○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・14・001
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04.Nov.2015 Rev.001
0.5 Amp or Less
Reversible Motor Drivers (Single Motor)
BH6578FVM BD7931F
General Description
The BH6578FVM and BD7931F are reversible motor
drivers with a wide output dynamic range, with power
MOS used for the output transistor. The motor drivers
can be set to four output modes 1) forward (normal)
rotation, 2) reverse rotation, 3) stop (idling or OFF)
and 4) brake using 2 logic inputs.
Features
Wide dynamic range loading driver with MOS
output, RON = 1.0Ω (Top + Bottom)
With loading driver voltage setting terminal
Built-in Thermal Shutdown Circuit (TSD)
Applications
Tray loading of CD/DVD,
applications using DC motors
Key Specifications
Supply Voltage Range:
BH6578FVM 4.5V to 5.5V
BD7931F 4.5V to 14V
Standby Current:
BH6578FVM 0.4mA (Typ)
BD7931F 0µA (Typ)
ON-Resistance(Top + Bottom): 1.0Ω (Typ)
Operating Temperature Range:
BH6578FVM -35°C to +85°C
BD7931F -40°C to +85°C
Packages W(Typ) x D(Typ) x H(Max)
Typical Application Circuit, Block Diagram, Pin Configuration and Pin Descriptions
BH6578FVM, BD7931F (in common)
Pin No.
Pin Name
Function
1
VCC
Supply voltage
2
OUT+
FWD output
3
OUT-
REV output
4
GND
Power ground
5
GND_S
Signal ground
6
LDCONT
Loading driver voltage setting pin
7
INREV
REV input
8
INFWD
FWD input
SOP8 (BD7931F)
5.00mm x 6.20mm x 1.71mm
MSOP8 (BH6578FVM)
2.90mm x 4.00mm x 0.90mm
1
2
3
4
8
7
6
5
Control
Logic
LDCONT
TSD
+
-
FWD IN
REV IN
LDCONT
VCC
F
R
PRE
GND
POW
GND
POWGND
PREGND
POW CMOS
H-Bridge
M
Bypass
capacitor
0.1μF
TOP VIEW
Datashee
t
Datashee
t
BH6578FVM BD7931F
2/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
BH6578FVM
BD7931F
Supply Voltage
VCC
7
15
V
Power Dissipation
Pd
0.55 (Note 1)
0.69 (Note 2)
W
Operating Temperature
Topr
-35 to +85
-40 to +85
°C
Storage Temperature
Tstg
-55 to +150
°C
Output Current
IOUT
500
mA
Junction Temperature
Tjmax
150
°C
(Note 1) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 4.4 mW/°C.
(Note 2) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 5.5 mW/°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
BH6578FVM
BD7931F
単位
Min
Typ
Max
Min
Typ
Max
Supply Voltage
VCC
4.5
5
5.5
4.5
8
14
V
Truth Table
BH6578FVM, BD7931F
INPUT
OUTPUT
Function
INFWD
INREV
OUT+
OUT-
L
L
Hi-Z
Hi-Z
High Impedance
L
H
L
H
REV mode
H
L
H
L
FWD mode
H
H
L
L
Brake mode
Hi-Z : Hi-impedance
BH6578FVM BD7931F
3/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
Electrical Characteristics
BH6578FVM (Unless otherwise specified, Ta=25°C, VCC=5V)
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Standby Current
ICC
-
0.4
0.8
mA
No load
(Loading Driver)
Output Offset Voltage
VOFSL
-15
0
+15
mV
Brake mode
Input Voltage H Level
VIH
2.0
－
VCC
V
Input Voltage L Level
VIL
GND
－
0.5
V
ON-Resistance
RON
－
1.0
1.8
Ω
IOUT=500mA,Top + Bottom
Voltage Gain
GVLD
4.5
6.0
7.5
dB
(Note 1)
Voltage Gain Difference
ΔGVLD
-2.0
0
+2.0
dB
Input Bias Current
IINL
－
86
120
µA
VFIN=5V,VRIN=5V
LDCONT Bias Current
ILDC
－
－
300
nA
VCONT=2V
(Note 1) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output Voltage when VCONT=3.5V, voltage gain can be expressed
by the following equation: GVLD=20log| (VO2-VO1)/2.5|
BD7931F (Unless otherwise specified, Ta=25°C, VCC=8V)
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Standby Current
ICC1
-
0
5
µA
Supply Current 1
ICC2
-
1.1
2.2
mA
VFIN=5V,VRIN=0V
Supply Current 2
ICC3
-
0.8
1.6
mA
VFIN=VRIN=5V
(Loading Driver)
Output Offset Voltage
VOFSL
-35
0
+35
mV
Brake mode
Input Voltage H Level
VIH
2.0
－
VCC
V
Input Voltage L Level
VIL
GND
－
0.5
V
ON-Resistance
RON
－
1.0
1.8
Ω
IOUT=500mA,Top+Bottom
Voltage Gain
GVLD
4.0
6.0
8.0
dB
(Note 2)
Voltage Gain Difference
ΔGVLD
-2.0
0
+2.0
dB
Input Bias Current
IINL
－
165
250
µA
VFIN=5V,VRIN=5V
LDCONT Bias Current
ILDC
－
－
300
nA
VCONT=5V
(Note 2) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output voltage when VCONT=3.5V, voltage gain can be expressed
by the following equation: GVLD=20log|(VO2-VO1)/2.5|
BH6578FVM BD7931F
4/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
0.0
0.1
0.2
0.3
0.4
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage L [V]
85°C
25°C
-35°C
0.0
0.1
0.2
0.3
0.4
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage L [V]
85°C
25°C
-35°C
0
1
2
3
4
5
0 1 2 3 4 5
LDCONT [V]
Output Voltage [V]
-35°C
25°C
85°C
-0.4
-0.3
-0.2
-0.1
0.0
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage H [V]
-35°C
25°C
85°C
Typical Performance Curves
Figure 1. Output Loss Voltage L vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
FWD Mode
Figure 2. Output Loss Voltage L vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
REV Mode
Figure 3. Output Voltage vs Input Voltage
(Voltage Gain (BH6578FVM))
VCC=5V, LDCONT=SWEEP
RL=8Ω+47µH
Figure 4. Output Voltage H vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
FWD Mode
BH6578FVM BD7931F
5/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
-5
-4
-3
-2
-1
0
0 1 2 3 4 5
LDCONT [V]
Output Voltage [V]
85℃
25℃
-35℃
Figure 6. Output Voltage vs Input Voltage
(Voltage Gain (BH6578FVM))
VCC=5V, LDCONT=SWEEP
RL=8Ω+47µH
0.0
0.1
0.2
0.3
0.4
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage L [V]
85℃
25℃
-40℃
Figure 8. Output Loss Voltage L vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
REV Mode
Typical Performance Curves – continued
Figure 5. Output Loss Voltage H vs Load Current
(BH6578FVM)
VCC=5V, LDCONT=OPEN
REV Mode
REV mode
-0.4
-0.3
-0.2
-0.1
0.0
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage H [V]
-35℃
25℃
85℃
0.0
0.1
0.2
0.3
0.4
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage L [V]
85℃
25℃
-40℃
Figure 7. Output Loss Voltage L vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
FWD Mode
BH6578FVM BD7931F
6/13
TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
Typical Performance Curves – continued
-10
-8
-6
-4
-2
0
0
1
2
3
4
5
LDCONT [V]
Output Voltage [V]
85°C
25°C
-40°C
-0.4
-0.3
-0.2
-0.1
0.0
0
100
200
300
400
500
Load Current [mA]
Output Loss Voltage H [V]
-40°C
25°C
85°C
Figure 10. Output Loss Voltage H vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
FWD Mode
-0.4
-0.3
-0.2
-0.1
0.0
0100 200 300 400 500
Load Current [mA]
Output Loss Voltage H [V]
-40℃
25℃
85℃
Figure 11. Output Loss Voltage H vs Load Current
(BD7931F)
VCC=8V, LDCONT=OPEN
REV Mode
Figure 12. Output Voltage vs Input Voltage
(Voltage Gain (BD7931F))
VCC=8V, LDCONT=SWEEP
RL=20Ω+47µH
Figure 9. Output Voltage vs Input Voltage
(Voltage Gain (BD7931F))
VCC=8V, LDCONT=SWEEP
RL=20Ω+47µH
0
2
4
6
8
10
0
1
2
3
4
5
LDCONT [V]
Output Voltage [V]
-40℃
25℃
85℃
BH6578FVM BD7931F
7/13
TSZ02201-0H5H0BK01500-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
04.Nov.2015 Rev.001
Power Dissipation
BH6578FVM BD7931F
(Note) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
I/O Equivalent Circuits
BH6578FVM BD7931F
Control and Operation
1. OUTPUT MODE CONTROL AND OPERATION
Control and operation of each output mode is described as follows:
When INFWD is “HIGH” and INREV is “LOW”, the output is at normal rotation mode. In normal rotation mode, current
flows from OUT+ to OUT-. When both INFWD and INREV are “HIGH”, the output is at brake mode. In brake mode,
the top-side transistor is OFF to stop the supply of motor drive current while the bottom-side transistor is ON to absorb
the reverse EMF of motor and apply brake to the motor. When both INFWD and INREV are “LOW”, OUT+ and OUT-
become high-impedance and the motor stops.
2. OUTPUT VOLTAGE CONTROL
Controlling the output voltage can vary the voltage applied to the motor and thus control motor speed. The output HIGH
voltage can be controlled (gain 6dB Typ), using the voltage applied to the CONT terminal. The output voltage never
exceeds the power supply voltage even if the voltage applied to CONT terminal exceeds (VCC Max).
85
85
Ambient Temperature : Ta [°C]
0
0
25
50
75
100
125
150
0.2
0.4
0.6
175
0.8
0
0
25
50
75
100
125
150
0.2
0.4
0.6
175
Ambient Temperature : Ta [°C]
0.8
Power Dissipation : Pd [W]
Power Dissipation : Pd [W]
OUT+/OUT-
INFWD/INREV
LDCONT
6
39KΩ
10KΩ
LDCONT
6
10KΩ
49.6KΩ
VCC
2
3
VCC
50KΩ
50KΩ
200KΩ
7
8
VCC
VCC
OUT+/OUT-
2
3
VCC
VCC
INFWD/INREV
50KΩ
50KΩ
200KΩ
7
8
50KΩ
50KΩ
BH6578FVM BD7931F
8/13
TSZ02201-0H5H0BK01500-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
04.Nov.2015 Rev.001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go
below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages
going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors
and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
BH6578FVM BD7931F
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TSZ02201-0H5H0BK01500-1-2
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TSZ22111・15・001
04.Nov.2015 Rev.001
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 13. Example of monolithic IC structure
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Capacitor Across Output and GND
In the event a large capacitor is connected across output and GND, when VCC and IN are short-circuited with 0V or
GND for some reason, the charge stored in the capacitor flows into the output and may destroy the IC. Use a
capacitor smaller than 0.1 µF between output and GND.
TSD ON temperature [°C]
(typ)
Hysteresis temperature [°C]
(typ)
BH6578FVM, BD7931F
175
25
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
BH6578FVM BD7931F
10/13
TSZ02201-0H5H0BK01500-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
04.Nov.2015 Rev.001
Ordering Information
B
H
6
5
7
8
F
V
M
-
T R
Part number
Package
FVM : MSOP8
Packaging and forming specification
TR: Embossed tape and reel
B
D
7
9
3
1
F
-
E 2
Part number
Package
F : SOP8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
MSOP8 (TOP VIEW)
H 6 5
Part Number Marking
LOT Number
1PIN MARK
7
8
SOP8 (TOP VIEW)
7931
Part Number Marking
LOT Number
1PIN MARK
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation dependin g on ambient temperature. W hen used in sealed area, confirm that it is the us e in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the prod uct specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condi tion from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any d amages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are store d in the places where:
[a] the Products are exposed to sea winds or corrosive gases, i nclud ing Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or conde nsation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before u s ing Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using a n authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
