© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1854 / 1102012996 Rev No: V.8A Date: 04/03/2019 Page 1 / 4
DESCRIPTIONS
zThe Super Bright Red source color devices are
made with Gallium Aluminum Arsenide Red Light
Emitting Diode
zElectrostatic discharge and power surge could
damage the LEDs
zIt is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
zAll devices, equipments and machineries must be
electrically grounded
FEATURES
zPre-trimmed leads for pc mounting
zBlack case enhances contrast ratio
zHigh reliability life measured in years
zHousing UL rating: 94V-0
zHousing material: Type 66 nylon
zRoHS compliant
APPLICATIONS
zStatus indicator
zIlluminator
zSignage applications
zDecorative and entertainment lighting
zCommercial and residential architectural lighting
ATTENTION
Observe precautions for handling
Electrostatic discharge sensitive devices
PACKAGE DIMENSIONS
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.
Part Number Emitting Color
(Material)
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Min. Typ. 2θ1/2
WP934CB/SRD ■ Super Bright Red
(GaAlAs)
Red Diffused
150 400
50°
*50 *100
Lens Type
WP934CB/SRD
T-1 (3mm) Single-Level Circuit Board Indicator
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1854 / 1102012996 Rev No: V.8A Date: 04/03/2019 Page 2 / 4
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
WP934CB/SRD
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission IF = 20mA λpeak Super Bright Red 655 - nm
Dominant Wavelength IF = 20mA λdom [1] Super Bright Red 640 - nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA Δλ Super Bright Red 20 - nm
Capacitance C Super Bright Red 45 - pF
Forward Voltage IF = 20mA VF [2] Super Bright Red 1.85 2.5 V
Reverse Current (VR = 5V) IR Super Bright Red - 10 µA
Temperature Coefficient of λpeak
IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Super Bright Red 0.14 - nm/°C
Temperature Coefficient of λdom
IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Super Bright Red 0.05 - nm/°C
Temperature Coefficient of VF
IF = 20mA, -10°C ≤ T ≤ 85°C TCV Super Bright Red -1.9 - mV/°C
Parameter Symbol Value Unit
Power Dissipation PD 75 mW
Reverse Voltage VR 5 V
Junction Temperature Tj 115 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +85 °C
DC Forward Current IF 30 mA
Peak Forward Current IFM [1] 155 mA
Electrostatic Discharge Threshold (HBM) - 3000 V
Lead Solder Temperature [3] 260°C For 3 Seconds
Lead Solder Temperature [4] 260°C For 5 Seconds
Thermal Resistance (Junction / Ambient) Rth JA [2] 500 °C/W
Thermal Resistance (Junction / Solder point) Rth JS [2] 240 °C/W
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rth
JA ,Rth
JS Results from mounting on PC board FR4 (pad size ≥ 16 mm2 per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1854 / 1102012996 Rev No: V.8A Date: 04/03/2019 Page 3 / 4
TECHNICAL DATA
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Red
Wavelength (nm)
Relative Intensity (a. u.)
RELATIVE INTENSITY vs. WAVELENGTH
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
0° 15°
90°
1.0 1.0
T
a
= 25 °C
SPATIAL DISTRIBUTION
SUPER BRIGHT RED
0
10
20
30
40
50
1.5 1.7 1.9 2.1 2.3 2.5
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
0 1020304050
Ta = 25 °C
Forward current (mA)
Luminous intensity normalised
at 20mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at Ta = 25 °C
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
WP934CB/SRD
RECOMMENDED WAVE SOLDERING PROFILE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
© 2019 Kingbright. All Rights Reserved. Spec No: DSAF1854 / 1102012996 Rev No: V.8A Date: 04/03/2019 Page 4 / 4
WP934CB/SRD
PRECAUTIONS
Storage Conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
"
○
"
Correct mounting method " x " Incorrect mounting method
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
Lead Forming Procedures
1. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering.
2. The tip of the soldering iron should never touch the lens epoxy.
3. Through-hole LEDs are incompatible with reflow soldering.
4. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes
