Intel® Desktop Board DQ77MK
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Specifications
Essentials
Memory Specifications
Graphics Specifications
Expansion Options
I/O Specifications
Package Specifications
Advanced Technologies
Intel® Platform
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Specifications
-Essentials
Status End of Interactive Support
Launch Date Q2'12
Board Form Factor Micro ATX
Socket LGA1155
Extended Life Program (XLP) Yes
TDP 95 W
Recommended Customer Price N/A
Description Link
-Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types Dual DDR3 1333/1600
Max # of Memory Channels 2
Max # of DIMMs 4
ECC Memory Supported ‡No
-Graphics Specifications
Integrated Graphics ‡Yes
Graphics Output DP DVI-I DVI-D
# of Displays Supported ‡2
Discrete Graphics 1 PCIe 3.0 x16
Requires a Processor with Intel Graphics
Technology Yes
-Expansion Options
PCI Support 1
PCI Express Revision 3.0, 2.0
Max # of PCI Express Lanes 2
PCIe x1 Gen 2.x 1
PCIe x4 Gen 2.x 1
PCIe x8 Gen 2.x 0
PCIe x16 Gen 2.x 0
PCIe x1 Gen 1.x 0
PCIe x4 Gen 1.x 0
PCIe x8 Gen 1.x 0
PCIe x16 Gen 1.x 0
PCIe Mini Card Slot (Full Length) 1
-I/O Specifications
USB Revision 3.0/2.0
# of USB Ports 12
USB 2.0 Configuration (External + Internal) 4,4
Related Products
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Intel® Desktop Boards
with Intel® Q77 Express
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herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of
the products listed. Please contact system vendor for more information on specific products or systems.
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Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please
contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard,
processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality,
performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten
and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to
suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not
confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any
additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without
notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit.
Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709
requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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USB 3.0 Configuration (External + Internal) 2,2
Total # of SATA Ports 6
Max # of SATA 6.0 Gb/s Ports 2
# of eSATA Ports 1
RAID Configuration 0,1,5,10
# of PATA Ports 0
# of Parallel Ports 0
Parallel Port via Internal Header No
# of Serial Ports 1
Serial Port via Internal Header Yes
Audio (back channel + front channel) 6,2
Integrated LAN Dual 10/100/1000
Firewire 1,1
S/PDIF Out Connector 1
# of PS2 Ports 0
-Package Specifications
Max CPU Configuration 1
Low Halogen Options Available See MDDS
-Advanced Technologies
Intel® vPro Technology ‡Yes
Intel® ME Firmware Version 8.0
Intel® Remote Wake Technology Yes
Intel® Remote PC Assist Technology Yes
TPM Yes
TPM Version 1.2
Intel® HD Audio Technology Yes
Intel® Matrix Storage Technology Yes
Intel® Rapid Storage Technology Yes
-Intel® Platform Protection Technology
Anti-Theft Technology Yes
