Products Learn & Develop Support USA (English) Type Here to Search Products ARK Menu Intel(R) NUC Kit D54250WYKH Compare Specifications Specifications Essentials Memory Specifications Graphics Specifications Expansion Options I/O Specifications Package Specifications Advanced Technologies Intel(R) Data Protection Technology Ordering / sSpecs / Steppings Related Products - Essentials Intel(R) NUC Boards and Kits Status End of Interactive Support Intel(R) NUC Kits Launch Date Q4'13 Products formerly Wilson Canyon Expected Discontinuance See Roadmap Board Form Factor UCFF (4" x 4") Socket Soldered-down BGA Internal Drive Form Factor mSATA and 2.5" Drive Support Overview # of Internal Drives Supported 2 Search Distributors Embedded Options Available No Lithography 22 nm PCN/MDDS Information TDP 15 W DC Input Voltage Supported 12-19 VDC Recommended Customer Price N/A 932421: PCN 932422: PCN 932423: PCN 932424: PCN Datasheet Link Processor Included Intel(R) CoreTM i5-4250U Processor (3M Cache, up to 2.60 GHz) Product Brief Link Warranty Period 3 yrs - Memory Specifications Max Memory Size (dependent on memory type) 16 GB Memory Types DDR3L-1333/1600 1.35V SODIMM Max # of Memory Channels 2 Max Memory Bandwidth 25.6 GB/s Max # of DIMMs 2 ECC Memory Supported No - Graphics Specifications Integrated Graphics Yes Graphics Output Mini-DP 1.2; Mini-HDMI 1.4a Intel(R) Clear Video Technology # of Displays Supported + Yes 3 - Expansion Options PCI Express Revision Gen2 PCI Express Configurations Half-length MiniPCI card with PCIe x1 lane PCIe Mini Card Slot (Half Length) 1 PCIe Mini Card Slot (Full Length) 1 - I/O Specifications USB Revision 2.0, 3.0 # of USB Ports 6 USB 2.0 Configuration (External + Internal) 0+2 Quick Links Export Full Specifications USB 3.0 Configuration (External + Internal) 2B 2F + 0 Total # of SATA Ports 2 Max # of SATA 6.0 Gb/s Ports 2 RAID Configuration 2.5" SSD + mSATA SSD (RAID-0 RAID-1) Audio (back channel + front channel) 7.1 digital + analog stereo headset Integrated LAN 10/100/1000 Integrated Wifi No Integrated Bluetooth No Consumer Infrared Rx Sensor Yes Additional Headers FRONT_PANEL, 2x USB2.0, DC_IN, CUST_SOL (CEC, WDT, DMIC) - Package Specifications Low Halogen Options Available See MDDS - Advanced Technologies Intel(R) Virtualization Technology for Directed I/O (VT-d) Yes Intel(R) vPro Technology No TPM No Intel(R) HD Audio Technology Yes Intel(R) Rapid Storage Technology Yes Intel(R) Virtualization Technology (VT-x) Yes - Intel(R) Data Protection Technology Intel(R) AES New Instructions Yes All information provided is subject to change at any time, without notice. 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"Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. The Recommended Customer -unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Send us your feedback! 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