ECCM1G-20-26.641176M TR ECCM1 G Pb RoHS -20 -26.641176M TR Series RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic SMD Crystal Packaging Options Tape & Reel Nominal Frequency 26.641176MHz Frequency Tolerance/Stability 15ppm at 25C, 30ppm over -20C to +70C Load Capacitance 20pF Parallel Resonant Mode of Operation AT-Cut Fundamental ELECTRICAL SPECIFICATIONS Nominal Frequency 26.641176MHz Frequency Tolerance/Stability 15ppm at 25C, 30ppm over -20C to +70C Aging at 25C 3ppm/year Maximum Load Capacitance 20pF Parallel Resonant Shunt Capacitance (C0) 7pF Maximum Equivalent Series Resistance 30 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 50Watts Maximum, 50Watts Correlation Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm) Storage Temperature Range -40C to +85C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.00 0.15 7.00 0.15 2 MARKING ORIENTATION 1 2.54 0.20 1.2 0.1 (x4) 4 4 1 PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground LINE MARKING 4.6 0.2 3 1.3 MAX 3 2 1 E26.64 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.0 0.2 (x4) Note: Chamfer and index mark not shown. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 1 of 5 ECCM1G-20-26.641176M TR Suggested Solder Pad Layout All Dimensions in Millimeters 1.4 (x4) 2.2 (X4) Solder Land (X4) 3.6 1.1 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 2 of 5 ECCM1G-20-26.641176M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.2 2.0 0.2 DIA 1.5 0.1 0.30 0.05 7.5 0.2 16.0 0.3 7.9 0.1 6.75 0.20 8.0 0.2 5.4 0.1 1.7 0.1 *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 3 of 5 ECCM1G-20-26.641176M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 4 of 5 ECCM1G-20-26.641176M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 5 of 5