RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 1 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
Available Surface Mount 3000 Watt
Transient Voltage Suppressor
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The MSMLG(J)5.0A through MXLSMLG(J)170A series of high-reliability Transient Voltage
Suppressors (TVSs) protect circuits from voltage spikes containing up to 3000 W (10/1000 µs
model pulse. The SMLG gull-wing design in the DO-215AB package allows for visible solder
connections. The SMLJ J-bend design in the DO-214AB package allows for greater PC board
mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant
versions. These are available with a variety of upscreening options for enhanced reliability. They
protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses
from inductive switching environments and induced by RF radiation. Since their response time is
virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2
and IEC61000-4-4.
DO-215AB
Package
DO-214AB
Package
Important: For the latest inform ation, vis it our website http://www.microsemi.com.
FEATURES
• High reliability devices with fabrication and assembly lot traceability for all M prefix devices
• All devices are 100% surge tested
• 3σ lot norm screening performed on standby current (ID) for all M prefix devices
• Available in both unidirectional and bidirectional versions
• Moisture classification is “Level 1” with no dry pack requir ed per IPC/JED EC J-STD-020B for all M
prefix devices.
• Enhanced reliability screening options with M prefix are avail able in ref eren ce to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all available options.)
• RoHS compliant versions available
• Axial-lead equivalent packages for thru-hole mounting are availa ble as M5KP5.0A to M5KP110CA
with 5000 W rating (contact Microsemi for other surface mount options).
APPLICATIONS / BENEFITS
• Suppresses transients up to 3000 watts (10/1000 us test pulse - see Figure 2)
• Selections for 5.0 to 170 volts standoff voltages (VWM)
• Protect ion from switch ing tr an sien ts and indu ced RF
• Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
• Secondary lightning protection per IEC61000-4-5 with 42 ohms sour ce imp edance:
Class 1 & 2: SML 5.0A to SML 170A or CA
Class 3: SML 5.0A to SML 150A or CA
Class 4: SML 5.0A to SML 75A or CA
• Secondary lightning protection per IEC61000-4-5 with 12 ohms sour ce imp edan ce:
Class 1: SML 5.0A to SML 170A or CA
Class 2: SML 5.0A to SML 90A or CA
Class 3: SML 5.0A to SML 48A or CA
Class 4: SML 5.0A to SML 24A or CA
• Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance:
Class 2: SML 5.0A to SML 43A or CA
Class 3: SML 5.0A to SML 22A or CA
Class 4: SML 5.0A to SML10A or CA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 2 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +150
ºC
Thermal Resi stan ce Jun cti on-to-Lead
RӨJL
17.5
ºC/W
Thermal Resi stan ce Jun ction-to-Ambient (1)
RӨJA
77.5
ºC/W
Peak Pulse Power Diss ipa tion @ 25 ºC
(at 10/1000
µ
s, see Figures 1, 2, and 3)
P
PP
3000
W
Impulse Repetition Rate (duty factor)
df
0.01 or less
%
t
clamping
(0 volts to V
(BR)
min.)
t
clamping
<100
<5
ps
ns
Rated Average Power Dissipation
L
P
M(AV)
6
1.61
(1)
W
Maximum Forward Surge Current (2)
IFSM
200
A (pk)
Solder Temperature @ 10 s
TSP
260
oC
Notes: 1. When mount ed on FR4 PC board (1oz Cu) with rec ommended footprint (see last page)
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only)
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0
• TERMINALS: Tin-lead or RoHS compli ant annealed matte-tin plating. Solderable to M IL-STD-750, method 2026.
• MARKING: Part number m ar k ed on package
• POLARITY: Cathode indicated by band. No cathode band on bi-directional devices
• TAPE & REEL option: Standard per EIA-481-B with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.25 grams
• See Package Dimensions on last page.
PART NOMENCLATURE
MX SM L G 5.0 C A e3
Reliability Level*
M (controlled product)
MA (Avionics grade)
MX (reference JANT X)
MXL (MX Lite)
Blank = commercial
*(see High Reliability
Up-Screened Plastic
Products Portfolio)
Surface Mount
Package
3000 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RoHS Compli ance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 3 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
SYMBOLS & DEFINITIONS
Symbol
Definition
I(BR)
Breakdown Current: T he curr ent used for mea suri ng breakdown voltage V(BR).
ID
Standby Current: The current at the rated standoff voltage (VWM).
IF
Forward Current: The forward current dc value, no alternating component.
IO
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle .
IPP
Peak Impulse Current: The peak current during the impulse.
PPP
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP.
VC
Clamping Voltage: Maximum clamping voltage at specified I PP (Peak Pulse Current) at the specified pulse conditions.
V(BR)
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VWM
Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is
also referred to as standoff voltage.
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
PART NUMBER REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
Gull-Wing
J-Bend
MIN. MAX.
I
(BR)
mA
SMLG5.0A
SMLG6.0A
SMLJ5.0A
SMLJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
10.3
326.0
291.3
1000
1000
SMLG6.5A
SMLG7.0A
SMLJ6.5A
SMLJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
267.9
250.0
500
200
SMLG7.5A
SMLG8.0A
SMLJ7.5A
SMLJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
232.6
220.6
100
50
SMLG8.5A
SMLG9.0A
SMLJ8.5A
SMLJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
208.4
194.8
25
10
SMLG10A
SMLG11A
SMLJ10A
SMLJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
176.4
164.8
5
5
SMLG12A
SMLG13A
SMLJ12A
SMLJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
150.6
139.4
5
5
SMLG14A
SMLG15A
SMLJ14A
SMLJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
129.4
123.0
2
2
SMLG16A
SMLG17A
SMLJ16A
SMLJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
115.4
106.6
2
2
SMLG18A
SMLG20A
SMLJ18A
SMLJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
102.8
92.6
2
2
SMLG22A
SMLG24A
SMLJ22A
SMLJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
84.4
77.2
2
2
SMLG26A
SMLG28A
SMLJ26A
SMLJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
71.2
66.0
2
2
SMLG30A
SMLG33A
SMLJ30A
SMLJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
62.0
56.2
2
2
SMLG36A
SMLG40A
SMLJ36A
SMLJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
51.6
46.4
2
2
SMLG43A
SMLG45A
SMLJ43A
SMLJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
43.2
41.2
2
2
SMLG48A
SMLG51A
SMLJ48A
SMLJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
38.8
36.4
2
2
SMLG54A
SMLG58A
SMLJ54A
SMLJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
34.4
32.0
2
2
SMLG60A
SMLG64A
SMLJ60A
SMLJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
103.0
31.0
29.2
2
2
SMLG70A
SMLG75A
SMLJ70A
SMLJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
26.6
24.8
2
2
Continued.
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 4 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated (continued)
MICROSEMI PART NUMBER REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
Gull-Wing
J-Bend
MIN. MAX.
I
(BR)
mA
SMLG78A
SMLG85A
SMLJ78A
SMLJ85A
78
85
86.7 – 95.8
94.4 – 104.0
1
1
126
137
22.8
20.8
2
2
SMLG90A
SMLG100A
SMLJ90A
SMLJ100A
90
100
100 – 111
111 – 123
1
1
146
162
20.6
18.6
2
2
SMLG110A
SMLG120A
SMLJ110A
SMLJ120A
110
120
122 – 135
133 – 147
1
1
177
193
16.8
15.6
2
2
SMLG130A
SMLG150A
SMLJ130A
SMLJ150A
130
150
144 – 159
167 – 185
1
1
209
243
14.4
12.4
2
2
SMLG160A
SMLG170A
SMLJ160A
SMLJ170A
160
170
178 – 197
189 – 209
1
1
259
275
11.6
11.0
2
2
NOTE 1: Bidirectional capacitance is half that shown in figure 4 at zero volts.
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 5 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
GRAPHS
tp – Pulse Time – sec
FIGURE 1
Peak Pulse Power vs. Pulse Time
t – Time (msec)
FIGURE 2
Pulse Waveform
I
PP
– Peak Pulse Current - % I
PP
Test wave form
parameters
tr = 10 µ
sec.
tp = 1000 µsec.
P
PP
– Peak Pulse Power - kW
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 6 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
GRAPHS (continued)
TL Lead Temperature oC
FIGURE 3
Derating Curve
BV – Breakdown Voltage (V)
FIGURE 4
Typical Capacitance vs.
Breakdo wn Vo ltage (unidirectional configuration)
NOTE : Bidi rect i onal capacitance is half that shown at zero volts.
Peak Pulse Power (P
PP
) or continuous
Power in Percent of 25
o
C Rating
C – Capacitance (pF)
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 7 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
PACKAGE DIMENSIONS
NOTES: Dimension “E” exceeds the JEDEC outline as shown.
Typical S tandoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
NOTES: Dimension “E” exceeds the JEDEC outline in height as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
0.115
0.121
2.92
3.07
B
0.260
0.280
6.60
7.11
C
0.220
0.245
5.59
6.22
E
0.077
0.110
1.95
2.80
F
0.380
0.400
9.65
10.16
K
0.025
0.040
0.635
1.016
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
0.115
0.121
2.92
3.07
B
0.260
0.280
6.60
7.11
C
0.220
0.245
5.59
6.22
D
0.305
0.320
7.75
8.13
E
0.077
0.110
1.95
2.80
L
0.030
0.060
0.760
1.52
SMLG (DO-215AB)
SMLJ (DO-214AB)
RF01003, Rev. C (7/30/13) ©2013 Microsemi Corporation Page 8 of 8
MSMLG5.0A – MSMLG170CAe3,
MSMLJ5.0 – MSMLJ170CAe3
PAD LAYOUT
SMLG (DO-215AB)
Ltr
Inch
Millimeters
A
0.510
12.95
B
0.110
2.79
C
0.150
3.81
SMLJ (DO-214AB)
Ltr
Inch
Millimeters
A
0.390
9.90
B
0.110
2.79
C
0.150
3.81