IRMS 6100 TOP VIEW IRMT6100 SIDE VIEW 1.15 Mb/s IrDT Data Transceiver Preliminary Dimensions in inches (mm) E PIN 1 D E=Emitter D=Detector C .116 L .106 (2.95) (2.70) D E .157 (4.00) PIN 1 .190 (4.83) .138 (3.50) .374 (9.86) DESCRIPTION IRMS6100 IRMT6100 FEATURES * * * * * * * * * Fully Compliant with IrDA Specification IrDA Data Rates 9.6 Kb/s to 1.152 Mb/s High Immunity to Fluorescent Light Noise Battery & Power Management Features: - Receive - 470 A Typical - Shutdown - 10 nA Typical - Programmable 500 mA/50 mA LED Transmitter for Standard 1.0 m or Low Power (30 cm) Operation - Independent LED Anode Supply - up to 9.0 V DC - Wide Voltage Range 2.7 V to 5.5 V Full Specification - High VCC Noise Rejection >100 mVP-P Shutdown Tri-States Receiver Output and Disables TxD allowing Bus Interfacing Integrated Protection for Eye Safety-- AC Coupled Transmit Input High DC Ambient Rejection--Operates Outdoors Receiver Latency Less <100 s Slimline Package: H 4.0 mm x D 4.8 mm x L 9.8 mm IRMS6100/IRMT6100 is an IrDA compliant 1.152 Mb/s infrared data transceiver. Its external Shut Down (SD) feature cuts current consumption to typically less than 0.01 A. The Shut Down (SD) mode disables the transmit input and tri-states the receiver output with a 500 k pull up. The transmit input is AC coupled, limiting transmit pulse duration to 70 s, preventing transmitter damage and continuous LED output which also provides protection for eye safety. Selectable LED transmit power (Pin 7) makes it easy for designers to use standard power mode (Pin 7=H) for 1 meter link or low power mode (Pin7=L) for 20 cm link. Absolute Maximum Ratings, TA=25C (except where noted) Supply Voltage Range, all states, VCC ................................ -0.5 to +7.0 V LED Anode Voltage, VCC=0 to 5.5 V, not transmitting, VLEDA ......................... -0.5 to +9.0 V LED Anode Voltage, VCC=2.7 to 5.5 V, transmitting, VLEDA ..................... -0.5 to VCC +4.0 V Input Current, ICC during transmit, VCC=5.0 V, TxD=VCC (peak)........................ 20 mA Output RxD Current ....................................................................... 50 mA Storage Temperature, storage or reduced performance, TS ............................. -40 to +100C Ambient Temperature, operating, TA .....................................-25 to 85C Lead Solder Temperature, 230C.....................................................<10 s IC Junction Temperature, TJ ........................................................... 125C Average IR LED Current, LED Anode=3.3 V, ILED ........................ 100 mA Repetitive Pulsed IR LED Current, <10 s, ton <20%, LED Anode=3.3 V, ILED(RP) ......................... 600 mA Input Voltage: TxD, SD................................................. -0.5 to VCC+0.5 V RxD Voltage ................................................................ -0.5 to VCC +0.5 V Table 1. Pin Functions Pin no. Function Pin no. Function 1 IR LEDA 5 SD 2 IR LEDC 6 VCC 3 TxD 7 LED Power Select 4 RxD 8 GND 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) 4-40 March 22, 2001-15 Figure 1. Block Diagram VCC Photodiode Lowpass Filter Preamp Receive Detector Main AMP VCC VCC Tri-State CMOS Buffer Pin 6 500 k RxD + Pin 4 Receiver Output + Ambient DC Cancelling AGC Tri-State Control Detector Reference Receive Ouput Blanking AGC & Signal Reference Processor Regulated Voltage & Current Sources Power Down Pin 5 VCC Power Select Tx Blanking Tx Input Buffer TxD Pin 3 GND Pin 8 SD Pin 7 LED Anode Pin 1 Switched current source VCC Tx In Transmit IR LED 500 k LED Cathode Pin 2 Current Limited Driver Error AMP Theory of Operation The IRMS6100/IRMT6100 Slimline--Infrared Data Transceiver consists of a detector photodiode, an IR LED transmitter, an IC containing ambient light suppressor and Automatic Gain control circuitry (AGC). Table 2. Slimline Truth Table Inputs Outputs SD TxD detector RxD LED at The ambient light suppressor can cancel up to 10 5.0 V. This will typically allow operation in all but direct sunlight. High X=don't care state X=don't care state 500 k pull-up Off The receiver automatic gain control (AGC) circuit normalizes pulse width despite 120 dB signal range. The AGC also improves noise immunity while receiving a transmission by reducing gain so that noise less than 1/2 the peak signal height will not be detected. Low High Undefined On <0.4 W/cm (115 Kb/s) <1 W/cm2 (1 Mb/s) High Off >4 W/cm2 (115 Kb/s) >10 W/cm2 (1 Mb/s) Low mW/cm2 Asserting shutdown powers down the transceiver, and for bus multiplexing, tri-states the receiver output and disables TxD input. In receive mode, the receiver output (RxD) which normally stays high, will go low for duration of the receive pulses. It is a push-pull CMOS driver capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. Low 2 The transmitter current limit is programmed to the high or low value by the state of Power Selection pin. If Power Select is low, low drive current limit is set. If the Power Select is high, high drive current limit is set. In transmit mode, by asserting the TxD pin above 1.4 V will turn on IR LED transmitter. This pin has a 500 k pulldown. At the LED Anode (pin 1) connect this pin to VCC or unregulated power supply (not to exceed VCC +4.0 V), through a resistor to set the proper LED current to reduce the thermal dissipation and to lower LED current. 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) IRMS6100/IRMT6100 4-41 March 22, 2001-15 ELECTRICAL CHARACTERISTICS Table 3. Basic Operating Parameters, TA=25C (except where noted) Parameter Symbol Min. Typ. Max. Unit Conditions Supported IrDA Data Rate -- 9.6 -- 1152 Kb/s 3/16 clock period or 1/4 clock >115 Kb/s VCC Voltage VCC 2.7 -- 5.5 V 0 to 70C VCC to VSS Maximum LED Anode Voltage VLEDA -- -- VCC+4 V VCC=1.5 V to 5.5 V ICC Shut Down Current (Note 1) ICC1 -- 0.01 1.0 A SD=VCC VCC=2.7 V to 5.5 V ICC Standby Current ICC2 375 470 585 A SD=0 VCC=2.7 V to 5.0 V no signal ICC Receiving Current ICC3 -- 650 -- A 4.0 W/cm2 576 Kb/s 15 pF load ICC Transmitting Current, Saturated Driver (Average) ICC4 -- 3.0 4.5 mA VCC=5.0, LED I=400 mA Table 4. I/O Parameters Parameter Symbol Min. Typ. Max. Unit Conditions TxD, SD input capacitance -- -- 5.0 -- pF VCC=2.7 V to 5.5 V TxD Resistance -- 350 500 650 k TxD=VCC VCC=2.7 V to 5.5 V TxD, SD Input Threshold (Note 1) -- 0.8 1.4 2.0 V VCC=2.7 V to 5.0 V SD to RxD Tri-State -- -- 35 100 ns VCC=2.7 V to 5.0 V SD to RxD Enable -- -- 90 200 ns VCC=2.7 V to 5.0 V RxD Output High VIH 4.3 4.6 -- V VCC=5.0 V Ioh=8.0 mA RxD Output High VIH 1.5 1.7 -- V VCC=2.7 V Ioh=2.0 mA RxD Output Low VIL -- 0.22 0.4 V VCC=5.0 V Iol=8.0 mA RxD Output Low VIL -- 0.17 0.3 V VCC=2.7 V Iol=2.0 mA RxD Short Circuit -- -- 40 -- mA VCC=5.0 V RxD=0 RxD=VCC RxD Short Circuit -- -- 8.0 -- mA VCC=2.7 V RxD=0 RxD=VCC RxD to VCC Tri-State Impedance -- 350 500 650 k SD=VCC VCC=2.0 V to 5.0 V between RxD to VCC RxD Rise/Fall Time -- 12 18 27 ns VCC=5.0 V Load=15 pF RxD Rise/Fall Time -- 20 30 40 ns VCC=5.0 V Load=50 pF RxD Rise/Fall Time -- 24 36 55 ns VCC=2.7 V Load=15 pF RxD Rise/Fall Time -- 42 63 94 ns VCC=2.7 V Load=50 pF Table 5. Receiver Parameters, TA=25C (except where noted) Parameter Symbol Min. Typ. Max. Unit Conditions Maximum Data Rate -- -- 1.15 -- Mb/s 200 ns 4.0 W/cm2 to 500 mW/cm2 Receive 1/2 Angle -- 15 -- -- degrees IrDA Physical Layer specification 2 Bit error Rate=10-8 217 ns pulse Minimum Signal Detect Irradiance EIHmin -- 5.0 10 W/cm Maximum Signal Detect Irradiance EEmax 500 1000 -- mW/cm2 Bit error Rate=10-8 217 ns pulse Maximum Signal Irradiance No detect -- -- -- 0.3 W/cm2 Maximum DC Ambient Irradiance 5.0 V -- -- 30 -- mW/cm2 VCC=5.0 V Maximum DC Ambient Irradiance 2.7 V -- -- 10 -- mW/cm2 VCC=2.7 V AGC Attack Time (Note 2) -- -- 300 1000 s 4.0 W/cm2 to 500 mW/cm2 AGC Settling (Note 3) -- -- 2.0 5.0 pulse 4.0 W/cm2 to 500 mW/cm2 217ns pulse 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) < 0.1 pulse per second detect, 20 kHz to 200 kHz square wave <100 ns rise/fall IRMS6100/IRMT6100 4-42 March 22, 2001-15 Table 5. Receiver Parameters (continued) AGC Decay Rate (Note 5) -- -- 44 -- dB/ms Following AGC settling at 500 mW/cm2 Transmit Receiver Latency (Note 4) tL -- 50 100 s 0 to 3.0 mW/cm2 DC ambient input RxD Suppression Duration (Note 7) -- -- 50 100 s Following end of TxD pulse Powerup Receiver Latency -- -- 50 100 s 0 to 2.5 mW/cm2 DC ambient input First Pulse Width at RxD (Note 8) -- 150 500 900 ns 217 ns 4.0 W/cm2 to 500 mW/cm2 input Subsequent Pulse Width at RxD (Note 8) -- 150 217 400 ns 217 ns 4.0 W/cm2 to 500 mW/cm2 input Small Ripple Power Supply Rejection (Note 6) -- 50 100 -- mV/s 100 mVP-P triangle wave on VCC Large Ripple Power Supply Rejection (Note 6) -- 100 200 -- mV/ms 1.0 VP-P triangle wave on VCC Parameter Symbol Min. Typ. Max. Unit Conditions Maximum Data Rate -- -- 1.1 -- Mb/s TxD pulse width=125 ns TxD Radiant Intensity, Tx Mode High -- 100 170 500 mW/Sr VCC=5.0 V LEDA=3.3 V Tx High 10% duty cycle TxD Radiant Intensity, Tx Mode High -- 100 150 500 mW/Sr VCC=2.7 V LEDA=3.3 V Tx High 10% duty cycle TxD Radiant Intensity, Tx Mode High -- -- 50 -- mW/Sr LEDA=1.8 V 10% duty cycle TxD Radiant Intensity, Tx Mode Low -- -- 18 -- mW/Sr LEDA=3.3 V Tx Low 10% duty cycle TxD Radiant Intensity, Tx Mode Low -- -- 16 -- mW/Sr LEDA=2.7 V Tx Low 10% duty cycle TxD 1/2 Angle -- 15 20 30 degrees IrDA Physical Layer specification TxD Peak Wavelength -- 850 870 900 nm IF=500 mA ILED Limit, Tx High -- 385 500 650 mA TxD=VCC LED anode=3.3 V VCC=2.7 to 5.0 V ILED Limit, Tx Low -- 40 50 70 mA TxD=VCC LED anode=3.3 V VCC=2.7 to 5.0 V ILED Limit Tempco -- -- +0.47 -- %/C TxD=VCC LED anode=3.3 V VCC=2.7 to 5.0 V LED Tempco -- -- -0.5 -- %/C ILED=500 mA LED Cathode Saturation Drop -- -- 0.3 0.4 V 300 mA, VCC=2.7 TxD VCC dV/dt Rejection -- -- 5.0 -- V/s dV/dt for less than 20% change in TxD output Table 6. Transmitter Output Note 1: For Shut Down (SD) current to fall below 1.0 A requires driving Shut Down (SD) to within 0.5 V of VCC to ensure cutoff of the PMOS transistor of the input CMOS totem pole. In most applications this is not an issue if Shut Down (SD) is driven from a CMOS driver supplied from the same voltage supply. Note 2: "AGC Attack Time" is the time required for internal AGC (Automatic Gain Control) attenuation to rise to within 10% of final value. Note 3: "AGC Settling" is the number of pulses within 100 s required for the output pulse width to settle to 90% of its final value. Note 4: "Near-far Receiver Latency" is the time required for the AGC and ambient correction circuits to return to maximum sensitivity (Far) following reception of a maximum (Near) signal or a change in ambient. "Transmit Receiver Latency" is commonly called "Receiver Latency" or "Transmitter Turnaround Time". Note 5: "AGC Decay Rate" is the rate at which the receiver gain increases following the cessation of signal input. Note 6: The receiver VCC power supply rejection is significantly better for small ripple of less than 100 mVP-P than for larger values. For ripple of more than 100 mVP-P internal circuits can maintain operating headroom provided that the slew rate is significantly slower. Typically, these specifications allow operation without an external filter from either switching supplies with less than 50 mV P-P ripple or unregulated supplies with less than 1.0 V P-P of 120 Hz ripple. Note 7: RxD is suppressed (forced high) while (TxD) transmit pulse is active and for the indicated period following the end of the TxD pulse. Note 8: "First Pulse Width" specifies the width of the first pulse received after AGC has decayed to maximum sensitivity. "Subsequent Pulse Width" defines the width of subsequent pulses received within 100 s of first pulse. 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) IRMS6100/IRMT6100 4-43 March 22, 2001-15 Tx Power Mode Selection Figure 3. Output Schematics The IRMS6100/IRMT6100 initializes in the standard Tx Power Mode upon power-up. To select Low Tx Power mode simply tie Power Select pin low (Gnd). V CC 500 k pullup Table 7. External Component Parameter V CC Values Unit 2 VLED power supply 2.7 3.0 3.5 4.0 4.5 5.0 V Resistor (R0) 0 0 1.5 2.7 3.9 5.1 0 V CC V CC V CC Figure 2. Input Schematics RxD V CC TxD V CC A current limiting resistor should be used between the LED anode and VCC (see Table 7 for recommended values). V CC SD Figure 4. Infrared Reflow Soldering Profile 300 Maximum 240(+5/- 0) C 250 Temperature (C) 210C 200 150 30 s minimum 100 50 30 s maximum 60 s minimum 0 0 50 100 Time (sec) 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) 150 IRMS6100/IRMT6100 4-44 March 22, 2001-15 INTERFACE DIAGRAM Figure 5. Super I/O (PC87108AVJE) to IRMS6100/IRMT6100 VCC 0.1 F 22 F R0 6 VCC 50 VCC IR TxD 3 65 1 LED Anode TxD IRMX6100 PC87338VLJ IR RxD IR SLO VSS GND 4 67 RxD SD GND 5 8 68 42 Figure 6. With Independent VLED Power Supply VLED VCC R0 C3=0.1 F 1 6 VCC LED Anode C1=0.1 F C2=10 F 50 VCC IR TxD 65 3 TxD IRMX6100 PC87338VLJ 67 4 RxD IR SLO 68 SD 5 IR RxD GND VSS 42 C4=22 F 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) GND 8 IRMS6100/IRMT6100 4-45 March 22, 2001-15 ORDERING INFORMATION Part Number Figure 8. Reel Dimensions in Inches (mm) Description PCB Mounting Orientation Matte finish these areas IRMS6100 Integrated Packaged in Transceiver Component Carrier Reel --Side View (1000/reel) for Side View Mounting on PCB Packaged in Component Carrier Reel (1000/reel) for Top View Mounting on PCB X IRMT6100 Integrated Transceiver --Top View Detail A 12.97 (330.0) Ref. 4.01 (102.0) Ref. 0.512+0.020 0.79 - 0 .0 0 8 (20.2) Min. 0.5 13.0 + - 0.2 0.0790.020 (2.0 0.5) Tape Leader and Trailer is 400 mm minimum. See detail A W1 (Measured at hub) W2 (Measured at hub) 16.4 mm (+2 mm/-0 mm) 22.4 mm (Max) Figure 7. Tape dimensions in Inches (mm) .315.004 (8.00.10) .059+.004 (1.50+.10) .079.004 (2.00.10) .157.004 (4.000.10) .069.004 (1.75.010) 4 Max. .295.004 (7.500.10) .401.004 Bo (10.19.10) .630 +.012 -.004 16.0 +.30 -.10 Pin 1 IRMT6100 (top view) 1.50+.25 (.059+.010) (.199.004) 5.06.10 Ko .0140.0005 (.356.013) Feed direction 8 Max. (.167.004) Ao 4.23.10 .315.004 (8.00.10) .059+.004 (1.50+.10) .079.004 (2.00.10) .157.004 (4.000.10) .069.004 (1.75.010) .295.004 (7.500.10) .630 +.012 -.004 16.0 +.30 -.10 4 Max. .216 (5.48) .400.004 Bo (10.16.10) Pin 1 IRMS6100 (side view) 1.50+.25 (.059+.010) .156 (3.97) Feed direction .0130.0005 (.330.013) (.167.004) 4.23.10 Ko 8 Max. .185.004 Ao (4.70.10) 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) IRMS6100/IRMT6100 4-46 March 22, 2001-15 Figure 9. IRMS6100/IRMT6100 Detail Drawings With Optional Side View or Top View Mounting .197 (5.00) .333 (7.71) 1 2 3 4 5 6 7 8 1" Draft pick and place .165 (4.20) .079 (2.00) .053 (1.35) .167 .051 (4.23) (1.30) .004 (.10) .028 (.70) Typ. .190 (4.83) .039 (1.00) Typ. Recommended PCB footprint TOP VIEW .065 (1.65) .134 (3.40) .67 (1.70) Front pick and place CL E D .079 (2.00) .012 (.28) 5 4X 5 4X .069 (1.74) .157 (4.00) .051 (1.30) Pin 1 .030 (0.75) .008 (.20) 90 to 93 Coplaner .0059 (0.15) .053 (1.35) .016 (0.40) Typ. .116 (2.95) .106 (2.70) CL .014 (.36) .388 (9.86) Max. Pin 1 1 Draft (2 Plcs) .027 (0.69) .020 .039 (0.51) (1.00) .138 (3.50) 6100RYYWW 5 4X .378 (9.60) (c) Infineon Technologies, Corp., Optoelectronic Division (formerly Siemens Microelectronics, Inc.) Printed in the United States of America. All rights reserved. The information provided is believed to be accurate and reliable. Infineon reserves the right to make changes to the product described without notice. No liability is assumed as a result of its use nor for any infringement of the rights of others. This document may contain preliminary information and is subject to change by Infineon without notice. Some of the parametric data expressed in this preliminary data sheet is considered to be functional by design. Infineon assumes no responsibility or liability for any use of the information contained herein. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Infineon or third parties. The products described in this document are not intended for use in implantation or other direct life support applications where malfunction may result in the direct physical harm or injury to persons. NO WARRANTIES OF ANY KIND, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OF FITNESS FOR A PARTICULAR PURPOSE, ARE OFFERED IN THIS DOCUMENT. 2001 Infineon Technologies Corp. * Optoelectronics Division * San Jose, CA www.infineon.com/opto * 1-888-Infineon (1-888-463-4636) IRMS6100/IRMT6100 4-47 March 22, 2001-15