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© 2012 ROHM Co., Ltd. All rights reserved. 1/26 4.SEP.2012 Rev.003
TSZ221111400
Datasheet
Maximum Operation Temperature
Slew Rate
Operational Amplifiers
Low Noise Operational Amplifiers
BA4558xxx, BA4558Rxxx
General Description
Normal BA4558 and high-reliability BA4558R integrate two independent Op-Amps on a single chip Especially, this series is
suitable for any audio applications due to low noise and low distortion characteristics and are usable for other many
applications by wide operating supply voltage range.BA4558R is high-reliability products with extended operating
temperature range and high ESD tolerance.
Features
High voltage gain, low noise, low distortion
Wide operating supply voltage
Internal ESD protection
Wide operating temperature Rang e
Packages W(Typ.) x D(Typ.) x H(Max.)
MSOP8 2.90mm x 4.00mm x 0.90mm
SSOP-B8 3.00mm x 6.40mm x 1.35mm
SOP8 5.00mm x 6.20mm x 1.71mm
TSSOP-B8 3.00mm x 6.40mm x 1.20mm
SOP-J8 4.90mm x 6.00mm x 1.65mm
Key Specification
Wide Operating Supply Voltage
(split supply):±4.0V to ±15V
Wide Temperature Range: BA4558: -40°C to +85°C
BA4558R: -40°C to +105°C
High Slew Rate: 1V/µs(Typ.)
Total Harmonic Distortion : 0.005%(Typ.)
Input Referred Noise Voltage : 12 HznV/ (Typ.)
Selection Guide
Block Diagram
Product structureSilicon monolithic integrated circuitThis product is not designed protection against radioactive rays.
+105°C
BA4558RF
BA4558RFV
BA4558RFVT
BA4558RFVM
BA4558RFJ
Dual High Reliability 1V/µs
Slew Rate
Normal Dual 1V/µs BA4558F
BA4558FV
BA4558FVT
BA4558FVM
BA4558FJ
+85°C
IN
IN
VOU
T
VCC
VEE
Fig. 1 Simplified schematic
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 2/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Pin Configuration(TOP VIEW)
Package
SOP8 SSOP-B8 TSSOP-B8 MSOP8 SOP-J8
BA4558F
BA4558RF BA4558FV
BA4558RFV BA4558FVT
BA4558RFVT BA4558FVM
BA4558RFVM BA4558FJ
BA4558RFJ
Ordering Information
B A 4 5 5 8 x x x x - x x
Part Number
BA4558xxx
BA4558Rxxx
Package
F: SOP8
FV: SSOP-B8
FJ: SOP-J8
FVT: TSSOP-B8
FVM: MSOP8
Packaging and forming specific ation
E2: Embossed tape and reel
(SOP8/SSOP-B8/TSSOP-B8/SOP-J8)
TR: Embossed tape and reel
(MSOP8)
Line-up
Topr Operating Supply
Voltage
(split supply)
Supply
Current
(Typ.)
Slew
Rate
(Typ.) Package Orderable
Part Number
-40°C to +85°C
±4.0V to ±15.0V 3mA 1V/µs
SOP8 Reel of 2500 BA4558F-E2
SSOP-B8 Reel of 2500 BA4558FV-E2
TSSOP-B8 Reel of 3000 BA4558FVT-E2
MSOP8 Reel of 3000 BA4558FVM-TR
SOP-J8J Reel of 2500 BA4558FJ-E2
-40°C to +105°C
SOP8 Reel of 2500 BA4558RF-E2
SSOP-B8 Reel of 2500 BA4558RFV-E2
TSSOP-B8 Reel of 3000 BA4558RFVT-E2
MSOP8 Reel of 3000 BA4558RFVM-T R
SOP-J8 Reel of 2500 BA4558RFJ-E2
SOP8 SSOP-B8 MSOP8
BA4558F
BA4558RF
BA4558FV
BA4558RFV
BA4558FVM
BA4558RFVM
TSSOP-B8
BA4558FVT
BA4558RFVT
SOP-J8
BA4558FJ
BA4558RFJ
45
36
27
18
CH1
- +
CH2
+ -
OUT1
-IN1
+IN1
VEE
OUT2
-IN2
+IN2
VCC
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 3/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Absolute Maximum Ratings (Ta=25)
BA4558, BA4558R
Parameter Symbol Ratings Unit
BA4558 BA4558R
Supply Voltage VCC-VEE +36 V
Power dissipation Pd
SOP8 552*1*5 690*1*5
mW
SSOP-B8 500*2*5 625*2*5
TSSOP-B8 500*2*5 625*2*5
MSOP8 470*3*5 587*3*5
SOP-J8 540*4*5 675*4*5
Differential Input Voltage*5 Vid VCC-VEE +36 V
Input common-mode voltage ra nge Vicm VEE to VCC (VEE-0.3) to VEE+36 V
Operating Supply Voltage Vopr +8 to +30 (±4 to ±15) V
Operating Temperature Topr -40 to +85 -40 to +105
Storage Temperature Tstg -55 to +125 -55 to +150
Maximum Junction Temperature Tjmax +125 +150
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment
may cause deterioration of characteristics.
*1 To use at temperature above Ta25 reduce 5.52mW.
*2 To use at temperature above Ta25 reduce 5mW.
*3 To use at temperature above Ta25 reduce 4.7mW.
*4 To use at temperature above Ta25 reduce 5.4mW.
*5 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*6 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 4/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Electrical Characteristics
BA4558 (Unless otherwise specified VCC=+15V, VEE=-15V)
Parameter Symbol
Temperature
Range Limits Unit Condition
Min. Typ. Max.
Input Offset Voltage *7 Vio 25 - 0.5 6 mV VOUT=0V
Input Offset Current *7 Iio 25 - 5 200 nA VOUT=0V
Input Bias Current *8 Ib 25 - 60 500 nA VOUT=0V
Supply Current ICC 25 - 3 6 mA RL=∞, All Op-Amp s,
VIN+=0V
Maximum Output Voltage VOM 25 ±10 ±13 - V RL2k
25 ±12 ±14 - RL10k
Large Signal Voltage Gain AV 25 86 100 - dB RL2k, VOUT=±10V,
Vicm=0V
Input Common-mode V oltage Range Vicm 25 ±12 ±14 - V -
Common-mode Rejection Ra tio CMRR 25 70 90 - dB Ri10k
Power Supply Rejection Ratio PSRR 25 76.3 90 - dB Ri10k
Slew Rate SR 25 - 1 - V/μs AV=0dB, RL2k
Unity Gain Frequency ft 25 - 2 - MHz RL=2k
Total Harmonic Distortion THDN 25 - 0.005 - %
AV=20dB, RL=10k
VIN=0.05Vrms, f=1kHz
Input Referred Noise Voltage Vn 25 - 12 - HznV/ RS=100, V i=0V, f=1kHz
- 1.8 - μVrms RS=100, Vi=0 V, DIN-AUDIO
Channel Separation CS 25 - 105 - dB f=1kHz
*7 Absolute value
*8 Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of I C.
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 5/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R (Unless otherwise specified VCC=+15V, VEE=-15V, Full range -40 to +105)
Parameter Symbol
Temperature
Range Limits Unit Condition
Min. Typ. Max.
Input Offset Voltage *9 Vio 25 - 0.5 6
mV VOUT=0V
Full range - - 7
Input Offset Current *9 Iio 25 - 5 200 nA VOUT=0V
Full range - - 200
Input Bias Current *10 Ib 25 - 60 500 nA VOUT=0V
Full range - - 800
Supply Current ICC 25 - 3 6
mA RL=∞, All Op-Amps,
VIN+=0V
Full range - - 6.5
Maximum Output Voltage VOM 25 ±10 ±13 - V RL2k
Full range ±10 - -
25 ±12 ±14 - RL10k
Large Signal Voltage Gain AV 25 86 100 - dB RL2k, VOUT=±10V,
Vicm=0V
Full range 83 - -
Input Common-mode V oltage Range Vicm 25 ±12 ±14 - V -
Full range ±12 - -
Common-mode Rejection Ra tio CMRR 25 70 90 - dB Ri10k
Power Supply Rejection Ratio PSRR 25 76.5 90 - dB Ri10k
Slew Rate SR 25 - 1 - V/μsAV=0dB, RL=2k
CL=100pF
Unity Gain Frequency ft 25 - 2 - MHz RL=2k
Total Harmonic Distortion THD+N 25 - 0.005 - %
AV=20dB, RL=10k
VIN=0.05Vrms, f=1kHz
Input Referred Noise Voltage Vn 25 - 12 - HznV/ RS=100, V i=0V, f=1kHz
- 1.8 - μVrms RS=100,
V i = 0V, DIN-AUDIO
Channel Separation CS 25 - 105 - dB R1=100, f=1kHz
*9 Absolute value
*10 Current direction: Since first input stage is composed with PNP transistor, input bia s current fl ows out of IC.
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and s ymbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indic ates the condition which must not be exceeded. Applicatio n of voltage in excess of
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
characteristics.
1.1 Power supply voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circu it.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristi cs of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum rating s not assure
normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperatur e)and thermal resistance of the package.
2. Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.4 Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC operates norm ally.
2.5 Large signal voltage gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and Inverting terminal. It is normally the ampl ifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.6 Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.7 Output saturation voltage (VOM)
Signifies the voltage range that can be output under specific output conditions.
2.8 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is cha nged. It is normally the fluctuation
of DC.
PSRR = (Change of power supply voltage) / (Input offset fluctuation)
2.10 Channel Separation (CS)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.11 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variabl e output voltage
as unit time.
2.12 Transition Frequency (ft)
Indicates a frequency where the voltage ga in of operational amplifier is 1.
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
2.13 Total Harmonic Distortion (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.14 Input Referred Noise Voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by i deal voltage source connecte d in
series with input terminal.
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 8/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Typical Performance Curves
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
0
200
400
600
800
1000
0255075100125
AM BIEN T TEMPER TU RE [] .
POWER DISSIPATION [mW ] .
25
85
-40
Fig.3
Supply Current – Supply Voltage
0
5
10
15
20
25
30
0.1 1 10
LOAD RESISTANCE [kΩ]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
Fig.5
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V, Ta=25)
Fig.2
Derating Curve
0.0
1.0
2.0
3.0
4.0
5.0
0 5 10 15 20 25 30 35
SU PPLY VOLTAGE [V]
SUPPLY CURRE NT [mA]   .
85
BA4558F
BA4558FVM
BA4558FJ
BA4558FV/FVT
Fig.4
Supply Current – Ambient Temperature
0.0
1.0
2.0
3.0
4.0
5.0
-50-25 0 25 50 75100
AMBIENT TEMPERATURE []
SUPPLY CURRENT [mA]
±4 V
±15V
±7.5 V
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 9/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
Fig.8
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2k)
-20
-15
-10
-5
0
5
10
15
20
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE []
OUTPUT VOLTAGE [V]
VOH
VOL
Fig.9
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
0 5 10 15 20 25
OUTPUT CURRENT [mA]
OUTPUT VOLTAGE [V]
VOL
VOH
Fig.7
Maximum Output Voltage
- Supply Voltage
(RL=2k, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
OUTPUT VOLTAGE [V]
VOH
VOL
Fig.6
Maximum Output Voltage
– Load Resistance
(VCC/VEE=+15V/-15V, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
0.1 1 10
LOAD RESISTANCE [kΩ]
OUTPUT VOLTAGE [ V]
VOH
VOL
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
0
10
20
30
40
50
60
70
80
-50 -25 0 25 50 75 100
AMBIE N T TEMPERATUR E []
INP UT B IAS CURRE NT [ nA ]
0
10
20
30
40
50
60
70
80
±0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
INP UT BIA S CURRENT [nA] .
±15V
±7.5V
±4V
-6
-4
-2
0
2
4
6
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE []
INPUT OFF SET VO LTAGE [ mV
]
±4V
±7.5V
±15V
-40 25
85
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
Fig.12
Input Bias Current - Supply Voltage
(Vicm=0V, Vout=0V)
Fig.13
Input Bias Current - Ambient Temperature
(Vicm=0V, Vout=0V)
Fig.11
Input Offset Voltage - Ambient Temperature
(Vicm=0V, Vout=0V)
Fig.10
Input Offset Voltage - Supply Voltage
(Vicm=0V, Vout=0V)
-6
-4
-2
0
2
4
6
±0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPL Y VOL TAGE [V]
INPUT OFFSET VOLTAGE [mV]
-40
85
25
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
Fig.14
Input Offset Current - Supply Voltage
(Vicm=0V, Vout=0V)
-30
-20
-10
0
10
20
30
±0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
INP UT OFFSET CURRENT [n A] .
85
-40
25
Fig.15
Input Offset Current -
Ambient Temperature
(Vicm=0V, Vout=0V)
-30
-20
-10
0
10
20
30
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
INP U T OFFSE T CURRENT [ nA]
±4V
±15V
±7.5V
Fig.16
Input Offset Voltage
- Common Mode Input Voltage
(VCC=8V, Vout=4V)
-5
-4
-3
-2
-1
0
1
2
3
4
5
02468
COMMON MODE INPUT VOLTAGE [V]
INPUT OFFSET VOLTAGE [mV]
85
25
-40
Fig.17
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, Vicm= -12V to + 12V)
0
25
50
75
100
125
150
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
COMMO N MODE REJECTION RATIO [dB]
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
0
20
40
60
80
1 10 100 1000
FREQ UENCY [ k Hz]
INTPUT REFERRED NOISE VOLTAGE
[nV / Hz]
0.0001
0.001
0.01
0.1
1
0.1 1 10
OUTPU T VOLTAGE [Vrms]
TOTA L HARMONIC DISTORTION [%] .
20kHz
20Hz
1kHz
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
Fig.19
Slew Rate - Supply Voltage
(CL=100pF, RL=2k, Ta=25)
0.0
0.5
1.0
1.5
2.0
±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPL Y VOLTAGE [V]
SL E W RATE [V s] .
Fig.18
Power Supply Rejecti on Ratio
- Ambient Temperature
(VCC/VEE=+4V/-4V to +15V/-15V)
0
25
50
75
100
125
150
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE []
POWE R SUPPLY REJECTIO N R ATIO [dB ]
.
Fig.20
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+15V/-15V, RS=100, Ta=25)
Fig.21
Total Harmonic Distortion -Output Voltage
RL=2k, 80kHz-LPF, Ta=25)
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 13/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558
(*) The above data is measurement value of typical sample, it is not guaranteed.
0
10
20
30
40
50
60
1. E+
00 1.E+
01 1.E+
02 1. E+
03 1.E+
04 1.E+
05 1.E+
06 1.E+
07 1.E+
08
FREQ UENCY [ Hz ]
VOLTAGE GAIN [dB]
-180
-150
-120
-90
-60
-30
0
PHASE [de g]
Fig.22
Maximum Output Voltage Swing - Frequency
(VCC/VEE=+15V/-15V, RL=2k , Ta=25)
0
5
10
15
20
25
30
1 10 100 1000
FREQUENCY [kHz]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
Fig.23
Voltage Gain - Frequency
(VCC/VEE=+15V/-15V, AV=40dB, RL=2k, Ta=25)
1 10 102 103 10
4 10
5 10
6 10
7 108
GAIN
PHASE
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 14/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sampl e, it is not guaranteed.
Fig.27
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V, Ta=25)
0
5
10
15
20
25
30
0.1 1 10
LOAD RESISTANCE [kΩ]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
Fig.25
Supply Current - Supply Voltage
0.0
1.0
2.0
3.0
4.0
5.0
0 5 10 15 20 25 30 35
SUPPLY VOLTAGE [V]
SUP PLY CURRENT [mA]   .
25
105
-40
Fig.26
Supply Current - Ambient Temperature
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE []
SUPP LY CURRE N T [mA ]
±4 V
±15V
±7.5 V
Fig.24
Derating Curve
0
200
400
600
800
1000
0255075100125
AM BIE N T TE MP ERT UR E [] .
POWER DI SSI PATI ON [mW] .
BA4558RF
BA4558RFVM
BA4558RFV/FVT
105
BA4558RFJ
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 15/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sampl e, it is not guaranteed.
Fig.28
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
0.1 1 10
LOAD RESISTANCE [kΩ]
OUTPUT VOLTAGE [V]
VOH
VOL
Fig.29
Maximum Output Voltage
- Supply Voltage
(RL=2k, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPL Y VOLTAGE [V]
OUTPUT VOLTAGE [V]
VOH
VOL
Fig.30
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2k)
-20
-15
-10
-5
0
5
10
15
20
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE []
OUTPUT VOLTAGE [V]
VOH
VOL
Fig.31
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V, Ta=25)
-20
-15
-10
-5
0
5
10
15
20
0 5 10 15 20 25
OUTPUT CURRENT [mA]
OUTPUT VOLTAGE [V]
VOL
VOH
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 16/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sampl e, it is not guaranteed.
Fig.32
Input Offset Voltage - Supply Voltage
(Vicm=0V, Vout=0V)
-6
-4
-2
0
2
4
6
±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
INPUT OFFSET VOLTAGE [mV]
-40
105
25
Fig.33
Input Offset Voltage - Ambient Temperature
(Vicm=0V, Vout=0V)
-6
-4
-2
0
2
4
6
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE []
INPUT OFFSET VOLTAGE [mV]
±4V
±7.5V
±15V
Fig.35
Input Bias Current - Ambient Temperature
(Vicm=0V, Vout=0V)
0
10
20
30
40
50
-50 -25 0 25 50 75 100 125
AMB IENT TEMPE RATURE []
INPUT BIAS CURRENT [nA]
±15V
±7.5V
±4V
Fig.34
Input Bias Current - Supply Voltage
(Vicm=0V, Vout=0V)
0
10
20
30
40
50
±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
I NPUT BI AS CURRENT [ nA] .
-40 25
105
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 17/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sampl e, it is not guaranteed.
Fig.38
Input Offset Voltage
- Common Mode Input Voltage
(
VCC=8V
,
Vout=4V
)
-5
-4
-3
-2
-1
0
1
2
3
4
5
02468
COMMON MO DE INPUT VO LTAG E [V]
INPUT OFFSET VOLTAGE [mV]
Fig.37
Input Offset Current - Ambient Temperature
(Vicm=0V, Vout=0V)
-60
-40
-20
0
20
40
60
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE [°C]
I NPUT O FF SET CURRENT [ nA]
±4V
±15V
±7.5V
25
105
-40
Fig.39
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, Vicm=- 12V to + 12V)
0
25
50
75
100
125
150
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE [°C]
CO MMO N MO DE RE J ECTI ON RA T I O [ dB ]
Fig.36
Input Offset Current - Supply Voltage
(Vicm=0V, Vout=0V)
-60
-40
-20
0
20
40
60
±0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VO LTAGE [V]
INPUT OFFS E T CURRENT [n A ]
105
-40
25
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 18/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sampl e, it is not guaranteed.
Fig.40
Power Supply Rejection R atio
- Ambient Temperature
(VCC/VEE=+4V/-4V to +15V/-15V)
0
25
50
75
100
125
150
-50-250 255075100125
AMBIENT TEMPERATURE []
POWER SUPPLY REJECTION RATIO [dB] .
Fig.41
Slew Rate - Supply Voltage
(CL=100pF, RL=2k, Ta=25)
0.0
0.5
1.0
1.5
2.0
±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
SL EW RATE [V/µs] .
Fig.42
Equivalent Input Noise Voltage - F requency
VCC/VEE=+15V/-15V, RS=100, Ta=25)
0
20
40
60
80
1101001000
FREQUENCY [kHz]
INTPUT RE FERRED NOISE V OLTAG E
[n V/Hz]
Fig.43
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V,AV=20dB,
RL=2k, 80kHz-LPF, Ta=25)
0.0001
0.001
0.01
0.1
1
0.1 1 10
OUTPUT VOLTAG E [ Vrms]
TOTAL HARMONIC DIS T O RT ION [%]
20kHz
20Hz
1kHz
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 19/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
BA4558R
(*) The above data is measurement value of typical sample, it is not guaranteed.
Fig.44
Maximum Output Voltage Swing – Frequency
(VCC/VEE=+15V/-15V, RL=2k, Ta=25)
0
5
10
15
20
25
30
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
FREQUENCY [Hz ]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
10 10
2 10
3 10
4 10
5 10
60
10
20
30
40
50
60
1.E+
00 1.E+
01 1.E+
02 1.E+
03 1.E+
04 1.E+
05 1.E+
06 1.E+
07 1.E+
08
FREQ UENCY [Hz]
VOLTAGE GAIN [dB]
-180
-150
-120
-90
-60
-30
0
PHASE [de g]
GAIN
PHASE
1 10 102 103 10
4 10
5 10
6 10
7 108
Fig.45
Voltage Gain - Frequency
(VCC/VEE=+15V/-15V , AV=40dB, RL=2k, Ta=25)
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 20/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Applic at ion Informa tion
Test circuit1 NULL method VCC, VEE, EK, Vicm Unit: V
Parameter VF S1 S2 S3 VCC VEE EK Vicm calculation
Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1
Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2
Input Bias Current VF3 OFF ON OFF 15 -15 0 0 3
VF4 ON OFF
Large Signal Voltage Gain VF5 ON ON ON 15 -15 0 0 4
VF6 15 -15 0 0
Common-mode Rejection Ratio
(Input common-mode Voltage Range) VF7 ON ON OFF 3 -27 0 0 5
VF8 27 -3 0 0
Power Supply
Rejection Ratio VF9 ON ON OFF 4 -4 0 0 6
VF10 15 -15 0 0
-Calculation-
1. Input Offset Voltage (Vio)
]V[
Rs / Rf + 1 VF1
Vio
2. Input Offset Current (Iio)
]A[
Rs) / Rf + (1× Ri VF1-VF2
Iio
3. Input Bias Current (I b)
]A[
Rs) / Rf + (1 ×Ri×2 VF3-VF4
Ib
4. Large Signal Voltage Gain (Av)
]dB[
VF6-VF5 Rf/Rs)+(1×EK
Log×20 Av Δ
5. Common-mode Rejection Ration (CMRR)
]dB[
VF7-VF8 Rf/Rs)+(1×Vicm
Log×20 CMRR Δ
6. Power supply rejection ratio (PSRR)
]dB[
VF9-VF10 Rf/Rs)+(1×Vcc
Log×20 PSRR Δ
Test Circuit 2 Sw itch Condition
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
High Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Low Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF
Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF OFF
Gain Bandwidth Product OFF ON OF F OFF ON ON OFF OFF ON ON OFF OFF OFF OFF
Equivalent Input Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OF F OFF OFF
Fig. 46 Test circuit1 (one channel only)
VF
RL
0.1μF
500kΩ
500
Rf=50kΩ
Rs=50Ω
Ri=10kΩ
EK
NULL
DUT
V
SW1
SW2
Vicm 1000pF
SW3
VCC
VEE
-15V
+15V
Ri=10kΩ
Rs=50Ω
50kΩ
0.F
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
Test Circuit 3 Channel Separation
Fig.47 Test Circuit 2 (each Op-Amp)
VH
VL
Input wave t
Input voltage
VH
VL
Δ
t
ΔV
Output wave
SR=ΔV/Δt
t
Output voltage
Fig. 48 Slew Rate Input Waveform
VCC
VEE
R1
V
R2
R1//R2
VOUT1
=0.5[Vrms]
VIN
VCC
VEE
R1
V
R2
R1//R2
VOUT2
OTHE
R
CH
CS20×log 100×VOUT1
VOUT2
Fig. 49 Test circuit 3
(VCC=+15V, VEE=-15V, R1=1k, R2=100k)
SW1 SW2 SW3
SW10 SW11 SW12
A
VIN- VIN+ RL
VCC
VEE
SW9
SW6 SW7 SW8
CL
SW13 SW14
A
V
VOU
T
RS
SW5
SW4
V
R1
R2
C
90%
10%
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
(b) Derating curve
Power Dissipation
Power dissipation(total loss) indicates the power t hat can be consum ed by I C at Ta= 25(normal temper ature). IC is heat ed
when it consumed p ower, and the temperat ure of IC chip becom es higher than ambie nt temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represent ed by the symbol θja/W.The t emperature of IC inside th e package can be estimated by this
thermal resistance. Fig.50(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd /W ・・・・・ ()
Derating curve in Fig.50 (b) in dicat es power that can be consumed by IC with referenc e t o ambient t emperat ure. Po wer t hat
can be consumed by IC with reference to ambient temperature. Power t hat can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on
chip size, power consumptio n, package, ambient t emperat ure, package conditi on, wind velocity, etc even when the same of
package is used. Thermal reduction curv e indicat es a r efer ence va lu e measure d at a sp ecified c on ditio n. F ig.51(c), (d) show
a derating curve for an example of BA4558, BA4558R.
(*11) (*12) (*13) (*14) Unit
5.52 5.4 5 4.7
mW/
When using the unit above Ta=25, subtract the value above per degree. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Fig. 51 Derating curve
(a) Thermal resistance
Fig. 50Thermal resistance and derating curve
(d)BA4558R
(c)BA4558
0 50 75 100 125 15025
P1
P2
Pd (m ax )
LSIの消費電力 [W]
θ' ja2
θ' ja1 Tj ' ( ma x)
θja2 < θja1
周囲温度 Ta []
θ ja2
θ ja1 Tj ( max)
Power dissipation of LSI [W]
A
mbient temperature Ta []
周囲温 Ta []
チッ Tj []
P [W]
Ambient temperature Ta []
Chip sur face temperature Tj []
Power dissipation P [W]
θja=(Tjmax-Ta)/Pd /W
0
200
400
600
800
1000
0 255075100125
AMBIENT TEMPERATURE [] .
POWER DISSIPATION [mW] .
BA4558FJ(
12)
BA4558FV/FVT(
13)
BA4558F(
11)
BA4558FVM(
14)
0
200
400
600
800
1000
0 25 50 75 100 125
AMBIENT T EMPER AT URE [] .
POWER DISSIPATION [mW] .
BA4558RF(
11)
BA4558RFVM(
14)
BA4558RFV/FVT(
13)
BA4558RFJ(
12)
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
Examples of circuit
Voltage follo wer
Inverting amplifier
Non-inverting amplifier
Fig. 52 Voltage follower circuit
Fig. 53 Inverting amplifier circuit
Fig. 54 Non-inverting amplifier circuit
Voltage gain is 0 dB.
This circuit controls output voltage (Vout) equal input
voltage (Vin), and keeps Vout with stable because of
high input impedance and low output impedance.
Vout is shown next formula.
Vout=Vin
For inverting amplifier, Vi(b) Derating curve voltage
gain decided R1 an d R2, and phase reverse d voltage
is outputted.
Vout is shown next formula.
Vout=-(R2/R1)Vin
Input impedance is R1.
For non-inverting amplifier, Vin is amplified by voltage
gain decided R1 and R2, and phase is same wit h Vin.
Vout is shown next formula.
Vout=(1 + R2/R1)Vin
This circuit realizes high input impedance because
Input impedance is operational amplifier’s input
Impedance.
VEE
Vout
Vin
VCC
R2
R1
VEE
R1//R2
Vin
Vout
VCC
VEE
R2
VCC
Vin Vout
R1
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 24/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Operational Notes
1) Processing of unused circuit
It is recommended to ap ply connect ion (see the F ig.55) and set t he non invertin g
input terminal at the potential within input common-mode voltage range (Vicm),
for any unused circuit.
2) Input voltage
Applying (VEE - 0.3) to (VEE + 36)V
(BA4558R) to the in put terminal is possible without c ausing deterioration of the
electrical characteristics or destruction, irrespective of the supply voltage.
However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is within the common mode
input voltage range of the electric characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature charact erist ics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Fig.56, thereby protecting against
load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and VEE.
Th e r e f o re , t h e s i n g l e s u p p l y O p - A m p c a n be us e d f o r d o uble supply Op-Amp as well.
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Short-circuit between pins and wrong mounting
Pay attention t o the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiat ion-resistant.
10) IC Handling
When stress is applied to I C because of deflection or bend of board, the characteristics may fluctuate due to piezo electric
(piezo) effect.
11) Inspection on set board
During testing, turn on or off the power befor e mounting or dismounting the board f rom the test Jig. Do not power up the
board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can
stress the device. Pay attention to the elect ro static voltages during IC handling, transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an elect ric charge has accumulated on the external capacitor,
connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the
ci rcuit or terminal prot ec t i on element. T h e element in the c i r c uit may be d amaged (thermal destruction). When usi ng this IC
for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a
voltage comparator. Set the capaci tor connected to output terminal below 0.1μF in order to prevent damage to IC.
Status of this document
The Japanese version of t his document is formal spec ification. A customer may use this translati on version only for a re ference
to help reading t he formal version.
If there are any differences in tr anslation version of this document formal version takes priority.
application circuit for unused op-amp
Fig. 55 The example of
Fig. 56 The example of
output short protection
Connect
to Vicm
VCC
VEE
Vicm
-
+
VEE
VCC
+
-
protection
resistor
Datasheet
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© 2012 ROHM Co., Ltd. All rights reserved. 25/26 4.SEP.2012 Rev.003
TSZ221111500
BA4558xxx, BA4558Rxxx
Physical Dimensions Tape and Reel Information
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP8
0.9±0.15
0.3MIN
4
°
+
6
°
4
°
0.17 +0.1
-
0.05
0.595
6
43
8
2
5
1
7
5.0±0.2
6.2±0.3
4.4±0.2
(MAX 5.35 include BURR)
1.27
0.11
0.42±0.1
1.5±0.1
S
0.1 S
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
MSOP8
0.08 S
S
4.0±0.2
8
3
2.8±0.1
1
6
2.9±0.1
0.475
4
57
(MAX 3.25 include BURR)
2
1PIN MARK
0.9MAX
0.75±0.05
0.65
0.08±0.05
0.22 +0.05
0.04
0.6±0.2
0.29±0.15
0.145 +0.05
0.03
4°
+6°
4°
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SSOP-B8
0.08
M
0.3MIN
0.65
(0.52)
3.0±0.2
0.15±0.1
(MAX 3.35 include BURR)
S
S
0.1
1234
5678
0.22
6.4±0.3
4.4±0.2
+0.06
0.04
0.1
1.15±0.1
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
(Unit : mm)
TSSOP-B8
0.08 S
0.08
M
4 ± 4
234
8765
1
1.0±0.05
1PIN MARK
0.525
0.245+0.05
0.04
0.65
0.145+0.05
0.03
0.1±0.05
1.2MAX
3.0±0.1
4.4±0.1
6.4±0.2
0.5±0.15
1.0±0.2
(MAX 3.35 include BURR)
S
Datasheet
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TSZ221111500
BA4558xxx, BA4558Rxxx
Marking Diagrams
Product Name Package Type Marking
BA4558
F SOP8
4558
FV SSOP-B8
FVT TSSOP-B8
FVM MSOP8
FJ SOP-J8
BA4558R
F SOP8
4558R
FV SSOP-B8
FVT TSSOP-B8
FVM MSOP8
FJ SOP-J8
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP-J8
4°+6°
4°
0.2±0.1
0.45MIN
234
5678
1
4.9±0.2
0.545
3.9±0.2
6.0±0.3
(MAX 5.25 include BURR)
0.42±0.1
1.27
0.175
1.375±0.1
0.1 S
S
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Mouser Electronics
Authorized Distributor
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ROHM Semiconductor:
BA4558F-E2 BA4558RF-E2 BA4558RFV-E2 BA4558RFVM-TR BA4558FJ-GE2 BA4558FVM-GTR BA4558FVT-
GE2 BA4558RFVT-E2 BA4558FV-GE2 BA4558RFJ-GE2