PFRR
Vishay Sfernice
Document Number: 53046 For technical questions, contact: sfer@vishay.com www.vishay.com
Revision: 21-Jan-10 1
ESCC ( ) 4001/023 Qualified R Failure Rate High Precision
(10 ppm/°C, 0.05 %) Thin Film Chip Resistors
Vishay Sfernice Thin Film division holds ESCC QML
qualification (ESCC technology flow qualification).
These HiRel components are ideal for low noise and
precision applications, superior stability, low temperature
coefficient of resistance, and low voltage coefficient,
VISHAY SFERNICE’s precision thin film wraparound
resistors exceed requirements of MIL-PRF-55342G
characteristics Y (± 10 ppm/°C).
FEATURES
•Load life stability at ± 70 °C for 2000 h: 0.25 %
under Pn
•Temperature coefficient to: 10 ppm/°C
•Very low noise (< 35 dB) and voltage coefficient
(< 0.01 ppm/V)
•Resistance range: 100 Ω to 3.01 MΩ (depending on size)
•Tolerances down to 0.05 %
•SnPb terminations over nickel barrier
•ESCC 4001 (generic spec)
•ESCC 4001/023 (detailed spec)
•ESCC qualified
•R failure rate (0.01 % per 1000 h)
•SMD wraparound chip resistor
•Halogen-free according to IEC 61249-2-21
DIMENSIONS
CASE SIZE
DIMENSIONS in millimeters
A
MAX. TOL. + 0.64
MIN. TOL. - 0.13
B
MAX. TOL. + 0.26
MIN. TOL. - 0.13
C
MAX. TOL. + 0.64
MIN. TOL. - 0.13
D/E
MAX. TOL. + 0.13
MIN. TOL. - 0.13
0603 1.52 0.75 0.38 0.38
0805 1.91 1.27 0.38 0.38
1206 3.00 1.60 0.38 0.38
2010 5.08 2.54 0.38 0.58
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PFRR0603Y1003BBT (preferred part number format)
TYPE TCR OHMIC
VALUE TOLERANCE TERMINATION PACKAGING
PFRR0603
PFRR0805
PFRR1206
PFRR2010
Y = ± 10 ppm/°C
E = ± 25 ppm/°C
The first three digits are
significant figures and the
last digit specifies the
number of zero to follow.
Example:
3901 = 3900 Ω
1004 = 1 MΩ
W = ± 0.05 %
B = ± 0.10 %
B: SnPb over
nickel barrier
T: For tape
and reel
(Leave blank
for waffle pack)
A
D
D
C
E
E
B
FRR0603Y1003BBTP
PFRR
Vishay Sfernice ESCC ( ) 4001/023 Qualified R Failure Rate High Precision
(10 ppm/°C, 0.05 %) Thin Film Chip Resistors
www.vishay.com For technical questions, contact: sfer@vishay.com Document Number: 53046
2Revision: 21-Jan-10
Vishay/Sfernice thin film is the first passive manufacturer to
hold the ESCC Technology Flow Qualification, official
certificate is available on ESCIES web site
https://escies.org/ReadArticle?docId=727).
This qualification open the door to a new concept at ESA:
The Failure Rate option (similar to the one offered in the MIL
system), for instance R failure rate: 0.01 % per 1000 h.
New specifications describing this new concept have been
released by the ESA:
2544001: Requirements for the Technology Flow
Qualification of Film Resistors
https://escies.org/escc/specifications/2544001.pdf
26000: Failure Rate Level Sampling Plans and Procedures
https://escies.org/escc/specifications/26000.pdf
21300: Terms, Definitions, Abbreviations, Symbols and Units
https://escies.org/escc/specifications/21300.pdf
21700: General Requirements for the Marking of the ESCC
Components
https://escies.org/escc/specifications/21700.pdf
4001: Generic Specification Resistors Fixed Film
https://escies.org/escc/specifications/4001.pdf
4001023: Resistors, Fixed, Chip, Thin Film, Type PHR and
PFRR
https://escies.org/escc/specifications/4001023.pdf
Parts are delivered with space C.O.C.
Parts undergo 100 % overload at end of production process.
Note
• Suggested land pattern: According to IPC-7351
GLOBAL PART NUMBER INFORMATION
ESCC Code
ESCC SPEC VARIANT FAILURE RATE OHMIC VALUE TOLERANCE TCR
4001023 0603 = 09
0805 = 10
1206 = 11
2010 = 12
RThe first three digits are significant figures and the
last digit specifies the number of zero to follow.
Example:
3901 = 3900 Ω
1004 = 1 MΩ
W = ± 0.05 %
B = ± 0.10 %
1 = ± 10 ppm/°C
2 = ± 25 ppm/°C
LAND PATTERN in millimeters
CHIP SIZE Zmax. Gmin. Xmax.
0603 2.37 0.35 0.98
0705/0805 2.76 0.74 1.40
1206 3.91 1.85 1.73
2010 5.93 3.71 2.67
STANDARD ELECTRICAL SPECIFICATIONS
VISHAY SFERNICE DESIGNATION PFRR 0603 PFRR 0805 PFRR 1206 PFRR 2010
ESA specification applied ESCC 4001/023
Variant number 09 10 11 12
Power rating at + 70 °C (Pn) 0.1 W 0.125 W 0.25 W 0.50 W
Limiting element voltage (UL) 50 V 100 V 150 V 200 V
Ohmic value range Min. 100 Ω
Max. 261 kΩ
Min. 100 Ω
Max. 301 kΩ
Min. 100 Ω
Max. 1 MΩ
Min. 100 Ω
Max. 3.01 MΩ
Insulation voltage (Ui) 100 V 200 V 300 V 300 V
Temperature coefficient ± 10 ppm/°C; ± 25 ppm/°C
Tolerance ± 0.05 %, ± 0.1 %
Temperature range - 55 °C to + 155 °C
Soldering temperature (Tsol) 260 °C, immersion 10 s
Gmin.
Zmax.
X
max.
400102309 1003B1R
PFRR
ESCC ( ) 4001/023 Qualified R Failure Rate High Precision
(10 ppm/°C, 0.05 %) Thin Film Chip Resistors Vishay Sfernice
Document Number: 53046 For technical questions, contact: sfer@vishay.com www.vishay.com
Revision: 21-Jan-10 3
POWER DERATING CURVE
EXTENDED FEATURES
You may consult VISHAY SFERNICE for chip sizes, ohmic
values and tolerances outside of the qualified range.
MECHANICAL SPECIFICATIONS
Substrate material Alumina
Technology Thin Film
Film Nickel Chromium
with mineral passivation
Protection Epoxy and Silicon
Terminations B type: SnPb over nickel barrier
for solder reflow
PACKAGING
Two types of packaging are available: waffle-pack and tape
and reel.
SIZE
NUMBER OF PIECES PER PACKAGE
TAPE
WIDTH
WAFFLE
PAC K
2" × 2"
TAPE AND REEL
MIN. MAX.
0603
100
100 4000 8 mm
0805
1206 140
2010 60
0
1206
AMBIENT TEMPERATURE IN °C
RATED POWER
070 155
0603
0805
2010
500
250
125
100
PERFORMANCE
TEST CONDITIONS
REQUIREMENTS
TYPICAL
ESA/SCC 4001/023 MIL-PRF-55342G
Short time overload Umax. < 2 UL ± 0.05 % + (0.05 Ω x 100/Rn) 0.10 % ± 0.01 %
Rapid temperature
change
- 55 °C/+ 155 °C 5 cycles
CEI 66-2-14 Test Na ± 0.05 % + (0.05 Ω x 100/Rn) 0.1 %
(for 100 cycles)
± 0.01 %
± 0.015 % (for 500 cycles)
Soldering
(thermal shock)
260 °C/10 s
CEI 68-2-20 A Test T6 (met. 1A) ± 0.05 % + (0.05 Ω x 100/Rn) - ± 0.005 %
Terminal strength:
Adhesion bend strength
of end plated facing
CEI 115-1 Clause 4.32
CEI 115-1 Clause 4.33 ± 0.05 % + (0.05 Ω x 100/Rn) - ± 0.01 %
Climatic sequence CEI 67-2-1/CEI 68-2-2
CEI 67-2-13/CEI 68-2-30 ± 0.10 % + (0.05 Ω x 100/Rn) - ± 0.02 %
Insulation resistance > 1 GΩ
Load life
2000 h Pn at + 70 °C
90’/30’ cycle
8000 h
± 0.25 % + (0.05 Ω x 100/Rn)
1 % + (0.05 Ω x 100/Rn) 0.5 % ± 0.05 % (8000 h)
Insulation resistance > 1 GΩ
High temperature
exposure
2000 h Pn at + 155 °C
CEI 68-2-20A Test B ± 0.15 % + (0.05 Ω x 100/Rn) ± 0.10 %
(duration 1000 h)
± 0.05 %
Insulation resistance > 1 GΩ
U = 6.25 x Pn x Rn/2s
Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1
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