K
9.65
15.6 13.8 10.15 952745-1933 19
8.15
8.65
9.15
10.6516.1
15.1
14.6
14.1
14.3
13.3
12.8
12.3
9.5
8.5
8
7.5
52745-2033
52745-1833
52745-1733
52745-1633
20
18
17
16
13.6
13.1
12.6
12.1
11.6
11.1
10.6
10.1
9.6
9.1
8.1
11.8
11.3
10.8
10.3
9.8
9.3
8.8
8.3
7.8
7.3
5.15
4.15
7
4
3.5
3
5
1.5
D C B (A) CKT.
極数
CONNECTOR SERIES NO. : 52745-**22
6.3 2.65 4
7.65 6.5 14
13
67.15
6.65 5.5 12
11
6.15
5.65 4.5 10
8
4.65
3.65 2.5 6
15
9
7
ORDER No. オーダー番号
EMBOSSED PACKAGE
52745-0433
52745-0633
52745-0733
52745-0833
52745-0933
52745-1033
52745-1133
52745-1233
52745-1333
52745-1433
52745-1533
FITTING NAIL
金具
5
(DETAIL OF FITTING NAIL)
(金具部投影図)
VIEW K
7
注記NOTES
 1.使用材料
MATERIAL
ハウジング:ポリアミド(PA)、ガラス充填、UL94V-0、ナチュラル(白)
HOUSING:POLYAMIDE,GLASS FILLED,UL94V-0,NATURAL(WHITE)
アクチュエータ:ポリフェニレンサルファイド(PPS)、ガラス充填、UL94V-0、黒
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK
ターミナル:リン青銅、(t=0.2)
TERMINAL:PHOSPHOR BRONZE
金具:リン青銅、(t=0.2)
FITTING NAIL:PHOSPHOR BRONZE
2.めっき仕様
PLATING
ターミナル TERMINAL
錫銀ビスマスめっき(1.0μm以上)
下地:ニッケルめっき(1.0μm以上)
TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM)
UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM)
金具 FITTING NAIL
錫めっき(1.0μm以上)
下地:ニッケルめっき(1.0μm以上)
TIN PLATING (1.0 MICROMETER MINIMUM)
UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM)
 3.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR SHOULD BE LOCKED.
偶数極に適用
APPLY FOR EVEN CIRCUIT.
パターン剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの導体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
ソルダーテール方向のズレ量、及び金具半田付け面のずれ量は、
基準面  に対し上方向0.1 MAX、下方向0.15MAXとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM UPPER
DIRECTION 0.1 MAX., LOWER DIRECTION 0.15 MAX.
8.ELV及びRoHS適合品
ELV AND RoHS COMPLIANT.
0.66
0.85
0.74
1.281.02
2.455
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/09
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
TMORISHITA
2012/09/06
APPR:
KMORIKAWA
2013/03/15
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52745
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (UPPER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52745-055
PSD
001
B
MATERIAL NUMBER CUSTOMER SHEET NUMBER
GENERAL MARKET 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:51:02
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
H
H
5
6
7
4
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
0.5(N-1)
±
0.05
4
±
0.5
6
±
0.5
0.5
±
0.08
0.5
±
0.05
0.5
±
0.08
0.3
±
0.03
0.5(N+1)
±
0.07
適合FPC推奨寸法
仕上がり厚さ:0.3
±
0.03
THICKNESS: 0.3+0.03/-0.03
(PITCH)
補強板
(STIFFENER BOARD)
6
    APPLICABLE FPC
PLATING RECOMMENDED DIMENSION
R0.3
0.5(N-1)
±
0.05
0.5
±
0.1
4
±
0.5
0.5(N+1)
±
0.07
6
±
0.5
0.5
±
0.1
0.5
±
0.05 0.35+0.04
-0.03
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
補強板
(STIFFENER BOARD)
    APPLICABLE FFC
PLATING RECOMMENDED DIMENSION
(PITCH)
FPC/FFCについて:
  抜き方向は、導体側から補強板側を推奨致します。
  尚、接着剤の接点部への付着は導通不良の原因になりますので、
  染み出しが無い様お願い致します。
ABOUT FPC/FFC:
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFNER SIDE
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE 
CAUSES THE DEFECT IN ELECTRICAL CONTINUITY.
マスク厚  :100μm
マスク開口率:100%
SCREEN THICKNESS : 100μm
SCREEN OPEN TATIO : 100%
M
SOLDERING AREA
OF FITTING NAIL
金具パターンエリア
パターンおよび
半田禁止エリア
KEEPING OUT AREA OF
PATTERN AND SOLDERING
DETAIL L
CONNECTOR
POSITION
コネクタ位置
L
(PITCH)
(NON-ACCUMULATIVE)
推奨基板レイアウト(マウント面)
RECOMMENDED P.C.BOARD
PATTERN DIMENSION (MOUNTING SIDE)
0.45MAX.
1.94MIN.
(0.3)
THICKNESS: 0.3+0.03/-0.03
仕上がり厚さ:0.3
±
0.03
1.25
適合FFC推奨寸法
1.25
0.5
±
0.05
0.5(N-1)
±
0.05
3.65 3.65
(0.3)
(0.3)
(0.2)
0.83.05
2.2
1.1
0.6MAX.
(0.3)
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/09
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
TMORISHITA
2012/09/06
APPR:
KMORIKAWA
2013/03/15
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52745
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (UPPER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52745-055
PSD
001
B
MATERIAL NUMBER CUSTOMER SHEET NUMBER
GENERAL MARKET 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:51:02
R0.303
PATTERN
(DETAIL OF FITTING NAIL
ON PATTERN)
(0.605)
VIEW M
BOARD
(FROM PATTERN EDGE)
0.3
±
0.03
補強板:ポリイミド
REINFORCE BOARD: POLYMIDE
仕上がり厚さ
THICKNESS
めっき:錫めっき(0.5-1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)     
NICKEL UNDER(1-5μm)
導体部: 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.3
±
0.03
仕上がり厚さ
THICKNESS
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
補強板:ポリエステル系
REINFORCE BOARD: PET
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム:ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
めっき:錫めっき(0.5-1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)     
NICKEL UNDER(1-5μm)
導体部: 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
FFC構成推奨仕様
RECOMMENDED STRUCTURE OF FFC
FPC構成推奨仕様
RECOMMENDED STRUCTURE OF FPC
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10