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1998©
Document No. D13536EJ3V0DS00 (3rd edition)
Date Published April 2002 N CP(K)
Printed in Japan
THYRISTORS
AC03DGM, AC03FGM
3 A MOLD TRIAC
DATA SHEET
2002
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
The AC03EGM and AC03FGM are fully diffused mold TRIACs
with an effective on-current of 3 A. The repeat peak off-voltages
are 400 V and 600 V.
FEATURES
• Gate trigger current (mode I, III, and IV) at 12 mA or less is
guaranteed.
• This transistor features a small and lightweight package and is
easy to handle even on the mounting surface due to its TO-
202AA dimensions. Processing of lead wires and heatsink
(tablet) using jigs is also possible.
• High degrees-of-freedom applications design is available due to
high gate trigger sensitivity and small hold current distribution.
• Employs flame-retardant epoxy resin (UL94V-0).
APPLICATIONS
Noncontact switches of motor speed control, heater
temperature control, lamp light control
PACKAGE DRAWING (UNIT: mm)
*TC test bench-mark Standard weight: 1.4 g
ABSOLUTE MAXIMUM RATINGS (Ta = 25°
°°
°C)
Parameter Symbol AC03DGM AC03FGM Unit Remarks
Non-repetitive peak off-state voltage VDSM 500 700 V −
Repetitive peak off-voltage VDRM 400 600 V −
Effective on-state current IT(RMS) 3 (TC = 92°C) A Refer to Figures
11 and 12.
Surge on-state current ITSM 30 (50 Hz 1 cycle)
33 (60 Hz 1 cycle)
A Refer to Figure 2.
Fusing current ƒiT2dt 4.0 (1 ms ≤ t ≤ 10 ms) A2S−
Critical rate of rise of on-state
current
dIT/dt 40 A/
µ
s−
Peak gate power dissipation PGM 3 (f ≥ 50 Hz, Duty ≤ 10 %) W −
Average gate power dissipation PG(AV) 0.3 W −
Peak gate current IGM ±0.5 (f ≥ 50 Hz, Duty ≤ 10 %) A −
Junction temperature Tj−40 to +125 °C−
Storage temperature Tstg −55 to +150 °C−
Data Sheet D13536EJ3V0DS
2
AC03DGM, AC03FGM
ELECTRICAL CHARACTERISTICS (Tj = 25°
°°
°C, RGK = 1 kΩ
ΩΩ
Ω)
Parameter Symbol Conditions MIN. TYP. MAX. Unit Remarks
Tj = 25°C−−
100
µ
A
Repeat peak off-current IDRM VDM = VDRM Tj = 125°C−−1mA
−
On-state voltage VTM ITM = 5 A −−
1.8 V Refer to
Figure 1.
Mode I T2 +, G+ −−
12
II T2 −, G+ −−−
III T2 −, G−−−
12
Gate trigger
current
IV
IGT
VDM = 12 V
RL = 30 Ω
T2 +, G−−−
12
mA Refer to
Figure 4.
Mode I T2 +, G+ −−
1.5
II T2 −, G+ −−−
III T2 −, G−−−
1.5
Gate trigger
voltage
IV
VGT
VDM = 12 V
RL = 30 Ω
T2 +, G−−−
1.5
VRefer to
Figure 4.
Gate non-trigger voltage VGD Tj = 125°C, VDM = 1
2 VDRM 0.2 −−
V−
Hold current IHVDM = 24 V, ITM = 5 A −10 −mA −
Critical rate of rise of off-
state voltage dv/dt Tj = 125°C, VDM = 2
3 VDRM −100 −V/
µ
s−
Commutating critical rate of
rise of off-state voltage (dv/dt)c
Tj = 125°C
(diT/dt)c = −1.6 A/ms
VD = 400 V
5−−V/
µ
s−
Rth(j−c) Junction-to-case AC −−
10 °C/W
Thermal resistance* Rth(j−a) Junction-to-ambient AC −−
75 °C/W
Refer to
Figure 13.
* The thermal resistance at 50 Hz and 60 Hz sine wave current, which is shown on the following expression:
Rth(j−c) = Tj(max)–TC
PT(AV) T
j(max) :Maximum junction temperature
TC:Case temperature
PT(AV) :Average on-dissipation
Data Sheet D13536EJ3V0DS 3
AC03DGM, AC03FGM
Data Sheet D13536EJ3V0DS
4
AC03DGM, AC03FGM
Data Sheet D13536EJ3V0DS 5
AC03DGM, AC03FGM
[MEMO]
AC03DGM, AC03FGM
M8E 00. 4
The information in this document is current as of July, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
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