Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/22
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
2ch High Side Switch ICs
for USB Devices and Memory Cards
BD2062FJ-LB BD2066FJ-LB
General Description
This is the product guarantees long time support in
Industrial market.
High side switch for USB is a high side switch having
over-current protection used in power supply line of
universal serial bus (USB). Its switch unit has two
channels of N-channel power MOSFET. And,
over-current detection circuit, thermal shutdown circuit,
under-voltage lockout and soft-start circuit are built in.
Features
Long time support a product for Industrial
applications.
Dual N-MOS High Side Switch
Current Limit Threshold 2.4A
Control input logic
¾ Active-Low : BD2062FJ
¾ Active-High: BD2066FJ
Soft-Start Circuit
Over-Current Detection
Thermal Shutdown
Under-Voltage Lockout
Open-Drain Error Flag Output
Reverse Current Protection
When Power Switch Off
Flag Output Delay Filter Built In
TTL Enable Input
0.8ms Ty pical Rise Time
Applications
Industrial Equipment,
PC, PC peripheral USB hub in consumer appliances,
Key Specifications
Input voltage range: 2.7V to 5.5V
ON resistance : 80mΩ(Typ.)
Over current threshold: 1.5A min., 3.0A max.
Standby current: 0.01μA (Typ.)
Operating temperature range: -40℃ to +85℃
Package W(Typ.) D(Typ.) H (Max.)
SOP-J8 4.90mm x 6.00mm x 1.65mm
Car accessory, and so forth
Typical Application Circuit
Lineup Over current detection Control input logic Package Orderable Part Number
Min. Typ. Max.
1.5A 2.4A 3.0A Low SOP-J8 Reel of 2500 BD2062FJ – LBE2
1.5A 2.4A 3.0A High SOP-J8 Reel of 2500 BD2066FJ – LBE2
SOP-J8
GND
IN
/
EN1
(EN1)
/OC1
OUT1
OUT2
/
OC2
5V(Typ.)
BD2062FJ/66FJ
CL
Data
/EN2
(EN2)
C IN
Data
CL
2/22
BD2062FJ-LB BD2066FJ-LB Datasheet
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Block Diagram
Gate
Logic1
OCD1 Charge
Pump1
TSD1
UVLO
Charge
Pump2
OCD2
Gate
Logic2
TSD2
/EN1
EN1
IN
/EN2
EN2
GND
/
OC1
O
UT1
O
UT2
/
OC2
Delay
Delay
Pin Configurations
Pin Descriptions
○BD2062FJ
Pin No. Symbol I / O Pin function
1 GND - Ground.
2 IN -
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4 /EN I Enable input.
Switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
5, 8 /OC O Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
6, 7 OUT O Switch output.
○BD2066FJ
Pin No. Symbol I / O Pin function
1 GND - Ground.
2 IN -
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4 EN I Enable input.
Switch on at High level.
High level input > 2.0V, Low level input < 0.8V
5, 8 /OC O Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
6, 7 OUT O Switch output.
BD2062FJ
TOP VIEW
1
2
8
7
GND
IN
/OC1
OUT1
3 /EN1
4
6
5
OUT2
/OC2
/EN2
BD2066FJ
TOP VIEW
1
2
8
7
GND
IN
/OC1
OUT1
3 /EN1
4
6
5
OUT2
/OC2
/EN2
3/22
BD2062FJ-LB BD2066FJ-LB Datasheet
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
Supply voltage VIN -0.3 to 6.0 V
Enable input voltage VEN -0.3 to 6.0 V
/OC voltage V/OC -0.3 to 6.0 V
/OC sink current IS/OC 5 mA
OUT voltage VOUT -0.3 to 6.0 V
Storage temperature TSTG -55 to 150 ℃
Power dissipation Pd 675*1 mW
*1 Mounted on 70mm * 70mm * 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC
Recommended Operating Range
Parameter Symbol Ratings Unit
Min. Typ. Max.
Operating voltage VIN 2.7 - 5.5 V
Operating temperature TOPR -40 - 85 ℃
Electrical Characteristics
○BD2062FJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Operating current IDD - 130 180
μA V/EN = 0V , OUT=OPEN
Standby current ISTB - 0.01 1 μA V/EN = 5V , OUT=OPEN
/EN input voltage V/EN 2.0 - - V High input
V/EN - - 0.8 V Low input
/EN input current I/EN -1.0 0.01 1.0 μA V/EN = 0V or V/EN = 5V
/OC output low voltage V/OCL - - 0.5 V I/OC = 1mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
/OC delay time T/OC 10 15 20 ms
On-resistance RON - 80 125
mΩ IOUT = 500mA
Switch leak current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold ITH 1.5 2.4 3.0 A
Short circuit current ISC 1.1 1.5 2.1 A VOUT = 0V
CL = 47μF (RMS)
Output rise time TON1 - 0.8 10 ms RL = 10Ω
Output turn-on time TON2 - 1.1 20 ms RL = 10Ω
Output fall time TOFF1 - 5 20 μs RL = 10Ω
Output turn-off time TOFF2 - 10 40 μs RL = 10Ω
UVLO threshold VTUVH 2.1 2.3 2.5 V Increasing VIN
VTUVL 2.0 2.2 2.4 V Decreasing VIN
4/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Electrical Characteristics - continued
○BD2066FJ (Unless otherwise specified VIN = 5.0V, Ta = 25 ℃)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
Operating current IDD - 130 180 μA VEN = 5V , OUT=OPEN
Standby current ISTB - 0.01 1 μA VEN = 0V , OUT=OPEN
EN input voltage VEN 2.0 - - V High input
VEN - - 0.8 V Low input
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 5V
/OC output low voltage V/OCL - - 0.5 V I/OC = 1m A
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
/OC delay time T/OC 10 15 20 ms
On-resistance RON - 80 125 mΩ IOUT = 500mA
Switch leak current ILSW - - 1.0 μA VEN = 0V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold ITH 1.5 2.4 3.0 A
Short circuit current ISC 1.1 1.5 2.1 A
VOUT = 0V
CL = 47μF (RMS)
Output rise time TON1 - 0.8 10 ms RL = 10Ω
Output turn-on time TON2 - 1.1 20 ms RL = 10Ω
Output fall time TOFF1 - 5 20 μs RL = 10Ω
Output turn-off time TOFF2 - 10 40 μs RL = 10Ω
UVLO threshold VTUVH 2.1 2.3 2.5 V Increasing VIN
VTUVL 2.0 2.2 2.4 V Decreasing VIN
5/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Measurement Circuit
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VIN
VEN
A
1µF
VEN
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VIN
VEN
1µF
VEN RL CL
RLCL
A. Operatin g current B. EN, /EN input voltage, Output rise, fall time
Inrush current
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VIN
VEN
1µF
VEN
IOUT
IOUT
VDD
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
VIN
VEN
1µF
VEN IOUT
10k10k
IOUT
C. On-resistance, Over-current detection D. /OC output low voltage
Figure 1. Measurement circuit
Timing Diagram
TON2
50%
TON1
10%
90%
50%
90%
10%
TOFF1
VOUT
V/EN
TOFF2
TON2
50%
TON1
10%
90%
50%
90%
10%
TOFF1
VOUT
VEN
TOFF2
Figure 2. Timing diagram(BD2062FJ) Figure 3. Timing diagram(BD2066FJ)
6/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves
(Reference Data)
Figure 4. Operating current
EN, /EN enable
0
20
40
60
80
100
120
140
160
180
23456
SUPPLY VOLTAGE: VIN (V)
OPERATING CURRENT: IDD (uA)
TA=25℃
Figure 6. Standby current
EN, /EN disable
0
0.2
0.4
0.6
0.8
1
23456
SUPPLY VOLTAGE: VIN (V)
STANDB Y CURRENT: IDD (uA)
TA=25℃
Figure 5. Operating current
EN, /EN enable
0
20
40
60
80
100
120
140
160
180
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
OPERATING CURRENT: IDD (uA)
VIN=5V
Figure 7. Standby current
EN, /EN disable
0
0.2
0.4
0.6
0.8
1
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
STANDBY CURRENT: IDD (uA)
VIN=5V
7/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
Figure 8. EN, /EN input
voltage
0
0.5
1
1.5
2
23456
SUPPLY VOLTAGE: VIN (V)
EN INPUT VOLTAGE: V
EN (V)
TA=25℃ Low to High
High to Low
Figure 9. EN, /EN input
voltage
0
0.5
1
1.5
2
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
EN INPUT VOLTAGE: V
EN (V)
VIN=5V
High to Low
Low to High
Figure 11. /OC output low voltage
0
20
40
60
80
100
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
/OC OUTPUT VOLTAGE: V
/OC (mV)
VIN=5V
Figure 10. /OC output low voltage
0
20
40
60
80
100
23456
SUPPLY VOLTAGE: VIN (V)
/OC OUTPUT VOLTAGE: V
/OC (mV)
TA=25℃
8/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
Figure 12. On-resistance
0
20
40
60
80
100
120
23456
SUPPLY VOLTAGE: VIN (V)
ON RESISTANCE: RON (mΩ)
TA=25℃
Figure 13. On-resistance
0
20
40
60
80
100
120
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
ON RESISTANCE: RON (mΩ)
VIN=5V
Figure 14. Current limit threshold
1.5
2
2.5
3
23456
SUPPLY VOLTAGE: VIN (V)
CURRENT LIMT THRESHOLD: ITH (A)
TA=25℃
1.5
2
2.5
3
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
CURRENT LIMIT THRESHOLD: ITH (A)
VIN=5V
Figure 15. Current limit threshold
9/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
Figure 19. Output rise time
0
0.2
0.4
0.6
0.8
1
-50 0 50 100
AMBIENT TEMPERATURE: TA(℃)
RI SE TI ME: TON1(ms)
VIN=5V
Figure 18. Output rise time
0
0.2
0.4
0.6
0.8
1
23456
SUPPLY VOLTAGE: VIN (V)
RIS E TIME: T ON1 (ms)
TA=25℃
Figure 17. Short circuit current
0
0.5
1
1.5
2
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
SHORT CIRCUIT CURRENT:ISC (A)
VIN=5V
Figure 16. Short circuit current
0
0.5
1
1.5
2
23456
SUPPLY VOLTAGE: VIN (V)
SHORT CIRCUIT CURRNT: ISC (A)
TA=25℃
10/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Figure 23. Output fall time
0
1
2
3
4
5
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
FALL TIME: TOFF1 (us)
VIN=5V
Typical Performance Curves - continued
Figure 20. Output turn-on time
0
0.2
0.4
0.6
0.8
1
23456
SUPPLY VOLTAGE: VIN (V)
TURN ON TIME: TON2 (ms)
TA=25℃
Figure 21. Output turn-on time
0
0.2
0.4
0.6
0.8
1
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
TURN ON TIME: TON2 (ms)
VIN=5V
Figure 22. Output fall time
0
1
2
3
4
5
23456
SUPPLY VOLTAGE: VIN (V)
FALL TIME: TOFF1 (us)
TA=25℃
11/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
Figure 24. Output turn-off time
0
2
4
6
8
10
23456
SUPPLY VOLTAGE: VIN (V)
TURN OFF TIME: TOFF2 (us)
TA=25℃
Figure 25. Output turn-off time
0
2
4
6
8
10
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
TURN OFF TIME: TOFF2 (us)
VIN=5V
Figure 26. /OC delay time
0
5
10
15
20
23456
SUPPLY VOLTAGE: VIN (V)
/OC DELAY TIME: T/OC (ms)
TA=25℃
Figure 27. /OC delay time
0
5
10
15
20
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
/OC DELAY TIME: T/OC (ms)
VIN=5V
12/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
Figure 28. UVLO threshold voltage
0
0.05
0.1
0.15
0.2
-50 0 50 100
AMBI ENT T EMPERATUR E: TA(℃)
UVL O HYSTER ESIS: VHYS(V)
Figure 29. UVLO hysteresis voltage
2
2.1
2.2
2.3
2.4
2.5
-50 0 50 100
AMBIENT TEMPERATURE: TA(℃)
UVLO THRESHOLD: VUVLO (V)
VUVLOH
VUVLOL
13/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Wave Forms
BD2062FJ
Figure 32. Inrush current
CL=47uF, 100uF, 147uF, 220uF
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
TIME 200us/div
VIN=5V
RL=5Ω
CL=47uF CL=220uF
CL=47uF
CL=220uF
Figure 33. Inrush current
VOUT1
1V/div
VOUT2
1V/div
V/OC1
1V/div
IOUT1
1.0A/div
TIME 200us/div
VIN=5V
CL=220uF
C=10uF
RL=5Ω
Figure 30. Output rise characteristics
VIN=5V
CL=100uF
RL=5Ω
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
TIME 200us/div Figure 31. Output fall characteristics
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
TIME 1ms/div
VIN=5V
CL=100uF
RL=5Ω
14/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Wave Forms - continued
Figure 35. Over-current response
1Ωload connected at enable
VOUT1
1V/div
V/OC1
1V/div
VOUT2
1V/div
IOUT1
1.0A/div
TIME 2ms/div
VIN=5V
CL=47uF
Figure 37. Thermal shutdown
res
p
onse
V/OC2
1V/div
VOUT1
1V/div
V/OC1
1V/div
IOUT1
0.5A/div
TIME 100ms/div
VIN=5V
CL=47uF
Figure 34. Over-current response
ramped load
VOUT2
1V/div
VOUT1
1V/div
V/OC1
1V/div
IOUT1
0.5A/div
TIME 5ms/div
VIN=5V
CL=47uF
Figure 36. Over-current response
enable to short circuit
/EN
1V/div
VOUT
1V/div
VOC
1V/div
IOUT1
0.5A/div
TIME 2ms/div
VIN=5V
CL=47uF
RL=1Ω
15/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Typical Application Circuit
ON/OFF
OC
OC
ON/OFF
GND
IN
/EN1
(EN1)
/
OC1
OUT1
OUT2
/
OC2
10k to 100k 5V(Typ.)
OUTIN
VBUS
D+
D-
GND
Data
Regulator
US B Controller
B D2062FJ/66FJ
CL
Data
/EN2
(EN2)
10k to 100k
CIN
Data
CL
Application Information
When excessive current flows due to output short-circuit or so, ringing occ urs because of inductance between po wer source
lines to IC, and may cause bad influences on IC operatio ns. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up value which satisfies the applic ation as CL.
This application circuit does n ot guara ntee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
Functional Description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 80mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode bet ween the drain and the so urce of switch MOSFET is not present in the off status, it is possible
to prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an over-current occurs, onl y the switch of an over-current state become off and error flag is output.
Thermal shut do wn action has hysteresis. Therefore, when the junctio n temperature goes do wn, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is
removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down
circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
16/22
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3. Over-current detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-curr ent. The over-current detecti on
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in short-circuit state
When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
3-2. When the output short-circuits while the switch is on
When the output short-circuits or high-current load is connected while the switch is on, very large curre nt flows until
the over-current limit circuit takes into action. When the current is detected, limiter circuit works, current limitation is
carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detecti on value, current limitation is carried out.
4. Under-voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of 10 0mV(Typ).
Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current or thermal shutdown, the output level is low.
Over-current detection has delay filter. T his delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
V/EN
VOUT
IOUT
V/OC
Out
p
ut shortcircuit
Thermal shut dow n
delay
Figure 38. Over current detection, thermal shutdown timing
(BD2062FJ)
VEN
VOUT
IOUT
V/OC
Out
p
ut shortcircuit
Thermal shut dow n
delay
Figure 39. Over current detection, thermal shutdown timing
(BD2066FJ)
17/22
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21.Feb.2014 Rev.002
Power Dissipation
(SOP-J8)
Figure 40. Power dissipation curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol Pin No Equivalence circuit
EN1(/EN1)
EN2(/EN2) 3, 4
/EN1(EN1)
/EN2(EN2)
/OC1
/OC2 5, 8
/
OC1
/
OC2
OUT1
OUT2 6, 7
OUT1
OUT2
0
100
200
300
400
500
600
0 25 50 75 100 125 150
AMBI ENT T EMPERAT URE: T a [℃]
P OW E R DISSIPATI ON: P d[mW]
18/22
BD2062FJ-LB BD2066FJ-LB Datasheet
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Operational Notes
(1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit betwee n pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended operati ng conditions
These conditions represent a range within which the expected char acteristics of the IC can be approximatel y obtained.
The electrical characteristics are guar anteed under the con ditions of each parameter.
(3) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the po wer supply, such as mounting an external diode bet ween the po wer supply and the IC’s power supply
terminals.
(4) Power supply lines
Design the PCB layout pattern t o provide low impedance ground and sup ply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during tr ansient condition.
(6) Short between pins and mounting errors
Be careful when mounting t he I C on printed c ircuit boar ds. T he IC ma y be damaged if it is mount ed in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caugh t between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may caus e the IC to malfunction.
(8) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always disch arge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, groun d the IC during assembly and use similar precautions during transport and storage.
(9) Regarding inpu t pins of the IC
This monolithic I C contains P+ isolation and P substrate laye rs between adjacent elements in order to keep them isol ated.
P-N junctions are formed at the intersecti on of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (ref er t o figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode
When GND > Pin B, the P-N junction operates as a parasitic t r ansistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
N N N P+ P
+
P
P substrate
GND
Parasitic element
Pin A
N
N P+ P+
P
P substrate
GND
Parasitic element
Pin B C B
E
N
GND
Pin A
Pin B
Other adjacent elements
E
B C
GND Parasitic
element
Parasitic
element
Figure 41. Example of monolithic IC structure
19/22
BD2062FJ-LB BD2066FJ-LB Datasheet
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large curre nts. Also ensure t hat t he GND t races of ext er nal com pon ents do not ca use variatio ns on th e
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporat es a built-in t hermal shutdown circuit, which is designed to turn off the IC when the int ernal temperat ure
of the IC reach es a specified value. Do not cont inue to oper ate the IC after this functio n is activated. Do not use th e IC in
conditions where t his function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja
Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Periph eral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
20/22
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Ordering Information
B D 2 0 6 x F J - L B E 2
Part Numbe
r
Package
FJ: SOP-J8 Product class
LB for Industrial applications
Packaging and forming spec ification
E2: Embossed tape and reel
Marking Diagram
Part Number Part Number Marking
BD2062FJ D2062
BD2066FJ D2066
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
21/22
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TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Physical Dimension Tape and Reel Information
Package Name SOP-J8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
22/22
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001 TSZ02201-0E3E0H300360-1-2
21.Feb.2014 Rev.002
Revision History
Date Revision Changes
13.Mar.2013 001 New Release
21.Feb.2014 002
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Indust r ial Applications” to “Industrial Equipm ent” in Applications (page 1).
Applied new style (“tit le”, “Ordering Information” an d “Physical Dimension Tape and Reel
Information”).
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
