CPDH5V0P-HF
Page 1
Comchip Technology CO., LTD.
REV:A
QW-JP059
RoHS Device
- Low capacitance: 3pF(Typ.)
- IEC 61000-4-2 (ESD): Contact ±12KV.
- Fast response time.
- Low Leakage current.
- Low reverse clamping voltage.
Features
Notes: 1. Device stressed with ten non-repetitive ESD pulses.
Circuit Diagram
Halogen Free
±12
W
3
39
Peak Pulse Power
ESD per IEC 61000-4-2 (Air)
Parameter Symbol Value Unit
Maximum Rating (at TA=25°C unless otherwise noted)
ESD per IEC 61000-4-2 (Contact)
Peak Pulse Current
±12
A
μA
V
5
IR
Reverse leakage current
Reverse stand-off voltage
Parameter Conditions Symbol Min Typ
Max
Unit
VRWM = 5 V
Electrical Characteristics (at TA=25°C unless otherwise noted)
Breakdown voltage IT = 1 mA V(BR)
Clamping voltage
IPP = 3 A V
5.6
Junction capacitance CJpF
1
13
V
8
VR = 0V , F = 1MHz 3
KV
±16
ESD Voltage ±0.4
Per Human Body Model
Per Machine Model
SMD ESD Protection Diode
Company reserves the right to improve product design , functions and reliability without notice.
- Bi-directional ESD protection of one line.
JESD22-A114-B ESD Voltage
VRWM(3)
VC(2)
2. Non-repetitive current pulse 8/20μs exponential decay waveform according to IEC61000-4-5.
°C
-40 to +150
260TL
Lead Solder Temperature
Junction temperature range TJ °C
Maximum (10 Second Duration)
PPP
(2)
IPP(2)
VESD
(1)
Dimensions in inches and (millimeter)
SOD-523
0.051(1.30)
0.043(1.10)
0.033(0.85)
0.030(0.75)
0.067(1.70)
0.059(1.50)
0.014(0.35)
0.010(0.25)
0.003(0.07)
0.001(0.01)
0.006(0.15)
0.003(0.08)
0.031(0.77)
0.020(0.51)
0.008(0.20)REF
Mechanical data
-55 to +150
Storage temperature range TSTG °C
- Terminals: Solderable per MIL-STD-750,
method 2026.
- Mounting position: Any
- Weight: 0.0012 grams(approx.).
- Case: SOD-523 standard package,
molded plastic.
- Marking Code: HD
3. Other voltages available upon request.