OLED-128O064B-LPP3N00000 - VISHAY

OLED-128O064B-LPP3N00000

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128 x 64 Graphic OLED

FEATURES

• Type: graphic

• Display format: 128 x 64 dots

• Built-in controller: SSD1305Z

• Duty cycle: 1/64

• +3 V power supply

• Interface: 6800, 8080, serial, and I2C

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Notes

(1) All the above voltages are on the basis of “VSS = 0 V”.

(2) When this module is used beyond the above absolute maximum

ratings, permanent breakage of the module may occur. Also, for

normal operations, it is desirable to use this module under the

conditions according to section 6 “Electrical Characteristics”. If

this module is used beyond these conditions, malfunctioning of

the module can occur and the reliability of the module may

deteriorate.

MECHANICAL DATA

ITEM STANDARD VALUE UNIT

Module dimension 45.24 x 29.14 x 2.05

Viewing area 37.056 x 19.52

Active area 35.056 x 17.52

Dot size 0.258 x 0.258

Dot pitch 0.274 x 0.274

Mounting hole n/a

ABSOLUTE MAXIMUM RATINGS

ITEM SYMBOL STANDARD VALUE UNIT

MIN. MAX.

Supply voltage

for logic (1)(2) VDD -0.3 4

Supply voltage

for display (1)(2) VCC 015

Operating temperature TOP -40 +80 °C

Storage temperature TSTG -40 +80

ELECTRICAL CHARACTERISTICS

ITEM SYMBOL CONDITION STANDARD VALUE UNIT

MIN. TYP. MAX.

Supply voltage for logic VDD - 2.8 3.0 3.3

Supply voltage for display VCC - 101215

Input high voltage VIH - 0.8 VDD -V

Input low voltage VIL - 0 - 0.2 VDD

Output high voltage VOH - 0.9 VDD -V

Output low voltage VOL - 0 - 0.1 VDD

50 % check board operating current ICC VCC = 12 V 232535mA

OPTIONS

EMITTING COLOR

YELLOW GREEN RED BLUE WHITE

Yes----

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INTERFACE PIN FUNCTION

PIN NO. SYMBOL FUNCTION

1 NC (GND)

Reserved pin (supporting pin)

The supporting pins can reduce the influences from stresses on the function pins. These pins must be

connected to external ground.

LSS Ground of analog circuit

This is an analog ground pin. It should be connected to VSS externally.

SS Ground of logic circuit

This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external ground.

4NC

Reserved pin

The NC pins between function pins are reserved for compatible and flexible design.

DD Power supply for logic circuit.

This is a voltage supply pin. It must be connected to external source.

6BS1

Communicating protocol select

These pins are MCU interface selection input. See the following table:

68XX-parallel 80XX-parallel Serial I2C

7BS2

BS1 0101

BS2 1100

8CS#

Chip select

This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.

9RES#

Power reset for controller and driver

This pin is reset signal input. When the pin is low, initialization of the chip is executed.

10 D / C#

Data / command control

This pin is data / command control pin. When the pin is pulled high, the input at D7 to D0 is treated as

display data. When the pin is pulled low, the input at D7 to D0 will be transferred to the command register.

For detail relationship to MCU interface signals, please refer to the timing characteristics diagrams. When

the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is

pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0

for slave address selection.

11 R / W#

Read / write select or write

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used

as read / write (R / W#) selection input. Pull this pin to “high” for read mode and pull it to “low” for write

mode.

When 80XX interface mode is selected, this pin will be the write (WR#) input. Data write operation is

initiated when this pin is pulled low and the CS# is pulled low.

12 E / RD#

Read / write enable or read

This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used

as the enable (E) signal. Read / write operation is initiated when this pin is pulled high and the CS# is pulled

low.

When connecting to an 80XX-microprocessor, this pin receives the read (RD#) signal. Data read operation

is initiated when this pin is pulled low and CS# is pulled low.

13 to 20 D0 to D7

Host data input / output bus

These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When

serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK.

When I2C mode is selected, D2 and D1 should be tired together and serve as SDAout and SDAin in

application and D0 is the serial clock input SCL.

21 IREF

Current reference for brightness adjustment

This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set

the current lower than 10 μA.

22 VCOMH

Voltage output high level for COM signal

This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected

between this pin and VSS.

23 VCC Power supply for OEL panel

This is the most positive voltage supply pin of the chip. It must be supplied externally.

24 GND

Reserved pin (supporting pin)

The supporting pins can reduce the influences from stresses on the function pins. These pins must be

connected to external ground.

OLED-128O064B-LPP3N00000

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DIMENSIONS in millimeters

The non-specied tolerance of dimension is ± 0.2 mm

45.24 ± 0.2

37.056 (VA)

35.056 (AA)

29.14 ± 0.2

24.50

19.52 (VA)

17.52 (AA)

Pull

tape

4.09

5.09

3.21

Stiffener

Contact side

12.5

0.35

3.00 ± 0.3

4.50 ± 0.5

36.00 ± 1.0

16.37

124

128 x 64 dots

0.258

0.274

0.258

0.274

SCALE: 20/1

DOTS SIZE

0.30 ± 0.05

2.05

Remove tape

2.21

44.24 polarizer

0.5

23.00 polarizer 0.5

6.00 ± 0.3

25.00 ± 0.3

10.4 ± 0.1

8.50 ± 0.1

3M#1318B

15 x 8 x 0.063

R0.40 ± 0.05

R0.50 ± 0.05

Common 31

(row 2)

Common 0

(row 64)

Segment 4

(Column 128)

Segment 131

(Common 32)

column 1

(row 63)

Common 63

(row 1)

Glue

P0.5 x 23 = 11.5 ± 0.05

OLED-128O064B-LPP3N00000

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1.Module Classification Information

OLED -128 O 064 B -L P P 3 N 0 0 000

1 2 3 4 5 6 7 8 9 10 11 12 13

1 Brand: Vishay Intertechnology, Inc.

2 Horizontal Format: 128 columns

3 Display Type烉HĺCharacter Type, GĺGraphic Type , XĺTAB Type ,OĺCOG Type

4 Vertical Format: 64 Lines

5 Serials code: B

6 Emitting Color

A烉R rebmA 烉RED

B烉C eulB 烉Full color

G烉W neerG 烉White

Y烉Yellow Green L烉Yellow

7 Polarizer P烉With Polarizer; N: Without Polarizer

8 Display Mode P烉Passive Matrix ; A: Active Matrix

9 Driver Voltage 3: 3.0 V; 5: 5.0V

10 Touch Panel N烉Without touch panel; T: With touch panel

11 Products type

᧶6WDQGDUGW\SH

 6XQOLJKW5HDGDEOHW\SH

 7UDQVSDUHQW2/('72/('

 )OH[LEOH2/('

 2/('IRU/LJKWLQJ



12 Product grades

SURGXFWJUDGHV 

᧶6WDQGDUG$OHYHO  

᧶%OHYHO 

᧶&OHYHO 

᧶KLJKFODVV$$OHYHO 

᧶&XVWRPHURIIHULQJV



13 Serial No. $SSOLFDWLRQVHULDOQXPEHUa===



OLED-128O064B-LPP3N00000

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2.General Specification

Item Dimension Unit

Dot Matrix 128 x 64 Dots 㸫

Module dimension 45.24 × 29.14 × 2.05 (mm) mm

Active Area 35.056 × 17.52 (mm) mm

Pixel Size 0.258 × 0.258 (mm) mm

Pixel Pitch 0.274 × 0.274 (mm) mm

Display Mode Passive Matrix

Display Color Yellow

Drive Duty 1/64 Duty

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The non-specified tolerance of dimension is 0.2mm.

45.24¡ Ó0.2

37.056(VA)

35.056(AA)

29.14¡ Ó0.2

24.50

19.52(VA)

17.52(AA)

PULL

TAPE

4.09

5.09

3.21

Stiffener

Contact side

12.5

P0.5*23=11.5¡ Ó0.05

0.35

3.00¡ Ó0.3

4.50¡ Ó0.5

36.00¡ Ó1.0

16.37

124

128*64 DOTS

0.258

0.274

0.258

0.274

SCALE:20/1

Dots Size

VLSS

VSS

VDD

CS#8

BS1

1NC(GND)

RES#

D/C#10

R/W#

E/RD#12

D013

D316

D518

D720

0.30¡ Ó0.05

IREF

VCOMH22

VCC

GND24

BS2

2.05

Remove Tape

2.21

44.24 Polarizer

0.5

23.00 Polarizer 0.5

6.00¡ Ó0.3

25.00¡ Ó0.3

10.4¡ Ó0.1

8.50¡ Ó0.1

3M#1318B

15*8*0.063mm

R0.40¡Ó0.05

R0.50¡Ó0.05

Common 31

(Row 2)

Common 0

(Row 64)

Segment 4

(Column 128)

Segment 131

(Column 1)

Common 32

(Row 63)

Common 63

(Row1)

Glue

3.Contour Drawing & Block Diagram

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FUNCTION BLOCK DIAGRAM

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4 . Interface Pin Function

Pin No. Symbol Function

1 NC(GND)

Reserved Pin (Supporting Pin)

The supporting pins can reduce the influences from stresses on the

function pins. These pins must be connected to external ground.

2 VLSS

Ground of Analog Circuit

This is an analog ground pin. It should be connected to VSS

externally.

3 VSS

Ground of Logic Circuit

This is a ground pin. It also acts as a reference for the logic pins. It

must be connected to external ground.

4 NC

Reserved Pin

The N.C. pins between function pins are reserved for compatible

and flexible design.

5 VDD

Power Supply for Logic Circuit

This is a voltage supply pin. It must be connected to external

source.

6 BS1

Communicating Protocol Select

These pins are MCU interface selection input. See the following

table:

68XX-parallel 80XX-parallel Serial I2C

BS1 0 1 0 1

BS2 1 1 0 0

7 BS2

8 CS#

Chip Select

This pin is the chip select input. The chip is enabled for

MCU communication only when CS# is pulled low

9 RES#

Power Reset for Controller and Driver

This pin is reset signal input. When the pin is low, initialization of

the chip is executed.

10 D/C#

Data/Command Control

This pin is Data/Command control pin. When the pin is pulled

high, the input at D7~D0 is treated as display data. When the pin is

pulled low, the input at D7~D0 will be transferred to the command

refer to the Timing Characteristics Diagrams.

When the pin is pulled high and serial interface mode is selected,

the data at SDIN is treated as data. When it is pulled low, the data

at SDIN will be transferred to the command register. In I2C mode,

this pin acts as SA0 for slave address selection.

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11 R/W#

Read/Write Select or Write

This pin is MCU interface input. When interfacing to a

68XX-series microprocessor, this pin will be used as Read/Write

(R/W#) selection input. Pull this pin to “High” for read mode and

pull it to “Low” for write mode.

When 80XX interface mode is selected, this pin will be the Write

(WR#) input. Data write operation is initiated when this pin is

pulled low and the CS# is pulled low.

12 E/RD#

Read/Write Enable or Read

This pin is MCU interface input. When interfacing to a

68XX-series microprocessor, this pin will be used as the

Enable (E) signal. Read/write operation is initiated when this pin is

pulled high and the CS# is pulled low.

When connecting to an 80XX-microprocessor, this pin receives the

Read (RD#) signal. Data read operation is initiated when this pin is

pulled low and CS# is pulled low.

13~20 D0~D7

Host Data Input/output Bus

These pins are 8-bit bi-directional data bus to be connected to the

microprocessor’s data bus. When serial mode is selected, D1 will

be the serial data input SDIN and D0 will be the serial clock input

SCLK. When I2C mode is selected, D2 & D1 should be tired

together and serve as SDAout & SDAin in application and D0 is

the serial clock input SCL.

21 IREF

Current Reference for Brightness Adjustment

This pin is segment current reference pin. A resistor should be

connected between this pin and VSS. Set the current lower than

10ȝA.

22 VCOMH

Voltage Output High Level for COM Signal

This pin is the input pin for the voltage output high level for COM

signals. A capacitor should be connected between this pin and

VSS.

23 VCC

Power Supply for OEL Panel

This is the most positive voltage supply pin of the chip.

It must be supplied externally.

24 GND

Reserved Pin (Supporting Pin)

The supporting pins can reduce the influences from stresses on the

function pins. These pins must be connected to external ground.

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5.Absolute Maximum Ratings

Parameter Symbol Min Max Unit Notes

Supply Voltage for Logic VDD -0.3 4 V 1, 2

Supply Voltage for Display VCC 0 15 V 1, 2

Operating Temperature TOP -40 +80 °C -

Storage Temperature TSTG -40 +80 °C -

Note 1: All the above voltages are on the basis of “VSS = 0V”.

Note 2: When this module is used beyond the above absolute maximum ratings, permanent

breakage of the module may occur. Also, for normal operations, it is desirable to use this

module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module

is used beyond these conditions, malfunctioning of the module can occur and the reliability of

the module may deteriorate



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6.Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage for Logic VDD 炼 2.8 3.0 3.3 V

Supply Voltage for Display VCC 炼 10 12 15 V

High Level Input VIH 炼 0.8×VDD 炼 VDD V

Low Level Input VIL 炼 0 炼 0.2×VDD V

High Level Output VOH 炼 0.9×VDD 炼 VDD V

Low Level Output VOL 炼 0 炼 0.1×VDD V

50% Check Board operating

Current VCC =12V 23 25 35 mA

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7.Optical Characteristics

Item Symbol Condition Min Typ Max Unit

View Angle

(V)ș 160 deg

(H)ĳ 160 deg

Contrast Ratio CR Dark 2000:1 炼炼

Response Time

T rise 炼 10 ȝs

T fall 炼 10 ȝs

Display with 50% check Board Brightness 100 120 cd/m2

CIEx(Yellow) (CIE1931) 0.45 0.47 0.49

CIEy(Yellow) (CIE1931) 0.48 0.50 0.52

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8.OLED Lifetime

ITEM Conditions Min Typ Remark

Operating

Life Time

Ta=25ɗ

/ Initial 50% check board

brightness Typical Value

80,000 Hrs 100,000 Hrs Note

Notes:

1. Life time is defined the amount of time when the luminance has decayed to <50% of the

initial value.

2. This analysis method uses life data obtained under accelerated conditions to extrapolate

an estimated probability density function (pdf) for the product under normal use conditions.

3. Screen saving mode will extend OLED lifetime.

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9.Reliability

Content of Reliability Test

Environmental Test

Test Item Content of Test Test Condition Applicable

Standard

High

Temperature

storage

Endurance test applying the high

storage temperature for a long time.

80

240hrs ——

Low

Temperature

storage

Endurance test applying the low storage

temperature for a long time.

-40

240hrs ——

High

Temperature

Operation

Endurance test applying the electric

stress (Voltage & Current) and the

thermal stress to the element for a long

time.

80

240hrs ——

Low

Temperature

Operation

Endurance test applying the electric

stress under low temperature for a long

time.

-40

240hrs ——

High

Temperature/

Humidity

Storage

Endurance test applying the high

temperature and high humidity storage

for a long time.

60,90%RH

240hrs ——

Temperature

Cycle

Endurance test applying the low and

high temperature cycle.

-40 25 80

30min 5min 30min

1 cycle

-40/80

100 cycles ——

Mechanical Test

Vibration test Endurance test applying the vibration

during transportation and using.

10~22Hzĺ1.5mmp-p

22~500Hzĺ1.5G

Tota l 0. 5 hr

——

Shock test

Constructional and mechanical

endurance test applying the shock

during transportation.

50G Half sin

wave 11 ms

3 times of each

direction

——

Atmospheric

pressure test

Endurance test applying the

atmospheric pressure during

transportation by air.

115mbar

40hrs ——

Others

Static

electricity test

Endurance test applying the electric

stress to the terminal.

VS=800V,RS=1.5kȍ

CS=100pF

1 time

——

*** Supply voltage for OLED system =Operating voltage at 25ɗ

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Test and measurement conditions

1. All measurements shall not be started until the specimens attain to temperature stability.

After the completion of the described reliability test, the samples were left at room

temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.

2. All-pixels-on is used as operation test pattern.

3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/

Humidity Storage, Temperature Cycle

Evaluation criteria

1. The function test is OK.

2. No observable defects.

3. Luminance: > 50% of initial value.

4. Current consumption: within ± 50% of initial value.

APPENDIX:

RESIDUE IMAGE

Because the pixels are lighted in different time, the luminance of active pixels

may reduce or differ from inactive pixels. Therefore, the residue image will occur.

To avoid the residue image, every pixel needs to be lighted up uniformly.

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10.Inspection Specification

LQA noiretirC metI ON

01 Electrical

Testing

1.1 Missing vertical, horizontal segment, segment contrast

defect.

1.2 Missing character , dot or icon.

1.3 Display malfunction.

1.4 No function or no display.

1.5 Current consumption exceeds product specifications.

1.6 OLED viewing angle defect.

1.7 Mixed product types.

1.8 Contrast defect.

0.65

02 Black or

white

spots on

OLED

(display

only)

2.1 White and black spots on display 䵐

0.25mm, no more than

three white or black spots present.

2.2 Densely spaced: No more than two spots or lines within

3mm. 2.5

03 OLED

black

spots,

white

spots,

contamina

tion

(non-displ

ay)

3.1 Round type : As

following drawing

ĭ=( x + y ) / 2

SIZE Acceptable Q

ĭʀ0.10 Accept no

dense

0.10烋

ĭʀ0.20

0.20烋

ĭʀ0.25

0.25烋ĭ 0

2.5

3.2 Line type : (As following drawing)

Length Width Acceptable Q TY

--- Wʀ0.02 Accept no dense

Lʀ3.0 0.02烋Wʀ0.03 2

Lʀ2.5 0.03烋Wʀ0.05

--- 0.05烋W As round type

2.5

04 Polarizer

bubbles

If bubbles are visible,

judge using black spot

specifications, not easy

to find, must check in

specify direction.

Size ĭ Acceptable Q TY

ĭʀ0.20 Accept no dense

0.20烋ĭʀ0.50 3

0.50烋ĭʀ1.00 2

1.00烋ĭ 0

Tota l Q TY 3

2.5

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NO Item Criterion AQL

05 Scratches Follow NO.3 OLED black spots, white spots, contamination

06 Chipped

glass

Symbols Define:

x: Chip length y: Chip width z: Chip thickness

k: Seal width t: Glass thickness a: OLED side length

L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Zʀ1/2t Not over viewing

area

xʀ1/8a

1/2t烋zʀ2t Not exceed 1/3k xʀ1/8a

˞If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Zʀ1/2t Not over viewing

area

xʀ1/8a

1/2t烋zʀ2t Not exceed 1/3k xʀ1/8a

˞If there are 2 or more chips, x is the total length of each chip.

2.5

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NO Item Criterion AQL

06 Glass

crack

Symbols :

x: Chip length y: Chip width z: Chip thickness

k: Seal width t: Glass thickness a: OLED side length

L: Electrode pad length

6.2 Protrusion over terminal :

6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

yʀ0.5mm xʀ1/8a 0 烋 z ʀ t

6.2.2 Non-conductive portion:

y: Chip width x: Chip length z: Chip

thickness

yʀ L xʀ1/8a 0 烋 z ʀ t

˞If the chipped area touches the ITO terminal, over 2/3 of the ITO

must remain and be inspected according to electrode terminal

specifications.

˞If the product will be heat sealed by the customer, the alignment

mark not be damaged.

6.2.3 Substrate protuberance and internal crack.

y: width x: length

yʀ1/3L x ʀ a

2.5

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uvG Item Criterion AQL

W^G Cracked

glass The OLED with extensive crack is not acceptable. 2.5

W_G Backlight

elements

8.1 Illumination source flickers when lit.

8.2 Spots or scratched that appear when lit must be judged.

Using OLED spot, lines and contamination standards.

8.3 Backlight doesn’t light or color wrong.

0.65

2.5

0.65

W`G Bezel

9.1 Bezel may not have rust, be deformed or have

fingerprints, stains or other contamination.

9.2 Bezel must comply with job specifications.

2.5

0.65

XWG PCBૠCOB

10.1 COB seal may not have pinholes larger than 0.2mm or

contamination.

10.2 COB seal surface may not have pinholes through to the

IC.

10.3 The height of the COB should not exceed the height

indicated in the assembly diagram.

10.4 There may not be more than 2mm of sealant outside the

seal area on the PCB. And there should be no more than

three places.

10.5 No oxidation or contamination PCB terminals.

10.6 Parts on PCB must be the same as on the production

characteristic chart. There should be no wrong parts,

missing parts or excess parts.

10.7 The jumper on the PCB should conform to the product

characteristic chart.

10.8 If solder gets on bezel tab pads, OLED pad, zebra pad

or screw hold pad, make sure it is smoothed down.

2.5

0.65

2.5

0.65

2.5

XXG Soldering

11.1 No un-melted solder paste may be present on the PCB.

11.2 No cold solder joints, missing solder connections,

oxidation or icicle.

11.3 No residue or solder balls on PCB.

11.4 No short circuits in components on PCB.

2.5

0.65

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NO Item Criterion AQL

12 General

appearance

12.1 No oxidation, contamination, curves or, bends on

interface Pin (OLB) of TCP.

12.2 No cracks on interface pin (OLB) of TCP.

12.3 No contamination, solder residue or solder balls on

product.

12.4 The IC on the TCP may not be damaged, circuits.

12.5 The uppermost edge of the protective strip on the

interface pin must be present or look as if it cause the

interface pin to sever.

12.6 The residual rosin or tin oil of soldering (component or

chip component) is not burned into brown or black color.

12.7 Sealant on top of the ITO circuit has not hardened.

12.8 Pin type must match type in specification sheet.

12.9 OLED pin loose or missing pins.

12.10 Product packaging must the same as specified on

packaging specification sheet.

12.11 Product dimension and structure must conform to

product specification sheet.

2.5

0.65

2.5

0.65

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Check Item Classification Criteria

No Display

Major

Missing Line

Major

Pixel Short

Major

Darker Short

Major

Wrong Display

Major

Un-uniform

B/A x 100% < 70%

A/C x 100% < 70%

Major

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11.Precautions in use of OLED Modules

Modules

(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.

(2)Don’t make extra holes on the printed circuit board, modify its shape or change the

components of OLED display module.

(3)Don’t disassemble the OLED display module.

(4)Don’t operate it above the absolute maximum rating.

(5)Don’t drop, bend or twist OLED display module.

(6)Soldering: only to the I/O terminals.

(7)Storage: please storage in anti-static electricity container and clean environment.

(8)It's pretty common to use "Screen Saver" to extend the lifetime and don't use fix information

for long time in real application.

(9)Don't use fixed information in OLED panel for long time, that will extend "screen burn" effect

time..

(10)Supplier has the right to change the passive components, including R2and R3 adjust

resistors. (Resistors, capacitors and other passive components will have different

appearance and color caused by the different supplier.)

(11)Vishay has the right to change the PCB Rev. (In order to satisfy the supplying stability,

management optimization and the best product performance...etc, under the premise of not

affecting the electrical characteristics and external dimensions, Vishay has the right to modify

the version.)

11.1. Handling Precautions

(1) Since the display panel is being made of glass, do not apply mechanical impacts such us

dropping from a high position.

(2) If the display panel is broken by some accident and the internal organic substance leaks out,

be careful not to inhale nor lick the organic substance.

(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,

the cell structure may be damaged and be careful not to apply pressure to these sections.

(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.

Please be careful when handling the OLED display module.

(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It

takes advantage of by using following adhesion tape.

* Scotch Mending Tape No. 810 or an equivalent

Never try to breathe upon the soiled surface nor wipe the surface using cloth containing

solvent

such as ethyl alcohol, since the surface of the polarizer will become cloudy.

Also, pay attention that the following liquid and solvent may spoil the polarizer:

* Water

* Ketone

* Aromatic Solvents

(6) Hold OLED display module very carefully when placing OLED display module into the

System housing. Do not apply excessive stress or pressure to OLED display module. And, do

not over bend the film with electrode pattern layouts.

These stresses will influence the display performance. Also, secure sufficient rigidity for the

outer cases.

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(7) Do not apply stress to the LSI chips and the surrounding molded sections.

(8) Do not disassemble nor modify the OLED display module.

(9) Do not apply input signals while the logic power is off.

(10) Pay sufficient attention to the working environments when handing OLED display

modules to prevent occurrence of element breakage accidents by static electricity.

* Be sure to make human body grounding when handling OLED display modules.

* Be sure to ground tools to use or assembly such as soldering irons.

* To suppress generation of static electricity, avoid carrying out assembly work under dry

environments.

* Protective film is being applied to the surface of the display panel of the OLED display

module. Be careful since static electricity may be generated when exfoliating the protective

film.

(11) Protection film is being applied to the surface of the display panel and removes the

protection film before assembling it. At this time, if the OLED display module has been stored

for a long period of time, residue adhesive material of the protection film may remain on the

surface of the display panel after removed of the film. In such case, remove the residue

material by the method introduced in the above Section 5.

(12) If electric current is applied when the OLED display module is being dewed or when it is

placed under high humidity environments, the electrodes may be corroded and be careful to

avoid the above.

11.2. Storage Precautions

(1) When storing OLED display modules, put them in static electricity preventive bags

avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding

high temperature and high humidity environment or low temperature (less than 0°C)

environments.

(We recommend you to store these modules in the packaged state when they were shipped

from Vishay Intertechnology Inc.

At that time, be careful not to let water drops adhere to the packages or bags nor let dewing

occur with them.

(2) If electric current is applied when water drops are adhering to the surface of the OLED

display module, when the OLED display module is being dewed or when it is placed under

high humidity environments, the electrodes may be corroded and be careful about the above.

11.3. Designing Precautions

(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED

display module, and if these values are exceeded, panel damage may be happen.

(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH

specifications and, at the same time, to make the signal line cable as short as possible.

(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power

circuit (VDD). (Recommend value: 0.5A)

(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the

neighboring devices.

(5) As for EMI, take necessary measures on the equipment side basically.

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(6) When fastening the OLED display module, fasten the external plastic housing section.

(7) If power supply to the OLED display module is forcibly shut down by such errors as taking

out the main battery while the OLED display panel is in operation, we cannot guarantee the

quality of this OLED display module.

* Connection (contact) to any other potential than the above may lead to rupture of

the IC.11.4.

Precautions when disposing of the OLED display modules

1) Request the qualified companies to handle industrial wastes when disposing of the OLED

display modules. Or, when burning them, be sure to observe the environmental and hygienic

laws and regulations.

11.5. Other Precautions

(1) When an OLED display module is operated for a long of time with fixed pattern may remain

as an after image or slight contrast deviation may occur.

Nonetheless, if the operation is interrupted and left unused for a while, normal state can be

restored. Also, there will be no problem in the reliability of the module.

(2) To protect OLED display modules from performance drops by static electricity rapture, etc.,

do not touch the following sections whenever possible while handling the OLED display

modules.

* Pins and electrodes

* Pattern layouts such as the TCP & FPC

(3) With this OLED display module, the OLED driver is being exposed. Generally speaking,

semiconductor elements change their characteristics when light is radiated according to the

principle of the solar battery. Consequently, if this OLED driver is exposed to light,

malfunctioning may occur.

* Design the product and installation method so that the OLED driver may be shielded from light

in actual usage.

* Design the product and installation method so that the OLED driver may be shielded from light

during the inspection processes.

(4) Although this OLED display module stores the operation state data by the commands and the

indication data, when excessive external noise, etc. enters into the module, the internal status

may be changed. It therefore is necessary to take appropriate measures to suppress noise

generation or to protect from influences of noise on the system design.

(5) We recommend you to construct its software to make periodical refreshment of the operation

statuses (re-setting of the commands and re-transference of the display data) to cope with

catastrophic noise.

(6)Resistors, capacitors and other passive components will have different appearance and color

caused by the different supplier.

(7)Our company will has the right to upgrade and modify the product function.

Legal Disclaimer Notice

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Revision: 08-Feb-17 1Document Number: 91000

Disclaimer



ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of

typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding

statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a

particular product with the properties described in the product specification is suitable for use in a particular application.

Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s

technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,

including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.

Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for

such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document

or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.