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Model X4C25J1-03G
Rev C
Ultra Low Profile 0805
3dB Hybrid Coupler
Description
The X4C25J1-03G is a low profile, high performance 3dB hybrid coupler in
a new easy to use, manufacturing friendly surface mount package. It is
designed for 5G applications. The X4C25J1-03G is available on tape and
reel for pick and place high volume manufacturing.
All of the Xinger components are constructed from ceramic filled PTFE
composites, which possess excellent electrical and mechanical stability. All
parts have been subjected to rigorous qualification testing and units are
100% RF tested. Produced in an ENIG final finish.
Electrical Specifications **
Features:
• 2200-2800 MHz
• 5G Applications
• Very Low Loss
• Tight Amplitude Balance
• High Isolation
• Production Friendly
• Tape and Reel
Frequency Isolation
Insertion
Loss
Return
Loss
Amplitude
Balance
MHz dB Min dB Max dB Min dB Max
2200-2800
20
0.5
20
± 0.5
Group Delay Phase Power Operating
Temp.
Max nS Degrees
o
ºC
0.09
90 ± 4
5
-55 to +140
**Specification based on performance of unit properly installed on Anaren Test Board with small signal applied.
*Specifications subject to change without notice. Refer to parameter definitions for details.
Mechanical Outline
Side View
1
1.29±.05 6x .98
4x .65
-Dimensions are in Millimeters
Bottom View (Farside)
4x .30
4x .37
2.04±.04
Orientation Marker
Denotes Pin Location
GND
Orientation Marker
Denotes Pin Location
2x .15
4x .22
Top View (Nearside)
43
2
.70±.07
.30
1.20
-Tolerances are Non-Cumulative
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Model X4C25J1-03G
Rev C
Hybrid Coupler Pin Configuration
The X4C25J1-03G has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
3dB Coupler Pin Configuration
Configuration
Pin 1
Pin 2
Pin 3
Pin 4
Splitter
Input
Isolated
-3dB
-3dB
Splitter
Isolated
Input
-3dB
-3dB
Splitter
-3dB
-3dB
Input
Isolated
Splitter
-3dB
-3dB
Isolated
Input
*Combiner
A
A
Isolated
Output
*Combiner
A
A
Output
Isolated
*Combiner
Isolated
Output
A
A
*Combiner
Output
Isolated
A
A
90−∠
θ
θ
∠
θ
∠
90−
∠
θ
90
−
∠
θ
θ
∠
θ
∠
90
−
∠
θ
90−∠
θ
θ
∠
θ
∠
90
−
∠
θ
90
−∠
θ
θ
∠
θ
∠
90
−
∠
θ
Note: The direct port has a DC connection to the input port and the coupled port has a DC connection to the
isolated port. For optimum IL and power handling performance, use Pin 1 or Pin 3 as inputs.
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Rev C
Insertion Loss and Power Derating Curves
Insertion Loss Derating:
The insertion loss, at a given frequency, of a group of
couplers is measured at 25°
C and then averaged. The
measurements are performed under small signal
conditions (i.e. using a Vector Network Analyzer). The
process is repeated at -55°C, 105°C and 140°C. A best-fit
line for the measured data is computed and then plotted
from -55°C to 140°C.
Power Derating:
The power handling and corresponding power derating
plots are a function of the thermal resistance, mounting
surface temperature (base
plate temperature), maximum
continuous operating temperature of the coupler, and the
thermal insertion loss. The thermal insertion loss is
defined in the Power Handling section of the data sheet.
As the mounting interface temperature approaches the
ma
ximum continuous operating temperature, the power
handling decreases to zero.
If mounting temperature is greater than 105°C, Xinger
coupler will perform reliably as long as the input power
is derated to the curve above.
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Model X4C25J1-03G
Rev C
Typical Performance: 2200 MHz to 2800 MHz (Configuration 1)
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Typical Performance: 2200 MHz to 2800 MHz (Configuration 1)
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Rev C
Definition of Measured Specifications
*100% RF test is performed per spec definition for pin configuration 1 and 2.
Parameter
Definition
Mathematical Representation
VSWR
(Voltage Standing Wave Ratio)
The impedance match of
the coupler to a 50Ω
system. A VSWR of 1:1 is
optimal.
VSWR =
min
max
V
V
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss
The impedance match of
the coupler to a 50Ω
system. Return Loss is an
alternate means to express
VSWR.
Return Loss (dB)= 20log
1-VSWR
1VSWR +
Insertion Loss
The input power divided by
the sum of the power at the
two output ports.
10log
direct cpl
in
PP
P
+
Isolation
The input power divided by
the power at the isolated
port.
Isolation(dB)= 10log
iso
in
P
P
Amplitude Balance
The power at each output
divided by the average
power of the two outputs.
10log
+
2
PP
P
directcpl
cpl
and 10log
+
2
PP
P
directcpl
direct
Phase Balance
The difference in phase
angle between the two
output ports.
Phase at coupled port – Phase at direct port
Group Delay (GD-C)
Group delay is average of
group delay’s from input
port to the coupled port
Average (GD-C)
Group Delay (GD-DC)
Group delay is average of
group delay’s from input
port to the direct port
Average (GD-DC)
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Notes on RF Testing and Circuit Layout:
The effects of the test fixture on the measured data must be minimized in order to accurately determine the
performance of the device under test. If the line impedance is anything other than 50Ω and/or there is a discontinuity
at the microstrip to SMA interface, there will be errors in the data for the device under test. The test environment can
never be “perfect”, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an
attempt to minimize the errors associated with testing these devices. The lower the signal level that is being
measured, the more impact the fixture errors will have on the data. Parameters such as Return Loss and
Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels, will present the
greatest measurement challenge.
Note: The S-parameter files that are available on the anaren.com website include data for frequencies that are
outside of the specified band.
Circuit Board Layout
The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4003 material
that is 0.008” thick. Consider the case when a different material is used. First, the pad size must remain the same to
accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the
interface to the coupler will also change. Second, the linewidth required for 50Ω will be different and this will introduce
a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will
affect the performance of the part. To achieve the specified performance, serious attention must be given to the
design and layout of the circuit environment in which this component will be used.
If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance
that is present on the Anaren RO4003 test board. When thinner circuit board material is used, the ground plane will
be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric
constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases,
narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will
compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used,
the interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line
before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will
match the performance of the Anaren test board.
Notice that the board layout shown below is the same for all 0805 “J” size 2dB, 3dB, 4dB, 5dB, 3dB couplers.
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Rev C
Testing Sample Parts Supplied on Anaren Test Boards
If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the
loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and
Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss
of the coupler. An S-parameter file for a “Thru” board (see description of “Thru” board above) will be supplied upon
request. As a first order approximation, one should consider the following loss estimates:
Frequency Band
Avg. Ins. Loss of Test Board @ 25°C
869-894 MHz
~0.195 dB
925-960 MHz
~0.208 dB
1805-1880 MHz
~0.358 dB
1930-1990 MHz
~0.376 dB
2110-2170 MHz
~0.406 dB
2200-2400 MHz
~0.439 dB
2500-2700 MHz
~0.481 dB
2800-3000 MHz
~0.506 dB
3000-3500 MHz
~0.549 dB
3500-4000 MHz
~0.581 dB
4000-6000 MHz
~0.757 dB
6000-8000 MHz
~0.943 dB
It is important to note that the loss of the test board will change with temperature and must be considered if the
coupler is to be evaluated at other temperatures.
Peak Power Handling
High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown voltage of 1Kv
(minimum recorded value). This voltage level corresponds to a breakdown resistance capable of handling at least
12dB peaks over average power levels, for very short durations. The breakdown location consistently occurred across
the pads and the ground bar (see illustration below). The breakdown levels at these points will be affected by any
contamination in the gap area around these pads. These areas must be kept clean for optimum performance. It is
recommended that the user test for voltage breakdown under the maximum operating conditions and over worst case
modulation induced power peaking. This evaluation should also include extreme environmental conditions (such as
high humidity).
Breakdown Area
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Test Plan
Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested at room
temperature.
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
• Internal circuit temperature.
• Unit mounting interface temperature.
• Unit thermal resistance
• Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
• The unit has reached a steady state operating condition.
• Maximum mounting interface temperature is 105oC.
• Conduction Heat Transfer through the mounting interface.
• No Convection Heat Transfer.
• No Radiation Heat Transfer.
• The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
• Unit material stack-up.
• Material properties.
• Circuit geometry.
• Mounting interface temperature.
• Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta (∆T) divided by thermal resistance (R). The
dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss
(ILtherm):
)(101 10 WP
R
T
P
therm
IL
indis
−⋅=
∆
=
−
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
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Rev C
Figure 1
The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are
no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is
returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the
power at the coupled port, and Pout(DC) is the power at the direct port.
At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and
direct ports:
Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a
negative number. Obviously, a mere sign change equates the two quantities.
)dB(
PP
P
log10IL
)DC(out)CPL(out
in
10
+
⋅=
(2)
In terms of S-parameters, IL can be computed as follows:
)dB(SSlog10IL
2
41
2
3110
+⋅−=
(3)
We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the
isolated port.
For thermal calculations, we are only interested in the power lost “inside” the coupler. Since Pout(RL) is lost in the
source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for
thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:
)(log10
)()()()(
10
dB
PPPP
P
IL
RLoutISOoutDCoutCPLout
in
therm
+++
⋅=
(4)
In terms of S-parameters, ILtherm can be computed as follows:
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)(log10
2
41
2
31
2
21
2
1110
dBSSSSIL
therm
+++⋅−=
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (Pin) therefore is:
)(
101
101
1010
W
R
T
P
P
thermtherm ILIL
dis
in
−
∆
=
−
=
−−
(6)
Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):
)( CT
TT o
mnt
circ −
=∆
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
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Rev C
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
Overall ground is improved if a de
nse population of
plated through holes connect the top and bottom ground
layers of the PCB.
This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and Hybrid couplers are constructed from ceramic filled
PTFE composites, which possess excellent electrical and
mechanical stability.
When a surface mount coupler is mounted to a printed
circuit board, the primary concerns are; ensuring the RF
pads of the device are in contact with the circuit trace of
the PCB and insuring th
e ground plane of neither the
component nor the PCB is in contact with the RF signal.
Mounting Footprint
Dimensions are in Millimeters
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
2. This process is conducive to both low and high volume
usage.
Figure 2: Surface Mounting Process Steps
Storage of Components: The Xinger
products are
available in an ENIG finish. IPC storage conditions used
to control oxidation should be followed for these surface
mount components.
Substrate:
Depending upon the particular component,
the circuit material has a coefficient of thermal expansion
(CTE) similar to commonly used board substrates such
as RF35, RO4003, FR4, polyimide and G-10 materials.
The similarity in CTE minimizes solder joint stresses due
to similar expansion rates between component and
board. Mounting to “hard” substrates (alumina etc.) is
possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with an ENIG.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger
surface mount
components. Solder paste can be applied with stencils or
syringe dispens
ers. An example of a stenciled solder
paste deposit is shown in Figure 3. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
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Rev C
Figure 3: Solder Paste Application
Component Positioning:
The surface mount
component can be placed manually or with automatic
pick and place mechanisms. Couplers should be
placed (see Figure 4 and 5
) onto wet paste with
common surface mount techniques and parameters.
Pick and place systems must supply adequate vacuum
to hold a 0.01 gram coupler.
Figure 4: Component Placement
Figure 5: Mounting Features Example
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 6
and 7, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-
heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
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Rev C
Figure 6 – Low Temperature Solder Reflow Thermal Profile
Figure 7 – High Temperature Solder Reflow Thermal Profile
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Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-D. Parts are oriented in tape and reel as shown below.
Minimum order quantities are 4000 per reel.
3.50
8.00
2.41
1.75
.25
1.00
4.00
2.00
1.60 4.00