
AMIS-42700 Dual High-Speed CAN Transceiver Preliminary Data Sheet
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS
“Data Handbook IC26; Integrated Circu it Packages” (d ocument ord er number 9398 65 2 90011) . There is no sol dering m ethod that
is ideal for all surface mount IC packages. Wave solderi ng is not al ways suitable for surf ace mou nt ICs, or for printed-circuit bo ard s
with high population densities. In these situations reflow soldering is often u sed.
10.2 Re-flow Soldering
Re-flow soldering requir es solder paste (a suspension of fine solder p articles, flux and binding agent) to be applie d to the printed-
circuit board by screen-printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for
re-flowing; for example, infrared/conv ection heating in a conve yor type oven. T hroughput times (preheat ing, soldering and c ooling)
vary between 100 and 200 seconds depending on heating method. T ypical re-flow peak temper atures range from 215 to 250°C.
The top-surface temperature of the packages should preferably b e kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-
wave soldering method was specificall y deve loped. If wave soldering is used th e follo wing conditions m ust be obs erved for optim al
results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
• For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm , the footprint longitudinal axis is preferred t o be parallel to the transport d irection
of the printed-circuit board;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-
circuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with lea ds on f our sides, the f ootprint must be placed at a 45º angl e to the transport direct ion of th e print ed-
circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by
screen-printing, pin transfer or syringe dispensing. T he package c an be soldered after the adhesive is cu red. Typical dwell time is
four seconds at 250°C. A mildly-activated flux will eliminate the nee d for removal of corrosive residues in most applicat ions.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to
the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within t wo to five secon ds between 270 and 320°C.
Table 11: Soldering Process Soldering Method
Package Wave Re-flow(1)
BGA, SQFP Not suitable Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2) Suitable
PLCC (3) , SO, SOJ Suitable Suitable
LQFP, QFP, TQFP Not recommended (3)(4) Suitable
SSOP, TSSOP, VSO Not recommended (5) Suitable
Notes:
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
AMI Semiconductor – Rev. 1.4, May 05 - Preliminary
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