GaAs INTEGRATED CIRCUIT HIGH POWER SPDT SWITCH FOR WiMAXTM 2 I en N t: U CG E 24 09 D M PG2409TB DESCRIPTION The PG2409TB is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for WiMAX. This device can operate frequency from 0.5 to 3.8 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type). And this package is suitable for high-density surface mounting. FEATURES * Switch control voltage : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. * Low insertion loss : Lins = 0.35 dB TYP. @ f = 1.0 GHz O pla N c T : Lins = 0.45 dB TYP. @ f = 2.5 GHz : Lins = 0.50 dB TYP. @ f = 3.0 GHz * High isolation : ISL = 32 dB TYP. @ f = 1.0 GHz : ISL = 26 dB TYP. @ f = 2.5 GHz : ISL = 23 dB TYP. @ f = 3.0 GHz * Handling power : Pin (1 dB) = +35.0 dBm TYP. @ f = 0.5 to 3.8 GHz em * High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 1.25 0.9 mm) APPLICATIONS * WiMAX and wireless LAN (IEEE802.11b/g/n) SC ORDERING INFORMATION Part Number PG2409TB-E4-A Package 6-pin super minimold Marking G5T Supplying Form Embossed tape 8 mm wide (SC-88/SOT-363 type) Pin 4, 5, 6 face the perforation side of the tape (Pb-Free) Qty 3 kpcs/reel Re PG2409TB-E4 Order Number Remark To order evaluation samples, please contact your nearby sales office. ro p D D I -In Part number for sample order: PG2409TB-A Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. Document No. PG10772EJ01V0DS (1st edition) Date Published July 2009 NS PG2409TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin Name 1 RF1 2 3 SW TRUTH TABLE On Path Vcont1 RFC-RF1 High RFC-RF2 Low 5 RFC 6 Vcont1 High O pla N c T ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified) Switch Control Voltage Vcont +6.0 Note Vcont = 3 V Pin +35 Vcont = 5 V Pin +37 Power Dissipation (average) PD Operating Ambient Temperature TA Storage Temperature Tstg Unit V dBm em Input Power Ratings 150 mW 45 to +85 C 55 to +150 C Note Vcont1 Vcont2 6.0 V SC RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified) Operating Frequency Switch Control Voltage (H) MIN. TYP. MAX. Unit f 0.5 3.8 GHz Vcont (H) 2.7 3.0 5.3 V Vcont (L) 0.2 0 0.2 V Vcont (H), Vcont (L)Note 0.1 0 0.1 V -In Switch Control Voltage (L) Symbol Re Parameter D D I Control Voltage Difference ro p Note Vcont (H) = Vcont1 (H) Vcont2 (H) Vcont (L) = Vcont1 (L) Vcont2 (L) 2 Data Sheet PG10772EJ01V0DS RF2 Vcont2 Low Symbol GND 4 Vcont2 Parameter 2 I en N t: U CG E 24 09 D M Pin No. PG2409TB I en N t: U CG E 24 09 D M ELECTRICAL CHARACTERISTICS (T A = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 8 pF, unless otherwise specified) Symbol Insertion Loss 1 Lins1 Test Conditions MIN. TYP. MAX. f = 0.5 to 1.0 GHz Note 1 Unit 0.35 0.60 dB Note 1 0.40 0.65 dB 2 Parameter Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz 0.45 0.70 dB Insertion Loss 4 Lins4 f = 2.5 to 3.0 GHz 0.50 0.75 dB Insertion Loss 5 Lins5 f = 3.0 to 3.8 GHz Isolation 1 ISL1 0.60 0.85 dB f = 0.5 to 1.0 GHz Note 1 29 32 dB Note 1 25 28 dB Isolation 2 ISL2 f = 1.0 to 2.0 GHz Isolation 3 ISL3 f = 2.0 to 2.5 GHz 23 26 dB Isolation 4 ISL4 f = 2.5 to 3.0 GHz 20 23 dB Isolation 5 ISL5 f = 3.0 to 3.8 GHz 16 19 dB RL f = 0.5 to 3.8 GHz 15 20 dB +33.5 dBm Note 1 +35 dBm Note 1 +37 dBm Return Loss 0.1 dB Loss Compression f = 2.5 GHz O pla N c T Input Power Pin (0.1 dB) Note 2 Note 1 1 dB Loss Compression Note 3 Vcont = 3 V 1 dB Loss Compression Input Power 2 Pin (1 dB) 2 f = 0.5 to 3.8 GHz Note 3 Vcont = 5 V em Input Power 1 Pin (1 dB) 1 f = 0.5 to 3.8 GHz 2f0 f = 2.5 GHz, Pin = +26 dBm 75 dBc 3rd Harmonics 3f0 f = 2.5 GHz, Pin = +26 dBm 80 dBc Input 3rd Order Intercept Point IIP3 f = 2.5 GHz +60 dBm Switch Control Current Icont No RF input 0.1 10 A Switch Control Speed tSW 50% CTL to 90/10% RF 100 250 ns SC 2nd Harmonics -In Re Notes 1. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 3. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. ro p D D I Caution It is necessary to use DC blocking capacitors with this device. Data Sheet PG10772EJ01V0DS 3 PG2409TB 2 I en N t: U CG E 24 09 D M EVALUATION CIRCUIT Note C1 : 0.5 to 2.0 GHz : 2.0 to 3.8 GHz 56 pF 8 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. em O pla N c T APPLICATION INFORMATION * C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. * The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. * LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the ro p D D I -In Re SC antenna. 4 Data Sheet PG10772EJ01V0DS PG2409TB ro p D D I -In Re SC em O pla N c T 2 I en N t: U CG E 24 09 D M TYPICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 2.7 to 5.3 V, Vcont (L) = 0.2 to 0.2V, unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PG10772EJ01V0DS 5 ro p D D I -In Re SC em O pla N c T 2 I en N t: U CG E 24 09 D M PG2409TB Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10772EJ01V0DS PG2409TB MOUNTING PAD LAYOUT DIMENSIONS 2 I en N t: U CG E 24 09 D M 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) Remark The mounting pad layout in this document is for reference only. O pla N c T When designing PCB, please consider workability of mounting, solder joint reliability, prevention of ro p D D I -In Re SC em solder bridge and so on, in order to optimize the design. Data Sheet PG10772EJ01V0DS 7 PG2409TB PACKAGE DIMENSIONS ro p D D I -In Re SC em O pla N c T 2 I en N t: U CG E 24 09 D M 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 8 Data Sheet PG10772EJ01V0DS PG2409TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering I en N t: U CG E 24 09 D M methods and conditions other than those recommended below, contact your nearby sales office. Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below 2 Soldering Method IR260 WS260 HS350 ro p D D I -In Re SC em O pla N c T Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10772EJ01V0DS 9 PG2409TB This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. I en N t: U CG E 24 09 D M Caution GaAs Products * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 2 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. ro p D D I -In Re SC em O pla N c T * Do not lick the product or in any way allow it to enter the mouth. 10 Data Sheet PG10772EJ01V0DS NOTICE 4. 5. 6. 7. 8. 9. 11. 12. 2 Re SC 10. I en N t: U CG E 24 09 D M 3. em 2. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 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NOTE 3: Products and product information are subject to change without notice. ro p CEL Headquarters * 4590 Patrick Henry Drive, Santa Clara, CA 95054 * Phone (408) 919-2500 * www.cel.com For a complete list of sales offices, representatives and distributors, Please visit our website: www.cel.com/contactus Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: CEL: UPG2409TB-A UPG2409TB-E4-A