MLX91208
IMC-Hall® Current Sensor (TriaxiTechnology)
3901091208 Page 1 of 20
MLX91208
Rev.007 June 2018
Features and Benefits
1.
Triaxis Technology
Very high sensitivity due to Integrated
Magnetic Concentrator (IMC-Hal)
Programmable high speed current sensor IC
Wideband: DC to 250kHz
Short response time 3us
Programmable linear transfer characteristic
Selectable Analog ratiometric output
SOIC8 package RoHS compliant
Lead free component, suitable for lead free
soldering profile 260°C (target), MSL3
AEC-Q100 Automotive Qualified
Application Examples
2.
Inverter HEV and EV
BLDC motor current monitoring
Smart fuse (over-current detection)
AC/DC Converters
DC/AC Converter (inverter)
DC/DC switched mode power supply
AC/D
Figure 1: Typical application of MLX91208
Description
3.
The MLX91208 is a monolithic sensor IC featuring the
Triais Hall technology. Conventional planar Hall
technology is only sensitive to the flux density applied
orthogonally to the IC surface. The IMC-Hall current
sensor is sensitive to the flux density applied parallel to the
IC surface. This is obtained through an Integrated Magneto-
Concentrator (IMC-Hall) which is deposited on the CMOS
die (as an additional back-end step). The IMC-Hall
technology is automotive qualified.
The product is a single chip Hall sensor which provides an
output signal proportional to the flux density applied
horizontally and is therefore suitable for current
measurement. It is ideally suited as an open loop current
sensor for PCB or bus bar mounting. It features small size
application design and a simple construction for various
current ranges from few Amperes up to 1000 Amperes.
The transfer characteristic of the MLX91208 is
programmable in terms of offset, gain or temperature
compensation. The linear analog output is designed for
applications where a very fast response is required, such as
inverter applications.
Figure 2: Block diagram
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 2 of 20
MLX91208
Rev.007 June 2018
Ordering Information
4.
Product Temperature Package Option Code Packing Form Sensitivity Range (typ.)
ML91208 L (-40°C to 150°C) DC CAL - 000 TU/RE 100-700mV/mT (250mV/mT)
ML91208 L (-40°C to 150°C) DC CAH - 000 TU/RE 50-300mV/mT (100mV/mT)
ML91208 L (-40°C to 150°C) DC CAV - 000 TU/RE 30-200mV/mT (40mV/mT)
ML91208 L (-40°C to 150°C) DC CAV - 001 TU/RE 30-200mV/mT (60mV/mT)
Table 1: Ordering Information
Legend:
Temperature Code: L: from -40°C to 150°C
Package Code: “DC” for SOIC-8 package
Option Code: CAL : Low field version
CAH : High field version
CAV : Very high field version
Packing Form: “RE” for Reel, “TU” for Tube
Ordering Example: “MLX91208LDC-CAH-000-RE”
Table 2: Legend
Glossary of Terms
5.
Terms Definition
Tesla Units for the magnetic flux density, 1 mT = 10 Gauss
TC Temperature Coefficient in ppm/deg C
NC Not Connected
ADC Analog to Digital Converter
DAC Digital to Analog Converter
LSB Least Significant Bit
MSB Most Significant Bit
DNL Differential Non Linearity
INL Integral Non Linearity
IMC Integrated Magneto Concentrator (IMC)
PTC Programming Through Connector
Table 3: Glossary of terms
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 3 of 20
MLX91208
Rev.007 June 2018
Contents
Features and Benefits
Features and BenefitsFeatures and Benefits
Features and Benefits
................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................................
........................................................
............................
1
11
1
1.
1.1.
1.
Application Examples
Application ExamplesApplication Examples
Application Examples
................................
................................................................
................................................................
................................................................
................................................................
................................................................
.............................................................
..........................................................
.............................
1
11
1
2.
2.2.
2.
Description
DescriptionDescription
Description
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................
........................
............
1
11
1
3.
3.3.
3.
Ordering Information
Ordering InformationOrdering Information
Ordering Information
................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................................
........................................................
............................
2
22
2
4.
4.4.
4.
Glossary of Terms
Glossary of TermsGlossary of Terms
Glossary of Terms
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
..................................
....
..
2
22
2
5.
5.5.
5.
Absolute Maximum Ratings
Absolute Maximum RatingsAbsolute Maximum Ratings
Absolute Maximum Ratings
................................
................................................................
................................................................
................................................................
................................................................
................................................................
...................................................
......................................
...................
5
55
5
6.
6.6.
6.
Pin Definitions and Descriptions
Pin Definitions and DescriptionsPin Definitions and Descriptions
Pin Definitions and Descriptions
................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................
........................
............
5
55
5
7.
7.7.
7.
General Electrical Specifications
General Electrical SpecificationsGeneral Electrical Specifications
General Electrical Specifications
................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................
........................
............
6
66
6
8.
8.8.
8.
Magnetic specification
Magnetic specificationMagnetic specification
Magnetic specification
................................
................................................................
................................................................
................................................................
................................................................
................................................................
...........................................................
......................................................
...........................
7
77
7
9.
9.9.
9.
Low Field Version 10mT (marking xxL) .............................................................................................. 7
9.1.
High Field Version 25mT (marking xxH) ............................................................................................. 7
9.2.
Very High Field Version 60mT (marking xxV) .................................................................................... 8
9.3.
Analog output specification
Analog output specificationAnalog output specification
Analog output specification
................................
................................................................
................................................................
................................................................
................................................................
................................................................
.................................................
..................................
.................
8
88
8
10.
10.10.
10.
Timing specification .......................................................................................................................... 8
10.1.
Accuracy specification ...................................................................................................................... 9
10.2.
Remarks to the achievable accuracy ............................................................................................... 9
10.3.
Programmable items
Programmable itemsProgrammable items
Programmable items
................................
................................................................
................................................................
................................................................
................................................................
................................................................
.........................................................
..................................................
.........................
10
1010
10
11.
11.11.
11.
Parameter table .............................................................................................................................. 10
11.1.
Sensitivity programming (RG, FG) .................................................................................................. 10
11.2.
Offset / output quiescent voltage programming (VOQ) ............................................................... 10
11.3.
Output ratiometry (ENRATIO) ........................................................................................................ 10
11.4.
Sensitivity temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT) ..................... 11
11.5.
Offset temperature drift programming (OFFDR2C, OFFDR2H) .................................................... 11
11.6.
Noise filter (NOISEFILT) .................................................................................................................. 11
11.7.
Identification code (ID) ................................................................................................................... 11
11.8.
Self
SelfSelf
Self-
--
-diagnostic
diagnosticdiagnostic
diagnostic
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
...................................
......
...
12
1212
12
12.
12.12.
12.
Application information
Application informationApplication information
Application information
................................
................................................................
................................................................
................................................................
................................................................
................................................................
.....................................................
..........................................
.....................
12
1212
12
13.
13.13.
13.
Low current measurement ±2-10A................................................................................................ 12
13.1.
Medium current measurement up to ±50A .................................................................................. 13
13.2.
High current measurement up to ±1000A .................................................................................... 13
13.3.
Recommended Application Diagrams
Recommended Application DiagramsRecommended Application Diagrams
Recommended Application Diagrams
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................
14
1414
14
14.
14.14.
14.
Resistor and capacitor values......................................................................................................... 14
14.1.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 4 of 20
MLX91208
Rev.007 June 2018
Pull-up/down resistor for diagnostic high/low ............................................................................. 14
14.2.
Typical performance
Typical performanceTypical performance
Typical performance
................................
................................................................
................................................................
................................................................
................................................................
................................................................
..........................................................
....................................................
..........................
15
1515
15
15.
15.15.
15.
Standard information regarding manufacturability of Melexis products w
Standard information regarding manufacturability of Melexis products wStandard information regarding manufacturability of Melexis products w
Standard information regarding manufacturability of Melexis products with different soldering
ith different soldering ith different soldering
ith different soldering
16.
16.16.
16.
processes
processesprocesses
processes
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
............................................
........................
............
16
1616
16
ESD Precautions
ESD PrecautionsESD Precautions
ESD Precautions
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
.................................
..
.
16
1616
16
17.
17.17.
17.
Package information
Package informationPackage information
Package information
................................
................................................................
................................................................
................................................................
................................................................
................................................................
..........................................................
....................................................
..........................
17
1717
17
18.
18.18.
18.
SOIC-8 Package Dimensions ........................................................................................................... 17
18.1.
SOIC-8 Pinout and Marking ............................................................................................................ 17
18.2.
SOIC-8 Hall plate position ............................................................................................................... 17
18.3.
SOIC-8 IMC Position and magnetic sensitive direction ................................................................. 18
18.4.
Disclaimer
DisclaimerDisclaimer
Disclaimer
................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
................................................................
..........................................
....................
..........
19
1919
19
19.
19.19.
19.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 5 of 20
MLX91208
Rev.007 June 2018
Absolute Maximum Ratings
6.
Parameters Symbol Value Units
Positive Supply Voltage
(overvoltage) Vdd +10 V
Reverse Supply Voltage Protection -0.3 V
Positive Output Voltage +10 V
Output Current Iout ±70 mA
Reverse Output Voltage -0.3 V
Reverse Output Current -50 mA
Package Thermal Resistance Rth 105 °C/W
Operating Ambient Temperature
Range TA -40 to 150 °C
Storage Temperature Range TS -55 to 165 °C
Magnetic Flux Density infinite T
Table 4: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum
rated conditions for extended periods may affect device reliability.
Pin Definitions and Descriptions
7.
Pin № Name Type Function
5 VDD Supply Supply Voltage
3 VSS Ground Supply Voltage
1 VDEC Digital Digital supply voltage
4 TEST/MUST Digital Test and Factory calibration
6 OUT Analog Current sensor output
Table 5: PIN definitions and descriptions
It is recommended to connect the unused pins to the Ground for optimal EMC results.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 6 of 20
MLX91208
Rev.007 June 2018
General Electrical Specifications
8.
Operating Parameters: TA = -40 to 125deg.C, Vdd = 4.5V to 5.5V, Iout = -2mA to +2 mA, recommended
application diagram in section 14, unless otherwise specified. All mentioned component values can have a
±20% tolerance.
Parameter Symbol Test Conditions Min Typ. Max
Units
Nominal Supply Voltage Vdd 4.5 5 5.5 V
Supply Current Idd W/o output load
in application mode
T
A
= -40 to 150
o
C
7
12
14
mA
DC load Current Iout Rout in range [6kΩ, 100kΩ] -2 2 mA
Maximum Output Current
(driving capability)
Imax Inside this range, output voltage
reaches 3%VDD and 97%VDD -2 2 mA
Output Resistance Vout = 50% Vdd, R
L
= 5kΩ 1 5
Output Capacitive Load C
load
Capacitive load range for the
stability of the output amplifier.
Output amplifier optimized for the
typical capacitive load.
1 2 10 nF
Output resisitive load R
load
Output resistive load range for the
stability of the output amplifier 6
Output Short Circuit Current I
short
Output shorted to Vdd- Permanent 35 180 mA
Output shorted to Vss Permanent 35 180 mA
Leakage current I
leak
High impedance mode
(1)
T=150°C 0.5 1.5 20 uA
Output Voltage Swing (Linear
Range)
V
out_pd
pull down ≥ 10 kΩ 10 90 %Vdd
High-impedance mode levels
(1)
V
out_HiZ_pd
pull-down R
L
≤ 25 kΩ, T≤125°C 5 %Vdd
Under-voltage detection
(2)
V
dd_uvd
Low to high voltage 3 3.3 4 V
V
dd_uvh
Hysteresis 0.25
0.3 0.4 V
Over-voltage detection
(2)
V
dd_ovd2
Low to High voltage 6.7 7.6 V
V
dd_ovh2
Hysteresis 0.05
0.7 V
Ratiometry enable detection
(2)
V
ratio_d
Low to High Voltage 4 4.45 V
V
ratio_h
Hysteresis 0.05
0.5 V
1
Refer to chapter Self-diagnostic, table 12
2
See graph below the table
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 7 of 20
MLX91208
Rev.007 June 2018
Table 6: General electrical parameter
(2) According to the figure below:
Magnetic specification
9.
Low Field Version 10mT
Low Field Version 10mTLow Field Version 10mT
Low Field Version 10mT
(
((
(marking xxL)
marking xxL)marking xxL)
marking xxL)
9.1.
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V, unless otherwise specified.
Parameter Symbol Test Conditions Min Typ Max Units
Nominal Field Range Bnom -7.5 +7.5 mT
Operational Field Range
(3)
Bop -10 +10 mT
Linearity Error NL B in range Bop
Vout in [10%VDD, 90%VDD -0.7 +0.7 %FS
Hysteresis, remanent Field Br B = Bop -10 +10 uT
Programmable Sensitivity S 100 250 700 mV/mT
Sensitivity programming Resolution Sres 0.1 %
Table 7: Magnetic specification for 10mT version (low-field version)
High Field Version 25mT
High Field Version 25mTHigh Field Version 25mT
High Field Version 25mT
(marking xxH)
(marking xxH)(marking xxH)
(marking xxH)
9.2.
Parameter Symbol
Test Conditions Min Typ Max Units
Nominal Field Range
Bnom -20 +20 mT
Operational Field Range
(3)
Bop -25 +25 mT
Linearity Error NL B in range Bop
Vout in [10%VDD, 90%VDD
-0.7 +0.7 %FS
Hysteresis, remanent Field Br B = Bop -25 +25 uT
Programmable Sensitivity S 50 100 300 mV/mT
Sensitivity programming Resolution Sres 0.1 %
Table 8: Magnetic specification 25mT version (high-field version)
3
Outside Bop, the IMC progressively enters saturation, yielding to an increase of the linearity error.
Vout
Detected
Voltage
Hysteresis
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 8 of 20
MLX91208
Rev.007 June 2018
Very High Field Version 60mT (marking xxV)
Very High Field Version 60mT (marking xxV)Very High Field Version 60mT (marking xxV)
Very High Field Version 60mT (marking xxV)
9.3.
Parameter Symbol
Test Conditions Min Typ Max Units
Nominal Field Range Bnom -50 +50 mT
Operational Field Range
(3)
Bop -60 +60 mT
Linearity Error NL B in range Bop
Vout in [10%VDD, 90%VDD]
-0.7 +0.7 %FS
Hysteresis, remanent Field Br B = Bop -50 +50 uT
Programmable Sensitivity S CAV-000
CAV-001
30
30
40
60
200
200
mV/mT
mV/mT
Sensitivity programming Resolution Sres 0.1 %
Table 9: Magnetic specification 60mT version (Very high-field version)
Note: The noise filter is disabled by default for all MLX91208 versions.
Analog output specification
10.
Timing specification
Timing specificationTiming specification
Timing specification
10.1.
Operating Parameters T
A
= -40 to 125deg.C, Vdd = 4.5 V to 5.5 V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Refresh rate Trr 0.8 1 2 us
Step Response Time
Tresp
Delay between the input
signal reaching 90% and the
output signal reaching 90%,
(2V step at the output, input
rise time = 1µs)
-Noise filter OFF
-Noise filter ON
3
5
4
6
μs
μs
Bandwidth BW -Noise filter OFF
-Noise filter ON
200
120
250
150
300
180
kHz
kHz
Power on Delay
TPOD
Vout =100% of FS
Pull-down resistor
≤100kOhm
During the Power-on delay,
the output will remain within
the 10% fault band at all
time.
1 ms
Ratiometry Cut-off Frequency Fratio 250 Hz
Table 10: Timing specification high speed analog output
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 9 of 20
MLX91208
Rev.007 June 2018
1 µs
in, Vout
time
90%100 %
Response
time
Figure 3: Response time definition
Accuracy specification
Accuracy specificationAccuracy specification
Accuracy specification
10.2.
Operating Parameters T
A
= -40 to 125deg.C, Vdd = 4.5 V to 5.5 V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Thermal Offset Drift Δ
T
Voq
Offset drift referred to 25°C
S=40mV/mT (xxV version)
S=100mV/mT (xxH version)
S=250mV/mT (xxL version)
Vdd=5V, TC=0±150 ppm/°C
Voq=50±0.2 %Vdd
-10 +10 mV
Thermal Offset Drift Resolution Δ
T
VoqRes
0.075 mV/°C
Thermal Sensitivity Drift TC -1.5 0 +1.5 % of S
Thermal Sensitivity Drift
Resolution TCres 40 ppm/°C
RMS Output noise N
rms
S=40mV/mT (xxV version)
S=100mV/mT (xxH version)
S=250mV/mT (xxL version)
-Noise filter OFF
-Noise filter ON
0.2
0.12
%Vdd
%Vdd
Ratiometry Error Offset ΔVoq Voq = 50%Vdd
ΔVdd = 10%Vdd -0.4 +0.4 % of
Voq
Ratiometry Error Sensitivity ΔS ΔVdd = 10%Vdd -0.4 +0.4 % of S
Table 11: Accuracy-Specific Parameters
Remarks to the achievable accuracy
Remarks to the achievable accuracyRemarks to the achievable accuracy
Remarks to the achievable accuracy
10.3.
The achievable target accuracy is dependent on user’s end-of-line calibration. The resolution for the offset
and offset drift calibration is better than 0.1%Vdd. Trimming capability is higher than the measurement
accuracy. End-user calibration can increase the accuracy of the system.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 10 of 20
MLX91208
Rev.007 June 2018
Programmable items
11.
Parameter table
Parameter tableParameter table
Parameter table
11.1.
Parameter Bits Factory Setting Comment
VOQ[11:0] 12 trimmed Quiescent output level (0 Gauss) adjustment
RG[2:0] 3 trimmed Rough gain adjustment
FG[9:0] 10 trimmed Fine gain adjustment
ENRATIO 1 1 Ratiometry enablement
TC1[7:0] 8 trimmed Adjustment of the first order temperature compensation of the
magnetic sensitivity
TC2HOT[4:0] 5 trimmed Adjustment of the extra temperature compensation of the magnetic
sensitivity at high temperature
TC2COLD[4:0] 5 trimmed Adjustment of the extra temperature compensation of the magnetic
sensitivity at low temperature
OFFDR2C[5:0] 6 trimmed Adjustment of the offset drift at low temperature after the VGA
OFFDR2H[5:0] 6 trimmed Adjustment of the offset drift at high temperature after the VGA
NOISEFILT 1 0 Noise filter enablement
PLATEPOL 1 0 0: default polarity as described in section 18.4
1: opposite polarity
ID[47:0] 48 Programmed Melexis traceability ID
Table 12: Customer programmable items
Sensitivity
SensitivitySensitivity
Sensitivity
programming (RG, FG)
programming (RG, FG)programming (RG, FG)
programming (RG, FG)
11.2.
The sensitivity can be programmed from 50 to 300mV/mT (high field version) or 100 to 700mV/mT (low field
version), with the ROUGHGAIN (3 bits) and FINEGAIN (10 bits) parameters.
Offset / o
Offset / oOffset / o
Offset / output
utpututput
utput
quiescent
quiescent quiescent
quiescent voltage programming
voltage programmingvoltage programming
voltage programming
(
((
(VOQ
VOQVOQ
VOQ)
))
)
11.3.
The offset is programmable with 12 bits in 1.5 mV steps over the full output range. This corresponds to a
calibration resolution of 0.03 %VDD.
The typical step size would be 5V/4096 = 1.22 mV, but the actual step size can differ from the nominal value
because of internal gain tolerance. A maximum step size of 1.5 mV is guaranteed.
Note: for optimal performance over temperature, the VOQ should be programmed in the range from 2 to
3V.
Output ratiometry (ENRATIO)
Output ratiometry (ENRATIO)Output ratiometry (ENRATIO)
Output ratiometry (ENRATIO)
11.4.
The ratiometry of the output versus the supply can be disabled by setting this bit to 0.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 11 of 20
MLX91208
Rev.007 June 2018
Note: for optimal performance over temperature, the ratiometry setting should not be changed on
customer side. By default, this setting is enabled during final test calibration.
Sensitivity
SensitivitySensitivity
Sensitivity
temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT)
temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT)temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT)
temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT)
11.5.
First order sensitivity temperature drift can be trimmed with TC1. The programming resolution is 40ppm/K.
Second order sensitivity temperature drift can be trimmed with TC2COLD and TC2HOT. The programming
resolution is 2ppm/K
2
for TC2COLD and 0.6ppm/K
2
for TC2HOT.The second order can also be seen as third
order correction since cold and hot sides are independently adjusted.
Note: for optimal performance over temperature, the first order sensitivity drift compensation (TC1ST)
should not exceed ±250ppm/K.
Offset
Offset Offset
Offset temperature
temperaturetemperature
temperature
drift programming (OFFDR
drift programming (OFFDRdrift programming (OFFDR
drift programming (OFFDR2
22
2C, OFFDR
C, OFFDRC, OFFDR
C, OFFDR2
22
2H)
H)H)
H)
11.6.
Offset temperature drift caused by the output amplifier can be compensated with these two parameters.
This first order correction is done independently for temperatures over and below 25°C.
Note: Two additional parameters (OFFDR1C, OFFDR1H) are calibrated by Melexis to compensate for the
offset temperature drift caused by the Hall element (before the variable gain amplifier). These parameters
should not be adjusted on customer-side.
Noise
Noise Noise
Noise filter
filterfilter
filter
(NOISEFILT)
(NOISEFILT)(NOISEFILT)
(NOISEFILT)
11.7.
Setting this bit to 1 enables the noise filter, reducing noise and increasing response time.
Identification
IdentificationIdentification
Identification
code (ID)
code (ID) code (ID)
code (ID)
11.8.
48 bits programmed identification code.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 12 of 20
MLX91208
Rev.007 June 2018
Self-diagnostic
12.
The MLX91208 provides self-diagnostic features to detect internal memory errors and over- / under-voltage.
Those features increase the robustness of the IC functionality, as they prevent the IC from providing
erroneous output signal in case of internal or external failure modes.
Error Action Effect on
Outputs Remarks
Calibration Data CRC Error (at power up
and in normal working mode) Fault mode
High
Impedance
mode
Pull down resistive load, Diagnostic
Low
Power On delay
High
Impedance
mode
5ms max in high impedance
followed by settling
Undervoltage Mode IC is reset
High
Impedance
mode
300mV Hysteresis (typical)
Overvoltage detection IC is reset
High
Impedance
mode
100mV Hysteresis (typical)
Table 13: Self diagnostic
Application information
13.
Please refer to our current sensor reference design guide for more application information:
http://melexis.com/Assets/Current-Sensors-Reference-Designs-6187.aspx
Low current measurement
Low current measurement Low current measurement
Low current measurement ±2
±2±2
±2-
--
-10A
10A10A
10A
13.1.
Low currents can be measured by either using a multi-turn/multi-layer PCB where the current is
allowed to flow several times under the sensor, or by adding a closed ferromagnetic shield around the
current trace with a small air gap to concentrate the magnetic flux above the sensor.
Figure 4: Low current applications with either multi-trace/multi-layer PCB (left) or closed shield (right).
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 13 of 20
MLX91208
Rev.007 June 2018
Medium
Medium Medium
Medium current measurement up to
current measurement up to current measurement up to
current measurement up to ±50
±50±50
±50A
AA
A
13.2.
For medium currents, a single PCB trace can be used. The
sizing of the PCB trace should take into account the
current handling capability and the total power
dissipation. The PCB trace should be thick and wide
enough to handle the RMS current continuously.
A simple U-shaped ferromagnetic shield is often
required to protect the sensor from cross-talk or external
stray fields, if they cannot be cancelled-out by other
means (peak-peak detection, etc.).
Figure 5: Medium current application on PCB
High current measurement up to ±1000A
High current measurement up to ±1000AHigh current measurement up to ±1000A
High current measurement up to ±1000A
13.3.
For high currents flowing in a bus bar, MLX91208 is
typically assembled on a PCB lying immediately above the
current conductor.
A ferromagnetic shield is usually added to protect the
sensor from external fields and ensure good
homogeneity of the magnetic flux, for optimal robustness
against vibrations and mechanical tolerances.
Figure 6: High current application on bus bar
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 14 of 20
MLX91208
Rev.007 June 2018
Recommended Application Diagrams
14.
Resistor and capacitor values
Resistor and capacitor valuesResistor and capacitor values
Resistor and capacitor values
14.1.
Part Description Value Unit
C1 Supply capacitor, EMI, ESD 100 nF
C2 Decoupling, EMI, ESD 2-10
(4)
nF
C3 Decoupling, EMI, ESD 47 nF
R1 Pull down resistor 6-100
Table 14: Resistor and capacitor values
Pull
PullPull
Pull-
--
-down
down down
down resistor
resistorresistor
resistor
for diagnostic
for diagnostic for diagnostic
for diagnostic low
lowlow
low
14.2.
5
OUT
VDD
VSS
TEST
6
7
8
4
3
2
1
MLX91208
Supply voltage
Analog Output
GND
C2 R1C1
C3
VDEC
Figure 7: Diagnostic low/ Pull-down resistors
4
10nF is recommended for better EMC and ESD performance
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 15 of 20
MLX91208
Rev.007 June 2018
Typical performance
15.
Figure 9: Thermal sensitivity drift.
Figure 10: Thermal offset drift.
Figure 11: Linearity error for all versions.
Figure 12: Response time with noise filter OFF.
Figure 13: Response time with noise filter ON.
shunt
MLX91208
shunt
MLX91208
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 16 of 20
MLX91208
Rev.007 June 2018
Standard information regarding manufacturability of Melexis products
16.
with different soldering processes
Melexis devices are qualified using state-of-the-art practices in accordance with automotive and
environmental requirements.
Through qualifications, various soldering techniques are considered; please refer to “Soldering
recommendations for Melexis products” for more information:
(
http://www.melexis.com/Asset/Soldering_Application_Note_and_Recommendations_DownloadLink_5446.
aspx).
For components normally soldered using Surface Mounted Device techniques (eg: Reflow process), Melexis
has defined and qualified Moisture Sensitivity Level and Peak Temperature in accordance with the Jedec J-
STD-020 standard. Delivered material is conditioned accordingly. Moisture Sensitivity Level and Peak
Temperature information can be found on the label identifying the material.
In case you intend to use a reflow soldering process for through hole devices (Melexis’ package codes: SA,
UA, VA, VK, VM), please contact Melexis to verify your soldering process compatibility.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, Europe legislations (Direction on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has deployed
Pb free leadfinish (typically Matte Tin) on all ASSP products.
For through hole devices (Melexispackage codes: SA, UA, VA, VK, VM) Trim&Form, please refer to “Trim &
Form recommendations for Melexis products” for more information:
(
http://www.melexis.com/Assets/Trim_and_form_recommendations_DownloadLink_5565.aspx
)
ESD Precautions
17.
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
ESD HBM robustness is 2kV on external pins according to AEC-Q100-002 REV-D.
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 17 of 20
MLX91208
Rev.007 June 2018
Package information
18.
SOIC
SOICSOIC
SOIC-
--
-8
88
8
Package Dimensions
Package DimensionsPackage Dimensions
Package Dimensions
18.1.
0.19
0.25
NOTES:
All dimensions are in millimeters (anlges in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion
(shall not exceed 0.25 per side).
** * Dim ension does not include dambar pro trusion .
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
5.84
6.20**
1.27 TYP
4.80
4.98*
1.55
1.73
0.127
0.250
1.40
1.55
0.35
0.49***
3.81
3.99**
0.41
0.89
Figure 14: SOIC-8 Package dimensions
SOIC
SOICSOIC
SOIC-
--
-8 Pinout
8 Pinout 8 Pinout
8 Pinout and Marking
and Markingand Marking
and Marking
18.2.
Figure 15: SOIC-8 Pinout and marking (Very High Field, High Field and Low Field version)
SOIC
SOICSOIC
SOIC-
--
-8 Hall plate position
8 Hall plate position8 Hall plate position
8 Hall plate position
18.3.
Very high field
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 18 of 20
MLX91208
Rev.007 June 2018
Figure 16: SOIC-8 Hall Plate positioning
SOIC
SOICSOIC
SOIC-
--
-8 IMC P
8 IMC P8 IMC P
8 IMC Position and magnetic sensitive direction
osition and magnetic sensitive directionosition and magnetic sensitive direction
osition and magnetic sensitive direction
18.4.
B extern B extern
Figure 17: IMC position and geometry for low-field version
B extern B extern
Figure 18: IMC position and geometry high-field version
B extern B extern
Figure 19: IMC position and geometry very high-field version
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 19 of 20
MLX91208
Rev.007 June 2018
Disclaimer
19.
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of
Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth
herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to
change specifications and prices at any time and without notice. Therefore, prior to designing this product into a
system, it is necessary to check with Melexis for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not
recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to
recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of
profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in
connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or
liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.
© 2016 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia: America:
Phone: +32 1367 0495 Phone: +1 603 223 2362
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified
MLX91208
IMC-Hall
®
Current Sensor (Triaxis
®
Technology)
3901091208 Page 20 of 20
MLX91208
Rev.007 June 2018
HISTORY5
5
Dummy footnote to get last page number
Rev. Nb. Date Name Changes from Previous version
001
07-Jun-2014
Creation
002
10-Jul-2014
Incorrect MSL level, 1 => 3
004
22-Dec-2016
Migration to New template
005 13-Jul-2017
Formatting ® using existing from previous templates
Formatting table and figure caption
Added revision history
Formatting 18.4. SOIC-8 IMC Position and magnetic sensitive changed
figure 15 there is a rectangle text that is badly placed
Using body formatting for non-header, caption
Corrected references “
Self-diagnostic, table 12
” instead of 13
“application diagram in section 14” instead of 16
006 19-Jul-17
Bandwidth in chapter 1. Feature and Benefits modified to 250kHz
Read proof and typo corrections
Modified Chapter 11. Programmable Items – Table 12 : added
column “Factory Setting”, Removed parameter CRC[15:0] (not
programmable), added parameter PlatePol
007 9-Mar-18 Removed Pull-Down option for Diagnostic Low
007.01 3-Apr-18 Updated feature and benefits : “AEC-Q100 automotive qualified”