Products Learn & Develop Support USA (English) Type Here to Search Products ARK Menu Intel(R) Desktop Board DQ77MK Compare Specifications Specifications Essentials Memory Specifications Graphics Specifications Expansion Options I/O Specifications Package Specifications Advanced Technologies Intel(R) Platform Protection Technology Product Images + Related Products - Essentials Desktop Boards Intel(R) Desktop Boards with Intel(R) Q77 Express Chipset Status End of Interactive Support Launch Date Q2'12 Board Form Factor Micro ATX Socket LGA1155 Extended Life Program (XLP) Yes Export Full Specifications TDP 95 W Support Overview Recommended Customer Price N/A Description Link Quick Links Search Distributors PCN/MDDS Information Ordering / sSpecs / Steppings - Memory Specifications Max Memory Size (dependent on memory type) 32 GB Memory Types Dual DDR3 1333/1600 Max # of Memory Channels 2 Max # of DIMMs 4 ECC Memory Supported No - Graphics Specifications Integrated Graphics Yes Graphics Output DP DVI-I DVI-D # of Displays Supported 2 Discrete Graphics 1 PCIe 3.0 x16 Requires a Processor with Intel Graphics Technology Yes - Expansion Options PCI Support 1 PCI Express Revision 3.0, 2.0 Max # of PCI Express Lanes 2 PCIe x1 Gen 2.x 1 PCIe x4 Gen 2.x 1 PCIe x8 Gen 2.x 0 PCIe x16 Gen 2.x 0 PCIe x1 Gen 1.x 0 PCIe x4 Gen 1.x 0 PCIe x8 Gen 1.x 0 PCIe x16 Gen 1.x 0 PCIe Mini Card Slot (Full Length) 1 - I/O Specifications USB Revision 3.0/2.0 # of USB Ports 12 USB 2.0 Configuration (External + Internal) 4,4 PCN/MDDS Information Not Available USB 3.0 Configuration (External + Internal) 2,2 Total # of SATA Ports 6 Max # of SATA 6.0 Gb/s Ports 2 # of eSATA Ports 1 RAID Configuration 0,1,5,10 # of PATA Ports 0 # of Parallel Ports 0 Parallel Port via Internal Header No # of Serial Ports 1 Serial Port via Internal Header Yes Audio (back channel + front channel) 6,2 Integrated LAN Dual 10/100/1000 Firewire 1,1 S/PDIF Out Connector 1 # of PS2 Ports 0 - Package Specifications Max CPU Configuration 1 Low Halogen Options Available See MDDS - Advanced Technologies Intel(R) vPro Technology Yes Intel(R) ME Firmware Version 8.0 Intel(R) Remote Wake Technology Yes Intel(R) Remote PC Assist Technology Yes TPM Yes TPM Version 1.2 Intel(R) HD Audio Technology Yes Intel(R) Matrix Storage Technology Yes Intel(R) Rapid Storage Technology Yes - Intel(R) Platform Protection Technology Anti-Theft Technology Yes All information provided is subject to change at any time, without notice. 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"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. 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