SFH 415
GaAs-IR-Lumineszenzdioden
GaAs Infrared Emitters
Lead (Pb) Free Product - RoHS Compliant
2009-08-21 1
Wesentliche Merkmale
• GaAs-LED mit sehr hohem Wirkungsgrad
• Hohe Zuverlässigkeit
• UL Version erhältlich
• Gute spektrale Anpassung an
Si-Fotoempfänger
• SFH 415: Gehäusegleich mit SFH 300,
SFH 203
Anwendungen
• IR-Fernsteuerung von Fernseh- und
Rundfunkgeräten, Videorecordern,
Lichtdimmern
• Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
• Rauchmelder
• Sensorik
• Diskrete Lichtschranken
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 415 Q62702-P0296 > 25
SFH 415-U Q62702-P1137 > 40
1) gemessen bei einem Raumwinkel : = 0.01 sr / measured at a solid angle of : = 0.01 sr
Features
• Very highly efficient GaAs-LED
• High reliability
• UL version available
• Spectral match with silicon photodetectors
• SFH 415: Same package as SFH 300,
SFH 203
Applications
• IR remote control of hi-fi and TV-sets, video
tape recorders, dimmers
• Remote control for steady and varying intensity
• Smoke detectors
• Sensor technology
• Discrete interrupters
2009-08-21 2
SFH 415
Grenzwerte (TA = 25 qC)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top;Tstg – 40 }+ 100 qC
Sperrspannung
Reverse voltage
VR5V
Durchlassstrom
Forward current
IF100 mA
Stoßstrom, tp 10 Ps, D = 0
Surge current
IFSM 3A
Verlustleistung
Power dissipation
Ptot 165 mW
Wärmewiderstand
Thermal resistance
RthJA 450 K/W
Kennwerte (TA = 25 qC)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
Opeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF= 100 mA
'O 55 nm
Abstrahlwinkel
Half angle
SFH 415
M
r17
Grad
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area
LuB
LuW
0.3 u0.3 mm2
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top
H
4.2 }4.8
mm
SFH 415
2009-08-21 3
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 :
Switching times, ,e from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 :
tr,tf0.5 Ps
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co25 pF
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 Ps
VF
VF
1.3 (d 1.5)
2.3 (d 2.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (d 1) PA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
)e22 mW
Temperaturkoeffizient von Ie bzw. )e,
IF = 100 mA
Temperature coefficient of Ie or )e,
IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF,IF = 100 mA
Temperature coefficient of VF,IF = 100 mA
TCV– 2 mV/K
Temperaturkoeffizient von O,IF = 100 mA
Temperature coefficient of O,IF = 100 mA
TCO+ 0.3 nm/K
Kennwerte (TA = 25 qC)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2009-08-21 4
SFH 415
Gruppierung der Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel : = 0.01 sr
Grouping of Radiant Intensity Ie in Axial Direction
at a solid angle of : = 0.01 sr
Bezeichnung
Parameter
Symbol Wert
Value
Einheit
Unit
SFH 415 SFH 415-T1) SFH 415-U
Strahlstärke
Radiant intensity
IF = 100 mA,
tp = 20 ms
Ie min
Ie max
25
–
25
50
40
–
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A,
tp = 100 Ps
Ie typ.
–
350
450
mW/sr
1) SFH 415-T kann nicht einzeln bestellt werden. / SFH 415-T can not be ordered separately.
SFH 415
2009-08-21 5
Relative Spectral Emission
Irel = f (O)
Forward Current
IF = f(VF), single pulse, tp = 20 Ps
Permissible Pulse Handling
Capability IF=f(W), TA = 25 qC
duty cycle D = parameter
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
10
OHR01554
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
t
OHR00860
p
-5
10
10
2
Ι
F
10
3
10
4
5
DC
0.2
0.5
0.1
0.005
0.01
0.02
0.05
t
p
T
Ι
F
t
p
T
D=
5
mA
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10s
D=
Radiant Intensity
Single pulse, tp = 20 Ps
Radiation Characteristics,
,rel = f (M)
,e
,e100 mA = f(IF)
OHR01551
10 -3
Ι
F
-2
10
10 -1
10 0
10 1
10 2
Ιe 100 mA
e
Ι
-2
10 -1
10 0
10 1
10A
A
OHR01552
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
Max. Permissible Forward Current
IF=f (TA)
OHR00883
0
F
Ι
0
20
40
60
80
100
120
20 40 60 80 100 120
mA
˚C
T
A
R
thjA
= 450 K/W
2009-08-21 6
SFH 415
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße in mm (inch) / Dimensions in mm (inch).
7.8 (0.307)
7.5 (0.295)
9.0 (0.354)
8.2 (0.323)
29 (1.142)
27 (1.063)
1.8 (0.071)
1.2 (0.047)
4.8 (0.189)
4.2 (0.165)
ø5.1 (0.201)
ø4.8 (0.189)
0.8 (0.031)
0.4 (0.016)
0.6 (0.024)
0.4 (0.016)
2.54 (0.100)
spacing
5.9 (0.232)
5.5 (0.217)
0.6 (0.024)
0.4 (0.016)
Area not flat
Chip position
Cathode
GEOY6645
4 (0.157)
OHLPY985
4.8 (0.189)
SFH 415
2009-08-21 7
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
