PHOTOCOUPLER
PS8101
1 Mbps HIGH CMR ANALOG OUTPUT TYPE
5-PIN SOP PHOTOCOUPLER −NEPOC Series−
DESCRIPTION
The PS8101 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a
PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
This is a plastic SOP (Small Out-line Package) type for high density applications.
FEATURES
PIN CONNECTION
(Top View)
1. Anode
2. Cathode
3. GND
4. VO
5. VCC
53
12
4
• High common mode transient immunity (CMH, CML = ±10 kV/
µ
s MIN.)
• Small package (5-pin SOP)
• High supply voltage (VCC = 35 V)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.8
µ
s MAX., tPLH = 1.2
µ
s MAX.)
• Ordering number of taping product: PS8101-F3, F4: 2 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option)
APPLICATIONS
• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Power supply
Document No. PN10260EJ02V0DS (2nd edition)
Date Published February 2005 CP(K)
The mark shows major revised points.
PS8101
PACKAGE DIMENSIONS (UNIT: mm)
1.27
0.4+0.10
–0.05 0.25 M
0.1±0.1
4.4
7.0±0.3
0.5±0.3
0.15+0.10
–0.05
3.4 +0.3
–0.1
2.6±0.2
MARKING EXAMPLE
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Rank Code
Year Assembled
(Last 1 Digit)
Week Assembled
N234
Assembly Lot
8101
N234
N*1
*1 Bar : Pb-Free
Data Sheet PN10260EJ02V0DS
2
PS8101
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification Packing Style Safety Standard
Approval Application Part
Number*1
PS8101 PS8101-A Pb-Free*2 Magazine case 100 pcs Standard products PS8101
PS8101-F3 PS8101-F3-A Embossed Tape 2 500 pcs/reel (UL approved)
PS8101-F4 PS8101-F4-A
PS8101-V PS8101-V-A Magazine case 100 pcs DIN EN60747-5-2
PS8101-V-F3 PS8101-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2)
PS8101-V-F4 PS8101-V-F4-A Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your
nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF 25 mA
Reverse Voltage VR 5.0 V
Power Dissipation*1 PD 45 mW
Detector Supply Voltage VCC 35 V
Output Voltage VO 35 V
Output Current IO 8.0 mA
Power Dissipation*2 PC 100 mW
Isolation Voltage*3 BV 2 500 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +125 °C
*1 Reduced to 0.45 mW/°C at TA = 25°C or more.
*2 Reduced to 1.00 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60 % between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10260EJ02V0DS 3
PS8101
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V
Reverse Current IR VR = 3 V 10
µ
A
Forward Voltage
Temperature Coefficient
∆
VF/
∆
T IF = 16 mA −2.1 mV/°C
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 3 500 nA
High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V 100
µ
A
Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA 0.1 0.4 V
Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 50
µ
A
High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 0.01 2
Coupled Current Transfer Ratio*1 CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 20 35 %
Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60% 1011
Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF
Propagation Delay Time
(H → L)*2 tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ,
CL = 15 pF 0.5 0.8
µ
s
Propagation Delay Time
(L → H)*2 tPLH 0.6 1.2
Common Mode
Transient Immunity at
High Level Output*3
CMH IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV 10 kV/
µ
s
Common Mode
Transient Immunity at
Low Level Output*3
CML IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV −10
*1 CTR rank
K : 20 to 35 (%)
N : 15 to 35 (%)
Data Sheet PN10260EJ02V0DS
4
PS8101
*2 Test circuit for propagation delay time
Pulse input
47 Ω
(
Pulse width = 100 s,
Duty cycle = 1/10)
µ
R
L
= 2.2 kΩ
V
O
(Monitor)
V
CC
= 5 V
Input
(Monitor)
0.1 F
µ
C
L
= 15 pF
Input
Output
50
%
1.5
V
5 V
V
OL
t
PHL
t
PLH
C
L is approximately 15 pF which includes probe and stray wiring capacitance
*3 Test circuit for common mode transient immunity
I
F
R
L
= 4.1 kΩ
V
O
(Monitor)
V
CC
= 5 V
0.1 F
µ
V
CM
90 %
10 %
1.5 kV
0
V
5
V
2 V
0.8 V
V
O
L
V
CM
V
O
(I
F
= 0 mA)
V
O
(I
F
= 16 mA)
t
r
t
f
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1
µ
F is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10260EJ02V0DS 5
PS8101
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
50
30
20
10
0
40
25 50 75 100
Ambient Temperature T
A
(˚C)
Diode Power Dissipation P
D
(mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE 120
100
60
20
0
80
40
25 50 75 100
Ambient Temperature T
A
(˚C)
Transistor Power Dissipation P
C
(mW)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
0.01
0.1
10
1
1.4 1.8 2.0 2.41.0 1.2 1.6 2.2
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
T
A
= +100˚C
+50˚C
+25˚C
0˚C
–25˚C
1 000
1
0.1
100
10
50 100–25 0 25 75
Ambient Temperature T
A
(˚C)
High Level Output Current I
OH
(nA)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
V
CC
= V
O
= 30 V
V
CC
= V
O
= 5.5 V
I
F
= 0 mA
80
20
0
40
60
70
50
10
30
0.5 5 10 501
Forward Current I
F
(mA)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Current Transfer Ratio CTR (
%
)
V
CC
= 4.5 V,
V
O
= 0.4 V
1.6
0.0
1.2
0.4
1.4
1.0
0.8
0.6
0.2
0 50 100–50 –25 25 75
Ambient Temperature T
A
(˚C)
Normalized Current Transfer Raio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized to 1.0
at T
A
= 25 ˚C, I
F
= 16 mA,
V
CC
= 4.5 V, V
O
= 0.4 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10260EJ02V0DS
6
PS8101
10
4
0
8
6
2
4 8 18 20162 6 10 12 14
Output Voltage V
O
(V)
Output Current I
O
(mA)
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
20 mA
15 mA
10 mA
5 mA
I
F
= 25 mA
6
5
4
2
0
3
1
12 16 20
4826
10 14 18
Forward Current I
F
(mA)
Output Voltage V
O
(V)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
R
L
= 2.2 kΩ
5.6 kΩ
3.0
0
1.0
2.0
10 15 25
520
Forward Current I
F
(mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
Propagation Delay Time t
PHL
, t
PLH
( s)
µ
V
CC
= 5 V,
R
L
= 2.2 kΩ
t
PHL
t
PLH
10
1
0.1 10 k 100
k
1 k
Load Resistance R
L
(Ω)
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
Propagation Delay Time t
PHL
, t
PLH
( s)
µ
V
CC
= 5 V,
I
F
= 16 mA
t
PLH
t
PHL
5
4
2
0
3
1
–50 0 50 100
–25 7525
Ambient Temperature T
A
(˚C)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Normalized Propagation Delay Time t
PHL
, t
PLH
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 16 mA, V
CC
= 5 V,
R
L
= 2.2 kΩ
t
PLH
t
PHL
Remark The graphs indicate nominal characteristics.
Data Sheet PN10260EJ02V0DS 7
PS8101
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
Taping Direction
Outline and Dimensions (Reel)
Packing: 2 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS8101-F3 PS8101-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
3.9±0.1
3.45 MAX.
7.4±0.1
0.3±0.05
8.0±0.1
1.5
+0.1
–0
5.5±0.1
12.0±0.2
3.0±0.1
Data Sheet PN10260EJ02V0DS
8
PS8101
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
Data Sheet PN10260EJ02V0DS 9
PS8101
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10260EJ02V0DS
10
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile:
(
408
)
988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS Concentration Limit per RoHS
(values are not yet fixed) Concentration contained
in CEL devices
-A -AZ
Lead (Pb) < 1000 PPM Not Detected (*)
Mercury < 1000 PPM Not Detected
Cadmium < 100 PPM Not Detected
Hexavalent Chromium < 1000 PPM Not Detected
PBB < 1000 PPM Not Detected
PBDE < 1000 PPM Not Detected
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
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