TDA3676T - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation

Supersedes data of 1999 Nov 22

File under Integrated Circuits, IC01

2000 Feb 01

INTEGRATED CIRCUITS

TDA3676

Low dropout voltage/quiescent

current 10 V voltage regulator with

enable

2000 Feb 01 2

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

FEATURES

•Fixed 10 V, 100 mA regulator with enable function

•Supply voltage range up to 33 V (45 V)

•Very low quiescent current of 15 µA (typical value)

•Very low dropout voltage

•High ripple rejection

•Very high stability:

– Electrolytic capacitors: Equivalent Series Resistance

(ESR) < 38 Ω at IREG ≤25 mA

– Other capacitors: 100 nF at 200 µA≤IREG ≤100 mA.

•Pin compatible family TDA3672 to TDA3676

•Protections:

– Reverse polarity safe (down to −25 V without high

reverse current)

– Negative transient of 50 V (RS=10Ω, t < 100 ms)

– Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

– ESD protected for all pins

– DC short-circuit safe to ground and VP of the

regulator output

– Temperature protection at Tj> 150 °C.

GENERAL DESCRIPTION

The TDA3676 is a fixed 10 V voltage regulator with very

lowdropoutvoltageandquiescentcurrent,whichoperates

over a wide supply voltage range.

The IC is available as:

•TDA3676T: VP≤33 V, −40 °C≤Tamb ≤+85 °C and

SO8 package (non-automotive)

•TDA3676AT: VP≤45 V, −40 °C≤Tamb ≤+125 °C and

SO8 package (automotive).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPsupply voltage regulator on

TDA3676T 3 14.4 33 V

TDA3676AT 3 14.4 45 V

Iqquiescent supply current VP= 14.4 V; IREG = 0 mA;

VI(EN) =5V −15 30 µA

Regulator output

VREG regulator output voltage VI(EN) =5V

13V≤VP≤22 V; IREG = 0.5 mA 9.6 10 10.4 V

13V≤VP≤45 V; IREG = 0.5 mA 9.5 10 10.5 V

VP= 14.4 V;

0.5 mA ≤IREG ≤100 mA 9.5 10 10.5 V

VREG(drop) dropout voltage VP= 9.5 V; IREG =50mA −0.18 0.3 V

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA3676T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA3676AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

2000 Feb 01 3

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

BLOCK DIAGRAM

handbook, halfpage

MGL836

REGULATOR

2, 3, 6, 7

GND

REG

EN BAND GAP

TDA3676 THERMAL

PROTECTION

Fig.1 Block diagram.

PINNING

Note

1. All GND pins are connected to the lead frame and can

also be used to reduce the total thermal resistance

Rth(j-a) by soldering these pins to a ground plane.

The ground plane on the top side of the Printed-Circuit

Board (PCB) acts like a heat spreader.

SYMBOL PIN (SO8) DESCRIPTION

REG 1 regulator output

GND 2, 3, 6 and 7 ground; note 1

n.c. 4 not connected

EN 5 enable input

VP8 supply voltage

handbook, halfpage

MGL837

TDA3676

GNDGND

GND

n.c.

GND

REG

Fig.2 Pin configuration.

2000 Feb 01 4

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

FUNCTIONAL DESCRIPTION

The TDA3676 is a fixed 10 V regulator which can deliver

output currents up to 100 mA. The regulator is available in

an SO8 package with fused centre pins connected to the

lead frame. The regulator is intended for portable, mains,

telephone and automotive applications. To increase the

lifetime of batteries, a specially built-in clamp circuit keeps

the quiescent current of this regulator very low, also in

dropout and full load conditions.

The regulator remains operating down to very low supply

voltages and below this voltage it switches off.

A temperature protection circuit is included, which

switches off the regulator output at a junction temperature

above 150 °C.

A new output circuit guarantees the stability of the

regulator for a capacitor output circuit with an ESR up to

20 Ω. If only a 100 nF capacitor is used, the regulator is

fully stable when IREG > 200 mA. This is very attractive as

the ESR of an electrolytic capacitor increases strongly at

low temperatures (no expensive tantalum capacitor is

required).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage

TDA3676T −33 V

TDA3676AT −45 V

VP(rp) reverse polarity supply voltage non-operating −−25 V

Ptot total power dissipation temperature of PCB ground

plane is 25 °C−4.1 W

Tstg storage temperature non-operating −55 +150 °C

Tamb ambient temperature operating

TDA3676T −40 +85 °C

TDA3676AT −40 +125 °C

Tjjunction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air; soldered 125 K/W

Rth(j-c) thermal resistance from junction to case to centre pins; soldered 30 K/W

2000 Feb 01 5

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

CHARACTERISTICS

VP= 14.4 V; Tamb =25°C; VI(EN) = 5 V; measured in test circuit of Fig.3; unless otherwise speciﬁed.

Notes

1. The regulator output will follow VPif VP<V

REG +V

REG(drop).

2. Limiting values as applicable for device type:

a) TDA3676T: VP≤33 V, −40 °C≤Tamb ≤+85 °C.

b) TDA3676AT: VP≤45 V, −40 °C≤Tamb ≤+125 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin VP

VPsupply voltage regulator operating; note 1

TDA3676T 3 14.4 33 V

TDA3676AT 3 14.4 45 V

Iqquiescent current VP= 14.4 V; IREG = 0 mA;

VI(EN) =0V −415µA

= 14.4 V; IREG = 0 mA;

VI(EN) =5V −15 30 µA

11.5 V ≤VP≤22 V; IREG =10mA −0.2 0.5 mA

11.5 V ≤VP≤22 V; IREG =50mA −1.4 2.5 mA

Enable input: pin EN

VI(EN) enable input voltage enable off; VREG ≤0.8 V −1.0 −+1.0 V

enable on; VREG ≥9.5 V 3.0 −18 V

II(EN) enable input current VI(EN) =5V −0.3 −µA

Regulator output: pin REG; note 2

VREG output voltage 13 V ≤VP≤22 V; IREG = 0.5 mA 9.6 10 10.4 V

11V≤VP≤45 V; IREG = 0.5 mA;

Tamb ≤125 °C9.5 10 10.5 V

0.5 mA ≤IREG ≤100 mA;

Tamb ≤125 °C9.5 10 10.5 V

VREG(drop) dropout voltage VP= 9.5 V; IREG = 50 mA;

Tamb ≤85 °C−0.18 0.3 V

VREG(stab) long-term stability voltage −20 −mV/1000 h

∆VREG(line) line input regulation voltage 13 V ≤VP≤16 V; IREG = 0.5 mA −110mV

12V≤VP≤22 V; IREG = 0.5 mA −130mV

12V≤VP≤45 V; Tamb ≤125 °C−150mV

∆V

REG(load) load output regulation

voltage 0.5 mA ≤IREG ≤50 mA;

Tamb ≤125 °C−10 50 mV

SVRR supply voltage ripple

rejection fi= 120 Hz; Vi(ripple) = 1 V (RMS);

IREG = 0.5 mA 50 60 −dB

IREG(crl) current limit VREG > 9.5 V 0.17 0.25 −A

ILO(rp) output leakage current at

reverse polarity VP=−15 V; VREG ≤0.3 V −1 500 µA

2000 Feb 01 6

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

TEST AND APPLICATION INFORMATION

ndbook, halfpage

MGL838

VP81

2, 3, 6, 7

VI(EN) 5

TDA3676 10 µF

C1(1)

1 µF

VREG = 10 V

Fig.3 Test circuit.

VI(EN) =5V.

(1) C1 is optional (to minimize supply noise only).

handbook, halfpage

MDA961

ESR

(Ω)

C2 (µF)

102

10−1

10−111010

stable region

(2)

(1)

Fig.4 Graph for selecting the value of the output

capacitor.

(1) Maximum ESR at 200 µA≤IREG ≤100 mA.

(2) Minimum ESR only when IREG ≤200 µA.

Noise

The output noise is determined by the value of the output

capacitor. The noise figure is measured at a bandwidth of

10 Hz to 100 kHz (see Table 1).

Table 1 Noise ﬁgures

Stability

The regulator is stabilized with an external capacitor

connected to the output. The value of this capacitor can be

selected using the diagrams shown in Figs 4 and 5.

The following four examples show the effects of the

stabilization circuit using different values for the output

capacitor.

OUTPUT

CURRENT

IREG (mA)

NOISE FIGURE (µV)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300

50 650 400 400

handbook, halfpage

MDA962

ESR

(Ω)

IREG (mA)

103

102

10−1110 10

102

stable region

Fig.5 ESR as a function of IREG for selecting the

value of the output capacitor.

2000 Feb 01 7

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

EXAMPLE 1

The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At Tamb =−40 °C, the capacitor

value is decreased to 22 µF and the ESR is increased to

3.5 Ω. The regulator will remain stable at a temperature of

Tamb =−40 °C.

EXAMPLE 2

The regulator is stabilized with an electrolytic capacitor of

10 µF (ESR = 3.3 Ω). At Tamb =−40 °C, the capacitor

value is decreased to 3 µF and the ESR is increased to

20 Ω. The regulator will remain stable at a temperature of

Tamb =−40 °C.

EXAMPLE 3

The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. Full stability is guaranteed when

the output current is larger then 200 µA. Because the

thermal influence on this capacitor value is almost zero,

the regulator will remain stable at a temperature of

Tamb =−40 °C.

EXAMPLE 4

The regulator is stabilized with a 100 nF capacitor in

parallel with a electrolytic capacitor of 10 µF connected to

the output.

The regulator is now stable under all conditions and

independent of:

•The ESR of the electrolytic capacitor

•The value of the electrolytic capacitor

•The output current.

Application circuits

The maximum output current of the regulator equals:

When Tamb =21°C and VP= 19 V, the maximum output

current equals 140 mA.

For successful operation of the IC (maximum output

current capability) special attention has to be given to the

copper area required as heatsink (connected to all

GND pins), the thermal capacity of the heatsink and its

ability to transfer heat to the external environment. It is

possible to reduce the total thermal resistance from

125 to 50 K/W.

APPLICATION CIRCUIT WITH BACKUP FUNCTION

Sometimes a backup function is needed to supply, for

example, a microcontroller for a short period of time when

the supply voltage spikes to 0 V (or even −1 V).

ThisfunctioncaneasilybebuiltwiththeTDA3676 by using

an output capacitor with a large value. When the supply

voltage is 0 V (or −1 V), only a small current will flow into

pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.6.

IREG max() 150 Tamb

–

Rth(j-a) VPVREG

–()×

-------------------------------------------------------

150 Tamb

–

100 VP10–()×

----------------------------------------- (mA)=

dbook, halfpage

MGL839

VP81

2, 3, 6, 7

VREG = 10 V

C2(2)

VI(EN) 5

TDA3676

C1(1)

1 µF

Fig.6 Application circuit with backup function.

VI(EN) =5V.

(1) C1 is optional (to minimize supply noise only).

(2) C2 ≤4700 µF.

2000 Feb 01 8

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

Additional application information

This section gives typical curves for various parameters measured on the TDA3676AT. Standard test conditions are:

VP= 14.4 V; Tamb =25°C.

handbook, halfpage

010 V

(V)

(µA)

20 30

MDA947

Fig.7 Quiescent current as a function of the

supply voltage.

IREG = 0 mA.

handbook, halfpage

010 50

20 30 VP (V)

(mA)

MDA949

Fig.8 Quiescent current as a function of high

supply voltage.

handbook, halfpage

−40 0

(1)

(2)

160

1.5

0.5

40 80 Tj (°C)

(mA)

120

MDA951

Fig.9 Quiescent current as a function of the

junction temperature.

(1) Iqat 50 mA load.

(2) Iqat 10 mA load.

handbook, halfpage

0.36

0.40

0.44

0.48

10 15 VP (V)

(mA)

2520

MDA948

Fig.10 Quiescent current as a function of the

supply voltage.

IREG = 10 mA.

2000 Feb 01 9

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

handbook, halfpage

1.4

1.6

1.8

10 15 VP (V)

(mA)

2520

MDA950

Fig.11 Quiescent current as a function of the

supply voltage.

IREG = 50 mA.

handbook, halfpage

0 20 100

40 60 IREG (mA)

(mA)

MDA952

Fig.12 Quiescent current as a function of the load

current.

handbook, halfpage

−50 200

10.2

9.9

10.1

050 T

(°C)

VREG

(V)

100 150

MGL840

Fig.13 Output voltage as a function of the

junction temperature.

IREG = 0 mA.

handbook, halfpage

−50 200

050 T

(°C)

VREG

(V)

100 150

MGL841

Fig.14 Output voltage thermal protection as a

function of the junction temperature.

IREG = 0 mA.

2000 Feb 01 10

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

handbook, halfpage

040 I

REG (mA)

VREG(drop)

(mV)

80 120

500

400

200

100

300

MDA957

Fig.15 Dropout voltage as a function of the output

current.

handbook, halfpage

0100

VREG

(V)

IREG (mA)

200 300

MGL842

Fig.16 Fold back protection mode.

VP= 11.5 V with pulsed load.

handbook, halfpage

−70

−60

−50

−40

−30

MDA956

SVRR

(dB)

f (Hz)

102103104105

(1)

(2)

(3)

Fig.17 SVRR as a function of the ripple frequency.

IREG = 10 mA; C2 = 10 µF.

(1) SVRR at RL= 100 Ω.

(2) SVRR at RL= 500 Ω.

(3) SVRR at RL=10kΩ.

2000 Feb 01 11

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.050 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

97-05-22

99-12-27

2000 Feb 01 12

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

SOLDERING

Introduction to soldering surface mount packages

Thistext gives averybriefinsighttoa complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuitboardby screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs)or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadsonfour sides,thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Feb 01 13

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

2000 Feb 01 14

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

NOTES

2000 Feb 01 15

Philips Semiconductors Preliminary speciﬁcation

Low dropout voltage/quiescent current

10 V voltage regulator with enable TDA3676

NOTES

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

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Internet: http://www.semiconductors.philips.com

2000 69

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Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands 753503/02/pp16 Date of release: 2000 Feb 01 Document order number: 9397 750 06804