Data Sheet
February 2001
A1612A/B 1310 nm Forward-Path DFB Laser Modules
Features
OC-48 pinout compatible
Negative bias
112 channel loading
Meets
Telcordia Technologies
* 468 specifications
High output power, up to 31 mW
Applications
1310 nm forward path:
— Long distances
— High-count optical splits
Broadcast and narrowcast networks
*
Telcordia Technologies
is a trademark of Telcordia Technologies,
Inc
.
Description
The A1612A/B 1310 nm forward-path DFB laser
modules are designed for both broadcast and nar-
rowcast analog applications. The highly linear,
OC-48 pinout-compatible devices f eature up to
31 mW output power with superior distortion perfor-
mance over an enhanced operating temperature
range of –40 °C to + 85 °C.
With 31 mW of output power, the A1612A/B module
enables transmission beyond 40 km, and a greater
number of optical splits. In addition, the wide operat-
ing temperature range increases the laser’ s reliability
even in the harshest environments.
2Lucent Technologies Inc.
Data Sheet
A1612A/B 1310 nm Forward-Path DFB Laser Modules February 2001
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Electrical/Optical Characteristics
* OMI = 3.2% min, 112 unmodulated NTSC channels.
Parameter Symbol Condition Min Max Unit
Operating Case Temperature Range TCIF = IOP –40 85 °C
Storage Temperature Range Tstg –40 85 °C
Laser Forward dc Current 150 mA
Reverse dc Voltage (Laser) VR——2V
Reverse Voltage Photodiode VRPD ——10V
TEC Current ITEC –40 °C < TC < 85 °C,
TOP = 25 °C,
IF = 100 mA
—1.9A
Table 1. Electrical and Optical Characteristics
Parameter Symbol Condition Min Typ Max Unit
Wavelength λOP IF = IOP
, T = TOP 1310 ± 10 nm
Optic al Output Power POIF = IOP 4 31 mW
Optica l I so lat ion ISO TOP = 25 °C 30 dB
Side Mode Suppression Ratio SMSR IF = IOP 30 dB
Threshold Current ITH 25 °C, BOL 30 mA
Operating Current IOP BOL 120 mA
Monitor PD Current IPD VRM = 5 V,
TOP = 25 °C 10 200 µA/mW
Thermistor Resistance RTH TOP = 25 °C 10 ± 0.5 @ 25 °C k
Thermistor Temperature Coefficient TCTH TOP = 25 °C –4.4 @ 25 °C %/°C
TEC Current ITEC –40 °C < TC < 85 °C,
TOP = 25 °C,
IF = 100 mA
——1.6A
Table 2. RF Characteristics
Parameter Symbol Condition Min Typ Max Unit
Frequency Range F 40 860 MHz
Frequency Response |S21| IF = 60 mA,
40 MHz—860 MHz,
TOP = 25 °C
±0.5 dB
Carrier-to-Noise Ratio* CNR 51 dB
Composite Second Order:
1612A
1612B
CSO
57
60
dB
dB
Composite Triple Beat CTB 67 dB
Relative Intensity Noise RIN < 155 dB/Hz
3
Lucent Technologies Inc.
Data Sheet
February 2001 A1612A/B 1310 nm Forward-Path DFB Laser Modules
Electrical Schematics
Figure 1. A1612A/B Laser Schematic
Figure 2. A1611A/B Circuit Schematic
1
2
3
4
5
6
7
14
13
12
11
10
9
8
CASE
GROUND
NC
(+)
(–)
(+)
(–)
TEC
(–)
(+)
CASE
GROUND
NC
ISOLATOR
(+)
1-1233F
1-1234(F)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
THERMISTOR
TEC (–)
MPC CATHODE
NC
THERMISTOR
dc LAS ER
BIAS
MPD ANODE
CASE GROUND
TEC (+)
CASE
GROUND
CASE
GROUND
MPC CATHODENC
LASER
COMMON (+)
LASER
MODULATION (–)
LASER
COMMON (+) 39 nH
200
0.01
µ
f
3.3
µ
H
1000 pf
1000 pf
0.01
µ
f
0.01
µ
f
SEE
SEE
3A AN D 3B
FIGURES
FIGURE 4
4
4Lucent Technologies Inc.
Data Sheet
A1612A/B 1310 nm Forward-Path DFB Laser Modules February 2001
Electrical Schematics (continued)
Figure 3a. Impedance-Matched Configuration
Figure 3b. Resistive-Matched Configuration
C7
1 pF— 0.01
µ
f0.01
µ
f
VSWR
T1*
3:5
2
3
0.5 pF—2.5 pF
SEE PIN 12,
FIGURE 2
0.01
µ
f
FREQUENCY
RESPONSE
*T1 (75
) 3: 5.
5 pF
1-1238F.a
SEE PIN 12,
FIGURE 2
37.5
R1
37.5
R2
1-1238F.b
Note: When ordering the dc set, the following boards are included: alar m board, 9108-004; TEC board, 9028-004; constant current, 9383-004.
Figure 4. dc Set (Lucent Supplied)
CONSTANT ALARM
TEC
J1
1 THERMISTOR
2 THERMISTOR
3 dc LASER BIAS
4 MPD ANODE (CASE GROUND)
5 MPC CATHODE
6 TEC (+)
7 TEC (–)
8 GND
9 GND
10 GND
1
2
3
4
5
6
7
THERMISTOR
TEC (–)
MPC CATHODE
THERMISTOR
dc LASER
BIAS
MPD ANODE
CASE GROUND
TEC (+)
MPC CATHODE
39 nH
200
0.01
µ
f
3.3
µ
H
1000 pf
1000 pf
0.01
µ
f
0.01
µ
f
1-1238F.c
5
Lucent Technologies Inc.
Data Sheet
February 2001 A1612A/B 1310 nm Forward-Path DFB Laser Modules
Outline Diagram
Dimensions are in inches and (millimeters).
Pin Inform ation
Table 3. Pin Descriptions
Pin No. Description
1Thermistor
2Thermistor
3 dc Laser Bias (–)
4 MPD Anode, Case Ground
5 MPD Cathode
6 Thermoelectric Cooler (+)
7 Thermoelectric Cooler (–)
8 Case Ground
9 Case Ground
10 NC
11 Laser Common (+)
12 Laser Modulation (–)
13 Laser Common (+)
14 NC
LOCATION FOR LABEL
INCLUDING SERIAL NUMBER
AND DATE CODE
(LABEL NOT SHOWN)
0.049
(1.2)
4 x ø 0.105 (2.7)
0.213
(5.4)
PIN 1
LEADS
0.030 (0.8) WIDE x 0.008 (0.2) THICK
0.40 0 (10 .2) MINI MU M LENGT H
6 SPCS @ 0.100 (2.5)
0.250
(6.4)
0.190 ± 0.03
(5.0 ± 0.8)
0.078
(2.0)
0.215 ± 0.01
(5.5 ± 0.25) 0.248
(6.3)
0.040
(1.0)
0.350
(8.9)
0.500
(12.7)
0.820
(20.8)
1.025
(26.0)
1.180
(30.0)
0.365
(9.3)
0.700 ± 0.03
(18.0 ± 0.8)
(F)
1-1179.(F)
6Lucent Technologies Inc.
Data Sheet
A1612A/B 1310 nm Forward-Path DFB Laser Modules February 2001
Laser Safety Information
Class IIIb Laser Product
FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser
Safety requirements. All versions are Class 3B laser products per
IEC
* 60825-1:1993. The de vice has been classi-
fied with the FDA under an accession number to be determined.
This product complies with 21 CFR 1040.10 and 1040.11.
Single- mo de fibe r pigt ail
Wave length = 1. 3 µm
Maximum power = 50 mW
Because of size constraints, laser safety labeling (including an FD A Class IIIb label) is not affixed to the module but
attached to the outside of the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in
hazardous laser radiation exposure.
*
IEC
is a registered trademark of The International Electrotechnical Commission.
DANGER
INVISIBLE LASER RADIATION
IS EMITTED FROM THE END
OF FIBER OR CONNECTOR
Avoid direct exposure t o beam
Do not view beam directly with
optical in stru men ts
INVISIBLE LASER RADIATION EMITTED FROM END OF FIBER OR CONNECTOR
Avoid exposure to bea m
Class 3B Laser Product IEC-60825M 1993 Max. O utp ut : 50 m W Waveleng th: 1.3
µ
m
7
Lucent Technologies Inc.
Data Sheet
February 2001 A1612A/B 1310 nm Forward-Path DFB Laser Modules
Ordering Information
* For additional ordering inf ormation, please contact a Lucent
account manager at Microelectronics Group, Optoelectronics Divi-
sion, OPTO West, 1-800-362-3891 (for sales staff, please press
option 2).
Order Code Definitions
Table 4. Ordering Information*
Device Code Comcode
A1612ACB16 108851999
A1612ACB19 108852005
A1612ACB22 108852013
A1612ACB25 108854720
A1612ACB28 108854738
A1612ACB31 108854746
A1612ACB34 108855263
A1612ACR16 108855271
A1612ACR19 108855289
A1612ACR22 108855297
A1612ACR25 108855305
A1612ACR28 108855313
A1612ACR31 108855321
A1612ACR34 108855339
Field Description
Family Name
Analog 1310 nm, DFB,
Distortion Performance
A = Standar d Pe rfor ma nc e
P = PAL 60 Tested
Frequency Plan
C = 110 Channel
22 = 22 mW
25 = 25 mW
28 = 28 mW
31 = 31 mW
Custom
00
A1612 A B R 04 YY
B = Enhanced Performance
L = Link Tested
A = 60 Channel
B = 80 Channel
16 = 16 mW
19 = 19 mW
01
02
03
04
05
06
Connector
R = FC/APC
B = SC/APC
N = None (No connector)
Optical Power
N = None (Wireless)
High Power, Laser
04 = 4 mW
06 = 6 mW
08 = 8 mW
10 = 10 mW
13 = 13 mW
For additional information, contact your Microelectronic s Group Account Manager or the following:
INTERNET: http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto
E-MAIL: docmaster@micro.lucent.com
N. AMERICA: Microelectronics Gro up, Lucent Technologies Inc., 555 Union Boulevard, Room 3 0L -15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singap ore Pte. Ltd., 77 Science Park D rive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833, FAX (65) 777 7495
CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 325, FAX (86) 21 644 0 0 65 2
JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700
EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148
Techni cal Inquiries: OPTOELECTRONICS MARK ET ING: (44) 1344 865 900 (Ascot UK)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without noti ce. No liability is assumed as a r esult of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
Copyright © 2001 Lucent Technologies Inc.
All Rights Reserved
February 2001
DS00-292OPTO-1 (Replaces DS00-290OPTO )
Data Sheet
A1612A/B 1310 nm Forward-Path DFB Laser Modules February 2001