELAY values must be set correctly. The CLOCK value deter-
mines the length of the write pulse that is used to store the data
in the Flash. The CLOCK and DELAY values are dependent on
the CPU. Refer to ‘Clocking’ Section for additional information.
14.5.4 EraseBlock Function
The EraseBlock function is used to erase a block of 64
contiguous bytes in Flash. The first thing the EraseBlock function
does is to check the protection bits and determine if the desired
BLOCKID is writable. If write protection is turned on, the Erase-
Block function exits, setting the accumulator and KEY2 back to
00h. KEY1 has a value of 01h, indicating a write failure. The
EraseBlock function is only useful as the first step in
programming. Erasing a block does not cause data in a block to
be one hundred percent unreadable. If the objective is to oblit-
erate data in a block, the best method is to perform an Erase-
Block followed by a WriteBlock of all zeros.
To set up the parameter block for the EraseBlock function,
correct key values must be stored in KEY1 and KEY2. The block
number to be erased must be stored in the BLOCKID variable
and the CLOCK and DELAY values must be set based on the
current CPU speed.
14.5.5 ProtectBlock Function
The CYRF69103 device offers Flash protection on a
block-by-block basis. Table 14-7 lists the protection modes
available. In the table, ER and EW are used to indicate the ability
to perform external reads and writes. For internal writes, IW is
used. Internal reading is always permitted by way of the ROMX
instruction. The ability to read by way of the SROM ReadBlock
function is indicated by SR. The protection level is stored in two
bits, according to Table 14-7. These bits are bit packed into the
64 bytes of the protection block. Therefore, each protection block
byte stores the protection level for four Flash blocks. The bits are
packed into a byte, with the lowest numbered block’s protection
level stored in the lowest numbered bits.
The first address of the protection block contains the protection
level for blocks 0 through 3; the second address is for blocks 4
through 7. The 64th byte stores the protection level for blocks
252 through 255.
The level of protection is only decreased by an EraseAll, which
places zeros in all locations of the protection block. To set the
level of protection, the ProtectBlock function is used. This
function takes data from SRAM, starting at address 80h, and
ORs it with the current values in the protection block. The result
of the OR operation is then stored in the protection block. The
EraseBlock function does not change the protection level for a
block. Because the SRAM location for the protection data is fixed
and there is only one protection block per Flash macro, the
ProtectBlock function expects very few variables in the
parameter block to be set before calling the function. The
parameter block values that must be set, besides the keys, are
the CLOCK and DELAY values.
Table 14-5. WriteBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value, when SSC is
executing
BLOCK ID 0,FAh 8 KB Flash block number (00h–7Fh)
4 KB Flash block number (00h–3Fh)
3 KB Flash block number (00h–2Fh)
POINTER 0,FBh First 64 addresses in SRAM where
the data to be stored in Flash is
located before calling WriteBlock
CLOCK 0,FCh Clock Divider used to set the write
Pulse width
DELAY 0,FEh For a CPU speed of 12 MHz set to 56h
Table 14-6. EraseBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value when SSC is
executed
BLOCKID 0,FAh Flash block number (00h–7Fh)
CLOCK 0,FCh Clock Divider used to set the erase
pulse width
DELAY 0,FEh For a CPU speed of 12 MHz set to
56h
Table 14-7. Protection Modes
Mode Settings Description Marketing
00b SR ER EW IW Unprotected Unprotected
01b SR ER EW IW Read protect Factory upgrade
10b SR ER EW IW Disable external
write
Field upgrade
11b SR ER EW IW Disable internal
write
Full protection
76543210
Block n+3 Block n+2 Block n+1 Block n
Table 14-8. ProtectBlock Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value when SSC is
executed
CLOCK 0,FCh Clock Divider used to set the write
pulse width
DELAY 0,FEh For a CPU speed of 12 MHz set to 56h
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 23 of 68
14.5.6 EraseAll Function
The EraseAll function performs a series of steps that destroy the
user data in the Flash macros and resets the protection block in
each Flash macro to all zeros (the unprotected state). The
EraseAll function does not affect the three hidden blocks above
the protection block in each Flash macro. The first of these four
hidden blocks is used to store the protection table for its eight
Kbytes of user data.
The EraseAll function begins by erasing the user space of the
Flash macro with the highest address range. A bulk program of
all zeros is then performed on the same Flash macro, to destroy
all traces of the previous contents. The bulk program is followed
by a second erase that leaves the Flash macro in a state ready
for writing. The erase, program, erase sequence is then
performed on the next lowest Flash macro in the address space
if it exists. Following the erase of the user space, the protection
block for the Flash macro with the highest address range is
erased. Following the erase of the protection block, zeros are
written into every bit of the protection table. The next lowest
Flash macro in the address space then has its protection block
erased and filled with zeros.
The end result of the EraseAll function is that all user data in the
Flash is destroyed and the Flash is left in an unprogrammed
state, ready to accept one of the various write commands. The
protection bits for all user data are also reset to the zero state.
The parameter block values that must be set, besides the keys,
are the CLOCK and DELAY values.
14.5.7 TableRead Function
The TableRead function gives the user access to part specific
data stored in the Flash during manufacturing. It also returns a
Revision ID for the die (not to be confused with the Silicon ID).
The table space for the CYRF69103 is simply a 64 byte row
broken up into eight tables of eight bytes. The tables are
numbered zero through seven. All user and hidden blocks in the
CYRF69103 consist of 64 bytes.
An internal table holds the Silicon ID and returns the Revision ID.
The Silicon ID is returned in SRAM, while the Revision ID is
returned in the CPU_A and CPU_X registers. The Silicon ID is a
value placed in the table by programming the Flash and is
controlled by Cypress Semiconductor Product Engineering. The
Revision ID is hard coded into the SROM. The Revision ID is
discussed in more detail later in this section.
An internal table holds alternate trim values for the device and
returns a one-byte internal revision counter. The internal revision
counter starts out with a value of zero and is incremented each
time one of the other revision numbers is not incremented. It is
reset to zero each time one of the other revision numbers is
incremented. The internal revision count is returned in the
CPU_A register. The CPU_X register is always set to FFh when
trim values are read. The BLOCKID value, in the parameter
block, is used to indicate which table must be returned to the
user. Only the three least significant bits of the BLOCKID
parameter are used by the TableRead function for the
CYRF69103. The upper five bits are ignored. When the function
is called, it transfers bytes from the table to SRAM addresses
F8h–FFh.
The M8C’s A and X registers are used by the TableRead function
to return the die’s Revision ID. The Revision ID is a 16-bit value
hard coded into the SROM that uniquely identifies the die’s
design.
14.5.8 Checksum Function
The Checksum function calculates a 16-bit checksum over a
user specifiable number of blocks, within a single Flash macro
(Bank) starting from block zero. The BLOCKID parameter is
used to pass in the number of blocks to calculate the checksum
over. A BLOCKID value of 1 calculates the checksum of only
block 0, while a BLOCKID value of 0 calculates the checksum of
all 256 user blocks. The 16-bit checksum is returned in KEY1 and
KEY2. The parameter KEY1 holds the lower eight bits of the
checksum and the parameter KEY2 holds the upper eight bits of
the checksum.
The checksum algorithm executes the following sequence of
three instructions over the number of blocks times 64 to be
checksummed.
romx
add [KEY1], A
adc [KEY2], 0
Table 14-9. EraseAll Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value when SSC is
executed
CLOCK 0,FCh Clock Divider used to set the write pulse
width
DELAY 0,FEh For a CPU speed of 12 MHz set to 56h
Table 14-10. Table Read Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value when SSC is
executed
BLOCKID 0,FAh Table number to read
Table 14-11. Checksum Parameters
Name Address Description
KEY1 0,F8h 3Ah
KEY2 0,F9h Stack Pointer value when SSC is
executed
BLOCKID 0,FAh Number of Flash blocks to calculate
checksum on
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 24 of 68
15. Clocking
The CYRF69103 internal oscillator outputs two frequencies,
the Internal 24 MHz Oscillator and the 32 kHz Low power
Oscillator.
The Internal 24 MHz Oscillator is designed such that it may be
trimmed to an output frequency of 24 MHz over temperature
and voltage variation. The Internal 24 MHz Oscillator accuracy
is 24 MHz –22% to +10% (between 0°–70°C). No external
components are required to achieve this level of accuracy.
Firmware is responsible for selecting the correct trim values
from the User row to match the power supply voltage in the
end application and writing the values to the trim registers
IOSCTR and LPOSCTR.
The internal low speed oscillator of nominally 32 kHz provides
a slow clock source for the CYRF69103 in suspend mode.
This is used to generate a periodic wakeup interrupt and
provide a clock to sequential logic during power up and power
down events when the main clock is stopped. In addition, this
oscillator can also be used as a clocking source for the Interval
Timer clock (ITMRCLK) and Capture Timer clock (TCAPCLK).
The 32 kHz Low power Oscillator can operate in low power
mode or can provide a more accurate clock in normal mode.
The Internal 32 kHz Low power Oscillator accuracy ranges
from –53.12% to +56.25%. The 32 kHz low power oscillator
can be calibrated against the internal 24 MHz oscillator or
another timing source if desired.
CYRF69103 provides the ability to load new trim values for the
24 MHz oscillator based on voltage. This allows Vdd to be
monitored and have firmware trim the oscillator based on
voltage present. The IOSCTR register is used to set trim
values for the 24 MHz oscillator. CYRF69103 is initialized with
3.30V trim values at power on, then firmware is responsible for
transferring the correct set of trim values to the trim registers
to match the application’s actual Vdd. The 32 kHz oscillator
generally does not require trim adjustments versus voltage but
trim values for the 32 kHz are also stored in Supervisory ROM.
Figure 15-1. SROM Table
To improve the accuracy of the IMO, new trim values are loaded based on supply voltage to the part. For this, firmware needs to
make modifications to two registers:
1. The internal oscillator trim register at location 0x34.
2. The gain register at location 0x38.
Valid
Operating
Region
F8h F9h FAh FBh FCh FDh FEh FFh
Table 0
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Silicon ID
[15-8]
Silicon ID
[7-0]
24 MHz
IOSCTR
at 3.30V
24 MHz
IOSCTR
at 3.00V
24 MHz
IOSCTR
at 2.85V
24 MHz
IOSCTR
at 2.70V
32 kHz
LPOSCTR
at 3.30V
32 kHz
LPOSCTR
at 3.00V
32 kHz
LPOSCTR
at 2.85V
32 kHz
LPOSCTR
at 2.70V
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 25 of 68
Trim values for the IOSCTR register:
The trim values are stored in SROM tables in the part as shown in Figure 15-1. on page 24.
The trim values are read out from the part based on voltage settings and written to the IOSCTR register at location 0x34. The following
pseudo code shows how this is done.
_main:
mov A, 2
mov [SSC_BLOCKID], A
Call SROM operation to read the SROM table (Refer to section SROM Table Read Description)
//After this command is executed, the trim values for 3.3, 3.0, 2.85 and 2.7 are stored at locations
FC through FF in the RAM. SROM calls are explained in the previous section of this datasheet
; mov A, [FCh] // trim values for 3.3V
mov A, [FDh] // trim values for 3.0V
; mov A, [FEh] // trim values for 2.85V
; mov A, [FFh] // trim values for 2.70V
mov reg[IOSCTR],A // Loading IOSCTR with trim values for 3.0V
.terminate:
jmp .terminate
15.1 SROM Table Read Description
The Silicon IDs for CYRF69103 devices are stored in SROM tables in the part, as shown in Figure 15-1. on page 24.
The Silicon ID can be read out from the part using SROM Table reads. This is demonstrated in the following pseudo code. As
mentioned in the section “SROM” on page 20, the SROM variables occupy address F8h through FFh in the SRAM. Each of the
variables and their definition in given in the section “SROM” on page 20.
AREA SSCParmBlkA(RAM,ABS)
org F8h // Variables are defined starting at address F8h
SSC_KEY1: ; F8h supervisory key
SSC_RETURNCODE: blk 1 ; F8h result code
SSC_KEY2 : blk 1 ;F9h supervisory stack ptr key
SSC_BLOCKID: blk 1 ; FAh block ID
SSC_POINTER: blk 1 ; FBh pointer to data buffer
SSC_CLOCK: blk 1 ; FCh Clock
SSC_MODE: blk 1 ; FDh ClockW ClockE multiplier
SSC_DELAY: blk 1 ; FEh flash macro sequence delay count
SSC_WRITE_ResultCode: blk 1 ; FFh temporary result code
_main:
mov A, 0
mov [SSC_BLOCKID], A// To read from Table 0 - Silicon ID is stored in Table 0
//Call SROM operation to read the SROM table
mov X, SP ; copy SP into X
mov A, X ; A temp stored in X
add A, 3 ; create 3 byte stack frame (2 + pushed A)
mov [SSC_KEY2], A ; save stack frame for supervisory code
; load the supervisory code for flash operations
mov [SSC_KEY1], 3Ah ;FLASH_OPER_KEY - 3Ah
mov A,6 ; load A with specific operation. 06h is the code for Table read Table
14-1 on page 20
SSC ; SSC call the supervisory ROM
// At the end of the SSC command the silicon ID is stored in F8 (MSB) and F9(LSB) of the SRAM
.terminate:
jmp .terminate
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 26 of 68
Gain value for the register at location [0x38]:
3.3V = 0x40
3.0V = 0x40
2.85V = 0xFF
2.70V = 0xFF
Load register [0x38] with the gain values corresponding to the
appropriate voltage.
When using the 32 kHz oscillator the PITMRL/H must be read
until two consecutive readings match before sending/receiving
data. The following firmware example assumes the developer is
interested in the lower byte of the PIT.
Read_PIT_counter:
mov A, reg[PITMRL]
mov [57h], A
mov A, reg[PITMRL]
mov [58h],A
mov [59h], A
mov A, reg[PITMRL]
mov [60h], A
;;;Start comparison
mov A,[60h]
mov X, [59h]
sub A, [59h]
jz done
mov A, [59h]
mov X, [58h]
sub A, [58h]
jz done
mov X, [57h]
;;;correct data is in memory location 57h
done:
mov [57h], X
ret
15.2 Clock Architecture Description
The CYRF69103 clock selection circuitry allows the selection of
independent clocks for the CPU, Interval Timers, and Capture
Timers.
CPU Clock
The CPU clock, CPUCLK, can be sourced from the Internal
24 MHz oscillator. The selected clock source can optionally be
divided by 2n-1 where n is 0–7 (see Table 15-3 on page 27).
Table 15-1. Oscillator Trim Values vs. Voltage Settings
Supervisory ROM Table Function
Table2 FCh 24 MHz IOSCTR at 3.30V
Table2 FDh 24 MHz IOSCTR at 3.00V
Table2 FEh 24 MHz IOSCTR at 2.85V
Table2 FFh 24 MHz IOSCTR at 2.70V
Table3 F8h 32 kHz LPOSCTR at 3.30V
Table3 F9h 32 kHz LPOSCTR at 3.00V
Table3 FAh 32 kHz LPOSCTR at 2.85V
Table3 FBh 32 kHz LPOSCTR at 2.70V
Table 15-2. CPU Clock Config (CPUCLKCR) [0x30] [R/W]
Bit # 76543210
Field Reserved
Read/Write –––––––-
Default 00000000
Bits 7:0 Reserved
Note The CPU speed selection is configured using the OSC_CR0 Register (Figure 15-2. on page 29).
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 27 of 68
Table 15-3. OSC Control 0 (OSC_CR0) [0x1E0] [R/W]
Bit # 76543210
Field Reserved No Buzz Sleep Timer [1:0] CPU Speed [2:0]
Read/Write R/W R/W R/W R/W R/W R/W
Default 00001000
Bits 7:6 Reserved
Bit 5 No Buzz
During sleep (the Sleep bit is set in the CPU_SCR Register—Table 16-1 on page 31), the LVD and POR detection
circuit is turned on periodically to detect any POR and LVD events on the VCC pin (the Sleep Duty Cycle bits in the
ECO_TR are used to control the duty cycle—Table 18-3 on page 36). To facilitate the detection of POR and LVD
events, the No Buzz bit is used to force the LVD and POR detection circuit to be continuously enabled during
sleep. This results in a faster response to an LVD or POR event during sleep at the expense of a slightly higher
than average sleep current. Obtaining the absolute lowest power usage in sleep mode requires the No Buzz bit be
clear
0 = The LVD and POR detection circuit is turned on periodically as configured in the Sleep Duty Cycle.
1 = The Sleep Duty Cycle value is overridden. The LVD and POR detection circuit is always enabled.
Note The periodic Sleep Duty Cycle enabling is independent with the sleep interval shown in the following Sleep [1:0] bits.
Bits 4:3 Sleep Timer [1:0]
Note Sleep intervals are approximate
Bits 2:0 CPU Speed [2:0]
The CYRF69103 may operate over a range of CPU clock speeds. The reset value for the CPU Speed bits is zero.
Therefore, the default CPU speed is 3 MHz.
Sleep Timer
[1:0]
Sleep Timer Clock
Frequency (Nominal)
Sleep Period
(Nominal)
Watchdog Period
(Nominal)
00 512 Hz 1.95 ms 6 ms
01 64 Hz 15.6 ms 47 ms
10 8 Hz 125 ms 375 ms
11 1 Hz 1 sec 3 sec
CPU Speed
[2:0]
CPU when Internal
Oscillator is selected
000 3 MHz (Default)
001 6 MHz
010 12 MHz
011 Reserved
100 1.5 MHz
101 750 kHz
110 187 kHz
111 Reserved
[+] Feedback
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15.2.1 Interval Timer Clock (ITMRCLK)
The Interval Timer clock (ITMRCLK) can be sourced from the
internal 24 MHz oscillator, internal 32 kHz low power oscillator,
or timer capture clock. A programmable prescaler of 1, 2, 3, or 4
then divides the selected source. The 12-bit Programmable
Interval Timer is a simple down counter with a programmable
reload value. It provides a 1 μs resolution by default. When the
down counter reaches zero, the next clock is spent reloading.
The reload value can be read and written while the counter is
running, but care must be taken to ensure that the counter does
not unintentionally reload while the 12-bit reload value is only
partially stored—for example, between the two writes of the
12-bit value. The programmable interval timer generates
interrupt to the CPU on each reload.
The parameters to be set appears on the device editor view of
PSoC Designer after you place the CYRF69103 timer user
module. The parameters are PITIMER_Source and
PITIMER_Divider. The PITIMER_Source is the clock to the timer
and the PITIMER_Divider is the value the clock is divided by.
The interval register (PITMR) holds the value that is loaded into
the PIT counter on terminal count. The PIT counter is a down
counter.
The Programmable Interval Timer resolution is configurable. For
example:
TCAPCLK divide by x of CPU clock (for example TCAPCLK
divide by 2 of a 24 MHz CPU clock gives a frequency of 12 MHz)
ITMRCLK divide by x of TCAPCLK (for example, ITMRCLK
divide by 3 of TCAPCLK is 4 MHz so resolution is 0.25 μs).
15.2.2 Timer Capture Clock (TCAPCLK)
The Timer Capture clock (TCAPCLK) can be sourced from the
internal 24 MHz oscillator or the internal 32 kHz low power oscil-
lator. A programmable prescaler of 2, 4, 6, or 8 then divides the
selected source.
Table 15-4. Timer Clock Config (TMRCLKCR) [0x31] [R/W]
Bit # 76543210
Field TCAPCLK Divider TCAPCLK Select ITMRCLK Divider ITMRCLK Select
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 10001111
Bits 7:6 TCAPCLK Divider [1:0]
TCAPCLK Divider controls the TCAPCLK divisor.
0 0 = Divider Value 2
0 1 = Divider Value 4
1 0 = Divider Value 6
1 1 = Divider Value 8
Bits 5:4 TCAPCLK Select
The TCAPCLK Select field controls the source of the TCAPCLK.
0 0 = Internal 24 MHz Oscillator
0 1 =Reserved
1 0 = Internal 32 kHz Low power Oscillator
1 1 = TCAPCLK Disabled
Note The 1024 μs interval timer is based on the assumption that TCAPCLK is running at 4 MHz. Changes in TCAPCLK frequency
cause a corresponding change in the 1024 μs interval timer frequency.
Bits 3:2 ITMRCLK Divider
ITMRCLK Divider controls the ITMRCLK divisor
0 0 = Divider value of 1
0 1 = Divider value of 2
1 0 = Divider value of 3
1 1 = Divider value of 4
Bits 1:0 ITMRCLK Select
0 0 = Internal 24 MHz Oscillator
0 1 = Reserved
1 0 = Internal 32 kHz Low power Oscillator
1 1 = TCAPCLK
Note Changing the source of TMRCLK requires that both the source and destination clocks be running. Attempting to change
the clock source away from TCAPCLK after that clock has been stopped is not successful.
[+] Feedback
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Document #: 001-07611 Rev *F Page 29 of 68
Figure 15-2. Programmable Interval Timer Block Diagram
15.2.3 Internal Clock Trim
System
Clock
Clock
Timer
Configuration
Status and
Control
12-bit
reload
value
12-bit down
counter
12-bit
reload
counter
Interrupt
Controller
Table 15-5. IOSC Trim (IOSCTR) [0x34] [R/W]
Bit # 76543210
Field foffset[2:0] Gain[4:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0 0 0 D D D D D
The IOSC Calibrate register is used to calibrate the internal oscillator. The reset value is undefined but during boot the SROM
writes a calibration value that is determined during manufacturing test. The ‘D’ indicates that the default value is trimmed to
24 MHz at 3.30V at power on.
Bits 7:5 foffset [2:0]
This value is used to trim the frequency of the internal oscillator. These bits are not used in factory calibration and
are zero. Setting each of these bits causes the appropriate fine offset in oscillator frequency:
foffset bit 0 = 7.5 kHz
foffset bit 1 = 15 kHz
foffset bit 2 = 30 kHz
Bits 4:0 Gain [4:0]
The effective frequency change of the offset input is controlled through the gain input. A lower value of the gain
setting increases the gain of the offset input. This value sets the size of each offset step for the internal oscillator.
Nominal gain change (kHz/offsetStep) at each bit, typical conditions (24 MHz operation):
Gain bit 0 = –1.5 kHz
Gain bit 1 = –3.0 kHz
Gain bit 2 = –6 kHz
Gain bit 4 = –24 kHz
[+] Feedback
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Document #: 001-07611 Rev *F Page 30 of 68
15.2.4 LPOSC Trim
15.3 CPU Clock During Sleep Mode
When the CPU enters sleep mode, the oscillator is stopped. When the CPU comes out of sleep mode it is running on the internal
oscillator. The internal oscillator recovery time is three clock cycles of the Internal 32 kHz Low power Oscillator.
Table 15-6. LPOSC Trim (LPOSCTR) [0x36] [R/W]
Bit # 76543210
Field
32 kHz Low
Power
Reserved 32 kHz Bias Trim [1:0] 32 kHz Freq Trim [3:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 0 D D DDD D
This register is used to calibrate the 32 kHz Low speed Oscillator. The reset value is undefined but during boot the SROM writes
a calibration value that is determined during manufacturing test. This is the meaning of ‘D’ in the Default field. The trim value can
be adjusted vs. voltage as noted in Table 15-2 on page 26.
Bit 7 32 kHz Low Power
0 = The 32 kHz Low speed Oscillator operates in normal mode.
1 = The 32 kHz Low speed Oscillator operates in a low power mode. The oscillator continues to function normally
but with reduced accuracy.
Bit 6 Reserved
Bits [5:4] 32 kHz Bias Trim [1:0]
These bits control the bias current of the low power oscillator.
0 0 = Mid bias
0 1 = High bias
1 0 = Reserved
1 1 = Reserved
Important Note Do not program the 32 kHz Bias Trim [1:0] field with the reserved 10b value as the oscillator does not oscillate
at all corner conditions with this setting.
Bits 3:0 32 kHz Freq Trim [3:0]
These bits are used to trim the frequency of the low power oscillator.
[+] Feedback
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Document #: 001-07611 Rev *F Page 31 of 68
16. Reset
The microcontroller supports two types of resets: Power on Reset (POR) and Watchdog Reset (WDR). When reset is initiated, all
registers are restored to their default states and all interrupts are disabled.
The occurrence of a reset is recorded in the System Status and Control Register (CPU_SCR). Bits within this register record the
occurrence of POR and WDR Reset respectively. The firmware can interrogate these bits to determine the cause of a reset.
The microcontroller resumes execution from Flash address 0x0000 after a reset. The internal clocking mode is active after a reset,
until changed by user firmware.
Note The CPU clock defaults to 3 MHz (Internal 24 MHz Oscillator divide-by-8 mode) at POR to guarantee operation at the low VCC
that might be present during the supply ramp.
Note
3. C = Clear. This bit can only be cleared by the user and cannot be set by firmware.
Table 16-1. System Status and Control Register (CPU_SCR) [0xFF] [R/W]
Bit # 76543210
Field GIES Reserved WDRS PORS Sleep Reserved Reserved Stop
Read/Write R R/C[3] R/C[3] R/W R/W
Default 0001010 0
The bits of the CPU_SCR register are used to convey status and control of events for various functions of a CYRF69103
device.
Bit 7 GIES
The Global Interrupt Enable Status bit is a read-only status bit and its use is discouraged. The GIES bit is a legacy
bit, which was used to provide the ability to read the GIE bit of the CPU_F register. However, the CPU_F register
is now readable. When this bit is set, it indicates that the GIE bit in the CPU_F register is also set which, in turn,
indicates that the microprocessor services interrupts:
0 = Global interrupts disabled
1 = Global interrupt enabled
Bit 6 Reserved
Bit 5 WDRS
The WDRS bit is set by the CPU to indicate that a WDR event has occurred. The user can read this bit to
determine the type of reset that has occurred. The user can clear but not set this bit:
0 = No WDR
1 = A WDR event has occurred
Bit 4 PORS
The PORS bit is set by the CPU to indicate that a POR event has occurred. The user can read this bit to deter-
mine the type of reset that has occurred. The user can clear but not set this bit:
0 = No POR
1 = A POR event has occurred (Note that WDR events do not occur until this bit is cleared).
Bit 3 SLEEP
Set by the user to enable CPU sleep state. CPU remains in sleep mode until any interrupt is pending. The Sleep
bit is covered in more detail in the section Sleep Mode on page 32.
0 = Normal operation
1 = Sleep
Bits 2:1 Reserved
Bit 0 STOP
This bit is set by the user to halt the CPU. The CPU remains halted until a reset (WDR, POR, or external reset)
has taken place. If an application wants to stop code execution until a reset, the preferred method is to use the
HALT instruction rather than writing to this bit.
0 = Normal CPU operation
1 = CPU is halted (not recommended)
[+] Feedback
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Document #: 001-07611 Rev *F Page 32 of 68
16.1 Power On Reset
POR occurs every time the power to the device is switched on.
POR is released when the supply is typically 2.6V for the upward
supply transition, with typically 50 mV of hysteresis during the
power on transient. Bit 4 of the System Status and Control
Register (CPU_SCR) is set to record this event (the register
contents are set to 00010000 by the POR). After a POR, the
microprocessor is held off for approximately 20 ms for the VCC
supply to stabilize before executing the first instruction at
address 0x00 in the Flash. If the VCC voltage drops below the
POR downward supply trip point, POR is reasserted. The VCC
supply needs to ramp linearly from 0 to VCC in 0 to 200 ms.
Important The PORS status bit is set at POR and can only be
cleared by the user, and cannot be set by firmware.
16.2 Watchdog Timer Reset
The user has the option to enable the WDT. The WDT is enabled
by clearing the PORS bit. When the PORS bit is cleared, the
WDT cannot be disabled. The only exception to this is if a POR
event takes place, which disables the WDT.
The sleep timer is used to generate the sleep time period and the
Watchdog time period. The sleep timer uses the Internal 32 kHz
Low power Oscillator system clock to produce the sleep time
period. The user can program the sleep time period using the
Sleep Timer bits of the OSC_CR0 Register (Table 15-3). When
the sleep time elapses (sleep timer overflows), an interrupt to the
Sleep Timer Interrupt Vector is generated.
The Watchdog Timer period is automatically set to be three
counts of the Sleep Timer overflows. This represents between
two and three sleep intervals depending on the count in the
Sleep Timer at the previous WDT clear. When this timer reaches
three, a WDR is generated.
The user can either clear the WDT, or the WDT and the Sleep
Timer. Whenever the user writes to the Reset WDT Register
(RES_WDT), the WDT is cleared. If the data that is written is the
hex value 0x38, the Sleep Timer is also cleared at the same time.
17. Sleep Mode
The CPU can only be put to sleep by the firmware. This is accom-
plished by setting the Sleep bit in the System Status and Control
Register (CPU_SCR). This stops the CPU from executing
instructions, and the CPU remains asleep until an interrupt
comes pending, or there is a reset event (either a Power on
Reset, or a Watchdog Timer Reset).
The Low voltage Detection circuit (LVD) drops into fully functional
power reduced states, and the latency for the LVD is increased.
The actual latency can be traded against power consumption by
changing the Sleep Duty Cycle field of the ECO_TR Register.
The Internal 32 kHz low speed oscillator remains running. Before
entering suspend mode, firmware can optionally configure the 32
kHz Low speed Oscillator to operate in a low power mode to help
reduce the overall power consumption (using the 32 kHz Low
Power bit, Table 15-6). This helps save approximately 5 μA;
however, the trade off is that the 32 kHz Low speed Oscillator be
less accurate (–53.12% to +56.25% deviation).
All interrupts remain active. Only the occurrence of an interrupt
wakes the part from sleep. The Stop bit in the System Status and
Control Register (CPU_SCR) must be cleared for a part to
resume out of sleep. The Global Interrupt Enable bit of the CPU
Flags Register (CPU_F) does not have any effect. Any
unmasked interrupt wakes the system up. As a result, any inter-
rupts not intended for waking must be disabled through the
Interrupt Mask Registers.
When the CPU enters sleep mode, the internal oscillator is
stopped. When the CPU comes out of sleep mode, it is running
on the internal oscillator. The internal oscillator recovery time is
three clock cycles of the Internal 32 kHz Low power Oscillator.
On exiting sleep mode, when the clock is stable and the delay
time has expired, the instruction immediately following the sleep
instruction is executed before the interrupt service routine (if
enabled).
The Sleep interrupt allows the microcontroller to wake up period-
ically and poll system components while maintaining very low
average power consumption. The Sleep interrupt may also be
used to provide periodic interrupts during non sleep modes.
17.1 Sleep Sequence
The Sleep bit is an input into the sleep logic circuit. This circuit is
designed to sequence the device into and out of the hardware
sleep state. The hardware sequence to put the device to sleep
is shown in Figure 17-1. on page 33 and is defined as follows.
1. Firmware sets the SLEEP bit in the CPU_SCR0 register. The
Bus Request (BRQ) signal to the CPU is immediately assert-
ed. This is a request by the system to halt CPU operation at
an instruction boundary. The CPU samples BRQ on the pos-
itive edge of CPUCLK.
2. Due to the specific timing of the register write, the CPU issues
a Bus Request Acknowledge (BRA) on the following positive
edge of the CPU clock. The sleep logic waits for the following
negative edge of the CPU clock and then asserts a
system-wide Power Down (PD) signal. In Figure 17-1. on
page 33 the CPU is halted and the system-wide power down
signal is asserted.
Table 16-2. Reset Watchdog Timer (RESWDT) [0xE3] [W]
Bit # 76543210
Field Reset Watchdog Timer [7:0]
Read/Write WWWWWWW W
Default 0000000 0
Any write to this register clears the Watchdog Timer, a write of 0x38 also clears the Sleep Timer.
Bits 7:0 Reset Watchdog Timer [7:0]
[+] Feedback
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Document #: 001-07611 Rev *F Page 33 of 68
3. The system-wide PD (power down) signal controls several
major circuit blocks: The Flash memory module, the internal
24 MHz oscillator, the EFTB filter and the bandgap voltage
reference. These circuits transition into a zero power state.
The only operational circuits on chip are the Low Power oscil-
lator, the bandgap refresh circuit, and the supply voltage
monitor (POR/LVD) circuit.
17.2 Low Power in Sleep Mode
To achieve the lowest possible power consumption during
suspend or sleep, the following conditions are observed in
addition to considerations for the sleep timer:
All GPIOs are set to outputs and driven low
Clear P11CR[0], P10CR[0]
Set P10CR[1]
To avoid current consumption make sure ITMRCLK and
TCPCLK are not sourced by either low power 32 kHz oscillator
or 24 MHz crystal-less oscillator.
All the other blocks go to the power down mode automatically on
suspend.
The following steps are user configurable and help in reducing
the average suspend mode power consumption:
1. Configure the power supply monitor at a large regular inter-
vals, control register bits are 1,EB[7:6] (Power system sleep
duty cycle PSSDC[1:0]).
2. Configure the Low power oscillator into low power mode,
control register bit is LOPSCTR[7].
Figure 17-1. Sleep Timing
17.3 Wakeup Sequence
When asleep, the only event that can wake the system up is an
interrupt. The global interrupt enable of the CPU flag register
does not need to be set. Any unmasked interrupt wakes the
system up. It is optional for the CPU to actually take the interrupt
after the wakeup sequence. The wakeup sequence is synchro-
nized to the 32 kHz clock. This is done to sequence a startup
delay and enable the Flash memory module enough time to
power up before the CPU asserts the first read access. Another
reason for the delay is to enable the oscillator, Bandgap, and
LVD/POR circuits time to settle before actually being used in the
system. As shown in Figure 17-2. on page 34, the wakeup
sequence is as follows:
1. The wakeup interrupt occurs and is synchronized by the
negative edge of the 32 kHz clock.
2. At the following positive edge of the 32 kHz clock, the
system-wide PD signal is negated. The Flash memory
module, internal oscillator, EFTB, and bandgap circuit are all
powered up to a normal operating state.
3. At the following positive edge of the 32 kHz clock, the current
values for the precision POR and LVD have settled and are
sampled.
4. At the following negative edge of the 32 kHz clock (after about
15 µs nominal), the BRQ signal is negated by the sleep logic
circuit. On the following CPUCLK, BRA is negated by the CPU
and instruction execution resumes. Note that in Figure 17-2.
on page 34 fixed function blocks, such as Flash, internal oscil-
lator, EFTB, and bandgap, have about 15 µs start up. The
wakeup times (interrupt to CPU operational) ranges from
75 µs to 105 µs.
Firmware write to SCR
SLEEP bit causes an
immediate BRQ
IOW
SLEEP
BRQ
PD
BRA
CPUCLK
CPU captures
BRQ on next
CPUCLK edge
CPU
responds
with a BRA
On the falling edge of
CPUCLK, PD is asserted.
The 24/48 MHz system clock
is halted; the Flash and
bandgap are powered down
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 34 of 68
Figure 17-2. Wakeup Timing
INT
SLEEP
PD
BANDGAP
CLK32K
SAMPLE
SAMPLE
LVD/POR
CPUCLK/
24MHz
BRA
BRQ
ENABLE
CPU
(Not to Scale)
Sleep Timer or GPIO
interrupt occurs
Interrupt is double sampled
by 32K clock and PD is
negated to system
CPU is restarted
after 90 ms
(nominal)
[+] Feedback
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Document #: 001-07611 Rev *F Page 35 of 68
18. Low Voltage Detect Control
Table 18-1. Low Voltage Control Register (LVDCR) [0x1E3] [R/W]
Bit # 76543210
Field Reserved PORLEV[1:0] Reserved VM[2:0]
Read/Write R/W R/W –R/WR/W R/W
Default 0000000 0
This register controls the configuration of the Power on Reset/Low voltage Detection circuit. This register can only be accessed
in the second bank of I/O space. This requires setting the XIO bit in the CPU flags register.
Bits 7:6 Reserved
Bits 5:4 PORLEV[1:0]
This field controls the level below which the precision power on reset (PPOR) detector generates a reset
0 0 = 2.7V Range (trip near 2.6V)
0 1 = 3V Range (trip near 2.9V)
1 0 = Reserved
1 1 = PPOR does not generate a reset, but values read from the Voltage Monitor Comparators Register (Ta b l e
18-2 on page 36) give the internal PPOR comparator state with trip point set to the 3V range setting.
Bit 3 Reserved
Bits 2:0 VM[2:0]
This field controls the level below which the low voltage-detect trips—possibly generating an interrupt and the
level at which the Flash is enabled for operation.
VM[2:0] LVD Trip Point Typ. (V)
000 2.7
001 2.92
010 3.02
011 3.13
100
101
110
111
[+] Feedback
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Document #: 001-07611 Rev *F Page 36 of 68
18.1 POR Compare State
18.2 ECO Trim Register
Table 18-2. Voltage Monitor Comparators Register (VLTCMP) [0x1E4] [R]
Bit # 76543210
Field Reserved LVD PPOR
Read/Write ––––––R R
Default 0000000 0
This read-only register allows reading the current state of the Low voltage Detection and Precision-Power-On-Reset
comparators:
Bits 7:2 Reserved
Bit 1 LVD
This bit is set to indicate that the low voltage detect comparator has tripped, indicating that the supply voltage has
gone below the trip point set by VM[2:0] (see Table 18-1 on page 35).
0 = No low voltage detect event
1 = A low voltage detect has tripped
Bit 0 PPOR
This bit is set to indicate that the precision-power-on-reset comparator has tripped, indicating that the supply
voltage is below the trip point set by PORLEV[1:0]:
0 = No precision-power-on-reset event
1 = A precision-power-on-reset event has tripped
Note This register can only be accessed in the second bank of I/O space. This requires setting the XIO bit in the CPU flags
register
Table 18-3. ECO (ECO_TR) [0x1EB] [R/W]
Bit # 76543210
Field Sleep Duty Cycle [1:0] Reserved
Read/Write R/W R/W ––––––
Default 0000000 0
This register controls the ratios (in numbers of 32 kHz clock periods) of ‘on’ time versus ‘off’ time for LVD and POR detection
circuit.
Bits 7:6 Sleep Duty Cycle [1:0]
0 0 = 1/128 periods of the Internal 32 kHz Low-speed Oscillator
0 1 = 1/512 periods of the Internal 32 kHz Low-speed Oscillator
1 0 = 1/32 periods of the Internal 32 kHz Low-speed Oscillator
1 1 = 1/8 periods of the Internal 32 kHz Low speed Oscillator
Note This register can only be accessed in the second bank of I/O space. This requires setting the XIO bit in the CPU flags
register
[+] Feedback
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Document #: 001-07611 Rev *F Page 37 of 68
19. General Purpose I/O Ports
The general purpose I/O ports are discussed in the following sections.
19.1 Port Data Registers
Table 19-1. P0 Data Register (P0DATA)[0x00] [R/W]
Bit # 76543210
Field P0.7 Reserved P0.4/INT2 P0.3/INT1 Reserved P0.1 Reserved
Read/Write R/W -R/W R/W - R/W -
Default 0 - - 0 000 -
This register contains the data for Port 0. Writing to this register sets the bit values to be output on output enabled pins. Reading
from this register returns the current state of the Port 0 pins.
Bit 7 P0.7 Data
Bits 6:5 Reserved
Bits 4:3 P0.4–P0.3Data/INT2–INT1
In addition to their use as the P0.4–P0.3 GPIOs, these pins can also be used for the alternative functions as the
Interrupt pins (INT1–INT2). To configure the P0.4–P0.3 pins, refer to the P0.3/INT1–P0.4/INT2 Configuration
Register (Table 19-5 on page 39).
Bit 2 Reserved
Bit 1 P0.1 Data
Bit 0 Reserved
Table 19-2. P1 Data Register (P1DATA) [0x01] [R/W]
Bit # 76543210
Field P1.7 P1.6 P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2 P1.1 P1.0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000-
This register contains the data for Port 1. Writing to this register sets the bit values to be output on output enabled pins. Reading
from this register returns the current state of the Port 1 pins.
Bits 7 P1.7
Bits 6 P1.6 or alternate function of SMOSI in a 4-wire SPI
Bits 5:3 P1.5–P1.3 Data/3-wire SPI Pins (SMISO/SMOSI, SCLK, SSEL)
In addition to their use as the P1.6–P1.3 GPIOs, these pins can also be used for the alternative function as the
SPI interface pins. To configure the P1.6–P1.3 pins, refer to the P1.3–P1.6 Configuration Register (Table 19-10 on
page 41)
Bits 2:1 P1.2–P1.1
Bit 0 P1.0
Table 19-3. P2 Data Register (P2DATA) [0x02] [R/W]
Bit # 76543210
Field Reserved P2.1–P2.0
Read/Write -R/WR/W
Default -00
This register contains the data for Port 2. Writing to this register sets the bit values to be output on output enabled pins. Reading
from this register returns the current state of the Port 2 pins.
Bits 7:2 P2 Data [7:2]
Bits 1:0 P2 Data [1:0]
[+] Feedback
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Document #: 001-07611 Rev *F Page 38 of 68
19.2 GPIO Port Configuration
All the GPIO configuration registers have common configuration
controls. The following are the bit definitions of the GPIO
configuration registers. By default all GPIOs are configured as
inputs. To prevent the inputs from floating, the pull up resistors
are enabled. Firmware needs to configure each of the GPIOs
before use.
19.2.1 Int Enable
When set, the Int Enable bit allows the GPIO to generate
interrupts. Interrupt generate can occur regardless of whether
the pin is configured for input or output. All interrupts are edge
sensitive, however for any interrupt that is shared by multiple
sources (that is, Ports 2, 3, and 4) all inputs must be deasserted
before a new interrupt can occur.
When clear, the corresponding interrupt is disabled on the pin.
It is possible to configure GPIOs as outputs, enable the interrupt
on the pin and then to generate the interrupt by driving the
appropriate pin state. This is useful in test and may have value
in applications.
19.2.2 Int Act Low
When clear, the corresponding interrupt is active HIGH. When
set, the interrupt is active LOW. For P0.3–P0.4 Int act Low clear
causes interrupts to be active on the rising edge. Int act Low set
causes interrupts to be active on the falling edge.
19.2.3 TTL Thresh
When set, the input has TTL threshold. When clear, the input has
standard CMOS threshold.
Important Note The GPIOs default to CMOS threshold. User’s
firmware needs to configure the threshold to TTL mode if
necessary.
19.2.4 High Sink
When set, the output can sink up to 50 mA.
When clear, the output can sink up to 8 mA.
On the CY7C601xx, only the P3.7, P2.7, P0.1, and P0.0 have
50 mA sink drive capability. Other pins have 8 mA sink drive
capability.
On the CY7C602xx, only the P1.7–P1.3 have 50 mA sink drive
capability. Other pins have 8 mA sink drive capability.
19.2.5 Open Drain
When set, the output on the pin is determined by the Port Data
Register. If the corresponding bit in the Port Data Register is set,
the pin is in high impedance state. If the corresponding bit in the
Port Data Register is clear, the pin is driven LOW.
When clear, the output is driven LOW or HIGH.
19.2.6 Pull up Enable
When set the pin has a 7K pull up to VDD.
When clear, the pull up is disabled.
19.2.7 Output Enable
When set, the output driver of the pin is enabled.
When clear, the output driver of the pin is disabled.
For pins with shared functions there are some special cases.
P0.0 (CLKIN) and P0.1 (CLKOUT) can not be output enabled
when the crystal oscillator is enabled. Output enables for these
pins are overridden by XOSC Enable.
P1.3 (SSEL), P1.4 (SCLK), P1.5 (SMOSI) and P1.6 (SMISO)
can be used for their dedicated functions or for GPIO. To enable
the pin for GPIO use, clear the corresponding SPI Use bit or the
Output Enable has no effect.
19.2.8 SPI Use
The P1.3 (SSEL), P1.4 (SCLK), P1.5 (SMOSI) and P1.6
(SMISO) pins can be used for their dedicated functions or for
GPIO. To enable the pin for GPIO, clear the corresponding SPI
Use bit. The SPI function controls the output enable for its
dedicated function pins when their GPIO enable bit is clear.
Table 19-4. P0.1 Configuration (P01CR) [0x06] R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
This register is used to configure P0.1. In the CYRF69103, only 8 mA sink drive capability is available on this pin regardless of
the setting of the High Sink bit.
If this pin is used as a general purpose output it draws current. This pin must be configured as an input to reduce current draw.
Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 see Section 19.2.3
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
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Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 see Section 19.2.3
Bit 3 Reserved
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
Table 19-5. P0.3–P0.4 Configuration (P03CR–P04CR) [0x08–0x09] [R/W]
Bit # 76543210
Field
Reserved Int Act Low TTL Thresh Reserved Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W –R/WR/W R/W
Default 0000000 0
These registers control the operation of pins P0.3–P0.4 respectively. These pins are shared between the P0.3–P0.4 GPIOs and
the INT1–INT2. The INT1–INT2 interrupts are different than all the other GPIO interrupts. These pins are connected directly to
the interrupt controller to provide three edge-sensitive interrupts with independent interrupt vectors. These interrupts occur on
a rising edge when Int act Low is clear and on a falling edge when Int act Low is set. These pins are enabled as interrupt sources
in the interrupt controller registers (Table 21-8 on page 54 and Table 21-6 on page 53).
To use these pins as interrupt inputs, configure them as inputs by clearing the corresponding Output Enable. If the INT1–INT2
pins are configured as outputs with interrupts enabled, firmware can generate an interrupt by writing the appropriate value to the
P0.3, and P0.4 data bits in the P0 Data Register.
Regardless of whether the pins are used as Interrupt or GPIO pins the Int Enable, Int act Low, TTL Threshold, Open Drain, and
Pull up Enable bits control the behavior of the pin.
The P0.3/INT1–P0.4/INT2 pins are individually configured with the P03CR (0x08), and P04CR (0x09) respectively.
Note Changing the state of the Int Act Low bit can cause an unintentional interrupt to be generated. When configuring these
interrupt sources, it is best to follow the following procedure:
1. Disable interrupt source
2. Configure interrupt source
3. Clear any pending interrupts from the source
4. Enable interrupt source
Table 19-6. P0.7 Configuration (P07CR) [0x0C] [R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low TTL Thresh Reserved Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W R/W R/W R/W
Default 00000000
This register controls the operation of pin P0.7.
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Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 Reserved
Bit 2 Reserved
Bit 1 0 = disables the 5K ohm pull up resistors
1 = enables 5K ohm pull up resistors for both
P1.0 and P1.1 (this is not compatible with USB)
Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 Reserved
Bit 2 see Section 19.2.5
Bit 1 Reserved
Bit 0 see Section 19.2.7
Table 19-7. P1.0 Configuration (P10CR) [0x0D] [R/W]
Bit # 7 6 5 4 3 2 1 0
Field
Reserved Int Enable Int Act Low Reserved Reserved Reserved 5K pullup
Enable
Output
enable
Read/Write R/W R/W R/W - - - R/W R/W
Default 0000 0000
This register controls the operation of the P1.0 pin.
Note The P1.0 is an open drain only output. It can actively drive a signal low, but cannot actively drive a signal high.
Bit 0 This bit enables the output on P1.0. This bit must be cleared in sleep mode.
Table 19-8. P1.1 Configuration (P11CR) [0x0E] [R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low Reserved Open Drain Reserved Output
Enable
Read/Write R/W R/W –R/W–R/W
Default 00000000
This register controls the operation of the P1.1 pin.
The pull up resistor on this pin is enabled by the P10CR Register.
Note There is no 2 mA sourcing capability on this pin. The pin can only sink 5 mA at VOL3 section.
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Table 19-9. P1.2 Configuration (P12CR) [0x0F] [R/W]
Bit # 76543210
Field
CLK Output Int Enable Int Act Low TTL
Threshold
Reserved Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W R/W –R/WR/W R/W
Default 0000000 0
This register controls the operation of the P1.2.
Bit 7 CLK Output
0 = The internally selected clock is not sent out onto P1.2 pin.
1 = When CLK Output is set, the internally selected clock is sent out onto P1.2 pin.
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
Table 19-10. P1.3 Configuration (P13CR) [0x10] [R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W –R/WR/WR/W R/W
Default 0000000 0
This register controls the operation of the P1.3 pin.
The P1.3 GPIO’s threshold is always set to TTL.
When the SPI hardware is enabled, the output enable and output state of the pin is controlled by the SPI circuitry. When the SPI
hardware is disabled, the pin is controlled by the Output Enable bit and the corresponding bit in the P1 data register.
Regardless of whether the pin is used as an SPI or GPIO pin the Int Enable, Int act Low, High Sink, Open Drain, and Pull up
Enable control the behavior of the pin.
50 mA sink drive capability is available.
Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
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Table 19-11. P1.4–P1.6 Configuration (P14CR–P16CR) [0x11–0x13] [R/W]
Bit # 76543210
Field
SPI Use Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W –R/WR/WR/W R/W
Default 0000000 0
These registers control the operation of pins P1.4–P1.6, respectively.
The P1.4–P1.6 GPIO’s threshold is always set to TTL.
When the SPI hardware is enabled, pins that are configured as SPI Use have their output enable and output state controlled by
the SPI circuitry. When the SPI hardware is disabled or a pin has its SPI Use bit clear, the pin is controlled by the Output Enable
bit and the corresponding bit in the P1 data register.
Regardless of whether any pin is used as an SPI or GPIO pin the Int Enable, Int act Low, High Sink, Open Drain, and Pull up
Enable control the behavior of the pin.
The 50 mA sink drive capability is only available in the CY7C602xx. In the CY7C601xx, only 8 mA sink drive capability is available
on this pin regardless of the setting of the High Sink bit.
Bit 7 SPI Use
0 = Disable the SPI alternate function. The pin is used as a GPIO
1 = Enable the SPI function. The SPI circuitry controls the output of the pin
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
Note For Comm Modes 01 or 10 (SPI Master or SPI Slave, see Table 19-15 on page 45)
When configured for SPI (SPI Use = 1 and Comm Modes [1:0] = SPI Master or SPI Slave mode), the input/output direction of
pins P1.3, P1.5, and P1.6 is set automatically by the SPI logic. However, pin P1.4's input/output direction is NOT automatically
set; it must be explicitly set by firmware. For SPI Master mode, pin P1.4 must be configured as an output; for SPI Slave mode,
pin P1.4 must be configured as an input.
Table 19-12. P1.7 Configuration (P17CR) [0x14] [R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W R/W R/W R/W
Default 00000000
This register controls the operation of pin P1.7.
50 mA sink drive capability is available. The P1.7 GPIO’s threshold is always set to TTL.
Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 Reserved
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
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19.3 GPIO Configurations for Low Power Mode
To ensure low power mode, unbonded GPIO pins in CYRF69103 must be placed in a non-floating state. The following assembly code
snippet shows how this is achieved. This snippet can be added as a part of the initialization routine.
//Code Snippet for addressing unbonded GPIOs
mov A, 01h
mov reg[1Fh],A
mov A, 01h
mov reg[16h],A // Port3 Configuration register - Enable output
mov A, 00h
mov reg[03h],A // Asserting P3.0 to P3.7 outputs to '0'
//Port 2 configurations
mov A,01h
mov reg[15h],A //Port 2 Configuration register -Enable output
mov A,00h
mov reg[02h],A //Asserting P2.0 to P2.7 outputs to ‘0’
mov A, 01h
mov reg[05h],A // Port0.0 Configuration register - Enable output
mov reg[07h],A // Port0.2 Configuration register - Enable output
mov reg[0Ah],A // Port0.5 Configuration register - Enable output
mov reg[0Bh],A // Port0.6 Configuration register - Enable output
mov A,reg[00h]
mov A,00h
and A,9Ah
mov reg[00h], A // Asserting outputs '0' to pins in port 1
// NOTE: The code fragment in italics is to be used only if your application configures P2.0 and
P2.1 as push-pull outputs.
When writing to port 0, to access GPIOs P0.1,3,4,7, mask bits 0,2,5,6. Failing to do so voids the low power.
Table 19-13. P2 Configuration (P2CR) [0x15] [R/W]
Bit # 76543210
Field
Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull up
Enable
Output
Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W
Default 00000000
This register controls the operation of pins P2.0–P2.1.
Bit 7 Reserved
Bit 6 see Section 19.2.1
Bit 5 see Section 19.2.2
Bit 4 see Section 19.2.3
Bit 3 see Section 19.2.4
Bit 2 see Section 19.2.5
Bit 1 see Section 19.2.6
Bit 0 see Section 19.2.7
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19.4 Serial Peripheral Interface (SPI)
The SPI Master/Slave Interface core logic runs on the SPI clock domain. The SPI clock is a divider off of the CPUCLK when in Master
Mode. SPI is a four-pin serial interface comprised of a clock, an enable, and two data pins.
Figure 19-1. SPI Block Diagram
SPI State Machine
SS_N
Data (8 bit)
Load
Empty
Data (8 bit)
Load
Full
Sclk Output Enable
Slave Select Output Enable
Master IN, Slave Out OE
Master Out, Slave In, OE
Shift Buffer
Input Shift Buffer
Output Shift Buffer
SCK Clock Generation
SCK Clock Select
SCK Clock Phase/Polarity
Select
Register Block
SCK Speed Sel
Master/Slave Sel
SCK Polarity
SCK Phase
Little Endian Sel
MISO/MOSI
Crossbar
GPIO Block
SS_N
LE_SEL
SCK
LE_SEL
SCK_OE
SS_N_OE
MISO_OE
MOSI_OE
SCK
SCK_OE
SS_N_OE
SCK
SS_N
Master/Slave Set MISO
MOSI
MISO_OE
MOSI_OE
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19.5 SPI Data Register
When an interrupt occurs to indicate to firmware that an byte of receive data is available, or the transmitter holding register is empty,
firmware has 7 SPI clocks to manage the buffers—to empty the receiver buffer, or to refill the transmit holding register. Failure to meet
this timing requirement results in incorrect data transfer.
19.6 SPI Configure Register
Table 19-14. SPI Data Register (SPIDATA) [0x3C] [R/W]
Bit # 76543210
Field SPIData[7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
When read, this register returns the contents of the receive buffer. When written, it loads the transmit holding register.
Bits 7:0 SPI Data [7:0]
Table 19-15. SPI Configure Register (SPICR) [0x3D] [R/W]
Bit # 76543210
Field Swap LSB First Comm Mode CPOL CPHA SCLK Select
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
Bit 7 Swap
0 = Swap function disabled.
1 = The SPI block swaps its use of SMOSI and SMISO. Among other things, this can be useful in implementing
single wire SPI-like communications.
Bit 6 LSB First
0 = The SPI transmits and receives the MSB (Most Significant Bit) first.
1 = The SPI transmits and receives the LSB (Least Significant Bit) first.
Bits 5:4 Comm Mode [1:0]
0 0: All SPI communication disabled.
0 1: SPI master mode
1 0: SPI slave mode
1 1: Reserved
Bit 3 CPOL
This bit controls the SPI clock (SCLK) idle polarity.
0 = SCLK idles low
1 = SCLK idles high
Bit 2 CPHA
The Clock Phase bit controls the phase of the clock on which data is sampled. Table 19-16 on page 46 shows the
timing for the various combinations of LSB First, CPOL, and CPHA.
Bits 1:0 SCLK Select
This field selects the speed of the master SCLK. When in master mode, SCLK is generated by dividing the base
CPUCLK.
Important Note for Comm Modes 01b or 10b (SPI Master or SPI Slave):
When configured for SPI, (SPI Use = 1—Table 19-11 on page 42), the input/output direction of pins P1.3, P1.5, and P1.6 is set
automatically by the SPI logic. However, pin P1.4's input/output direction is NOT automatically set; it must be explicitly set by
firmware. For SPI Master mode, pin P1.4 must be configured as an output; for SPI Slave mode, pin P1.4 must be configured as
an input.
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Table 19-16. SPI Mode Timing vs. LSB First, CPOL and CPHA
LSB First CPHA CPOL Diagram
000
001
010
011
100
101
110
111
SCLK
SSEL
DATA X XMSB Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7 LSB
SCLK
SSEL
X X
DATA MSB Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7 LSB
SCLK
SSEL
X X
DATA MSB Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7 LSB
SCLK
SSEL
DATA X XMSB Bit 2Bit 3Bit 4Bit 5Bit 6Bit 7 LSB
SCLK
SSEL
DATA X XMSBBit 2 Bit 3 B it 4 Bit 5 B it 6 Bit 7LSB
SCLK
SSEL
X X
DATA MSBBit 2 B it 3 Bit 4 Bit 5 Bit 6 B it 7LSB
SCLK
SSEL
X X
DATA MSBBit 2Bit 3Bit 4Bit 5Bit 6Bit 7LSB
SCLK
SSEL
DATA XMSB XBit 2 Bit 3 Bit 4 B it 5 Bit 6 B it 7LSB
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19.7 SPI Interface Pins
The SPI interface between the radio function and MCU function
uses pins P1.3–P1.5 and optionally P1.6. These pins are
configured using the P1.3 and P1.4–P1.6 Configuration.
20. Timer Registers
All timer functions of the CYRF69103 are provided by a single
timer block. The timer block is asynchronous from the CPU clock.
The 16-bit free running counter is used as the time-base for timer
captures and can also be used as a general time-base by
software.
20.1 Registers
20.1.1 Free Running Counter
The 16-bit free running counter is clocked by a 4 or 6 MHz
source. It can be read in software for use as a general purpose
time base. When the low order byte is read, the high order byte
is registered. Reading the high order byte reads this register
allowing the CPU to read the 16-bit value atomically (loads all
bits at one time). The free running timer generates an interrupt
at 1024 μs rate. It can also generate an interrupt when the free
running counter overflow occurs—every 16.384 ms. This allows
extending the length of the timer in software.
Figure 20-1. 16-bit Free Running Counter Block Diagram
Table 19-17. SPI SCLK Frequency
SCLK
Select
CPUCLK
Divisor
SCLK Frequency when
CPUCLK = 12 MHz
00 6 2 MHz
01 12 1 MHz
10 48 250 kHz
11 96 125 kHz
Timer Capture
Clock
16-bit Free
Running Counter
Overflow
Interrupt
1024-µs
Timer
Interrupt
Table 20-1. Free Running Timer Low Order Byte (FRTMRL) [0x20] [R/W]
Bit # 76543210
Field Free Running Timer [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
Bits 7:0 Free running Timer [7:0]
This register holds the low order byte of the 16-bit free running timer. Reading this register causes the high order byte to be
moved into a holding register allowing an automatic read of all 16 bits simultaneously.
For reads, the actual read occurs in the cycle when the low order is read. For writes the actual time the write occurs is the cycle
when the high order is written.
When reading the free running timer, the low order byte must be read first and the high order second. When writing, the low
order byte must be written first then the high order byte.
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Table 20-2. Free Running Timer High-Order Byte (FRTMRH) [0x21] [R/W]
Bit # 76543210
Field Free Running Timer [15:8]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
Bits 7:0 Free Running Timer [15:8]
When reading the free running timer, the low order byte must be read first and the high order second. When writing, the low
order byte must be written first then the high order byte.
Table 20-3. Programmable Interval Timer Low (PITMRL) [0x26] [R]
Bit # 76543210
Field Prog Interval Timer [7:0]
Read/Write RRRRRRR R
Default 0000000 0
Bits 7:0 Prog Interval Timer [7:0]
This register holds the low order byte of the 12-bit programmable interval timer. Reading this register causes the high order byte
to be moved into a holding register allowing an automatic read of all 12 bits simultaneously.
Table 20-4. Programmable Interval Timer High (PITMRH) [0x27] [R]
Bit # 76543210
Field Reserved Prog Interval Timer [11:8]
Read/Write -- -- -- -- RRR R
Default 0000000 0
Bits 7:4 Reserved
Bits 3:0 Prog Internal Timer [11:8]
This register holds the high order nibble of the 12-bit programmable interval timer. Reading this register returns the high order
nibble of the 12-bit timer at the instant that the low order byte was last read.
Table 20-5. Programmable Interval Reload Low (PIRL) [0x28] [R/W]
Bit # 76543210
Field Prog Interval [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
Bits 7:0 Prog Interval [7:0]
This register holds the lower 8 bits of the timer. While writing into the 12-bit reload register, write lower byte first then the higher
nibble.
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Figure 20-2. 16-Bit Free Running Counter Loading Timing Diagram
Table 20-6. Programmable Interval Reload High (PIRH) [0x29] [R/W]
Bit # 76543210
Field Reserved Prog Interval[11:8]
Read/Write -- -- -- -- R/W R/W R/W R/W
Default 0000000 0
Bits [7:4] Reserved
Bits 3:0 Prog Interval [11:8]
This register holds the higher 4 bits of the timer. While writing into the 12-bit reload register, write lower byte first then the higher
nibble.
clk_sys
write
valid
addr
write data
FRT reload
ready
Clk Timer
12b Prog Timer
12b reload
interrupt
Capture timer
clk
16b free running
counter load
16b free
running counter 00A0 00A1 00A2 00A3 00A4 00A5 00A6 00A7 00A8 00A9 00AB 00AC 00AD 00AE 00AF 00B0 00B1 00B2 ACBE ACBF ACC0
16-bit free running counter loading timing
12-bit programmable timer load timing
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Figure 20-3. Memory Mapped Registers Read/Write Timing Diagram
21. Interrupt Controller
The interrupt controller and its associated registers allow the
user’s code to respond to an interrupt from almost every
functional block in the CYRF69103 devices. The registers
associated with the interrupt controller allow interrupts to be
disabled either globally or individually. The registers also provide
a mechanism by which a user may clear all pending and posted
interrupts, or clear individual posted or pending interrupts.
The following table lists all interrupts and the priorities that are
available in the CYRF69103.
21.1 Architectural Description
An interrupt is posted when its interrupt conditions occur. This
results in the flip-flop in Figure 21-1. on page 51 clocking in a ‘1’.
The interrupt remains posted until the interrupt is taken or until it
is cleared by writing to the appropriate INT_CLRx register.
A posted interrupt is not pending unless it is enabled by setting
its interrupt mask bit (in the appropriate INT_MSKx register). All
pending interrupts are processed by the Priority Encoder to
determine the highest priority interrupt which is taken by the M8C
if the Global Interrupt Enable bit is set in the CPU_F register.
Disabling an interrupt by clearing its interrupt mask bit (in the
INT_MSKx register) does not clear a posted interrupt, nor does
it prevent an interrupt from being posted. It simply prevents a
posted interrupt from becoming pending.
Nested interrupts can be accomplished by reenabling interrupts
inside an interrupt service routine. To do this, set the IE bit in the
Flag Register.
A block diagram of the CYRF69103 Interrupt Controller is shown
in Figure 21-1. on page 51.
Memory mapped registers Read/Write timing diagram
clk_sys
rd_wrn
Valid
Addr
rdata
wdata
Table 21-1. Interrupt Priorities, Address, Name
Interrupt
Priority
Interrupt
Address Name
0 0000h Reset
1 0004h POR/LVD
2 0008h Reserved
3 000Ch SPI Transmitter Empty
4 0010h SPI Receiver Full
5 0014h GPIO Port 0
6 0018h GPIO Port 1
7 001Ch INT1
8 0020h Reserved
9 0024h Reserved
10 0028h Reserved
11 002Ch Reserved
12 0030h Reserved
13 0034h 1 ms Interval timer
14 0038h Programmable Interval Timer
15 003Ch Reserved
16 0040h Reserved
17 0044h 16-bit Free Running Timer Wrap
18 0048h INT2
19 004Ch Reserved
20 0050h GPIO Port 2
21 0054h Reserved
22 0058h Reserved
23 005Ch Reserved
24 0060h Reserved
25 0064h Sleep Timer
Table 21-1. Interrupt Priorities, Address, Name (continued)
Interrupt
Priority
Interrupt
Address Name
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Figure 21-1. Interrupt Controller Block Diagram
21.1 Interrupt Processing
The sequence of events that occur during interrupt processing is
as follows:
1. An interrupt becomes active, either because:
a. The interrupt condition occurs (for example, a timer expires).
b. A previously posted interrupt is enabled through an update
of an interrupt mask register.
c. An interrupt is pending and GIE is set from 0 to 1 in the CPU
Flag register.
2. The current executing instruction finishes.
3. The internal interrupt is dispatched, taking 13 cycles. During
this time, the following actions occur:
a. The MSB and LSB of Program Counter and Flag registers
(CPU_PC and CPU_F) are stored onto the program stack
by an automatic CALL instruction (13 cycles) generated
during the interrupt acknowledge process.
b. The PCH, PCL, and Flag register (CPU_F) are stored onto
the program stack (in that order) by an automatic CALL
instruction (13 cycles) generated during the interrupt
acknowledge process.
c. The CPU_F register is then cleared. Because this clears the
GIE bit to 0, additional interrupts are temporarily disabled.
d. The PCH (PC[15:8]) is cleared to zero.
e. The interrupt vector is read from the interrupt controller and
its value placed into PCL (PC[7:0]). This sets the program
counter to point to the appropriate address in the interrupt
table (for example, 0004h for the POR/LVD interrupt).
4. Program execution vectors to the interrupt table. Typically, a
LJMP instruction in the interrupt table sends execution to the
user's Interrupt Service Routine (ISR) for this interrupt.
5. The ISR executes. Note that interrupts are disabled because
GIE = 0. In the ISR, interrupts can be re-enabled if desired by
setting GIE = 1 (care must be taken to avoid stack overflow).
6. The ISR ends with a RETI instruction which restores the
Program Counter and Flag registers (CPU_PC and CPU_F).
The restored Flag register re-enables interrupts because GIE
= 1 again.
7. Execution resumes at the next instruction, after the one that
occurred before the interrupt. However, if there are more
pending interrupts, the subsequent interrupts are processed
before the next normal program instruction.
21.2 Interrupt Latency
The time between the assertion of an enabled interrupt and the
start of its ISR can be calculated from the following equation.
Latency = Time for current instruction to finish + Time for internal
interrupt routine to execute + Time for LJMP instruction in
interrupt table to execute.
For example, if the 5-cycle JMP instruction is executing when an
interrupt becomes active, the total number of CPU clock cycles
before the ISR begins is as follows:
(1 to 5 cycles for JMP to finish) + (13 cycles for interrupt routine)
+ (7 cycles for LJMP) = 21 to 25 cycles.
In the following example, at 12 MHz, 25 clock cycles take
2.08 µs.
21.3 Interrupt Registers
The Interrupt Registers are discussed it the following sections.
21.3.1 Interrupt Clear Register
The Interrupt Clear Registers (INT_CLRx) are used to enable the
individual interrupt sources’ ability to clear posted interrupts.
When an INT_CLRx register is read, any bits that are set
indicates an interrupt has been posted for that hardware
resource. Therefore, reading these registers gives the user the
ability to determine all posted interrupts.
Interrupt
Source
(Timer,
GPIO, etc.)
Interrupt Tak en
or
Posted
Interrupt
Pending
Interrupt
GIE
Interrupt Vector
Mask Bit Setting
D
R
Q1
Priority
Encoder
M8C C ore
Interrupt
Request
...
INT_MSKx
INT_CLRx Write
CPU_F[0]
...
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 52 of 68
21.3.2 Interrupt Mask Registers
The Interrupt Mask Registers (INT_MSKx) are used to enable the individual interrupt sources’ ability to create pending interrupts.
There are four Interrupt Mask Registers (INT_MSK0, INT_MSK1, INT_MSK2, and INT_MSK3) that may be referred to in general as
INT_MSKx. If cleared, each bit in an INT_MSKx register prevents a posted interrupt from becoming a pending interrupt (input to the
priority encoder). However, an interrupt can still post even if its mask bit is zero. All INT_MSKx bits are independent of all other
INT_MSKx bits.
If an INT_MSKx bit is set, the interrupt source associated with that mask bit may generate an interrupt that becomes a pending
interrupt.
The Enable Software Interrupt (ENSWINT) bit in INT_MSK3[7] determines the way an individual bit value written to an INT_CLRx
register is interpreted. When is cleared, writing 1's to an INT_CLRx register has no effect. However, writing 0's to an INT_CLRx register,
when ENSWINT is cleared causes the corresponding interrupt to clear. If the ENSWINT bit is set, any 0's written to the INT_CLRx
registers are ignored. However, 1's written to an INT_CLRx register, while ENSWINT is set, cause an interrupt to post for the
corresponding interrupt.
Software interrupts can aid in debugging interrupt service routines by eliminating the need to create system level interactions that are
sometimes necessary to create a hardware-only interrupt.
Table 21-2. Interrupt Clear 0 (INT_CLR0) [0xDA] [R/W]
Bit # 76543210
Field GPIO Port 1 Sleep Timer INT1 GPIO Port 0 SPI Receive SPI Transmit Reserved POR/LVD
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
When reading this register:
0 = There is no posted interrupt for the corresponding hardware.
1 = Posted interrupt for the corresponding hardware present.
Writing a ‘0’ to the bits clears the posted interrupts for the corresponding hardware. Writing a ‘1’ to the bits and to the ENSWINT
(Bit 7 of the INT_MSK3 Register) posts the corresponding hardware interrupt.
The GPIO interrupts are edge-triggered.
Table 21-3. Interrupt Clear 1 (INT_CLR1) [0xDB] [R/W]
Bit # 76543210
Field
Reserved Prog Interval
Timer
1 ms
Program-
mable
Interrupt
Reserved
Read/Write -R/W R/W ––
Default 0000000 0
When reading this register:
0 = There is no posted interrupt for the corresponding hardware.
1 = Posted interrupt for the corresponding hardware present.
Writing a ‘0’ to the bits clears the posted interrupts for the corresponding hardware. Writing a ‘1’ to the bits AND to the ENSWINT.
Bit 7 Reserved
Table 21-4. Interrupt Clear 2 (INT_CLR2) [0xDC] [R/W]
Bit # 76543210
Field
Reserved Reserved Reserved GPIO Port2 Reserved INT2 16-bit
Counter
Wrap
Reserved
Read/Write - - R/W –R/WR/W -
Default 0000000 0
When reading this register:
0 = There is no posted interrupt for the corresponding hardware
1 = Posted interrupt for the corresponding hardware present.
Writing a ‘0’ to the bits clears the posted interrupts for the corresponding hardware. Writing a ‘1’ to the bits AND to the ENSWINT
(Bit 7 of the INT_MSK3 Register) posts the corresponding hardware interrupt.
Bits 7,6,5,3,0]Reserved
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 53 of 68
Table 21-5. Interrupt Mask 3 (INT_MSK3) [0xDE] [R/W]
Bit # 76543210
Field ENSWINT Reserved
Read/Write R–––––––
Default 0000000 0
Bit 7 Enable Software Interrupt (ENSWINT)
0 = Disable. Writing 0's to an INT_CLRx register, when ENSWINT is cleared, cause the corresponding interrupt to
clear
1 = Enable. Writing 1's to an INT_CLRx register, when ENSWINT is set, cause the corresponding interrupt to post
Bits 6:0 Reserved
Table 21-6. Interrupt Mask 2 (INT_MSK2) [0xDF] [R/W]
Bit # 76543210
Field
Reserved Reserved Reserved GPIO Port 2
Int Enable
Reserved INT2
Int Enable
16-bit
Counter
Wrap Int
Enable
Reserved
Read/Write - - R/W –R/WR/W -
Default 0000000 0
Bit 7: Reserved
Bit 6: Reserved
Bit 5: Reserved
Bit 4: GPIO Port 2 Interrupt Enable
0 = Mask GPIO Port 2 interrupt
1 = Unmask GPIO Port 2 interrupt
Bit 3: Reserved
Bit 2: INT2 Interrupt Enable
0 = Mask INT2 interrupt
1 = Unmask INT2 interrupt
Bit 1: 16-bit Counter Wrap Interrupt Enable
0 = Mask 16-bit Counter Wrap interrupt
1 = Unmask 16-bit Counter Wrap interrupt
Bit 0: Reserved
The GPIO interrupts are edge-triggered.
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 54 of 68
Table 21-7. Interrupt Mask 1 (INT_MSK1) [0xE1] [R/W]
Bit # 76543210
Field
Reserved Prog Interval
Timer
Int Enable
1 ms Timer
Int Enable
Reserved
Read/Write R/W R/W R/W ––
Default 0000000 0
Bit 7 Reserved
Bit 6 Prog Interval Timer Interrupt Enable
0 = Mask Prog Interval Timer interrupt
1 = Unmask Prog Interval Timer interrupt
Bit 5 1 ms Timer Interrupt Enable
0 = Mask 1 ms interrupt
1 = Unmask 1 ms interrupt
Bit 4:0 Reserved
Table 21-8. Interrupt Mask 0 (INT_MSK0) [0xE0] [R/W]
Bit # 76543210
Field
GPIO Port 1
Int Enable
Sleep Timer
Int Enable
INT1
Int Enable
GPIO Port 0
Int Enable
SPI Receive
Int Enable
SPI Transmit
Int Enable
Reserved POR/LVD
Int Enable
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
Bit 7 GPIO Port 1 Interrupt Enable
0 = Mask GPIO Port 1 interrupt
1 = Unmask GPIO Port 1 interrupt
Bit 6 Sleep Timer Interrupt Enable
0 = Mask Sleep Timer interrupt
1 = Unmask Sleep Timer interrupt
Bit 5 INT1 Interrupt Enable
0 = Mask INT1 interrupt
1 = Unmask INT1 interrupt
Bit 4 GPIO Port 0 Interrupt Enable
0 = Mask GPIO Port 0 interrupt
1 = Unmask GPIO Port 0 interrupt
Bit 3 SPI Receive Interrupt Enable
0 = Mask SPI Receive interrupt
1 = Unmask SPI Receive interrupt
Bit 2 SPI Transmit Enable
0 = Mask SPI Transmit interrupt
1 = Unmask SPI Transmit interrupt
Bit 1 Reserved
Bit 0 POR/LVD Interrupt Enable
0 = Mask POR/LVD interrupt
1 = Unmask POR/LVD interrupt
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 55 of 68
21.3.3 Interrupt Vector Clear Register
Table 21-9. Interrupt Vector Clear Register (INT_VC) [0xE2] [R/W]
Bit # 76543210
Field Pending Interrupt [7:0]
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Default 0000000 0
The Interrupt Vector Clear Register (INT_VC) holds the interrupt vector for the highest priority pending interrupt when read, and
when written clears all pending interrupts.
Bits 7:0 Pending Interrupt [7:0]
8-bit data value holds the interrupt vector for the highest priority pending interrupt. Writing to this register clears all pending
interrupts.
21.4 Microcontroller Function Register Summary
Addr Name 7 6 5 4 3 2 1 0 R/W Default
00 P0DATA P0.7 Reserved Reserved P0.4/INT2 P0.3/INT1 Reserved P0.1 Reserved b--bb-b- 00000000
01 P1DATA P1.7 P1.6/SMISO P1.5/SMOSI P1.4/SCLK P1.3/SSEL P1.2 P1.1 P1.0 bbbbbbb- 00000000
02 P2DATA Reserved P2.1–P2.0 ------bb 00000000
06 P01CR Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull up
Enable
Output
Enable
bbbbbbbb 00000000
08–09 P03CR–
P04CR
Reserved Int Act Low TTL Thresh Reserved Open Drain Pull up
Enable
Output
Enable
--bb-bbb 00000000
0C P07CR Reserved Int Enable Int Act Low TTL Thresh Reserved Open Drain Pull up
Enable
Output
Enable
-bbb-bbb 00000000
0D P10CR Reserved Int Enable Int Act Low Reserved 5K pullup
Enable
Output
enable
bbb----b 00000000
0E P11CR Reserved Int Enable Int Act Low Reserved Open Drain Reserved Output
Enable
-bb--b-b 00000000
0F P12CR CLK Output Int Enable Int Act Low TTL
Threshold
Reserved Open Drain Pull up
Enable
Output
Enable
bbbb-bbb 00000000
10 P13CR Reserved Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
-bb-bbbb 00000000
11–13 P14CR–
P16CR
SPI Use Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
bbb-bbbb 00000000
14 P17CR Reserved Int Enable Int Act Low Reserved High Sink Open Drain Pull up
Enable
Output
Enable
-bb-bbbb 00000000
15 P2CR Reserved Int Enable Int Act Low TTL Thresh High Sink Open Drain Pull up
Enable
Output
Enable
-bbbbbbb 00000000
20 FRTMRL Free Running Timer [7:0] bbbbbbbb 00000000
21 FRTMRH Free Running Timer [15:8] bbbbbbbb 00000000
26 PITMRL Prog Interval Timer [7:0] rrrrrrrr 00000000
27 PITMRH Reserved Prog Interval Timer [11:8] ----rrrr 00000000
28 PIRL Prog Interval [7:0] bbbbbbbb 00000000
29 PIRH Reserved Prog Interval [11:8] ----rrrr 00000000
30 CPUCLKCR Reserved -------- 00000000
31 TMRCLKCR TCAPCLK Divider TCAPCLK Select ITMRCLK Divider ITMRCLK Select bbbbbbbb 10001111
34 IOSCTR foffset[2:0] Gain[4:0] bbbbbbbb 000ddddd
36 LPOSCTR 32 kHz Low
Power
Reserved 32 kHz Bias Trim [1:0] 32 kHz Freq Trim [3:0] 0-bbbbbb d-dddddd
3C SPIDATA SPIData[7:0] bbbbbbbb 00000000
3D SPICR Swap LSB First Comm Mode CPOL CPHA SCLK Select bbbbbbbb 00000000
DA INT_CLR0 GPIO Port 1 Sleep Timer INT1 GPIO Port 0 SPI Receive SPI Transmit Reserved POR/LVD bbbbbb-b 00000000
DB INT_CLR1 Reserved Prog Interval
Timer
1 ms Timer Reserved -bb----- 00000000
DC INT_CLR2 Reserved Reserved Reserved GPIO Port 2 Reserved INT2 16-bit
Counter
Wrap
Reserved ---b-bb- 00000000
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 56 of 68
DE INT_MSK3 ENSWINT Reserved r------- 00000000
DF INT_MSK2 Reserved Reserved Reserved GPIO Port 2
Int Enable
Reserved INT2
Int Enable
16-bit
Counter
Wrap Int
Enable
Reserved ---b-bb- 00000000
E0 INT_MSK0 GPIO Port 1
Int Enable
Sleep Timer
Int Enable
INT1
Int Enable
GPIO Port 0
Int Enable
SPI Receive
Int Enable
SPI Transmit
Int Enable
Reserved POR/LVD
Int Enable
bbbbbb-b 00000000
E1 INT_MSK1 Reserved Prog Interval
Timer
Int Enable
1 ms Timer
Int Enable
Reserved -bb----- 00000000
E2 INT_VC Pending Interrupt [7:0] bbbbbbbb 00000000
E3 RESWDT Reset Watchdog Timer [7:0] wwwwwww
w
00000000
-- CPU_A Temporary Register T1 [7:0] -------- 00000000
-- CPU_X X[7:0] -------- 00000000
-- CPU_PCL Program Counter [7:0] -------- 00000000
-- CPU_PCH Program Counter [15:8] -------- 00000000
-- CPU_SP Stack Pointer [7:0] -------- 00000000
F7 CPU_F Reserved XIO Super Carry Zero Global IE ---brbbb 00000010
FF CPU_SCR GIES Reserved WDRS PORS Sleep Reserved Reserved Stop r-ccb--b 00010100
1E0 OSC_CR0 Reserved No Buzz Sleep Timer [1:0] CPU Speed [2:0] --bbbbbb 00001000
1E3 LVDCR Reserved PORLEV[1:0] Reserved VM[2:0] --bb-bbb 00000000
1E4 VLTCMP Reserved LVD PPOR ------rr 00000000
1EB ECO_TR Sleep Duty Cycle [1:0] Reserved bb------ 00000000
21.4 Microcontroller Function Register Summary (continued)
Addr Name 7 6 5 4 3 2 1 0 R/W Default
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 57 of 68
22. Radio Function Register Summary
All registers are read and writable, except where noted. Registers may be written to or read from either individually or in sequential
groups. A single-byte read or write reads or writes from the addressed register. Incrementing burst read and write is a sequence that
begins with an address, and then reads or writes to/from each register in address order for as long as clocking continues. It is possible
to repeatedly read (poll) a single register using a nonincrementing burst read.
Notes
4. b = read/write; r = read only; w = write only; ‘-’ = not used, default value is undefined.
5. SOP_CODE_ADR default = 0x17FF9E213690C782.
6. DATA_CODE_ADR default = 0x02F9939702FA5CE3012BF1DB0132BE6F.
7. PREAMBLE_ADR default = 0x333302;The count value must be great than 4 for DDR and greater than 8 for SDR
8. Registers must be configured or accessed only when the radio is in IDLE or SLEEP mode.The PMU, GPIOs, RSSI registers can be accessed in Active Tx and Rx mode.
9. EOP_CTRL_ADR[6:4] must never have the value of “000” i.e. EOP Hint Symbol count must never be “0”
10. PFET Bit: Setting this bit to "1" disables the FET, therefore safely allowing Vbat to be connected to a separate reference from Vcc when the PMU is disabled to the radio.om Vcc when the
PMU is disabled to the radio.
Address Mnemonic b7 b6 b5 b4 b3 b2 b1 b0 Default[4] Access[4]
0x00 CHANNEL_ADR Not Used Channel -1001000 -bbbbbbb
0x01 TX_LENGTH_ADR TX Length 00000000 bbbbbbbb
0x02 TX_CTRL_ADR TX GO TX CLR
TXB15
IRQEN
TXB8
IRQEN
TXB0
IRQEN
TXBERR
IRQEN
TXC
IRQEN
TXE
IRQEN
00000011 bbbbbbbb
0x03 TX_CFG_ADR Not Used Not Used
DATA CODE
LENGTH DATA MODE PA SETTING
--000101 --bbbbbb
0x04 TX_IRQ_STATUS_ADR
OS
IRQ
LV
IRQ
TXB15
IRQ
TXB8
IRQ
TXB0
IRQ
TXBERR
IRQ
TXC
IRQ
TXE
IRQ
-------- rrrrrrrr
0x05 RX_CTRL_ADR RX GO RSVD
RXB16
IRQEN
RXB8
IRQEN
RXB1
IRQEN
RXBERR
IRQEN
RXC
IRQEN
RXE
IRQEN
00000111 bbbbbbbb
0x06
RX_CFG_ADR AGC EN LNA ATT HILO
FAST TURN
EN Not Used RXOW EN VLD EN
10010-10 bbbbb-bb
0x07 RX_IRQ_STATUS_ADR
RXOW
IRQ
SOPDET
IRQ
RXB16
IRQ
RXB8
IRQ
RXB1
IRQ
RXBERR
IRQ
RXC
IRQ
RXE
IRQ
-------- brrrrrrr
0x08 RX_STATUS_ADR RX ACK PKT ERR EOP ERR CRC0 Bad CRC RX Code RX Data Mode -------- rrrrrrrr
0x09 RX_COUNT_ADR RX Count 00000000 rrrrrrrr
0x0A RX_LENGTH_ADR RX Length 00000000 rrrrrrrr
0x0B PWR_CTRL_ADR PMU EN LVIRQ EN PMU Mode
Force
PFET
disable
[10.]
LVI TH PMU OUTV 10100000 bbb-bbbb
0x0C XTAL_CTRL_ADR XOUT FN XSIRQ EN Not Used Not Used FREQ 000--100 bbb--bbb
0x0D IO_CFG_ADR IRQ OD IRQ POL MISO OD XOUT OD PACTL OD PACTL GPIO SPI 3PIN IRQ GPIO 00000000 bbbbbbbb
0x0E GPIO_CTRL_ADR XOUT OP MISO OP PACTL OP IRQ OP XOUT IP MISO IP PACTL IP IRQ IP 0000---- bbbbrrrr
0x0F XACT_CFG_ADR ACK EN Not Used FRC END END STATE ACK TO 1-000000 b-bbbbbb
0x10 FRAMING_CFG_ADR SOP EN SOP LEN LEN EN SOP TH 10100101 bbbbbbbb
0x11 DATA32_THOLD_ADR Not Used Not Used Not Used Not Used TH32 ----0100 ----bbbb
0x12 DATA64_THOLD_ADR Not Used Not Used Not Used TH64 ---01010 ---bbbbb
0x13 RSSI_ADR SOP Not Used LNA RSSI 0-100000 r-rrrrrr
0x14 EOP_CTRL_ADR [9.] HEN HINT EOP 10100100 bbbbbbbb
0x15 CRC_SEED_LSB_ADR CRC SEED LSB 00000000 bbbbbbbb
0x16 CRC_SEED_MSB_ADR CRC SEED MSB 00000000 bbbbbbbb
0x17 TX_CRC_LSB_ADR CRC LSB -------- rrrrrrrr
0x18 TX_CRC_MSB_ADR CRC MSB -------- rrrrrrrr
0x19 RX_CRC_LSB_ADR CRC LSB 11111111 rrrrrrrr
0x1A RX_CRC_MSB_ADR CRC MSB 11111111 rrrrrrrr
0x1B TX_OFFSET_LSB_ADR STRIM LSB 00000000 bbbbbbbb
0x1C TX_OFFSET_MSB_ADR Not Used Not Used Not Used Not Used STRIM MSB ----0000 ----bbbb
0x1D MODE_OVERRIDE_ADR RSVD RSVD FRC SEN FRC AWAKE Not Used Not Used RST 00000--0 wwwww--w
0x1E RX_OVERRIDE_ADR ACK RX RXTX DLY MAN RXACK
FRC
RXDR DIS CRC0 DIS RXCRC ACE Not Used
0000000- bbbbbbb-
0x1F TX_OVERRIDE_ADR ACK TX FRC PRE RSVD
MAN
TXACK OVRD ACK DIS TXCRC RSVD TX INV
00000000 bbbbbbbb
0x26 XTAL_CFG_ADR RSVD RSVD RSVD RSVD START DLY RSVD RSVD RSVD 00000000 wwwwwww
w
0x27 CLK_OVERRIDE_ADR RSVD RSVD RSVD RSVD RSVD RSVD RXF RSVD 00000000 wwwwwww
w
0x28 CLK_EN_ADR RSVD RSVD RSVD RSVD RSVD RSVD RXF RSVD 00000000 wwwwwww
w
0x29 RX_ABORT_ADR RSVD RSVD ABORT EN RSVD RSVD RSVD RSVD RSVD 00000000 wwwwwww
w
0x32 AUTO_CAL_TIME_ADR AUTO_CAL_TIME 00000011 wwwwwww
w
0x35 AUTO_CAL_OFFSET_ADR AUTO_CAL_OFFSET 00000000 wwwwwww
w
0x39 ANALOG_CTRL_ADR RSVD RSVD RSVD RSVD RSVD RSVD RX INV ALL SLOW 00000000 wwwwwww
w
Register Files
0x20 TX_BUFFER_ADR TX Buffer File -------- wwwwwww
w
0x21 RX_BUFFER_ADR RX Buffer File -------- rrrrrrrr
0x22 SOP_CODE_ADR SOP Code File Note [5] bbbbbbbb
0x23 DATA_CODE_ADR Data Code File Note [6] bbbbbbbb
0x24 PREAMBLE_ADR Preamble File Note [7] bbbbbbbb
0x25 MFG_ID_ADR MFG ID File NA rrrrrrrr
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 58 of 68
23. Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature .................................... –40°C to +90°C
Ambient Temperature with Power Applied........ 0°C to +70°C
Supply Voltage on any power supply pin relative to VSS–f0.3V
to +3.9V
DC Voltage to Logic Inputs[11].................. –0.3V to VIO +0.3V
DC Voltage applied to Outputs
in High-Z State......................................... –0.3V to VIO +0.3V
Static Discharge Voltage (Digital)[12] ......................... >2000V
Static Discharge Voltage (RF)[12]................................ 1100V
Latch up Current......................................+200 mA, –200 mA
Ground Voltage.................................................................. 0V
FOSC (Crystal Frequency)........................... 12 MHz ±30 ppm
Notes
11. It is permissible to connect voltages above VIO to inputs through a series resistor limiting input current to 1 mA. AC timing not guaranteed.
12. Human Body Model (HBM).
13. VREG depends on battery input voltage.
14. Includes current drawn while starting crystal, starting synthesizer, transmitting packet (including SOP and CRC16), changing to receive mode, and receiving ACK
handshake. Device is in sleep except during this transaction.
24. DC Characteristics (T = 25°C)
Parameter Description Conditions Min Typ Max Unit
VBAT Battery Voltage 0–70°C1.8 3.6 V
VREG[13] PMU Output Voltage 2.7V mode 2.7 2.73 V
VLVD Low Voltage Detect LVDCR [2:0] set to 000 2.69 2.7 2.72 V
LVDCR [2:0] set to 001 2.90 2.92 2.94 V
LVDCR [2:0] set to 010 3.00 3.02 3.04 V
LVDCR [2:0] set to 011 3.10 3.13 3.15 V
VIO VIO Voltage 1.8 3.6 V
VCC VCC Voltage 0–70°C2.4 3.6 V
Device Current (For total current consumption in different modes, for example Radio, active, MCU, and sleep, add Radio Function
Current and MCU Function Current)
ICC (GFSK)[14] Average ICC, 1 Mbps, slow channel PA = 5, 2-way, 4 bytes/10 ms CPU
speed = 6 MHz
9.87 mA
ICC (32-8DR)[14] Average ICC, 250 kbps, fast channel PA = 5, 2-way, 4 bytes/10 ms CPU
speed = 6 MHz
10.2 mA
ISB1 Sleep Mode ICC VCC = 3.0V, MCU sleep, PMU
disabled
2.72 µA
ISB2 Sleep Mode ICC VCC = 3.0V, MCU sleep, PMU enabled 30.4 µA
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 59 of 68
Radio Function Currents (VCC = 3.0V, MCU Sleep)
IDLE ICC Radio off, XTAL Active XOUT disabled 1.1 mA
Isynth ICC during Synth Start 8.6 mA
TX ICC ICC during Transmit PA = 5 (–5 dBm) 21.2 mA
TX ICC ICC during Transmit PA = 6 (0 dBm) 28.5 mA
TX ICC ICC during Transmit PA = 7 (+4 dBm) 39.9 mA
RX ICC ICC during Receive LNA off, ATT on. 18.9 mA
RX ICC ICC during Receive LNA on, ATT off. 21.9 mA
Boost Eff PMU Boost Converter Efficiency VBAT = 2.5V,
VREG = 2.73V, ILOAD = 20 mA
83 %
ILOAD_EXT[15] Average PMU External Load current VBAT = 1.8V,
VREG = 2.73V, RX Mode
15 mA
MCU Function Currents (VDD = 3.0V)
IDD1 VDD Operating Supply Current CPU speed = 6 MHz 5.0 mA
IDD1 VDD Operating Supply Current CPU speed = 3 MHz 4.4 mA
Radio Function GPIO Interface
VOH1 Output High Voltage Condition 1 At IOH = –100.0 µA VIO – 0.1 VIO V
VOH2 Output High Voltage Condition 2 At IOH = –2.0 mA VIO – 0.4 VIO V
VOL Output Low Voltage At IOL = 2.0 mA 00.4 V
VIH Input High Voltage 0.76VIO VIO V
VIL Input Low Voltage 00.24VIO V
IIL Input Leakage Current 0 < VIN < VIO –1 0.26 +1 µA
CIN Pin Input Capacitance except XTAL, RFN, RFP
, RFBIAS 3.5 10 pF
MCU Function GPIO Interface
RUP Pull up Resistance 4 12 KΩ
VICR Input Threshold Voltage Low, CMOS
mode
Low to High edge 40% 65% VCC
VICF Input Threshold Voltage Low, CMOS
mode
High to Low edge 30% 55% VCC
VHC Input Hysteresis Voltage, CMOS Mode High to low edge 3% 10% VCC
VILTTL Input Low Voltage, TTL Mode 0.72 V
VIHTTL Input HIGH Voltage, TTL Mode 1.6 V
VOL1 Output Low Voltage, High Drive[16] IOL1 = 50 mA 1.4 V
VOL2 Output Low Voltage, High Drive[16] IOL1 = 25 mA 0.4 V
VOL3 Output Low Voltage, Low Drive IOL2 = 8 mA 0.8 V
VOH Output High Voltage[17] IOH = 2 mA VCC – 0.5 V
24. DC Characteristics (T = 25°C) (continued)
Parameter Description Conditions Min Typ Max Unit
Notes
15. ILOAD_EXT is dependant on external components and this entry applies when the components connected to L/D are SS12 series diode and DH53100LC inductor
from Sumida.
16. Available only on P1.3,P1.4,P1.5,P1.6,P1.7.
17. Except for pins P1.0, P1,1 in GPIO mode.
[+] Feedback
CYRF69103
Document #: 001-07611 Rev *F Page 60 of 68
Figure 25-1. Clock Timing
Note
18. In Master mode first bit is available 0.5 SPICLK cycle before Master clock edge available on the SCLK pin.
25. AC Characteristics
Parameter Description Conditions Min Typ Max Unit
GPIO Timing
TR_GPIO Output Rise Time Measured between 10 and 90%
Vdd/Vreg with 50 pF load
50 ns
TF_GPIO Output Fall Time Measured between 10 and 90%
Vdd/Vreg with 50 pF load
15 ns
FIMO Internal Main Oscillator Frequency With proper trim values loaded[5] 18.72 26.4 MHz
FILO Internal Low Power Oscillator With proper trim values loaded[5] 15.0001 50.0 kHz
SPI Timing
TSMCK SPI Master Clock Rate FCPUCLK/6 2 MHz
TSSCK SPI Slave Clock Rate 2.2 MHz
TSCKH SPI Clock High Time High for CPOL = 0, Low for CPOL = 1 125 ns
TSCKL SPI Clock Low Time Low for CPOL = 0, High for CPOL = 1 125 ns
TMDO Master Data Output Time[18] SCK to data valid –25 50 ns
TMDO1 Master Data Output Time,
First bit with CPHA = 0
Time before leading SCK edge 100 ns
TMSU Master Input Data Setup time 50 ns
TMHD Master Input Data Hold time 50 ns
TSSU Slave Input Data Setup Time 50 ns
TSHD Slave Input Data Hold Time 50 ns
TSDO Slave Data Output Time SCK to data valid 100 ns
TSDO1 Slave Data Output Time,
First bit with CPHA = 0
Time after SS LOW to data valid 100 ns
TSSS Slave Select Setup Time Before first SCK edge 150 ns
TSSH Slave Select Hold Time After last SCK edge 150 ns
CLOCK
TCYC
TCL
TCH
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CYRF69103
Document #: 001-07611 Rev *F Page 61 of 68
Figure 25-2. GPIO Timing Diagram
Figure 25-3. SPI Master Timing, CPHA = 1
10%
TR_GPIO TF_GPIO
GPIO Pin Output
Voltage
90%
MSB
TMSU
LSB
TMHD
TSCKH
TMDO
SS
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
(SS is under firmware control in SPI Master mode)
TSCKL
MSB LSB
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Document #: 001-07611 Rev *F Page 62 of 68
Figure 25-4. SPI Slave Timing, CPHA = 1
Figure 25-5. SPI Master Timing, CPHA = 0
MSB
TSSU
LSB
TSHD
TSCKH
TSDO
SS
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
TSCKL
TSSS TSSH
MSB LSB
MSB
TMSU
LSB
TMHD
TSCKH
TMDO1
SS
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
(SS is under firmware control in SPI Master mode)
TSCKL
TMDO
LSBMSB
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Document #: 001-07611 Rev *F Page 63 of 68
Figure 25-6. SPI Slave Timing, CPHA = 0
MSB
TSSU
LSB
TSHD
TSCKH
TSDO1
SS
SCK (CPOL=0)
SCK (CPOL=1)
MOSI
MISO
TSCKL
TSDO
LSBMSB
TSSS TSSH
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CYRF69103
Document #: 001-07611 Rev *F Page 64 of 68
26. RF Characteristics
Notes
19. Exceptions F/3 & 5C/3.
20. When using an external switching regulator to power the radio, care must be taken to keep the switching frequency well away from the IF frequency of 1MHz.
Table 26-1. Radio Parameters
Parameter Description Conditions Min Typ Max Unit
RF Frequency Range Subject to regulation 2.400 2.497 GHz
Receiver (T = 25°C, VCC = 3.0V, fOSC = 12.000 MHz, BER < 103)
Sensitivity 125 kbps 64-8DR BER 1E-3 –97 dBm
Sensitivity 250 kbps 32-8DR BER 1E-3 –93 dBm
Sensitivity CER 1E-3 –80 –87 dBm
Sensitivity GFSK BER 1E-3, ALL SLOW = 1 –84 dBm
LNA Gain 22.8 dB
ATT Gain –31.7 dB
Maximum Received Signal LNA On –15 –6 dBm
RSSI Value for PWRin –60 dBm LNA On 21 Count
RSSI Slope 1.9 dB/Count
Interference Performance (CER 1E-3)
Co-channel Interference rejection
Carrier-to-Interference (C/I)
C = –60 dBm, 9 dB
Adjacent (±1 MHz) Channel Selectivity C/I 1 MHz C = –60 dBm 3 dB
Adjacent (±2 MHz) Channel Selectivity C/I 2 MHz C = –60 dBm –30 dB
Adjacent (> 3 MHz) Channel Selectivity C/I > 3 MHz C = –67 dBm –38 dB
Out-of-Band Blocking 30 MHz–12.75 MHz[19] C = –67 dBm –30 dBm
Intermodulation C = –64 dBm, Δf = 5,10 MHz –36 dBm
Receive Spurious Emission
800 MHz 100 kHz ResBW –79 dBm
1.6 GHz 100 kHz ResBW –71 dBm
3.2 GHz 100 kHz ResBW –65 dBm
Transmitter (T = 25°C, VCC = 3.0V, fOSC = 12.000 MHz)
Maximum RF Transmit Power PA = 7 +2 4 +6 dBm
Maximum RF Transmit Power PA = 6 –2 0 +2 dBm
Maximum RF Transmit Power PA = 5 –7 –5 –3 dBm
Maximum RF Transmit Power PA = 0 –35 dBm
RF Power Control Range 39 dB
RF Power Range Control Step Size seven steps, monotonic 5.6 dB
Frequency Deviation Min PN Code Pattern 10101010 270 kHz
Frequency Deviation Max PN Code Pattern 11110000 323 kHz
Error Vector Magnitude (FSK error) >0 dBm 10 %rms
Occupied Bandwidth –6 dBc, 100 kHz ResBW 500 876 kHz
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Document #: 001-07611 Rev *F Page 65 of 68
Transmit Spurious Emission (PA = 7)
In-band Spurious Second Channel Power (±2 MHz) –38 dBm
In-band Spurious Third Channel Power (>3 MHz) –44 dBm
Non-Harmonically Related Spurs (8.000 GHz) –38 dBm
Non-Harmonically Related Spurs (1.6 GHz) –34 dBm
Non-Harmonically Related Spurs (3.2 GHz) –47 dBm
Harmonic Spurs (Second Harmonic) –43 dBm
Harmonic Spurs (Third Harmonic) –48 dBm
Fourth and Greater Harmonics –59 dBm
Power Management (Crystal PN# eCERA GF-1200008)
Crystal Start to 10ppm 0.7 1.3 ms
Crystal Start to IRQ XSIRQ EN = 1 0.6 ms
Synth Settle Slow channels 270 µs
Synth Settle Medium channels 180 µs
Synth Settle Fast channels 100 µs
Link Turnaround Time GFSK 30 µs
Link Turnaround Time 250 kbps 62 µs
Link Turnaround Time 125 kbps 94 µs
Link Turnaround Time <125 kbps 31 µs
Max. packet length < 60 ppm crystal-to-crystal
all modes except 64-DDR and
64-SDR
40 bytes
Max. packet length < 60 ppm crystal-to-crystal
64-DDR and 64-SDR
16 bytes
Table 26-1. Radio Parameters (continued)
Parameter Description Conditions Min Typ Max Unit
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Document #: 001-07611 Rev *F Page 66 of 68
28. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this
moisture.The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure
time may degrade device reliability.
29. Package Diagram
Figure 29-1. 40-Pin Pb-Free QFN 6x6 mm
27. Ordering Information
Package Ordering Part Number
40-Pin Pb-Free QFN 6x6 mm CYRF69103-40LFXC
Table 28-1. Package Handling
Parameter Description Min Typ Max Unit
TBAKETEMP Bake Temperature 125 see package label °C
TBAKETIME Bake Time see package label 72 hours
001-12917 *B
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Document #: 001-07611 Rev *F Page 67 of 68
30. Document History Page
Document Title: CYRF69103 Programmable Radio on Chip Low Power
Document #: 001-07611
REV. ECN No. Orig. of
Change
Submission
Date Description of Change
** 479801 OYR See ECN New advance data sheet.
*A 501282 OYR See ECN Preliminary data sheet. Created Preliminary data sheet from Advance Information.
*B 631696 BOO
See ECN
Final data sheet. Updated DC Characteristics table with characterization data.
Minor text changes
GPIO capacitance and timing diagram included
Sleep and Wakeup sequence documented
PIT Timer registers’ R/W capability corrected to read only
Updated radio function register descriptions
Changed L/D pin description
Changed RST Capacitor from 0.1 uF to 0.47 uF
Added example PMU configuration circuits
*C 2447906 AESA See ECN Updated to new template
*D 2615458 KKU/AESA 01/13/2009 Replaced 51-85190 with 001-12917. Fixed format and language inconsistencies.
*E 2761532 DVJA 09/09/2009 Changed default value of the Sleep Timer from 00(512 Hz) to 01(64 Hz) in the
OSC_CR0 [0x1E0] register.
*F 2885149 KKU 02/26/2010 Updated the following sections:
Microcontroller Function, Clock Architecture Description, CPU Clock During Sleep
Mode, Sleep Mode, Low Power in Sleep Mode, General Purpose I/O Ports, Microcon-
troller Function Register Summary, and Package Diagram
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Document #: 001-07611 Rev *F Revised February 26, 2010 Page 68 of 68
PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC® and CapSense® are registered trademarks of Cypress Semiconductor Corporation.
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided
that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
All products and company names mentioned in this document may be the trademarks of their respective holders.
CYRF69103
© Cypress Semiconductor Corporation, 2006-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
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assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
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Use may be limited by and subject to the applicable Cypress software license agreement.
31. Sales, Solutions, and Legal Information
31.1 Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
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