(2,54mm) .100"
ALC SERIES
WWW.SAMTEC.COM
ALC–624–NGG
ALC–314–SGT
PLATING
OPTION
Lead DIA Accepted = .016" to .020" (0,41mm to 0,51mm)
Insertion Depth = .080" to .150"
Style N Component Part No. = SC-5P1
Style ZN Component Part No. = EZ-5P1
Requires Style
–S, –ZS, or –ZP
and .035"±.003"
board hole.
14
16
18
20
24
24
28
32
40
–314
–316
–318
–320
–324
–624
–628
–632
–640
No. of
Contacts
Row
Space
(7,62)
.300
(15,24)
.600
GG
= 30µ" (0,76µm) Gold
Contact 10µ" (0,25µm)
Gold Shell
GT
= 30µ" (0,76µm)
Gold Contact,
Tin Shell
TT
= Tin Contact
and Shell
(Styles –S,–ZS,
–L,–M,–N only)
Low Insertion Force (LIF) Contacts Available.
Lead DIA Accepted
= .015" to .022" (0,38mm to 0,56mm)
Insertion Depth
= .095" to .150" (2.41mm to 3,81mm)
Component Part No. = SC-1L1 or EZ-1L1
Lead DIA Accepted = .015" to .020" (0,38mm to 0,51mm)
Insertion Depth = .105" to .170" (2,76mm to 4,32mm)
Style L Component Part No. = SC-3P1
Style ZL Component Part No. = EZ-3P1
ALC ROW SPACING &
NO. OF CONTACTS
STYLE
OPTION
OTHER
OPTION
Lead DIA Accepted = .016" to .021" (0,41mm to 0,53mm
Insertion Depth = .080" to .115" (2,03mm to 2,92,mm)
Style M Component Part No. = SC-4P1
Style ZM Component Part No. = EZ-4P1
(2,54)
.100
TYP
-3XX
=(7,62)
.300
-6XX
=(15,24) .600
(7,62)
.300
(3,43)
.135
(1,32)
.052
DIA
(5,84)
.230
±.010
(0,74)
.029
DIA
(2,74)
.108
± .010
(0,76)
.030
(0,74)
.029
DIA
(2,41)
.095
± .010
(4,83)
.190
± .010
(1,32)
.052
DIA
(0,51)
.020
(1,32)
.052
DIA
(0,51)
.020
DIA
(5,20)
.205
(0,89)
.035
(0,76)
.030
Requires GT Plating Option
For LIF Specify –ZL
–L = Low Profi le, Hollow Leg
Mates with:
APA
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
Aluminum
Carriers
for Direct
Soldering to
PC Boards
Samtec aluminum
carriers are available in
the most popular DIP
lead counts for direct
mounting of lead
sockets to the printed
circuit board.
They are ideal for vapor
phase, infrared and
other high temperature
soldering techniques.
Low insertion force,
six-fi nger contacts or
standard insertion force
four-fi nger contacts are
available. Shell styles
include ultra-low profi le
designs.
ST
= 10µ" (0,25µm) Gold
Contact Tin Shell
(Styles –S & –ZS only)
–L
= Locking
Socket
Specify from chart below
For complete specifi cations
see www.samtec.com?ALC
Insulator Material:
None
Carrier Material:
Aluminum
Contact: BeCu
Shell: Brass
Plating:
Au over 50µ" (1,27µm) Ni
or Sn over 100µ" (2,54µm)
Cu or 50µ" (1,27µm) Ni
Current Rating:
1 A
Contact Resistance:
10 mΩ min
Insertion Force:
Standard = 9 oz (2,50N)
avg, 16 oz (4,45N) max
Low Insertion Force =
2.5 oz (0,70N) avg, 5.5 oz
(1,53N) max
Withdrawal Force:
Standard = 2.5 oz (0,70N) avg,
1.5 oz (0,42N) min
Low Insertion Force = 2.0 oz
(0,56N) avg, 0.35 oz (0,10N)
min except Styles ZM & ZN
= 2.0 oz (0,56N) avg, 0.5 oz
(0,14N) min
SPECIFICATIONS
For LIF Specify –ZS
For LIF Specify –ZM For LIF Specify –ZN
–S = Standard Solder Tail
–M = Low Profi le, Standard Mount –N = Low Profi le, Micro Socket
(1,32)
.052
DIA
(0,51)
.020
DIA
(0,76)
.030
(3,18)
.125
(7,62)
.300
Lead DIA Accepted = .015" to .022" (0,38mm to 0,56mm)
Insertion Depth = .095" to .150" (2,41mm to 3,81mm)
Style S Component Part No. = SC-1P1
Style ZS Component Part No. = EZ-1P1
Locking lead
(–L) available.
See OPTION.
F-210-1 SUPPLEMENT
ALUMINUM DIP SOCKET CARRIER
MOLD-TO-POSITION
PRODUCT
Minimums or set-up charges
may apply. Call Samtec.
