SMSC USB224x Revision 2.0 (10-14-09)
DATASHEET
Datasheet
PRODUCT FEATURES
USB224x
Ultra Fast USB 2.0 Multi-
Format, SD/MMC, and MS
Flash Media Controllers
General Description
The SMSC USB224x is a USB 2.0 compliant, Hi-Speed
bulk only1 mass storage class peripheral controller intended
for reading and writing to popular flash media from the xD-
Picture CardTM (xD)2, Memory Stick® (MS), Secure Digital
(SD), and MultiMediaCardTM (MMC) families.
The SMSC USB224x is a fully integrated, single chip
solution capable of ultra high performance operation.
Average sustained transfer rates exceeding 35 MB/s are
possible if the media and host can support those rates. The
USB2244/44i includes provisions to read/write secure
media formats.
General Features
Low pin count 36-pin QFN (6x6 mm) lead-free RoHS
compliant package
USB2240/40i/41/41i
— Targeted for applications in which single or "combo"
media sockets are used
Hardware-controlled data flow architecture for all self-
mapped media
Pipelined hardware support for access to non-self-
mapped media
Order number with “i” denote the products that support
the industrial temperature range of -40ºC to 85ºC
Support included for secure media format on a licensed,
customized basis
— USB2244/44i: SD Secure
— USB2242/42i: Sony MagicGateTM
Hardware Features
Single chip flash media controller with
— USB2240/40i/41/4i: multiplexed interface for use with
“combo” card sockets
— USB2242/42i: MS flash media reader/writer
— USB2244/44i: SD/MMC flash media reader/writer
SDIO and MMC Streaming Mode support
Extended configuration options
— xD player mode operation
— Socket switch polarities, etc.
Media Activity LED
GPIO configuration and polarity
— Up to 8 GPIOs for special function use
— One GPIO with up to 200 mA drive
On board 24 MHz crystal driver circuit
Optional external 24 MHz clock input3
Internal card power FET
— 200 mA
— "Fold-back" short circuit protection
8051 8-bit microprocessor
— 60 MHz - single cycle execution
— 64 KB ROM | 14 KB RAM
Supports a single external 3.3 V supply source; internal
regulators provide 1.8 V internal core voltage for
additional bill of materials and power savings
Optimized pinout improves signal routing which eases
implementation for improved signal integrity
Flash Media Specification Compliance
Secure Digital 2.0
— HS-SD, SDHC
— TransFlashTM and reduced form factor media
MultiMediaCard 4.2
— 1/4/8-bit MMC
Memory Stick Formats
— MS 1.43, Pro 1.02, Duo 1.10
— Pro-HG Duo 1.01
– MS, MS Duo, HS-MS, MS Pro-HG, MS Pro
xD-Picture Card 1.2
Software Features
Customizable vendor specific data
Optimized for low latency interrupt handling
Reduced memory footprint
Applications
Flash media card reader/writers
Desktop and mobile PCs
Printers
Consumer A/V and media players/viewers
Compatible with
–Microsoft
® VistaTM and Vista ReadyBoostTM
–Windows
® XP, ME, 2K SP4
– Apple Mac OSx®
– Linux Mass Storage Class Drivers
1.Bulk only is not applicable to USB2240/40i/41/41i.
2.xD-Picture Card is not applicable to USB2241/41i. 3.Only applicable to USB2240/40i/41/41i.
ORDER NUMBERS:
“XX” in the order number indicates the internal ROM firmware revision level.
Please contact your SMSC sales representative for more information.
This product meets the halogen maximum concentration values per IEC61249-2-21
For RoHS compliance and environmental information, please visit www.smsc.com/rohs
ORDER NUMBERS
LEAD-FREE
ROHS
COMPLIANT
PACKAGE
TYPE / SIZE SD/MMC xD
MS/
MS PRO/
MS PRO-HG
OPERATING
TEMPERATURE
USB2240-AEZG-XX
36 QFN
6 x 6 x 0.5 mm
33 3 0ºC to 70ºC
USB2240i-AEZG-XX 33 3 -40ºC to 85ºC
USB2241-AEZG-XX 330ºC to 70ºC
USB2241i-AEZG-XX 33-40ºC to 85ºC
USB2242-AEZG-XX 30ºC to 70ºC
USB2242i-AEZG-XX 3-40ºC to 85ºC
USB2244-AEZG-XX 30ºC to 70ºC
USB2244i-AEZG-XX 3-40ºC to 85ºC
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 2 SMSC USB224x
DATASHEET
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2009 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information
sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is
assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local
SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the
described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional
on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your
order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate
from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life
support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior
written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC
literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered trademark of
Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC makes the following part-numbered device available for purchase only by customers who are xD-Picture Card licensees: USB2240/USB2240i.
By purchasing or ordering any of such devices, Buyer represents, warrants, and agrees that Buyer is a duly licensed Licensee under an xD-Picture CardTM License Agreement
with Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation; and that Buyer will maintain in effect such xD-Picture Card license and will give SMSC
reasonable advance notice of any termination or expiration of such xD-Picture Card license, but in no event less than five days advance notice. SMSC may discontinue making
such devices available for purchase by Buyer and/or discontinue further deliveries of such devices if such xD-Picture Card license shall expire, terminate, or cease to be in
force, or if Buyer is or becomes in default of such xD-Picture Card license.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD
TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 3 Revision 2.0 (10-14-09)
DATASHEET
Table of Contents
Chapter 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2 Acronyms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 3 Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 4 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 5 Pin Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1 USB224x 36-Pin QFN Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Chapter 7 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1 Card Reader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.2 System Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.2.1 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.2.2 EEPROM Data Descriptor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.2.3 EEPROM Data Descriptor Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.2.4 A0h-A7h: Device Power Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.2.5 Device ID Strings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7.3 Default Configuration Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.3.1 External Hardware RESET_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.3.2 USB Bus Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Chapter 8 Pin Reset States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.1 USB2240/40i/41/41i Pin Reset States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.2 USB2242/42i Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.3 USB2244/44i Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Chapter 9 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.1 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.2 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.3 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9.4 Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
9.5 Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Chapter 10 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10.1 Oscillator/Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10.2 Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.3 External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Chapter 11 GPIO Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Chapter 12 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 4 SMSC USB224x
DATASHEET
Table of Contents
Table 5.1 USB2240/2240i 36-Pin QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 5.2 USB2241/2241i 36-Pin QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5.3 USB2242/2242i 36-Pin QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 5.4 USB2244/2244i 36-Pin QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 6.1 USB224x 36-PiN QFN Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 6.2 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 7.1 Internal Flash Media Controller Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 7.2 RESET_N Timing for EEPROM Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 8.1 Legend for Pin Reset States Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 8.2 USB2240/40i/41/41i 36-Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 8.3 USB2242/42i 36-Pin Reset States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 8.4 USB2244/USB2244i 36-Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 9.1 Pin Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 9.2 36-Pin QFN Package Thermal Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 10.1 Crystal Circuit Legend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 11.1 USB2240/40i and USB2241/41i GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 11.2 USB2242/42i GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 11.3 USB2244/44i GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 12.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 5 Revision 2.0 (10-14-09)
DATASHEET
List of Figures
Figure 3.1 USB2240/40i/41/41i Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3.2 USB2242/42i Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3.3 USB2244/44i Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4.1 USB2240/USB2240i 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4.2 USB2241/USB2241i 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4.3 USB2242/USB2242i 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 4.4 USB2244/USB2244i 36-Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7.1 RESET_N Timing for EEPROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 8.1 Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 9.1 Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 10.1 Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 10.2 Capacitance Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 10.3 Ceramic Resonator Usage with SMSC IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 12.1 USB224x 36-QFN, 6x6 mm Body, 0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 12.2 Additional Package Information and Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 6 SMSC USB224x
DATASHEET
Chapter 1 Overview
The SMSC USB224x is a flash media card reader solution fully compliant with the USB 2.0
specification. All required resistors on the USB ports are integrated into the device. This includes all
series termination resistors on D+ and D– pins and all required pull-down and pull-up resistors. The
over-current sense inputs for the downstream facing ports have internal pull-up resistors.
Hardware Features
Single chip flash media controller in low pin count 36-pin QFN, lead-free RoHS compliant package
Commercial temperature products support 0°C to +70°C: USB2240/41, USB2242 and USB2244
Industrial temperature products support -40°C to +85°C: USB2240i/41i, USB2242i and USB2244i
Up to 8 GPIOs
- Configuration and polarity for special function use such as LED indicators, button inputs, and
power control to memory devices
- The number of actual GPIOs depends on the implementation configuration used
One GPIO available with up to 200 mA drive and “fold-back” short circuit protection
8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM |14 KB RAM
Supports a single external 3.3 V supply source; internal regulators provide 1.8 V internal core
voltage for additional bill of materials and power savings
Compliance with the following flash media card specifications:
Secure Digital 2.0
- HS-SD and SDHC
- TransFlash™ and reduced form factor media
MultiMediaCard 4.2
- 1/4/8 bit MMC
Memory Stick 1.43
Memory Stick Pro Format 1.02
Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
Memory Stick Duo 1.10
xD-Picture Card 1.2
Software Features
If the OEM is using an external EEPROM, the following features are available:
- Customizable vendor, product, language, and device ID’s
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
- LED blink interval or duration
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 7 Revision 2.0 (10-14-09)
DATASHEET
Chapter 2 Acronyms
ATA: Advanced Technology Attachment
FET: Field Effect Transistor
LUN: Logical Unit Number
MMC: MultiMediaCard1
MSC: Memory Stick Controller2
PLL: Phase-Locked Loop
QFN: Quad Flat No leads
RoHS: Restriction of Hazardous Substances Directive
RXD: Received eXchange Data
SDIO: Secure Digital Input/Output
SDC: Secure Digital Controller
SIE: Serial Interface Engine
TXD: Transmit eXchange Data
UART: Universal Asynchronous Receiver-Transmitter
UCHAR: Unsigned Character
UINT: Unsigned Integer
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made
the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other
intellectual property rights from or through various persons or entities, including without limitation media standard companies,
forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations
include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia
Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji
Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses
or technical information available; does not promise or represent that any such licenses or technical information will actually be
obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or
with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or
otherwise with respect to, any such technical information. SMSC's obligations (if any) under the Terms of Sale Agreement, or any
other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligations to defend
or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document
or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement
or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications
("Solid State Disk Patents"). By making any purchase of any of the devices made the subject of this document, the customer
represents, warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the
manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost
or expense to SMSC all necessary licenses under Solid State Disk Patents; that the manufacture and testing by or for SMSC of
the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by SMSC of
such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that SMSC
shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or
sale of such units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having
obtained rights or licenses under any Solid State Disk Patents.
SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER
VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES
AGAINST INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask
work right, trade secret, or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of
these Software License Agreements may be obtained by contacting SMSC.
1.MMC, SDIO, and SDC are not applicable to USB2242/42i.
2.Not applicable to USB2244/44i.
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 8 SMSC USB224x
DATASHEET
Chapter 3 Block Diagrams
Figure 3.1 USB2240/40i/41/41i Block Diagram
FMDU
CTL
8051
PROCESSOR
SFR
RAM
MS
RAM
USB
Host
AUTO_CBW
PROC
PHY
FMI
XDATA BRIDGE
+ BUS ARBITER
BUS
INTFC
BUS
INTFC
BUS
INTFC
EP0 TX
EP0 RX
EP2 TX
EP2 RX
EP1 RX
EP1 TX
ROM
64 KB
RAM
10 KB ADDR
MAP
PWR_FET1
8 pins
GPIO10 / CRD_PWR
Clock
Generation and
Control
SD/
MMC
4K
total
GPIOs
Program Memory I/O Bus
3.3 V
1.8 V Reg
VDD18
3.3 V
VDD18PLL
PLL
24 MHz
Crystal
SIE
CTL
1.8 V Reg
USB2240 / 40i
USB2241 / 41i*
xD*
Multiplexed
Interface
NOTE: xD-Picture Card is not applicable to USB2241/41i.
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 9 Revision 2.0 (10-14-09)
DATASHEET
Figure 3.2 USB2242/42i Block Diagram
FMDU
CTL
8051
PROCESSOR
SFR
RAM
MS
RAM
USB
Host
AUTO_CBW
PROC
PHY
FMI
XDATA BRIDGE
+ BUS ARBITER
BUS
INTFC
BUS
INTFC
BUS
INTFC
EP0 TX
EP0 RX
EP2 TX
EP2 RX
EP1 RX
EP1 TX
ROM
64 KB
RAM
10 KB ADDR
MAP
PWR_FET1
7 pins
GPIO10 / CRD_PWR
Clock
Generation and
Control
4K
total
GPIOs
Program Memory I/O Bus
3.3 V
1.8 V Reg
VDD18
3.3 V
VDD18PLL
PLL
24 MHz
Crystal
SIE
CTL
1.8 V Reg
USB2242 / USB2242i
Media
Interface
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 10 SMSC USB224x
DATASHEET
Figure 3.3 USB2244/44i Block Diagram
FMDU
CTL
8051
PROCESSOR
SFR
RAM
SD/
MMC
RAM
USB
Host
AUTO_CBW
PROC
PHY
FMI
XDATA BRIDGE
+ BUS ARBITER
BUS
INTFC
BUS
INTFC
BUS
INTFC
EP0 TX
EP0 RX
EP2 TX
EP2 RX
EP1 RX
EP1 TX
ROM
64 KB
RAM
10 KB ADDR
MAP
PWR_FET1
7 pins
GPIO10 / CRD_PWR
Clock
Generation and
Control
4K
total
GPIOs
Program Memory I/O Bus
3.3 V
1.8 V Reg
VDD18
3.3 V
VDD18PLL
PLL
24 MHz
Crystal
SIE
CTL
1.8 V Reg
USB2244 / USB2244i
Media
Interface
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 11 Revision 2.0 (10-14-09)
DATASHEET
Chapter 4 Pin Configurations
Figure 4.1 USB2240/USB2240i 36-Pin QFN Diagram
Ground Pad
(must be connected to VSS)
SMSC
USB2240/2240i
(Top View QFN-36)
Indicates pins on the bottom of the device.
26
xD_D6 / SD_D3 / MS_D3
25
GPIO15 (SD_nCD)
24
xD_D5 / SD_D2
23
GPIO12 (MS_INS)
22 VDD33
21 GPIO10 (CRD_PWR)
20
19
GPIO2 / RXD / SDA
27
18
17
16
15
14
13
12
11
10
28
29
31
32
33
36
35
34
30
1
2
3
4
5
6
7
8
9
TEST
GPIO4
xD_D4 / GPIO6 (SD_WP) / MS_SCLK
GPIO7 / TXD / SCK / MS_SKT_SEL
XTAL2
XTAL1 (CLKIN)
VDD18PLL
RBIAS
VDDA33
GPIO1 (LED)
USB+
USB-
xD_D3 / SD_D1 / MS_D5
xD_D2 / SD_D0 / MS_D4
VDD33
xD_D0 / SD_D6 / MS_D7
xD_nWP / SD_CLK / MS_BS
xD_ALE / SD_D5 / MS_D1
VDD18
xD_nWE
xD_CLE / SD_CMD / MS_D0
xD_nCE
xD_nRE
xD_nB/R
RESET_N
GPIO14 (xD_nCD)
xD_D7 / SD_D4 / MS_D2
xD_D1 / SD_D7 / MS_D6
VDD33
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 12 SMSC USB224x
DATASHEET
Figure 4.2 USB2241/USB2241i 36-Pin QFN Diagram
Ground Pad
(must be connected to VSS)
SMSC
USB2241/2241i
(Top View QFN-36)
Indicates pins on the bottom of the device.
26
SD_D3 / MS_D3
25
GPIO15 (SD_nCD)
24
SD_D2
23
GPIO12 (MS_INS)
22 VDD33
21 GPIO10 (CRD_PWR)
20
19
GPIO2 / RXD / SDA
27
18
17
16
15
14
13
12
11
10
28
29
31
32
33
36
35
34
30
1
2
3
4
5
6
7
8
9
TEST
GPIO4
GPIO6 (SD_WP) / MS_SCLK
GPIO7 / TXD / SCK / MS_SKT_SEL
XTAL2
XTAL1 (CLKIN)
VDD18PLL
RBIAS
VDDA33
GPIO1 (LED)
USB+
USB-
SD_D1 / MS_D5
SD_D0 / MS_D4
VDD33
SD_D6 / MS_D7
SD_CLK / MS_BS
SD_D5 / MS_D1
VDD18
NC
SD_CMD / MS_D0
NC
NC
NC
RESET_N
GPIO14
SD_D4 / MS_D2
SD_D7 / MS_D6
VDD33
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 13 Revision 2.0 (10-14-09)
DATASHEET
Figure 4.3 USB2242/USB2242i 36-Pin QFN Diagram
Ground Pad
(must be connected to VSS)
SMSC
USB2242/2242i
(Top View QFN-36)
Indicates pins on the bottom of the device.
26
MS_D3
25
GPIO15
24
NC
23
GPIO12 (MS_INS)
22 VDD33
21 GPIO10 (CRD_PWR)
20
19
GPIO2 / RXD / SDA
27
18
17
16
15
14
13
12
11
10
28
29
31
32
33
36
35
34
30
1
2
3
4
5
6
7
8
9
TEST
GPIO4
MS _SCLK
GPIO7 / TXD / SCK / MS_SKT_SEL
XTAL2
XTAL1 (CLKIN)
VDD18PLL
RBIAS
VDDA33
GPIO1 (LED)
USB+
USB-
MS_D5
MS_D4
VDD33
MS_D7
MS_BS
MS_D1
VDD18
NC
MS_D0
NC
NC
NC
RESET_N
GPIO14
MS_D2
MS_D6
VDD33
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 14 SMSC USB224x
DATASHEET
Figure 4.4 USB2244/USB2244i 36-Pin QFN Diagram
Ground Pad
(must be connected to VSS)
SMSC
USB2244/2244i
(Top View QFN-36)
Indicates pins on the bottom of the device.
26
SD_D3
25
GPIO15 (SD_nCD)
24
SD_D2
23
GPIO12
22 VDD33
21 GPIO10 (CRD_PWR)
20
19
GPIO2 / RXD / SDA
27
18
17
16
15
14
13
12
11
10
28
29
31
32
33
36
35
34
30
1
2
3
4
5
6
7
8
9
TEST
GPIO4
SD _WP
GPIO7 / TXD / SCK
XTAL2
XTAL1 (CLKIN)
VDD18PLL
RBIAS
VDDA33
GPIO1 (LED)
USB+
USB-
SD_D1
SD_D0
VDD33
SD_D6
SD_CLK
SD_D5
VDD18
NC
SD_CMD
NC
NC
NC
RESET_N
GPIO14
SD_D4
SD_D7
VDD33
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 15 Revision 2.0 (10-14-09)
DATASHEET
Chapter 5 Pin Tables
Table 5.1 USB2240/2240i 36-Pin QFN Package
xD/SD/MS INTERFACE (18 PINS)
xD_D3 /
SD_D1 /
MS_D5
xD_D2 /
SD_D0 /
MS_D4
xD_D1 /
SD_D7 /
MS_D6
xD_D0 /
SD_D6 /
MS_D7
xD_nWP /
SD_CLK /
MS_BS
xD_ALE /
SD_D5 /
MS_D1
xD_CLE /
SD_CMD /
MS_D0
xD_D7 /
SD_D4 /
MS_D2
xD_D6 /
SD_D3 /
MS_D3
xD_D5 / SD_D2 xD_nRE xD_nWE
xD_D4 /
GPIO6
(SD_WP) /
MS_SCLK
xD_nB/R xD_nCE GPIO12 (MS_INS)
GPIO14 (xD_nCD) GPIO15 (SD_nCD)
USB INTERFACE (5 PINS)
USB+ USB- XTAL1 (CLKIN) XTAL2
RBIAS
MISC (7 Pins)
GPIO1 (LED)
GPIO2 /
RXD /
SDA
GPIO4
GPIO7 /
TXD /
SCK /
MS_SKT_SEL
GPIO10 (CRD_PWR) TEST RESET_N
DIGITAL, POWER (6 PINS)
(3) VDD33 VDDA33 VDD18 VDD18PLL
TOTAL 36
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 16 SMSC USB224x
DATASHEET
Table 5.2 USB2241/2241i 36-Pin QFN Package
SD/MS INTERFACE (14 PINS)
SD_D1 /
MS_D5
SD_D0 /
MS_D4
SD_D7 /
MS_D6
SD_D6 /
MS_D7
SD_CLK /
MS_BS
SD_D5 /
MS_D1
SD_CMD /
MS_D0
SD_D4 /
MS_D2
SD_D3 /
MS_D3 SD_D2
GPIO6
(SD_WP) /
MS_SCLK
GPIO12 (MS_INS)
GPIO14 GPIO15 (SD_nCD)
USB INTERFACE (5 PINS)
USB+ USB- XTAL1 (CLKIN) XTAL2
RBIAS
MISC (11 Pins)
GPIO1 (LED)
GPIO2 /
RXD /
SDA
GPIO4
GPIO7 /
TXD /
SCK /
MS_SKT_SEL
GPIO10 (CRD_PWR) TEST RESET_N (4) NC
DIGITAL, POWER (6 PINS)
(3) VDD33 VDDA33 VDD18 VDD18PLL
TOTAL 36
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 17 Revision 2.0 (10-14-09)
DATASHEET
Table 5.3 USB2242/2242i 36-Pin QFN Package
MS INTERFACE (11 PINS)
MS_D0 MS_D1 MS_D2 MS_D3
MS_D4 MS_D5 MS_D6 MS_D7
MS_BS MS_SCLK GPIO12 (MS_INS)
USB INTERFACE (5 PINS)
USB+ USB- XTAL1 (CLKIN) XTAL2
RBIAS
MISC (14 PINS)
GPIO1 (LED)
GPIO2 /
RXD /
SDA
GPIO4
GPIO7 /
TXD /
SCK /
MS_SKT_SEL
GPIO10 (CRD_PWR) GPIO14 GPIO15 (5) NC
TEST RESET_N
DIGITAL, POWER (6 PINS)
(3) VDD33 VDDA33 VDD18 VDD18PLL
TOTAL 36
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 18 SMSC USB224x
DATASHEET
Table 5.4 USB2244/2244i 36-Pin QFN Package
SD/MMC INTERFACE (12 Pins)
SD_D0 SD_D1 SD_D2 SD_D3
SD_D4 SD_D5 SD_D6 SD_D7
SD_CLK SD_CMD SD_WP GPIO15 (SD_nCD)
USB INTERFACE (5 PINS)
USB+ USB- XTAL1 (CLKIN) XTAL2
RBIAS
MISC (13 PINS)
GPIO1 (LED)
GPIO2 /
RXD /
SDA
GPIO4
GPIO7 /
TXD /
SCK
GPIO10 (CRD_PWR) GPIO12 GPIO14 (4) NC
TEST RESET_N
DIGITAL, POWER (6 PINS)
(3)VDD33 VDDA33 VDD18 VDD18PLL
TOTAL 36
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 19 Revision 2.0 (10-14-09)
DATASHEET
Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional
groups according to their associated interface. The pin descriptions are applied when using the internal
default firmware and can be referenced in Chapter 7, "Pin Configurations," on page 25. Please
reference Chapter 2, "Acronyms," on page 7 for a list of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal
is at a low voltage level. When “n” is not present in the signal name, the signal is asserted at the high
voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working
with a mixture of “active low” and “active high” signals. The term assert, or assertion, indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation, indicates that a signal is inactive.
6.1 USB224x 36-Pin QFN Pin Descriptions
Table 6.1 USB224x 36-PiN QFN Pin Descriptions
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
xD-PICTURE CARD (xD) INTERFACE (APPLIES ONLY TO USB2240/USB2240i)
xD_D[7:0] 20
23
25
30
4
5
7
8
I/O12PD xD Data
These bi-directional data signals have weak internal
pull-down resistors.
xD_nWP 9O12PD xD Write Protect
This pin is an active low write protect signal for the xD
device and has a weak pull-down resistor that is
permanently enabled.
xD_ALE 10 O12PD xD Address Strobe
This pin is an active high Address Latch Enable signal
for the xD device and has a weak pull-down resistor
that is permanently enabled.
xD_CLE 11 O12PD xD Command Strobe
This pin is an active high Command Latch Enable
signal for the xD device and has a weak pull-down
resistor that is permanently enabled.
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 20 SMSC USB224x
DATASHEET
xD_nRE 16 O12PU xD Read Enable
This pin is an active low read strobe signal for the xD
device.
When using the internal FET, this pin has a weak
internal pull-up resistor that is tied to the output of the
internal power FET.
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used).
xD_nWE 12 O12PU xD Write Enable
This pin is an active low write strobe signal for the xD
device.
When using the internal FET, this pin has a weak
internal pull-up resistor that is tied to the output of the
internal power FET.
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used).
xD_nB/R 17 IPU xD Busy or Data Ready
This pin is connected to the BSY/RDY pin of the xD
device.
When using the internal FET, this pin has a weak
internal pull-up resistor that is tied to the output of the
internal power FET.
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used).
GPIO14
(xD_nCD)
19 I/O12 xD Card Detection GPIO
This is a GPIO designated by the default firmware as
the xD-Picture card detection pin.
xD_nCE 15 O12PU xD Chip Enable
This pin is the active low chip enable signal to the xD
device.
When using the internal FET, this pin has a weak
internal pull-up resistor that is tied to the output of the
internal power FET.
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used).
Table 6.1 USB224x 36-PiN QFN Pin Descriptions (continued)
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 21 Revision 2.0 (10-14-09)
DATASHEET
MEMORY STICK (MS) INTERFACE
MS_D[7:0] 8
7
4
5
23
20
10
11
I/O12PD MS System Data In/Out
These pins are the bi-directional data signals for the
MS device. MS_D0, MS_D2, and MS_D3 have weak
pull-down resistors.
In serial mode, the most significant bit (MSB) of each
byte is transmitted first by either MSC or MS device on
MS_D0.
In parallel mode, MS_D1 has a pull-down resistor,
otherwise it is disabled.
In 4- or 8-bit parallel mode, there is a weak pull-down
resistor on all MS_D7 - 0 signals.
MS_BS 9 O12 MS Bus State
This pin is connected to the bus state (BS) pin of the
MS device. It is used to control the bus states 0, 1, 2
and 3 (BS0, BS1, BS2 and BS3) of the MS device.
MS_SCLK 30 O12 MS System CLK
This pin is an output clock signal to the MS device.
The clock frequency is software configurable.
GPIO12
(MS_INS)
24 IPU MS Card Insertion GPIO
This is a GPIO designated by the default firmware as
the Memory Stick card detection pin.
SECURE DIGITAL (SD) / MULTIMEDIACARD (MMC) INTERFACE
SD_D[7:0] 7
8
10
20
23
25
4
5
7
8
10
20
23
25
4
5
I/O12PU SD Data
The pins are bi-directional data signals SD_D0 -
SD_D7 and have weak pull-up resistors.
SD_CLK 9 9 O12 SD Clock
This is an output clock signal to SD/MMC device.
The clock frequency is software configurable.
SD_CMD 11 11 I/O12PU SD Command
This is a bi-directional signal that connects to the CMD
signal of the SD/MMC device and has a weak internal
pull-up resistor.
Table 6.1 USB224x 36-PiN QFN Pin Descriptions (continued)
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 22 SMSC USB224x
DATASHEET
GPIO6
(SD_WP)
30 I/O12 SD Write Protect Detection GPIO
This is a GPIO designated by the default firmware as
the Secure Digital card mechanical write protect
detection pin.
GPIO15
(SD_nCD)
26 I/O12 SD Card Detect GPIO
This is a GPIO designated by the default firmware as
the Secure Digital card detection pin.
USB INTERFACE
USB+
USB-
2
3
I/O-U USB Bus Data
These pins connect to the USB bus data signals.
RBIAS 35 I-R USB Transceiver Bias
A 12.0 kΩ, ±1.0% resistor is attached from VSS to this
pin in order to set the transceiver's internal bias
currents.
XTAL1 (CLKIN) 33 ICLKx 24 MHz Crystal (External clock input)
This pin can be connected to one terminal of the
crystal or can be connected to an external 24 MHz
clock when a crystal is not used.
XTAL2 32 OCLKx 24 MHz Crystal
This is the other terminal of the crystal, or it is left open
when an external clock source is used to drive
XTAL1(CLKIN). It may not be used to drive any
external circuitry other than the crystal circuit.
VDDA33 36 3.3 V Analog Power
VDD18PLL 34 1.8 V PLL Power
+1.8 V Filtered analog power for internal PLL. This pin
must have a 1.0 μF(or greater) ±20% (ESR <0.1 Ω)
capacitor to VSS.
MISC
GPIO1 (LED) 1 I/O12 General Purpose I/O (GPIO): This pin may be used
either as input, edge sensitive interrupt input, or
output. Custom firmware is required to activate this
function.
LED: GPIO1 can be used as an LED output.
Table 6.1 USB224x 36-PiN QFN Pin Descriptions (continued)
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 23 Revision 2.0 (10-14-09)
DATASHEET
GPIO2 /
RXD /
SDA
27 I/O12 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output. Custom firmware is
required to activate this function.
I RXD: This signal can be used as input to the RXD of
UART in the device. Custom firmware is required to
activate this function.
I/O12 SDA: This is the data pin when used with an external
serial EEPROM.
GPIO4 29 I/O12 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output. Custom firmware is
required to activate this function.
For the USB2240/USB2240i only, this pin can be used
as the xD-Picture card detection pin.
GPIO7 /
TXD /
SCK /
MS_SKT_SEL
31 I/O12 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output. Custom firmware is
required to activate this function.
O12 TXD: The GPIO7 can be used as an output TXD of
UART in the device. Custom firmware is required to
activate this function.
O12 SCK: This is the clock output when used with an
external EEPROM.
I MS_SKT_SEL: On the positive edge of RESET_N,
this pin is sampled to determined the Memory Stick
socket size.
1 = 8-bit
0 = 4-bit
GPIO10
(CRD_PWR)
21 I/O200 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output. Custom firmware is
required to activate this function.
CRD_PWR: Card power drive of 3.3 V at either 100
mA or 200 mA.
RESET_N 18 IS RESET Input: This active low signal is used by the
system to reset the chip. The active low pulse should
be at least 1 μs wide.
TEST 28 I TEST Input: Tie this pin to ground for normal
operation.
GPIO12 24 I/O12 This pin may be used either as input, edge sensitive
interrupt input, or output.
GPIO14 19 I/O12 This pin may be used either as input, edge sensitive
interrupt input, or output.
GPIO15 26 I/O12 This pin may be used either as input, edge sensitive
interrupt input, or output.
Table 6.1 USB224x 36-PiN QFN Pin Descriptions (continued)
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
Revision 2.0 (10-14-09) 24 SMSC USB224x
DATASHEET
6.2 Buffer Type Descriptions
NC 12
15
16
17
12
15
16
17
25
12
15
16
17
No Connect. No trace or signal should be
routed/attached to these pins.
DIGITAL / POWER
VDD18 13 +1.8 V core power. This pin must have a 1.0 μF (or
greater) ±20% (ESR <0.1 Ω) capacitor to VSS.
VDD33 6
14
22
3.3 V Power and Regulator Input
VSS ePad Ground Pad.
Table 6.2 Buffer Type Descriptions
BUFFER DESCRIPTION
I Input.
IPU Input with internal weak pull-up resistor.
IS Input with Schmitt trigger.
I/O12 Input/Output buffer with 12 mA sink and 12 mA source.
I/O200 Input/Output buffer 12 mA with FET disabled, 100/200 mA source only when the FET
is enabled.
I/O12PD Input/Output buffer with 12 mA sink and 12 mA source with an internal weak pull-down
resistor.
I/O12PU Input/Output buffer with 12 mA sink and 12 mA source with a pull-up resistor.
O12 Output buffer with 12 mA source.
O12PU Output buffer with 12 mA sink and 12 mA source, with a pull-up resistor.
O12PD Output buffer with 12 mA sink and 12 mA source, with a pull-down resistor.
ICLKx XTAL clock input.
OCLKx XTAL clock output.
I/O-U Analog Input/Output as defined in the USB 2.0 Specification.
I-R RBIAS.
Table 6.1 USB224x 36-PiN QFN Pin Descriptions (continued)
SYMBOL
USB2240/40i
USB2241/41i
USB2242/42i
USB2244/44i
BUFFER
TYPE DESCRIPTION
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x 25 Revision 2.0 (10-14-09)
DATASHEET
Chapter 7 Pin Configurations
7.1 Card Reader
The SMSC USB224x is fully compliant with the following flash media card reader specifications:
Secure Digital 2.0
- HS-SD and SDHC
- TransFlash™ and reduced form factor media
MultiMediaCard 4.2
- 1/4/8 bit MMC
Memory Stick 1.43
Memory Stick Pro Format 1.02
Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
Memory Stick Duo 1.10
xD-Picture Card 1.2
7.2 System Configurations
7.2.1 EEPROM
The USB224x can be configured via a 2-wire (I2C) EEPROM (512x8) flash device containing the
options for the USB224x. If an external configuration device does not exist the internal default values
will be used. If one of the external devices is used for configuration, the OEM can update the values
through the USB interface. The device will then “attach” to the upstream USB host.
The USBDM tool set is available in the USB224x/USB225x Card Reader software release package.
To download the software package from SMSC's website, please visit:
https://www2.smsc.com/mkt/CW_SFT_PUB.nsf/Agreements/OBJ+Card+Reader
to go to the OBJ Card Reader Software Download Agreement. Review the license, and if you agree,
check the "I agree" box and then select “Confirm”. You will then be able to download the
USB224x/USB225x Card reader combo release package zip file containing the USBDM tool set.
Please note that the following applies to the system values and descriptions when used:
N/A = Not applicable to this part
Reserved = For internal use
7.2.2 EEPROM Data Descriptor
Table 7.1 Internal Flash Media Controller Configurations
ADDRESS REGISTER NAME DESCRIPTION INTERNAL DEFAULT VALUE
00h USB_SER_LEN USB Serial String
Descriptor Length
1Ah
01h USB_SER_TYP USB Serial String
Descriptor Type
03h
02h-19h USB_SER_NUM USB Serial Number "000000225001"
(See Note 7.1)
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1Ah-1Bh USB_VID USB Vendor Identifier 0424
1Ch-1Dh USB_PID USB Product Identifier 2240
1Eh USB_LANG_LEN USB Language String
Descriptor Length
04h
1Fh USB_LANG_TYP USB Language String
Descriptor Type
03h
20h USB_LANG_ID_LSB USB Language Identifier
Least Significant Byte
09h
(See Note 7.2)
21h USB_LANG_ID_MSB USB Language Identifier
Most Significant Byte
04h
(See Note 7.2)
22h USB_MFR_STR_LEN USB Manufacturer String
Descriptor Length
10h
23h USB_MFR_STR_TYP USB Manufacturer String
Descriptor Type
03h
24h-31h USB_MFR_STR USB Manufacturer String “Generic”
(See Note 7.1)
32h-5Dh Reserved - 00h
5Eh USB_PRD_STR_LEN USB Product String
Descriptor Length
24h
5Fh USB_PRD_STR_TYP USB Product String
Descriptor Type
03h
60h-99h USB_PRD_STR USB Product String “Ultra Fast Media Reader"
(See Note 7.1)
9Ah USB_BM_ATT USB BmAttribute 80h
9Bh USB_MAX_PWR USB Max Power 30h (96 mA)
9Ch ATT_LB Attribute Lo byte 40h (Reverse SD_WP only)
9Dh ATT_HLB Attribute Hi Lo byte 00h
9Eh ATT_LHB Attribute Lo Hi byte 00h
9Fh ATT_HB Attribute Hi byte 00h
A0h MS_PWR_LB Memory Stick Device
Power Lo byte
08h
A1h MS_PWR_HB Memory Stick Device
Power Hi byte
00h
A2h Reserved - 80h
A3h Reserved - 00h
A4h xD_PWR_LB xD-Picture Card Device
Power Lo byte
00h
A5h xD_PWR_HB xD-Picture Card Device
Power Hi byte
08h
Table 7.1 Internal Flash Media Controller Configurations (continued)
ADDRESS REGISTER NAME DESCRIPTION INTERNAL DEFAULT VALUE
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DATASHEET
Note 7.1 This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0
specification (Revision 2.0, 2000). Values in double quotations without this note are ASCII
values.
Note 7.2 For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding,
(Version 4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading,
Massachusetts.
Note 7.3 The “SM” value will be overridden with “xD” once an xD-Picture Card has been identified.
7.2.3 EEPROM Data Descriptor Register Descriptions
7.2.3.1 00h: USB Serial String Descriptor Length
A6h SD_PWR_LB Secure Digital Device
Power Lo byte
00h
A7h SD_PWR_HB Secure Digital Device
Power Hi byte
80h
A8h LED_BLK_INT LED Blink Interval 02h
A9h LED_BLK_DUR LED Blink After Access 28h
AAh - B0h DEV0_ID_STR Device 0 Identifier String “COMBO”
B1h - B7h DEV1_ID_STR Device 1 Identifier String “MS”
B8h - BEh DEV2_ID_STR Device 2 Identifier String “SM”
(See Note 7.3)
BFh - C5h DEV3_ID_STR Device 3 Identifier String “SD/MMC”
C6h - CDh INQ_VEN_STR Inquiry Vendor String “Generic”
CEh-D2h INQ_PRD_STR Inquiry Product String 2240
D3h DYN_NUM_LUN Dynamic Number of LUNs FFh
D4h - D7h DEV_LUN_MAP Device to LUN Mapping FFh, FFh, FFh, FFh
D8h - DAh Reserved - 00h, 03h, 07h
DBh - DDh Reserved - 5Ch, 56h, 97h
DEh-FBh Not Applicable - 00h
FCh-FFh NVSTORE_SIG Non-Volatile Storage Signature “ATA2”
BYTE NAME DESCRIPTION
0 USB_SER_LEN USB serial string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
Table 7.1 Internal Flash Media Controller Configurations (continued)
ADDRESS REGISTER NAME DESCRIPTION INTERNAL DEFAULT VALUE
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DATASHEET
7.2.3.2 01h: USB Serial String Descriptor Type
7.2.3.3 02h-19h: USB Serial Number Option
7.2.3.4 1Ah-1Bh: USB Vendor ID Option
7.2.3.5 1Ch-1Dh: USB Product ID Option
7.2.3.6 1Eh: USB Language Identifier Descriptor Length
7.2.3.7 1Fh: USB Language Identifier Descriptor Type
7.2.3.8 20h: USB Language Identifier Least Significant Byte
BYTE NAME DESCRIPTION
1 USB_SER_TYP USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
BYTE NAME DESCRIPTION
25:2 USB_SER_NUM Maximum string length is 12 hex digits. Must be unique to each device.
BYTE NAME DESCRIPTION
1:0 USB_VID This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
BYTE NAME DESCRIPTION
1:0 USB_PID This ID is unique for every product. The product ID is assigned by the vendor.
BYTE NAME DESCRIPTION
0 USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
BYTE NAME DESCRIPTION
1 USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
BYTE NAME DESCRIPTION
2 USB_LANG_ID
_LSB
English language code = ‘0409’. See Note 7.2 to reference additional
language ID’s defined by the USB-IF.
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7.2.3.9 21h: USB Language Identifier Most Significant Byte
7.2.3.10 22h: USB Manufacturer String Descriptor Length
7.2.3.11 23h: USB Manufacturer String Descriptor Type
7.2.3.12 24h-31h: USB Manufacturer String Option
7.2.3.13 32h-5Dh: Reserved
7.2.3.14 5Eh: USB Product String Descriptor Length
7.2.3.15 5Fh: USB Product String Descriptor Type
BYTE NAME DESCRIPTION
3 USB_LANG_ID
_MSB
English language code = ‘0409’. See Note 7.2 to reference additional
language ID’s defined by the USB-IF.
BYTE NAME DESCRIPTION
0 USB_MFR_STR
_LEN
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
BYTE NAME DESCRIPTION
1 USB_MFR_STR
_TYP
USB manufacturer string descriptor type as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
BYTE NAME DESCRIPTION
15:2 USB_MFR_STR The maximum string length is 29 characters.
BYTE NAME DESCRIPTION
59:16 Reserved Reserved.
BYTE NAME DESCRIPTION
0 USB_PRD_STR
_LEN
USB product string descriptor length as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes). Maximum string
length is 29 characters
BYTE NAME DESCRIPTION
1 USB_PRD_STR
_TYP
USB product string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string
descriptor type.
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7.2.3.16 60h-99h: USB Product String Option
7.2.3.17 9Ah: USB BmAttribute (1 byte)
7.2.3.18 9Bh: USB MaxPower (1 byte)
BYTE NAME DESCRIPTION
59:2 USB_PRD_STR This string will be used during the USB enumeration process in the
Windows® operating system. Maximum string length is 29 characters.
BIT NAME DESCRIPTION
7:0 USB_BM_ATT Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus
power) or bus-powered (limited to a 100 mA maximum of upstream power
prior to being configured by the host controller).
When configured as a bus-powered device, the SMSC device consumes
less than 100 mA of current prior to being configured. After configuration, the
bus-powered SMSC device (along with all associated device circuitry, any
embedded devices if part of a compound device, and 100 mA per externally
available downstream port) must consume no more than 500 mA of
upstream VBUS current. The current consumption is system dependent, and
the OEM must ensure that the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of upstream VBUS
current is consumed and all ports are available, with each port being capable
of sourcing 500 mA of current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
BIT NAME DESCRIPTION
7:0 USB_MAX_PWR USB Max Power per the USB 2.0 Specification. Do NOT set this value
greater than 100 mA.
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7.2.3.19 9Ch-9Fh: Attribute Byte Descriptions
BYTE
BYTE
NAME BIT DESCRIPTION
0 ATT_LB 3:0 Always reads ‘0’.
4 Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
5 Always reads ‘0’.
6 Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7 Reserved.
1 ATT_HLB 3:0 Always reads ‘0’.
4 Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
5 Common Media Insert / Media Activity LED
‘1’ - The activity LED will function as a common media inserted/media
access LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6 Always reads ‘0’.
7 Reserved.
2 ATT_LHB 0 Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
1 Always reads ‘0’.
2 Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
7:3 Always reads ‘0’.
3 ATT_HB 6:0 Always reads ‘0’.
7 xD Player Mode
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7.2.4 A0h-A7h: Device Power Configuration
The USB224x has one internal FET which can be utilized for card power. This section describes the
default internal configuration. The settings are stored in NVSTORE and provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or
external card power FET options. For internal FET card power control, bits 0 through 2 are used to
set the power limit. The “Device Power Configuration” bits are ignored unless the “Enable Device
Power Configuration” bit is set. See Section 7.2.3.19, "9Ch-9Fh: Attribute Byte Descriptions," on
page 31.
7.2.4.1 A0h-A1h: Memory Stick Device Power Configuration
7.2.4.2 A2h-A3h: Not Applicable
7.2.4.3 A4h-A5h: xD-Picture Card Device Power Configuration
When applicable, the "SM" value will be overridden with “xD” once an xD-Picture Card has been
identified.
FET TYPE BITS BIT TYPE DESCRIPTION
0 FET Lo Byte
MS_PWR_LB
3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
MS_PWR_HB
3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
BYTE NAME DESCRIPTION
1:0 Not Applicable Not applicable.
FET TYPE BITS BIT TYPE DESCRIPTION
0 FET Lo Byte
xD_PWR_LB
3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
xD_PWR_HB
3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
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7.2.4.4 A6h-A7h: Secure Digital Device Power Configuration
7.2.4.5 A8h: LED Blink Interval
7.2.4.6 A9h: LED Blink Duration
7.2.5 Device ID Strings
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in
combination with the device to LUN mapping bytes in applications where the OEM wishes to reorder
and rename the LUNs. If multiple devices are mapped to the same LUN (a COMBO LUN), then the
CLUN#_ID_STR will be used to name the COMBO LUN instead of the individual device strings. When
applicable, the "SM" value will be overridden with xD once an xD-Picture Card has been identified.
7.2.5.1 AAh-B0h: Device 0 Identifier String
7.2.5.2 B1h-B7h: Device 1 Identifier String
FET TYPE BITS BIT TYPE DESCRIPTION
0 FET Lo Byte
SD_PWR_LB
3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
SD_PWR_HB
3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
BYTE NAME DESCRIPTION
0 LED_BLK_INT The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 128 x 50 ms.
BYTE NAME DESCRIPTION
1 LED_BLK_DUR LED Blink After Access. This byte is used to designate the number of
seconds that the GPIO1 LED will continue to blink after a drive access.
Setting this byte to "05" will cause the GPIO 1 LED to blink for 5 seconds
after a drive access.
BYTE NAME DESCRIPTION
6:0 DEV0_ID_STR Not applicable.
BYTE NAME DESCRIPTION
6:0 DEV1_ID_STR This ID string is associated with the Memory Stick device.
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7.2.5.3 B8h-BEh: Device 2 Identifier String
7.2.5.4 BFh-C5h: Device 3 Identifier String
7.2.5.5 C6h-CDh: Inquiry Vendor String
7.2.5.6 CEh-D2h: Inquiry Product String
7.2.5.7 D3h: Dynamic Number of LUNs
7.2.5.8 D4h-D7h: Device to LUN Mapping
BYTE NAME DESCRIPTION
6:0 DEV2_ID_STR This ID string is associated with the xD-Picture Card device.
BYTE NAME DESCRIPTION
6:0 DEV3_ID_STR This ID string is associated with the Secure Digital / MultiMediaCard device.
BYTE NAME DESCRIPTION
7:0 INQ_VEN_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
BYTE NAME DESCRIPTION
4:0 INQ_PRD_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
BIT NAME DESCRIPTION
7:0 DYN_NUM_LUN These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
BYTE NAME DESCRIPTION
3:0 DEV_LUN_MAP These registers map a device controller (SD/MMC, SM, and MS) to a Logical
Unit Number (LUN). The device reports the mapped LUNs to the USB host
in the USB descriptor during enumeration. The icon installer associates
custom icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
7.2.5.7, "D3h: Dynamic Number of LUNs," on page 34.
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DATASHEET
7.2.5.9 D8h-FBh: Not Applicable
7.2.5.10 FCh-FFh: Non-Volatile Storage Signature
7.3 Default Configuration Option
The SMSC device can be configured via its internal default configuration. Please see Section 7.2.2,
"EEPROM Data Descriptor" for specific details on how to enable default configuration. Please refer to
Table 7.1 for the internal default values that are loaded when this option is selected.
7.3.1 External Hardware RESET_N
A valid hardware reset is defined as assertion of RESET_N for a minimum of 1 μs after all power
supplies are within operating range. While reset is asserted, the device (and its associated external
circuitry) consumes less than 500 μA of current from the upstream USB power source.
Assertion of RESET_N (external pin) causes the following:
1. The PHY is disabled and the differential pair will be in a high-impedance state.
2. All transactions immediately terminate; no states are saved.
3. All internal registers return to the default state.
4. The external crystal oscillator is halted.
5. The PLL is halted.
6. The processor is reset.
7. All media interfaces are reset.
7.3.1.1 RESET_N for EEPROM Configuration
Figure 7.1 RESET_N Timing for EEPROM Mode
BYTE NAME DESCRIPTION
35:0 Not Applicable Not Applicable.
BYTE NAME DESCRIPTION
3:0 NVSTORE_SIG This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for USB224x.
t1 t2
t4
t5 t6 t7
RESET_N
VSS
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery Idle
Start
completion
request
response
t3
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Note: All power supplies must have reached the operating levels mandated in Chapter 9, DC
Parameters, prior to (or coincident with) the assertion of RESET_N.
7.3.2 USB Bus Reset
In response to the upstream port signaling a reset to the device, the device does the following:
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. All transactions are stopped.
4. Processor reinitializes and restarts.
5. All media interfaces are disabled.
Table 7.2 RESET_N Timing for EEPROM Mode
NAME DESCRIPTION MIN TYP MAX UNITS
t1 RESET_N asserted 1 μsec
t2 Device recovery/stabilization 500 μsec
t3 8051 programs device configuration 20 50 msec
t4 USB attach 100 msec
t5 Host acknowledges attach and signals USB reset 100 msec
t6 USB idle Undefined msec
t7 Ready to handle requests (with or without data) 5 msec
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Chapter 8 Pin Reset States
Figure 8.1 Pin Reset States
8.1 USB2240/40i/41/41i Pin Reset States
Table 8.1 Legend for Pin Reset States Table
SYMBOL DESCRIPTION
0 Output driven low
1 Output driven high
IP Input enabled
PU Hardware enables pull-up
PD Hardware enables pull-down
-- Hardware disables function
Z Hardware disables pad. Both output
driver and input buffers are disabled.
Table 8.2 USB2240/40i/41/41i 36-Pin Reset States
RESET STATE
PIN PIN NAME FUNCTION
INPUT/
OUT-
PUT
PU/
PD
8 xD_D0 / SD_D6 / MS_D7 none z--
7 xD_D1 / SD_D7 / MS_D6 none z--
5 xD_D2 / SD_D0 / MS_D4 none z--
4 xD_D3 / SD_D1 / MS_D5 none z--
30 xD_D4 / GPIO6 (SD_WP) / MS_SCLK SD_WP 0--
25 xD_D5 / SD_D2 none z--
26 GPIO15 (SD_nCD) GPIO IP pu
Voltage
Signal
(v)
Time
(t)
RESET
RESET
Hardware
Initialization
Firmware
Operational
VDD33
VSS
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Note: xD signals only apply to USB2240/USB2240i.
8.2 USB2242/42i Pin Reset States
Table 8.3 USB2242/42i 36-Pin Reset States
24 GPIO12 (MS_INS) GPIO IP pu
23 xD_D6 / SD_D3 / MS_D3 none z--
20 xD_D7 / SD_D4 / MS_D2 none z--
9 xD_nWP / SD_CLK / MS_BS none z--
10 xD_ALE / SD_D5 / MS_D1 none z--
11 xD_CLE / SD_CMD / MS_D0 none z--
19 GPIO14 (xD_nCD) GPIO IP pu
1 GPIO1 (LED) GPIO 0--
16 xD_nRE none z--
27 GPIO2 / RXD / SDA GPIO 0--
29 GPIO4 GPIO 0--
31 GPIO7 / TXD / SCK / MS_SKT_SEL GPIO 0--
21 GPIO10 (CRD_PWR) GPIO z--
28 TEST TEST IP --
18 RESET_N RESET_N IP --
12 xD_nWE none z--
17 xD_nB/R none z--
15 xD_nCE none z--
2 USB+ USB+ z--
3USB- USB-
z--
RESET STATE
POST-RESET STATE
MS MODE
PIN PIN NAME FUNCTION
INPUT
/ OUT-
PUT
PU/
PD FUNCTION OUT-
PUT
PU/
PD
IN-
PUT
8 MS_D7 none z -- MS_D7 hw pd yes
Table 8.2 USB2240/40i/41/41i 36-Pin Reset States (continued)
RESET STATE
PIN PIN NAME FUNCTION
INPUT/
OUT-
PUT
PU/
PD
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7 MS_D6 none z -- MS_D6 hw pd yes
5 MS_D4 none z -- MS_D4 hw pd yes
4 MS_D5 none z -- MS_D5 hw hw yes
30 MS_SCLK SD_WP 0 -- MS_SCLK hw hw --
25 NC none z -- none z -- --
23 MS_D3 none z -- MS_D3 hw pd yes
20 MS_D2 none z -- MS_D2 hw pd yes
9 MS_BS none z -- MS_BS hw hw --
10 MS_D1 none z -- MS_D1 hw hw yes
11 MS_D0 none z -- MS_D0 hw pd yes
19 GPIO14 GPIO IP pu
26 GPIO15 GPIO IP pu
24 GPIO12 (MS_INS) GPIO IP pu
27 GPIO2 / RXD / SDA GPIO 0 --
29 GPIO4 GPIO 0 --
31 GPIO7 / TXD / SCK /
MS_SKT_SEL
GPIO 0 --
21 GPIO10 (CRD_PWR) GPIO z --
28 TEST TEST IP --
18 RESET_N RESET_N IP --
1 GPIO1 (LED) GPIO 0 --
16 NC none z -- none z -- --
12 NC none z -- none z -- --
17 NC none z -- none z -- --
15 NC none z -- none z -- --
2 USB+ USB+ z --
3 USB- USB- z --
35 RBIAS
33 XTAL1 (CLKIN)
32 XTAL2
RESET STATE
POST-RESET STATE
MS MODE
PIN PIN NAME FUNCTION
INPUT
/ OUT-
PUT
PU/
PD FUNCTION OUT-
PUT
PU/
PD
IN-
PUT
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8.3 USB2244/44i Pin Reset States
Table 8.4 USB2244/USB2244i 36-Pin Reset States
RESET STATE
Post-Reset State
SD Mode
PIN PIN NAME FUNCTION
INPUT
/ OUT-
PUT
PU/
PD FUNCTION OUT-
PUT
PU/
PD
IN-
PUT
8 SD_D6 none z -- SD_D6 hw pu yes
7 SD_D7 none z -- SD_D7 hw pu yes
5 SD_D0 none z -- SD_D0 hw pu yes
4 SD_D1 none z -- SD_D1 hw pu yes
30 SD_WP SD_WP 0 -- SD_WP (fw) (fw) (fw)
25 SD_D2 none z -- SD_D2 hw pu yes
23 SD_D3 none z -- SD_D3 hw pu yes
20 SD_D4 none z -- SD_D4 hw pu yes
9 SD_CLK none z -- SD_CLK hw -- yes
10 SD_D5 none z -- SD_D5 hw pu yes
11 SD_CMD none z -- SD_CMD hw pu yes
19 GPIO14 GPIO IP pu
26 GPIO15 (SD_nCD) GPIO IP pu
24 GPIO12 GPIO IP pu
27 GPIO2 / RXD / SDA GPIO 0-- RXD z pu yes
29 GPIO4 GPIO 0--
31 GPIO7 / TXD / SCK GPIO 0-- TXD hw -- --
21 GPIO10 (CRD_PWR) GPIO z-- PWR VDD -- --
28 TEST TEST IP --
18 RESET_N RESET_N IP --
1 GPIO1 (LED) GPIO 0--
17:15 NC none z -- none z -- --
12 NC none z -- none z -- --
2 USB+ USB+ z --
3 USB- USB- z --
35 RBIAS
33 XTAL1 (CLKIN)
32 XTAL2
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
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Chapter 9 DC Parameters
9.1 Maximum Guaranteed Ratings
Note 9.1 Stresses above the specified parameters may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at any condition above
those indicated in the operation sections of this specification is not implied.
Note 9.2 When powering this device from laboratory or system power supplies, it is important that
the absolute maximum ratings not be exceeded or device failure can result. Some power
supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.
In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, it is suggested that a clamp circuit be used.
Figure 9.1 Supply Rise Time Model
PARAMETER SYMBOL MIN MAX UNITS COMMENTS
Storage
Temperature
TA-55 150 °C
Lead
Temperature
°C Please refer to JEDEC
specification J-STD-020D.
3.3 V supply
voltage
VDD33 -0.5 4.0 V
Voltage on
USB+ and
USB- pins
-0.5 (3.3 V supply voltage + 2) ≤ 6V
Voltage on
GPIO10
-0.5 VDD33 + 0.3 V When internal power FET
operation of this pin is enabled,
this pin may be simultaneously
shorted to ground or any
voltage up to 3.63 V
indefinitely, without damage to
the device as long as VDD33
and VDDA33 are less than 3.63
V and TA is less than 70oC.
Voltage on any
signal pin
-0.5 VDD33 + 0.3 V
Voltage on
XTAL1
-0.5 3.6 V
Voltage on
XTAL2
-0.5 VDD18 + 0.3 V
t10%
10%
90%
Voltage tRT
t90% Time
100%
3.3 V
VSS
VDD33
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9.2 Operating Conditions
Note 9.3 A 3.3 V regulator with an output tolerance of 1% must be used if the output of the internal
power FETs must support a 5% tolerance.
9.3 DC Electrical Characteristics
PARAMETER SYMBOL MIN MAX UNITS COMMENTS
Commercial Part
Industrial Part
TA
TA
0
-40
70
85
°C
°C
Operating Temperature
Ambient temperature in still air.
3.3 V supply voltage VDD33 3.0 3.6 V (Note 9.3)
3.3 V supply rise time tRT 0 400 μs
Voltage on
USB+ and USB- pins
-0.3 5.5 V If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 ≤ 5.5
Voltage on any signal
pin
-0.3 VDD33 V
Voltage on XTAL1 -0.3 VDD33 V
Voltage on XTAL2 -0.3 VDD18 V
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
I, IPU, IPD Type Input Buffer
Low Input Level
High Input Level
Pull Down
Pull Up
VILI
VIHI
PD
PU
2.0
72
58
0.8 V
V
μA
μA
TTL Levels
IS Type Input Buffer
Low Input Level
High Input Level
Hysteresis
VILI
VIHI
VHYSI
2.0
420
0.8 V
V
mV
TTL Levels
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
1.4
-10
0.5
+10
V
V
μAVIN = 0 to VDD33
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Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
IIH
-10
-10
+10
+10
μA
μA
VIN = 0
VIN = VDD33
O12 Type Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
VDD33
- 0.4
-10
0.4
+10
V
V
μA
IOL = 12 mA @
VDD33= 3.3 V
IOH = -12 mA @
VDD33= 3.3 V
VIN = 0 to VDD33
(Note 9.4)
I/O12, I/O12PU & I/O12PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
Pull Down
Pull Up
VOL
VOH
IOL
PD
PU
VDD33
- 0.4
-10
72
58
0.4
+10
V
V
μA
μA
μA
IOL = 12 mA @
VDD33= 3.3 V
IOH = -12 mA @
VDD33= 3.3 V
VIN = 0 to VDD33
(Note 9.4)
IO-U
(Note 9.5)
I-R
(Note 9.6)
I/O200
Integrated Power FET for
GPIO10
High Output Current Mode
Low Output Current Mode
(Note 9.7)
On Resistance
(Note 9.7)
Output Voltage Rise Time
IOUT
IOUT
RDSON
tDSON
200
100
2.1
800
mA
mA
Ω
μs
VdropFET = 0.46 V
VdropFET = 0.23 V
IFET = 70 mA
CLOAD = 10 μF
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
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Note 9.4 Output leakage is measured with the current pins in high impedance.
Note 9.5 See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
Note 9.6 RBIAS is a 3.3 V tolerant analog pin.
Note 9.7 Output current range is controlled by program software, software disables FET during short
circuit condition.
Note 9.8 The assignment of each Integrated Card Power FET to a designated Card Connector is
controlled by both firmware and the specific board implementation. Firmware will default to
the settings listed in Table 11.1, “USB2240/40i and USB2241/41i GPIO Usage,” on
page 48.
Note 9.9 The 3.3 V supply should be at least at 75% of its operating condition before the 1.8 V
supply is allowed to ramp up.
9.4 Capacitance
TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V
Supply Current Unconfigured ICCINIT 80 90 mA
Supply Current Active
Full Speed
High Speed
ICC
ICC
110
135
140
165
mA
mA
Supply Current Suspend ICSBY 350 700 µA
Industrial Temperature Suspend ICSBYI 350 900 µA
Table 9.1 Pin Capacitance
PARAMETER SYMBOL
LIMITS
UNIT TEST CONDITIONMIN TYP MAX
Clock Input Capacitance CXTAL 2 pF All pins (except USB pins
and pins under test) are tied
to AC ground.
Input Capacitance CIN 10 pF
Output Capacitance COUT 20 pF
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
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9.5 Package Thermal Specifications
Note 9.10 Thermal parameters are measured or estimated for devices with the exposed pad soldered
to thermal vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured
from the die to the ambient air.
Table 9.2 36-Pin QFN Package Thermal Parameters
PARAMETER
VELOCITY
(meters/sec) SYMBOL VALUE UNIT
Thermal Resistance 0
ΘJA
33.2
°C/W129
226
Junction-to-Top-of-Package 0
ΨJT
2.6
°C/W12.6
22.6
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Chapter 10 AC Specifications
10.1 Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz ± 350 ppm.
Figure 10.1 Typical Crystal Circuit
Table 10.1 Crystal Circuit Legend
Figure 10.2 Capacitance Formulas
Note 10.1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL
and should be set to ‘0’ for use in the calculation of the capacitance formulas in
Figure 10.2, "Capacitance Formulas". However, the OEM PCB itself may present a
parasitic capacitance between XTAL1 and XTAL2. For an accurate calculation of C1 and
C2, take the parasitic capacitance between traces XTAL1 and XTAL2 into account.
Note 10.2 Each of these capacitance values is typically approximately 18 pF.
SYMBOL DESCRIPTION IN ACCORDANCE WITH
C0Crystal shunt capacitance Crystal manufacturer’s specification (See Note 10.1)
CLCrystal load capacitance
CBTotal board or trace
capacitance
OEM board design
CSStray capacitance SMSC IC and OEM board design
CXTAL XTAL pin input capacitance SMSC IC
C1Load capacitors installed on
OEM board Calculated values based on Figure 10.2,
"Capacitance Formulas" (See Note 10.2)
C2
XTAL1
(CS1 = CB1 + CXTAL1 )
XTAL2
(CS2 = CB2 + CXTAL2 )
C1
C2
CL1 M
Crystal
C0
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – CS2
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10.2 Ceramic Resonator
24 MHz ± 350 ppm
Figure 10.3 Ceramic Resonator Usage with SMSC IC
10.3 External Clock
50% Duty cycle ± 10%, 24 MHz ± 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2
specification on 1.8 V CMOS Logic. XTAL2 should be treated as a no connect.
XTAL1
XTAL2
1 M
24 MHz
Ceramic
Resonator
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Chapter 11 GPIO Usage
Table 11.1 USB2240/40i and USB2241/41i GPIO Usage
NAME ACTIVE LEVEL SYMBOL DESCRIPTION AND NOTE
GPIO1 H LED LED indicator
GPIO2 H RXD / SDA Receive Port of Debugger / Serial
EEPROM Data
GPIO4 USER GPIO User defined
GPIO6 L SD_WP SD Write Protect Detection
GPIO7 H TXD / SCK / MS_SKT_SEL Transmit Port of Debugger / Serial
EEPROM Clock / Memory Stick Socket
(1 = 8-bit; 0 = 4-bit)
GPIO10 L CRD_PWR Card Power Control
GPIO12 L MS_INS Memory Stick Card Insertion
GPIO14 L xD_nCD xD-Picture Card detect (USB2240/40i
only )
GPIO15 L SD_nCD Secure Digital card detect
Table 11.2 USB2242/42i GPIO Usage
NAME ACTIVE LEVEL SYMBOL DESCRIPTION AND NOTE
GPIO1 H LED LED indicator
GPIO2 H RXD / SDA Receive Port of Debugger / Serial
EEPROM Data
GPIO4 USER GPIO User defined
GPIO6 L SD_WP SD Write Protect Detection
GPIO7 H TXD / SCK / MS_SKT_SEL Transmit Port of Debugger / Serial
EEPROM Clock / Memory Stick Socket
(1 = 8-bit; 0 = 4-bit)
GPIO10 L CRD_PWR Card Power Control
GPIO12 L MS_INS Memory Stick Card Insertion
GPIO14 USER GPIO User defined
GPIO15 USER GPIO User defined
Table 11.3 USB2244/44i GPIO Usage
NAME ACTIVE LEVEL SYMBOL DESCRIPTION AND NOTE
GPIO1 H LED LED indicator
GPIO2 H RXD / SDA Receive Port of Debugger / Serial
EEPROM Data
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GPIO4 USER GPIO User defined
GPIO6 L SD_WP SD Write Protect Detection
GPIO7 H TXD / SCK / MS_SKT_SEL Transmit Port of Debugger / Serial
EEPROM Clock / Memory Stick Socket
(1 = 8-bit; 0 = 4-bit)
GPIO10 L CRD_PWR Card Power Control
GPIO12 USER GPIO User defined
GPIO14 USER GPIO User defined
GPIO15 L SD_nCD Secure Digital card detect
Table 11.3 USB2244/44i GPIO Usage (continued)
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Chapter 12 Package Outline
Figure 12.1 USB224x 36-QFN, 6x6 mm Body, 0.5 mm Pitch
Note 12.1 All dimensions are in millimeters.
Note 12.2 Position tolerance of each terminal and exposed pad is ±0.05 mm at maximum material
condition.
Note 12.3 Dimension “b” applies to plated terminals and is measured between 0.15 mm and 0.30 mm
from the terminal tip.
Table 12.1 Package Parameters
SYMBOL MIN NOMINAL MAX NOTE REMARKS
A 0.80 ~ 1.00 - Overall Package Height
A1 0 0.02 0.05 - Standoff
A2 0.60 ~ 0.80 - Mold Thickness
A3 0.20 REF - Leadframe Thickness
D/E 5.85 6.00 6.15 - X/Y Overall Body Size
D1/E1 5.55 ~ 5.95 - X/Y Mold Cap Size
D2/E2 4.00 4.10 4.20 2 X/Y Exposed Pad Size
L 0.50 0.60 0.75 - Terminal Length
b 0.18 0.25 0.30 2 Terminal Width
e 0.50 BSC - Terminal Pitch
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Note 12.4 Details of terminal #1 identifier are optional but must be located within the area indicated.
Note 12.5 Coplanarity zone applies to exposed pad and terminals.
Figure 12.2 Additional Package Information and Notes
