EPRODUCT PREVIEW
Ma
y
1998 Order Number: 290645-001
n
Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
n
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n
Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
n
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
VPP = GND Option
VCC Lockout Voltage
n
Low Power Consumption
9 mA Typical Read Power
10 µA Typical Standby Power with
Automatic Power Savings Feature
n
Extended Temperature Operation
–40 °C to +85 °C
n
Easy-12 V
Faster Production Programming
No Additional System Logic
n
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
n
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
n
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
n
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
n
SRAM-Compatible Write Interface
n
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
n
x 16 for High Performance
48-Ball µBGA* Package
48-Lead TSOP Package
n
x 8 I/O for Space Savings
48-Ball µBGA* Package
40-Lead TSOP Package
n
0.25 µ ETOX™ VI Flash Technology
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-ef fecti ve, fl exible, m onol i thic c ode pl us data storage s ol ution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property ri ghts is granted by this document. Except as provided in Intel’s Terms and Conditi ons of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property ri ght. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F008C3, 28F016C3, 28F032C3, 28F800C3, 28F160C3, 28F320C3 may contain design defects or errors known as
errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1998 CG-041493
*Third-party brands and names are the property of their respective owners.
E3 VOLT ADVANCED+ BOOT BLOCK
3
PRODUCT PREVIEW
CONTENTS
PAGE PAGE
1.0 INTRODUCTION .............................................5
1.1 3 Volt Advanced+ Boot Block Flash Memory
Enhancements............................................5
1.2 Product Overview.........................................6
2.0 PRODUCT DESCRIPTION..............................6
2.1 Package Pinouts..........................................6
2.2 Block Organization.....................................10
2.2.1 Parameter Blocks................................10
2.2.2 Main Blocks.........................................10
3.0 PRINCIPLES OF OPERATION .....................11
3.1 Bus Operation............................................11
3.1.1 Read....................................................11
3.1.2 Output Disable.....................................11
3.1.3 Standby...............................................11
3.1.4 Reset...................................................12
3.1.5 Write....................................................12
3.2 Modes of Operation....................................12
3.2.1 Read Array..........................................12
3.2.2 Read Configuration..............................13
3.2.3 Read Status Register ..........................13
3.2.3.1 Clearing the Status Register.........13
3.2.4 Read Query.........................................13
3.2.5 Program Mode.....................................14
3.2.5.1 Suspending and Resuming
Program.......................................14
3.2.6 Erase Mode.........................................14
3.2.6.1 Suspending and Resuming Erase.15
3.3 Flexible Block Locking................................19
3.3.1 Locking Operation ...............................19
3.3.2 Locked State .......................................19
3.3.3 Unlocked State....................................19
3.3.4 Lock-Down State.................................19
3.3.5 Reading a Block’s Lock Status ............20
3.3.6 Locking Operations during Erase
Suspend.............................................20
3.3.7 Status Register Error Checking ...........20
3.4 128-Bit Protection Register.........................21
3.4.1 Reading the Protection Register..........21
3.4.2 Programming the Protection Register..21
3.4.3 Locking the Protection Register...........22
3.5 VPP Program and Erase Voltages...............22
3.5.1 Easy-12 V Operation for Fast
Manufacturing Programming...............22
3.5.2 VPP ≤ VPPLK for Complete Protection...22
3.5.3 VPP Usage...........................................22
3.6 Power Consumption...................................23
3.6.1 Active Power (Program/Erase/Read)...23
3.6.2 Automatic Power Savings (APS) .........23
3.6.3 Standby Power....................................23
3.6.4 Deep Power-Down Mode.....................24
3.7 Power-Up/Down Operation.........................24
3.7.1 RP# Connected to System Reset ........24
3.7.2 VCC, VPP and RP# Transitions.............24
3.8 Power Supply Decoupling ..........................24
4.0 ABSOLUTE MAXIMUM RATINGS................25
4.2 Operating Conditions..................................25
4.3 Capacitance...............................................26
4.4 DC Characteristics .....................................26
4.5 AC Characteristics—Read Operations—
Extended Temperature..............................30
4.6 AC Characteristics—Write Operations—
Extended Temperature..............................32
4.7 Erase and Program Timings.......................33
4.8 Reset Operations .......................................35
5.0 ORDERING INFORMATION..........................36
6.0 ADDITIONAL INFORMATION.......................37
APPENDIX A: WSM Current/Next States..........38
APPENDIX B: Program/Erase Flowcharts........40
APPENDIX C: Common Flash Interface Query
Structure......................................................46
3 VOLT ADVANCED+ BOOT BLOCK E
4PRODUCT PREVIEW
APPENDIX D: Architecture Block Diagram......52
APPENDIX E: Word-Wide Memory Map
Diagrams .....................................................53
APPENDIX F: Byte-Wide Memory Map
Diagrams .....................................................55
APPENDIX G: Device ID Table ..........................57
APPENDIX H: Protection Register
Addressing..................................................58
REVISION HISTORY
Date of
Revision Version Description
05/12/98 -001 Original version
E3 VOLT ADVANCED+ BOOT BLOCK
5
PRODUCT PREVIEW
1.0 INTRODUCTION
This document contains the specifications for the
3 Volt Advanced+ Boot Block flash memory family.
These flash memories add features which can be
used to enhance the security of systems: instant
block locking and a protection register.
Throughout this document, the term “2.7 V” refers
to the ful l voltage range 2.7 V–3.6 V (except where
noted otherwise) and “VPP = 12 V” refers to 12 V
±5%. Sections 1 and 2 provide an overview of the
flash m emory family including appli cations, pinouts,
pin descriptions and memory organization. Section
3 describes t he operation of thes e product s. Finall y,
Section 4 contains the operating specifications.
1.1 3 Volt Advanced+ Boot Block
Flash Memory Enhancements
The 3 Volt Advanced+ Boot Block flash memory
features:
•Zero-latency, flexible block locking
•128-bit Protection Register
•Simple system implementation for 12 V
production programming with 2.7 V in-field
programming
•Ultra-low power operation at 2.7 V
•Minimum 100,000 block erase cycles
•Common Flash Interface for software query of
device specs and features
Table 1. 3 Volt Advanced+ Boot Block Feature Summary
Feature 8 M(2)
16 M
32 M(1)
8 M(2)
16 M
32 M Reference
VCC Operating Voltage 2.7 V – 3.6 V Table 8
VPP Voltage Provides complete write protection with
optional 12V Fast Programming Table 8
VCCQ I/O Voltage 2.7 V– 3.6 V Note 3
Bus Width 8-bit 16-bit Table 2
Speed (ns) 90, 110 @ 2.7 V and 80, 100 @ 3.0 V Table 11
Blocking (top or bottom) 8 x 8-Kbyte parameter
4-Mb: 7 x 64-Kbyte main
8-Mb: 15 x 64-Kbyte main
16-Mb: 31 x 64-Kbyte main
32-Mb: 63 x 64-Kbyte main
8 x 4-Kword parameter
4-Mb: 7 x 32-Kword main 8-
Mb: 15 x 32-Kword main
16-Mb: 31 x 32-Kword main
32-Mb: 63 x 32-Kword main
Section 2.2
Appendix E and F
Operating Temperature Extended: –40 °C to +85 °C Table 8
Program/Erase Cycling 100,000 cycles Table 8
Packages 40-Lead TSOP(1)
48-Ball µBGA* CSP(2) 48-Lead TSOP
48-Ball µBGA* CSP(2) Figures 1, 2, 3,
and 4
Block Locking Flexible locking of any block with zero latency Section 3.3
Protection Register 64-bit unique device number, 64-bit user programmable Section 3.4
NOTES:
1. 32-Mbit density not available in 40-lead TSOP.
2. 8-Mbit density not available in µBGA* CSP.
3. VCCQ operation at 1.65 V — 2.5 V available upon request.
3 VOLT ADVANCED+ BOOT BLOCK E
6PRODUCT PREVIEW
1.2 Product Overview
Intel prov ides secure low vol tage memory sol utions
with the A dvanced Boot B lock fami ly of product s. A
new block locking feature allows instant
locking/unlocking of any block with zero-latency. A
128-bit protection register allows unique flash
device identification.
Discrete supply pins provide single voltage read,
program, and erase capability at 2.7 V while also
allowing 12 V VPP for faster production
programming. Easy-12 V, a new feature designed
to reduce external logic, simplifies board designs
when combining 12 V production programm ing with
2.7 V in-field programming.
The 3 Volt Advanced+ Boot Block flash memory
products are available in either x8 or x16 packages
in the following densities: (see Section 6,
Ordering
Information
)
•8-Mbit (8,388,608 bit) f las h memori es organiz ed
as either 512 Kwords of 16 bits each or 1024
Kbytes or 8 bits each.
•16-Mbit (16,777,216 bit) flash memories
organized as either 1024 Kwords of 16 bits
each or 2048 Kbytes of 8 bits each.
•32-Mbit (33,554,432 bit) flash memories
organized as either 2048 Kwords of 16 bits
each or 4096 Kbytes of 8 bits each.
Eight 8-KB parameter blocks are located at either
the top (denoted by -T suffix) or the bottom (-B
suffi x) of the addres s m ap in order to acc ommodat e
different microprocessor protocols for kernel code
locati on. The remaining memory is grouped int o 64-
Kbyte main blocks.
All blocks can be locked or unlocked instantly to
provide complete protection for code or data. (see
Section 3.3 for details).
The Command User Interface (CUI) serves as the
interface between the microprocessor or
microcontroller and the internal operation of the
flash memory. The internal Write State Machine
(WSM) automatically executes the algorithms and
timings necessary for program and erase
operations, including verification, thereby
unburdening the microprocessor or microcontroller.
The status regist er indicates the status of the WSM
by signifying block erase or word program
completion and status.
Program and erase aut omation allows program and
erase operations to be executed using an industry-
standard two-write command sequence to the CUI.
Program operations are performed in word or byte
increments. Erase operations erase all locations
within a block simultaneously. Both program and
erase operations can be suspended by the system
software in order to read from any other block. In
addition, data can be programm ed to another block
during an erase suspend.
The 3 Volt Advanced+ Boot Block flash memories
offer two low power savings features: Automatic
Power Savings (APS) and standby mode. The
device automatically enters APS mode following t he
completion of a read cycle. Standby mode is
initiated when the system deselects the device by
driving CE# inactive. Combined, these two power
savings features significantly reduce power
consumption.
The device can be reset by lowering RP# to GND.
This provides CPU-memory reset synchronization
and additional protection against bus noise that
may occur during system reset and power-up/down
sequences (see Section 3.5 and 3.6).
Refer to the
DC Characteristics
Section 4.4 for
complete current and voltage specifications. Refer
to the
AC Characteristics
Sections 4.5 and 4.6, for
read and write performance s pecif ications . Program
and erase times and shown in Section 4.7.
2.0 PRODUCT DESCRIPTION
This section provides device pin descriptions and
package pinouts for the 3 Volt Advanced+ Boot
Block flash memory famil y, whic h is avai lable in 40-
Lead TSOP (x8, Figure 1), 48-lead TSOP (x16,
Figure 2) and 48-bal l µBGA packages (Figures 3
and 4).
2.1 Package Pinouts
In each diagram, upgrade pins from one density to
the next are circled.
E3 VOLT ADVANCED+ BOOT BLOCK
7
PRODUCT PREVIEW
Advanced Boot
40-Lead TSOP
10 mm x 20 mm
TOP VIEW
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
20
19
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
21
22
23
24
A16
A15
A14
A13
A12
A11
A9
A8
WE#
RP#
WP#
A7
A6
A5
A4
A3
A2
A1
VPP
A18
A17
GND
A10
DQ7
DQ6
DQ5
DQ4
VCCQ
VCC
NC
DQ3
DQ2
DQ1
OE#
GND
CE#
A0
A19
A20
DQ0
16M
8M
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pin 38.
Figure 1. 40-Lead TSOP Package for x8 Configurations
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
24
23
22
21
20
19
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
25
26
27
28
29
30
31
32
16
15
7
14
6
13
5
12
4
A
VCCQ
GND
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
OE#
GND
CE#
A
CC
11
3
10
2
9
1
8
0
0
A
A
A
A
A
A
A
A
NC
WE#
RP#
WP#
A
A
A
A
A
A
A
A17
7
6
5
4
3
2
1
15
14
13
12
11
10
9
8
VPP
A19
A20
A18
32M
16M
8M
NOTE:
Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pins 9 and 15.
Figure 2. 48-Lead TSOP Package for x16 Configurations
3 VOLT ADVANCED+ BOOT BLOCK E
8PRODUCT PREVIEW
A13 A11 A8VPP WP# A7A4A
B
C
D
E
F
12345678
A14 A10 WE# RP# A18 A17 A5A2
A15 A12 A9A6A3A1
A16 D14 D5D11 D2D8CE# A0
VCCQ D15 D6D12 D3D9D0GND
GND D7D13 D4VCC D10 D1OE#
A19
16M
A20
32M
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the
upgrade address for the 32-Mbit device.
2. 8-Mbit not available on µBGA* CSP.
Figure 3. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
A14 A12 A8VPP WP# A7A4
A
B
C
D
E
F
12345678
A15 A10 WE# RP# A19 A18 A5A2
A16 A13 A9A6A3A1
A17 NC D5NC D2NC CE# A0
VCCQ A11 D6NC D3NC D0GND
GND D7NC D4VCC NC D1OE#
A20
A21
32M
16M
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the
upgrade address for the 32-Mbit device.
2. 8-Mbit not available on µBGA* CSP.
Figure 4. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
E3 VOLT ADVANCED+ BOOT BLOCK
9
PRODUCT PREVIEW
Table 2. 3 Volt Advanced+ Boot Block Pin Descriptions
Symbol Type Name and Function
A0–A21 INPUT ADDRESS INPUTS for memory addresses. Addresses are internally
latched during a program or erase cycle.
8-Mbit x 8 A[0-19], 16-Mbit x 8 A[0-20], 32-Mbit x 8 A[0-21]
8-Mbit x 16 A[0-18], 16-Mbit x 16 A[0-19], 32-Mbit x 16 A[0-20]
DQ0–DQ7INPUT/OUTPUT DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and
WE# cycle during a Program command. Inputs commands to the
Command User Interface when CE# and WE# are active. Data is
internally latched. Outputs array, configuration and status register data.
The data pins float to tri-state when the chip is de-selected or the outputs
are disabled.
DQ8–DQ15 INPUT/OUTPUT DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and
WE# cycle during a Program command. Data is internally latched.
Outputs array and configuration data. The data pins float to tri-state when
the chip is de-selected. Not included on x8 products.
CE# INPUT CHIP ENABLE: Activates the internal control logic, input buffers,
decoders and sense amplifiers. CE# is active low. CE# high de-selects
the memory device and reduces power consumption to standby levels.
OE# INPUT OUTPUT ENABLE: Enables the device’s outputs through the data
buffers during a read operation. OE# is active low.
WE# INPUT WRITE ENABLE: Controls writes to the Command Register and
memory array. WE# is active low. Addresses and data are latched on
the rising edge of the second WE# pulse.
RP# INPUT RESET/DEEP POWER-DOWN: Uses two voltage levels (VIL, VIH) to
control reset/deep power-down mode.
When RP# is at logic low, the device is in reset/deep power-down
mode, which drives the outputs to High-Z, resets the Write State
Machine, and minimizes current levels (ICCD).
When RP# is at logic high, the device is in standard operation.
When RP# transitions from logic-low to logic-high, the device resets all
blocks to locked and defaults to the read array mode.
WP# INPUT WRITE PROTECT: Controls the lock-down function of the flexible
Locking feature
When WP# is a logic low, the lock-down mechanism is enabled and
blocks marked lock-down cannot be unlocked through software.
When WP# is logic high, the lock-down mechanism is disabled and
blocks previously locked-down are now locked and can be unlocked and
locked through software. After WP# goes low, any blocks previously
marked lock-down revert to that state.
See Section 3.3 for details on block locking.
VCC SUPPLY DEVICE POWER SUPPLY: [2.7 V–3.6 V] Supplies power for device
operations.
3 VOLT ADVANCED+ BOOT BLOCK E
10 PRODUCT PREVIEW
Table 2. 3 Volt Advanced+ Boot Block Pin Descriptions (Continued)
Symbol Type Name and Function
VCCQ INPUT I/O POWER SUPPLY: Supplies power for input/output buffers.
[2.7 V–3.6 V] This input should be tied directly to VCC.
[1.65 V– 2.5 V] Lower I/O power supply voltage available upon request.
Contact your Intel representative for more information.
VPP INPUT/
SUPPLY PROGRAM/ERASE POWER SUPPLY: [1.65 V–3.6 V or 11.4 V–12.6 V]
Operates as a input at logic levels to control complete device protection.
Supplies power for accelerated program and erase operations in 12 V ±
5% range. This pin cannot be left floating.
Lower VPP ≤ VPPLK, to protect all contents against Program and
Erase commands.
Set VPP = VCC for in-system read, program and erase operations. In
this configuration, V
PP
can drop as low as 1.65 V to allow for resistor or
diode drop from the system supply. Note that if VPP is driven by a logic
signal, VIH = 1.65. That is, VPP must remain above 1.65V to perform in-
system flash modifications.
Raise VPP to 12 V ± 5% for faster program and erase in a production
environment. Applying 12 V ± 5% to VPP can only be done for a
maximum of 1000 cycles on the main blocks and 2500 cycles on the
parameter blocks. V
PP
may be connected to 12 V for a total of 80 hours
maximum. See Section 3.4 for details on VPP voltage configurations.
GND SUPPLY GROUND: For all internal circuitry. All ground inputs must be
connected.
NC NO CONNECT: Pin may be driven or left floating.
2.2 Block Organization
The 3 Volt Advanced+ Boot Block is an
asymmetrically-blocked architecture that enables
system integration of code and data within a single
flash device. Each block can be erased
independently of the others up to 100,000 times.
For the address locations of each block, see the
memory maps in Appendix E and F.
2.2.1 PARAMETER BLOCKS
The 3 Volt Advanced+ Boot Block flash memory
architecture includes parameter blocks to facilitate
storage of frequently updated small parameters
(i.e., data that would normally be stored in an
EEPROM). Each device contains eight parameter
blocks of 8-Kbytes/4-Kwords (8,192 bytes/4,096
words).
2.2.2 MAIN BLOCKS
After the parameter blocks, the remainder of the
array is divided into equal size (64-Kword/32-
Kword; 65,536 by tes/32,768 words ) main blocks for
data or code storage. Each 8-Mbit, 16-Mbit, or
32-Mbit device contains 15, 31, or 63 main blocks,
respectively.
E3 VOLT ADVANCED+ BOOT BLOCK
11
PRODUCT PREVIEW
3.0 PRINCIPLES OF OPERATION
The 3 Volt Advanced+ Boot Block flash memory
family utilizes a CUI and automated algorithms to
simplify program and erase operations. The CUI
allows for 100% CMOS
-
level control inputs and
fixed power supplies during erasure and
programming.
The internal WSM completely automates program
and erase operations while t he CUI s ignals the s tart
of an operation and the status register reports
status. The CUI handles the WE# interface to the
data and address latches, as well as system status
requests during WSM operation.
3.1 Bus Operation
The 3 Volt Advanced+ Boot Block flash memory
devices read, program and erase in
-
system via the
local CPU or microcontroller. All bus cycles to or
from the flash memory conform to standard
microcontroller bus cycles. Four control pins dictate
the data flow in and out of the flash component:
CE#, OE#, WE# and RP#. These bus operations
are summarized in Table 3.
3.1.1 READ
The flash memory has four read modes available:
read array, read c onfiguration, read stat us and read
query. These modes are accessible independent of
the VPP voltage. The appropriate read mode
command must be issued to the CUI to enter the
corresponding mode. Upon initial device power
-
up
or after exit from reset, the device automatically
defaults to read array mode.
CE# and OE# must be driven active to obtain data
at the outputs. CE# is the device selection control;
when active it enables the flash memory device.
OE# is the data output control and it drives the
select ed memory data ont o the I /O bus . For al l read
modes, WE# and RP# must be at VIH. Figure 9
illustrates a read cycle.
3.1.2 OUTPUT DISABLE
With OE# at a logic
-
high level (VIH), the device
outputs are disabled. Output pins are placed in a
high
-
impedance state.
3.1.3 STANDBY
Deselecting the device by bringing CE# to a logic
-
high level (V IH) places the devic e in standby mode,
which substantially reduces device power
consumption without any latency for subsequent
read accesses. In standby, outputs are placed in a
high-impedance state independent of OE#. If
deselected during program or erase operation, the
device c ontinues to consume acti ve power until the
program or erase operation is complete.
Table 3. Bus Operations(1)
Mode Note RP# CE# OE# WE# DQ0–7 DQ8-15
Read (Array, Status,
Configuration, or Query) 2-4 VIH VIL VIL VIH DOUT DOUT
Output Disable 2 VIH VIL VIH VIH High Z High Z
Standby 2 VIH VIH X X High Z High Z
Reset 2,7 VIL X X X High Z High Z
Write 2,5-7 VIH VIL VIH VIL DIN DIN
NOTES:
1. 8-bit devices use only DQ[0:7], 16-bit devices use DQ[0:15]
2. X must be VIL, VIH for control pins and addresses.
3. See
DC Characteristics
for VPPLK, VPP1, VPP2, VPP3, voltages.
4. Manufacturer and device codes may also be accessed in read configuration mode (A
1–A20 = 0). See Table 4.
5. Refer to Table 5 for valid DIN during a write operation.
6. To program or erase the lockable blocks, hold WP# at VIH.
7. RP# must be at GND ± 0.2 V to meet the maximum deep power-down current specified.
3 VOLT ADVANCED+ BOOT BLOCK E
12 PRODUCT PREVIEW
3.1.4 RESET
From read mode, RP# at VIL for time tPLPH
deselects the memory, places output drivers in a
high
-
impedance state, and turns off all internal
circuits. After return from reset, a time tPHQV is
required until the initial read access outputs are
valid. A delay (tPHWL or tPHEL) is required after
return from reset before a write can be initiated.
After this wake
-
up interval, normal operation is
restored. The CUI resets to read array mode, and
the stat us regi st er is set to 80H. This c ase i s s hown
in Figure 11A.
If RP# is taken low for time tPLPH during a program
or erase operation, the operation will be aborted
and the memory contents at the aborted location
(for a program) or bloc k (f or an erase) are no l onger
valid, since the data may be partially erased or
written. The abort process goes through the
following sequence: When RP# goes low, the
device shuts down the operation in progress, a
process which takes time tPLRH to complete. After
this time tPLRH, the part will either reset to read
array mode (if RP# has gone high during tPLRH,
Figure 11B) or enter reset mode (if RP# is st ill logic
low after tPLRH, Figure 11C). In both cases, after
returning from an aborted operation, the relevant
time tPHQV or tPHWL/tPHEL must be waited before a
read or write operation is initiated, as discussed in
the previous paragraph. However, in this case,
these delays are referenced to the end of tPLRH
rather than when RP# goes high.
As with any automated device, it is important to
assert RP# during system reset. When the system
comes out of reset, proc essor expec ts to read from
the flash memory. Automated flash memories
provide status information when read during
program or block erase operations. If a CPU reset
occurs with no flash memory reset, proper CPU
initialization may not occur because the flash
memory may be providing status information
instead of array data. Intel’s flash memories allow
proper CPU initialization following a system reset
through the use of the RP# i nput. In this applic ation,
RP# is controlled by the same RESET# signal that
resets the system CPU.
3.1.5 WRITE
A write takes place when both CE# and WE# are
low and OE# is high. Commands are written to the
Command User Interface (CUI) using standard
microprocessor write timings to control flash
operations. The CUI does not occupy an
addressable memory location. The address and
data buses are latched on the rising edge of the
second WE# or CE# pulse, whichever occurs first.
Figure 10 illustrates a program and erase operation.
The available c omm ands are s hown in Table 6, and
Appendix A provides detailed information on
moving between the different modes of operation
using CUI commands.
There are two commands that modify array data:
Program (40H) and Erase (20H). Writing either of
these commands to the internal Command User
Interface (CUI) initiates a sequence of internally
-
timed functions that culminate in the completion of
the requested t ask (unl ess that operation is aborted
by either RP# being driven to VIL for tPLRH or an
appropriate suspend command).
3.2 Modes of Operation
The flash memory has four read modes and two
write modes. The read modes are read array, read
configuration, read status, and read query. The
write modes are program and block erase. Three
additional modes (erase suspend to program , erase
suspend to read and program suspend t o read) are
available only during suspended operations. These
modes are reached using the commands
summarized in Tables 5 and 6. A comprehensive
chart showing the state transitions is in Appendix A.
3.2.1 READ ARRAY
When RP# transitions from VIL (reset) to VIH, the
device default s t o read array mode and will respond
to the read cont rol i nputs (CE#, addres s input s, and
OE#) without any additional CUI commands.
When the device is in read array mode, f our control
signals control data output:
•WE# must be logic high (VIH)
•CE# must be logic low (VIL)
•OE# must be logic low (VIL)
•RP# must be logic high (VIH)
In addition, the addres s of the des ired loc ation m ust
be applied to the address pins. If the device is not
in read array mode, as would be the case after a
program or erase operation, the Read Array
command (FFH) must be written to the CUI before
array reads can take place.
E3 VOLT ADVANCED+ BOOT BLOCK
13
PRODUCT PREVIEW
3.2.2 READ CONFIGURATION
The Read Configuration mode outputs the
manufacturer/device identifier. The device is
switched to this mode by writing the Read
Configuration command (90H). Once in this mode,
read cycles from addresses shown in Table 4
retrieve the specified information. To return to read
array mode, write the Read Array command (FFH).
The Read Configuration mode outputs three types
of information: the manufacturer/device identifier,
the block lock ing stat us, and t he protect ion register.
The device is switched to this mode by writing the
Read Configuration command (90H). Once in this
mode, read cycles from addresses shown in Table
4 retrieve the specified information. To return to
read array mode, write the Read Array command
(FFH). Table 4. Read Configuration Table
Item Address Data
Manufacturer Code (x16) 00000 0089
Manufacturer Code (x8) 00000 89
Device ID (See Appendix G) 00001 ID
Block Lock Configuration2XX002(1) LOCK
• Block Is Unlocked DQ0 = 0
• Block Is Locked DQ0 = 1
• Block Is Locked-Down DQ1 = 1
Protection Register Lock380 PR-LK
Protection Register (x16) 81-88 PR
Protection Register (x8) (App. H) PR
NOTES:
1. “XX” specifies the block address of lock configuration
being read.
2. See Section 3.3.4 for valid lock status outputs.
3. See Section 3.4 for protection register information.
4. Other locations within the configuration address space
are reserved by Intel for future use.
3.2.3 READ STATUS REGISTER
The status register indicates the status of device
operations, and the success/failure of that
operation. The Read Status Register (70H)
command causes subsequent reads to output data
from the status register until another command is
issued. To return to reading from the array , issue a
Read Array (FFH) command.
The status register bits are output on DQ0–DQ7.
The upper byte, DQ8–DQ15, outputs 00H during a
Read Status Register command.
The contents of the status register are latched on
the falling edge of OE# or CE#, whichever occurs
last. This prevents possible bus errors which might
occur if status regi ster content s change while being
read. CE# or OE# must be toggled with each
subsequent status read, or the status register will
not indicate completion of a program or erase
operation.
When the WSM is active, SR.7 will indicate the
status of the WSM; the remaining bits in the status
register indicate whether the WSM was successful
in performing the desired operation (see Table 7).
3.2.3.1 Clearing the Status Register
The WSM sets status bits 1 through 7 to “1,” and
clears bi ts 2, 6 and 7 to “0, ” but cannot cl ear status
bits 1 or 3 t hrough 5 to “0. ” Bec ause bit s 1, 3, 4 and
5 indicate various error conditions, these bits can
only be cl eared through the use of the Clear Status
Register (50H) command. By allowing the system
software to control the resetting of these bits,
several operations may be performed (such as
cumulatively programming several addresses or
erasing multiple blocks in sequence) before readi ng
the stat us register to det ermine if an error oc curred
during that series. Clear the Status Register before
beginning another command or sequence. Note
that the Read Array command must be issued
before data can be read from the memory array.
Resetting the device also clears the status register.
3.2.4 READ QUERY
The Read Query mode outputs Common Flash
Interface (CFI) data when the device is read. This
can be accessed by writing the Read Query
Command (98H). The CFI data structure contains
information such as block size, density, command
set and electric al specificat ions. Once i n this mode,
read cycles from addresses shown in Appendix C
retrieve the specified information. To return to read
array mode, write the Read Array command (FFH).
3 VOLT ADVANCED+ BOOT BLOCK E
14 PRODUCT PREVIEW
3.2.5 PROGRAM MODE
Programming is executed using a two
-
write
sequence. The Program Setup command (40H) is
written t o the CUI fol lowed by a sec ond write which
specifies the address and data to be programmed.
The WSM will execute a sequence of internally
timed events to program desired bits of the
addressed location, then verify the bits are
sufficiently programmed. Programming the memory
results in specific bits within an address location
being changed to a “0.” If the user attempts to
program “1”s, the memory cell contents do not
change and no error occurs.
The status register indicates programming status:
while the program sequence executes, status bit 7
is “0.” The s tatus register c an be polled by t oggling
either CE# or OE#. While programming, the only
valid commands are Read Status Register,
Program Suspend, and Program Resume.
When programming is complete, the Program
Status bits should be checked. If the programming
operation was unsuccessful, bit SR.4 of the status
register is set to indicate a program failure. If SR.3
is set then VPP was not within acceptabl e l i m i ts, and
the WSM di d not execute t he program command. If
SR.1 is set, a program operation was attempt ed on
a locked block and the operation was aborted.
The status register should be cleared before
attempting the next operation. Any CUI instruction
can follow after programming is completed;
however, to prevent inadvertent status register
reads, be sure to reset the CUI to read array mode.
3.2.5.1 Suspending and Resuming
Program
The Program Suspend command halts an in
-
progress program operation so that data can be
read from other locations of memory. Once the
programming process starts, writing the Program
Suspend command to the CUI requests that the
WSM suspend the program sequence (at
predetermined points in the program algorithm).
The device continues to output status register data
after the Program Suspend command is written.
Polling status register bits SR.7 and SR.2 will
determine when the program operation has been
suspended (both will be set to “1”). tWHRH1/tEHRH1
specify the program suspend latency.
A Read Array command can now be written to the
CUI to read data from blocks other than that which
is suspended. The only other valid commands,
while program is suspended, are Read Status
Register, Read Configuration, Read Query, and
Program Resume. After the Program Resume
command is written to the flash memory, the WSM
will continue with the programming process and
status register bit s S R.2 and SR.7 will automat ically
be cleared. The device aut omatically outputs s tatus
register data when read (see Figure 13 in A ppendix
B,
Program Suspend/Resume Flowchart
) after the
Program Resume command is written. VPP must
remain at the same VPP level used for program
while in program suspend mode. RP# must also
remain at VIH.
3.2.6 ERASE MODE
To erase a block , write t he Eras e Set
-
up and Erase
Confirm commands to the CUI, along with an
address identifying the block to be erased. This
address is latched internally when the Erase
Confirm command is issued. Block erasure results
in all bits withi n the block being s et to “1.” Only one
block can be erased at a time. The WSM will
execute a sequence of internally timed events to
program all bits within t he block t o “0,” erase all bits
within t he block to “1,” t hen verify t hat all bits within
the block are sufficiently erased. While the erase
executes, status bit 7 is a “0.”
When the status register indicates that erasure is
complete, check the erase status bit to verify that
the erase operation was successful. If the Erase
operation was unsuccessful, SR.5 of the status
register will be set to a “1,” indicating an erase
failure. If VPP was not within acceptable limits after
the Erase Confirm command was issued, the WS M
will not execute the erase sequence; instead, SR.5
of the status register is set to indicate an erase
error, and SR.3 is set to a “1” to identify that VPP
supply voltage was not within acceptable limits.
After an erase operation, clear the status register
(50H) before attempting the next operation. Any
CUI instruction can follow after erasure is
completed; however, to prevent inadvertent status
register reads, it is advisable to place the flash in
read array mode after the erase is complete.
E3 VOLT ADVANCED+ BOOT BLOCK
15
PRODUCT PREVIEW
3.2.6.1 Suspending and Resuming Erase
Since an erase operation requires on the order of
seconds to compl ete, an Erase Suspend command
is provided to allow erase
-
sequence interruption in
order to read data from or program data to another
block in memory. Once the erase sequence is
started, writing the Erase Suspend com mand to the
CUI suspends the erase sequence at a
predetermined point in the erase algorithm. The
status register will indicate if/when the erase
operation has been suspended. Erase suspend
latency is specified by tWHRH2/tEHRH2.
A Read Array/Program command can now be
written to the CUI to read/program data from/to
blocks other than that which is suspended. This
nested Program command can subsequently be
suspended to read yet another location. The only
valid commands while erase is suspended are
Read Status Register, Read Configuration, Read
Query, Program Setup, Program Resume, Erase
Resume, Lock Bloc k, Unlock Block and Lock -Down
Block . During erase s uspend m ode, t he chip c an be
placed in a ps eudo
-
standby mode by taking CE# to
VIH. This reduces active current consumption.
Erase Resum e cont inues the erase sequenc e when
CE# = VIL. As with the end of a standard erase
operation, the status register must be read and
cleared before the next instruction is issued.
Table 5. Command Bus Definitions
First Bus Cycle Second Bus Cycle
Command Notes Oper Addr Data Oper Addr Data
Read Array 4 Write X FFH
Read Configuration 2, 4 Write X 90H Read IA ID
Read Query 2, 4 Write X 98H Read QA QD
Read Status Register 4 Write X 70H Read X SRD
Clear Status Register 4 Write X 50H
Program 3,4 Write X 40H/10H Write PA PD
Block Erase/Confirm 4 Write X 20H Write BA D0H
Program/Erase Suspend 4 Write X B0H
Program/Erase Resume 4 Write X D0H
Lock Block 4 Write X 60H Write BA 01H
Unlock Block 4 Write X 60H Write BA D0H
Lock-Down Block 4 Write X 60H Write BA 2FH
Protection Program 4 Write X C0H Write PA PD
X = Don’t Care PA = Prog Addr BA = Block Addr IA = Identifier Addr. QA = Query Addr.
SRD = Status Reg. Data PD = Prog Data ID = Identifier Data QD = Query Data
NOTES:
1. Bus operations are defined in Table 3.
2. Following the Read Configuration or Read Query commands, read operations output device configuration or CFI query
information, respectively. See Section 3.2.2 and 3.2.4.
3. Either 40H or 10H command is valid, but the Intel standard is 40H.
4. When writing commands, the upper data bus [DQ8–DQ15] should be either VIL or VIH, to minimize current draw.
3 VOLT ADVANCED+ BOOT BLOCK E
16 PRODUCT PREVIEW
Table 6. Command Codes and Descriptions
Code Device Mode Description
FF Read Array Places device in read array mode, such that array data will be output on the
data pins.
40 Program
Set-Up This is a two
-
cycle command. The first cycle prepares the CUI for a program
operation. The second cycle latches addresses and data information and
initiates the WSM to execute the Program algorithm. The flash outputs status
register data when CE# or OE# is toggled. A Read Array command is required
after programming to read array data. See Section 3.2.5.
20 Erase
Set-Up Prepares the CUI for the Erase Confirm command. If the next command is not
an Erase Confirm command, then the CUI will (a) set both SR.4 and SR.5 of the
status register to a “1,” (b) place the device into the read status register mode,
and (c) wait for another command. See Section 3.2.6.
D0 Erase Confirm
Program/Erase
Resume
Unlock Block
If the previous command was an Erase Set-Up command, then the CUI will
close the address and data latches, and begin erasing the block indicated on the
address pins. During program/erase, the device will respond only to the Read
Status Register, Program Suspend and Erase Suspend commands and will
output status register data when CE# or OE# is toggled.
If a program or erase operation was previously suspended, this command will
resume that operation.
If the previous command was Configuration Set-Up, the CUI will latch the
address and unlock the block indicated on the address pins. If the block had
been previously set to Lock-Down, this operation will have no effect. (Sect. 3.3)
B0 Program
Suspend
Erase
Suspend
Issuing this command will begin to suspend the currently executing
program/erase operation. The status register will indicate when the operation
has been successfully suspended by setting either the program suspend (SR.2)
or erase suspend (SR.6) and the WSM Status bit (SR.7) to a “1” (ready). The
WSM will continue to idle in the SUSPEND state, regardless of the state of all
input control pins except RP#, which will immediately shut down the WSM and
the remainder of the chip if RP# is driven to VIL. See Sections 3.2.5.1 and
3.2.6.1.
70 Read Status
Register This command places the device into read status register mode. Reading the
device will output the contents of the status register, regardless of the address
presented to the device. The device automatically enters this mode after a
program or erase operation has been initiated. See Section 3.2.3.
50 Clear Status
Register The WSM can set the Block Lock Status (SR.1) , VPP Status (SR.3), Program
Status (SR.4), and Erase Status (SR.5) bits in the status register to “1,” but it
cannot clear them to “0.” Issuing this command clears those bits to “0.”
90 Read
Configuration Puts the device into the Read Configuration mode, so that reading the device
will output the manufacturer/device codes or block lock status. Section 3.2.2.
60 Configuration
Set-Up Prepares the CUI for changes to the device configuration, such as block locking
changes. If the next command is not Block Unlock, Block Lock, or Block Lock-
Down, then the CUI will set both the Program and Erase Status register bits to
indicate a command sequence error. See Section 3.3.
01 Lock-Block If the previous command was Configuration Set-Up, the CUI will latch the
address and lock the block indicated on the address pins. (Section 3.3)
E3 VOLT ADVANCED+ BOOT BLOCK
17
PRODUCT PREVIEW
Table 6. Command Codes and Descriptions (Continued)
Code Device Mode Description
2F Lock-Down If the previous command was a Configuration Set-Up command, the CUI will
latch the address and lock-down the block indicated on the address pins.
(Section 3.3)
98 Read
Query Puts the device into the Read Query mode, so that reading the device will
output Common Flash Interface information. See Section 3.2.4 and Appendix C.
C0 Protection
Program
Setup
This is a two-cycle command. The first cycle prepares the CUI for an program
operation to the Protection Register. The second cycle latches addresses and
data information and initiates the WSM to execute the Protection Program
algorithm to the Protection Register. The flash outputs status register data when
CE# or OE# is toggled. A Read Array command is required after programming
to read array data. See Section 3.4.
10 Alt. Prog Set-Up Operates the same as Program Set
-
up command. (See 40H/Program Set-Up)
00 Invalid/
Reserved Unassigned commands that should not be used. Intel reserves the right to
redefine these codes for future functions.
NOTE:
See Appendix A for mode transition information.
3 VOLT ADVANCED+ BOOT BLOCK E
18 PRODUCT PREVIEW
Table 7. Status Register Bit Definition
WSMS ESS ES PS VPPS PSS BLS R
76543210
NOTES:
SR.7 WRITE STATE MACHINE STATUS
1 = Ready (WSMS)
0 = Busy
Check Write State Machine bit first to determine Word
Program or Block Erase completion, before checking
Program or Erase Status bits.
SR.6 = ERASE
-
SUSPEND STATUS (ESS)
1 = Erase Suspended
0 = Erase In Progress/Completed
When Erase Suspend is issued, WSM halts execution
and sets both WSMS and ESS bits to “1.” ESS bit
remains set to “1” until an Erase Resume command is
issued.
SR.5 = ERASE STATUS (ES)
1 = Error In Block Erase
0 = Successful Block Erase
When this bit is set to “1,” WSM has applied the max.
number of erase pulses to the block and is still unable to
verify successful block erasure.
SR.4 = PROGRAM STATUS (PS)
1 = Error in Programming
0 = Successful Programming
When this bit is set to “1,” WSM has attempted but failed
to program a word/byte.
SR.3 = VPP STATUS (VPPS)
1 = VPP Low Detect, Operation Abort
0 = VPP OK
The V
PP
status bit does not provide continuous indication
of VPP
level. The WSM interrogates V
PP level only after
the Program or Erase command sequences have been
entered, and informs the system if VPP has not been
switched on. The VPP
is also checked before the
operation is verified by the WSM. The VPP status bit is
not guaranteed to report accurate feedback between
VPPLK
and V
PP1Min.
SR.2 = PROGRAM SUSPEND STATUS
(PSS)
1 = Program Suspended
0 = Program in Progress/Completed
When Program Suspend is issued, WSM halts execution
and sets both WSMS and PSS bits to “1.” PSS bit
remains set to “1” until a Program Resume command is
issued.
SR.1 = BLOCK LOCK STATUS
1 = Prog/Erase attempted on a locked
block; Operation aborted.
0 = No operation to locked blocks
If a program or erase operation is attempted to one of the
locked blocks, this bit is set by the WSM. The operation
specified is aborted and the device is returned to read
status mode.
SR.0 = RESERVED FOR FUTURE
ENHANCEMENTS (R) This bit is reserved for future use and should be masked
out when polling the status register.
E3 VOLT ADVANCED+ BOOT BLOCK
19
PRODUCT PREVIEW
3.3 Flexible Block Locking
The Intel® 3 Volt Advanced+ Boot Block products
offer an instant, individual block locking scheme
that allows any bloc k to be locked or unlocked wi th
no latency, enabling instant code and data
protection.
This locki ng scheme off ers two levels of protection.
The first level allows software-only control of block
locking (useful for data blocks that change
frequently), while the second level requires
hardware interact ion bef ore lock ing c an be c hanged
(useful for code blocks that change infrequently).
The following sections will discuss the operation of
the locking system. The term “state [XYZ]” will be
used to specify locking states; e.g., “state [001],”
where X = value of WP#, Y = bit DQ1 of the Block
Lock status register, and Z = bit DQ0 of the Block
Lock status register. Table 9 defines all of these
possible locking states.
3.3.1 LOCKING OPERATION
The following concisely summarizes the locking
functionality.
•All blocks power-up locked, then can be
unlocked or locked with the Unlock and Lock
commands.
•The Lock-Down command locks a block and
prevents it from being unlocked when WP# = 0.
When WP# = 1, Lock-Down is overridden
and commands can unlock/lock locked-
down blocks.
When WP# returns to 0, locked-down
blocks return to Lock-Down.
Lock-Down is cleared only when the dev ice
is reset or powered-down.
The locki ng status of each bl ock can set to Locked,
Unlocked, and Lock-Down, each of which will be
described in the following sections. A
comprehensive state table for the locking functions
is shown in Table 9, and a flowchart for locking
operations is shown in Figure 16.
3.3.2 LOCKED STATE
The default status of all blocks upon power-up or
reset is locked (states [001] or [101]). Locked
blocks are fully protected from alteration. Any
program or erase operati ons attempt ed on a locked
block will return an error on bit SR.1 of the status
register. The status of a locked block can be
changed to Unlocked or Lock-Down using the
appropriate software commands. An Unlocked
block can be locked by writing the Lock command
sequence, 60H followed by 01H.
3.3.3 UNLOCKED STATE
Unlocked blocks (states [000], [100], [110]) can be
programmed or erased. All unlocked blocks return
to the Locked state when the device is reset or
powered down. The status of an unl ocked bloc k can
be changed to Locked or Locked-Down using the
appropriate software commands. A Locked block
can be unlocked by writing the Unlock command
sequence, 60H followed by D0H.
3.3.4 LOCK-DOWN STATE
Blocks that are Locked-Down (state [011]) are
protected from program and erase operations (just
like Locked blocks), but their protection status
cannot be changed using software commands
alone. A Loc ked or Unlocked block can be Locked-
down by writing the Lock-Down command
sequence, 60H followed by 2FH. Locked-Down
blocks revert to the Locked state when the device is
reset or powered down.
The Lock-Down function is dependent on the WP#
input pin. When WP# = 0, blocks in Lock-Down
[011] are protected from program, erase, and lock
status changes. When WP# = 1, the Lock-Down
functi on is disabled ([111]) and locked-down blocks
can be individually unlocked by software command
to the [110] state, where they can be erased and
programmed. These blocks can then be relocked
[111] and unlocked [110] as desired while WP#
remains high. When WP# goes low, blocks that
were previously locked-down return to the
Lock-Down state [011] regardless of any changes
made while WP# was high. Device reset or power-
down resets all blocks, including those in Lock-
Down, to Locked state.
3 VOLT ADVANCED+ BOOT BLOCK E
20 PRODUCT PREVIEW
3.3.5 READING A BLOCK’S LOCK STATUS
The lock status of every block can be read in the
Configuration Read mode of the device. To enter
this mode, write 90H to the device. Subsequent
reads at Bl ock Addres s + 00002 will output the loc k
status of that block. The lock status is represented
by the lowest two output pins, DQ0 and DQ1. DQ0
indicat es the Block Loc k /Unlock status and is s et by
the Lock command and cleared by the Unlock
command. It is als o autom atic ally s et when enteri ng
Lock-Down. DQ1 indicat es Lock-Down s tatus and i s
set by the Lock-Down command. It cannot be
cleared by software, only by device res et or power-
down. Table 8. Block Lock Status
Item Address Data
Block Lock Configuration XX002 LOCK
• Block Is Unlocked DQ0 = 0
• Block Is Locked DQ0 = 1
• Block Is Locked-Down DQ1 = 1
3.3.6 LOCKING OPERATIONS DURING
ERASE SUSPEND
Changes to block lock status can be performed
during an erase suspend by using the standard
locking command sequences to unlock, lock, or
lock-down a block. This is useful in the case when
another block needs to be updated while an erase
operation is in progress.
To change block locking during an erase operation,
first write the erase suspend c ommand (B0H), then
check the status register until it indicates that the
erase operation has been suspended. Next write
the desired lock c ommand sequenc e to a block and
the lock status will be changed. After completing
any desired lock, read, or program operations,
resume the erase operat ion with t he Erase Resum e
command (D0H).
If a block is locked or locked-down during a
suspended erase of the same block, the locking
status bits will be changed immediately, but when
the erase is resumed, the erase operation will
complete.
Locking operations cannot be performed during a
program suspend. Refer to Appendix A for detailed
information on which commands are valid during
erase suspend.
3.3.7 STATUS REGISTER ERROR
CHECKING
Using nested locking or program command
sequences during erase suspend can introduce
ambiguity into status register results.
Since locking changes are performed using a two
cycle command sequence, e.g., 60H followed by
01H to lock a block, following the Configuration
Setup command (60H) with an i nval id com mand wil l
produce a lock command error (SR.4 and SR.5 will
be set to 1) in the status register. If a lock
command error occurs during an erase suspend,
SR.4 and SR.5 will be set to 1, and will remain at 1
after the erase is resumed. When erase is
complete, any possible error during the erase
cannot be detected via the status register because
of the previous locking command error.
A similar s ituat ion happens if an error oc curs duri ng
a program operation error nested within an erase
suspend.
E3 VOLT ADVANCED+ BOOT BLOCK
21
PRODUCT PREVIEW
Table 9. Block Locking State Transitions
Current State Erase/Prog Lock Command Input Result [Next State]
WP# DQ1DQ0Name Allowed? Lock Unlock Lock-Down
000 “Unlocked” Yes Goes To [001] No Change Goes To [011]
0 0 1 “Locked” (Default) No No Change Goes To [000] Goes To [011]
0 1 1 “Locked-Down” No No Change No Change No Change
1 0 0 “Unlocked” Yes Goes To [101] No Change Goes To [111]
1 0 1 “Locked” No No Change Goes To [100] Goes To [111]
1 1 0 Lock-Down Disabled Yes Goes To [111] No Change Goes To [111]
1 1 1 Lock-Down Disabled No No Change Goes To [110] No Change
NOTES:
1. In this table, the notation [XYZ] denotes the locking state of a block, where X = WP#, Y = DQ1, and Z = DQ0. The current
locking state of a block is defined by the state of WP# and the two bits of the block lock status (DQ0, DQ1). DQ0 indicates if
a block is locked (1) or unlocked (0). DQ1 indicates if a block has been locked-down (1) or not (0).
2. At power-up or device reset, all blocks default to Locked state [001] (if WP# = 0). Holding WP# = 0 is the recommended
default.
3. The “Erase/Program Allowed?” column shows whether erase and program operations are enabled (Yes) or disabled (No)
in that block’s current locking state.
4. The “Lock Command Input Result [Next State]” column shows the result of writing the three locking commands (Lock,
Unlock, Lock-Down) in the current locking state. For example, “Goes To [001]” would mean that writing the command to a
block in the current locking state would change it to [001].
3.4 128-Bit Protection Register
The Advanced+ Boot Block architecture includes a
128-bit protection register than can be used to
increase the security of a system design. For
example, the number contained in the protection
register c an be used to “mate” the f lash component
with other system components such as the CPU or
ASIC, preventing device substitution. Additional
application information can be found in Intel
application note
AP-657
Designing with the
Advanced+ Boot Block Flash Memory Architecture
.
The 128-bits of the protection register are divided
into two 64-bit segments. One of the segments is
programmed at t he Int el fac tory with a unique 64-bit
number, whic h i s unchangeable. The other segment
is left blank for customer designs to program as
desired. Once the customer segment is
programmed, it can be locked to prevent
reprogramming.
3.4.1 READING THE PROTECTION
REGISTER
The protection register is read in the configuration
read mode. The device i s switched to t his mode by
writing the Read Configuration command (90H).
Once in this mode, read cycles from addresses
shown in Appendix H retrieve the specified
informat ion. To return to read array mode, write t he
Read Array command (FFH).
3.4.2 PROGRAMMING THE PROTECTION
REGISTER
The protection register bits are programmed using
the two-cycle Protection Program command. The
64-bit number is programmed 16 bits at a time for
word-wide parts and eight bits at a time for byte-
wide parts. Firs t writ e the P rotec tion P rogram S etup
command, C0H. The next write to the device will
latch i n address and data and program the s pec i fied
location. The allowable addresses are shown in
Appendix H. See Figure 17 for the
Protection
Register Programming Flowchart
.
3 VOLT ADVANCED+ BOOT BLOCK E
22 PRODUCT PREVIEW
Any attempt to address Protection Program
commands outside the defined protection register
address space will result in a Status Register error
(Program Error bit SR.4 will be set to 1). Attempting
to program or to a previously locked protection
register segment will result in a status register error
(program error bit SR.4 and lock error bit SR.1 will
be set to 1).
3.4.3 LOCKING THE PROTECTION
REGISTER
The user-programmable segment of the protection
register is lockable by programming Bit 1 of the
PR-LOCK location to 0. Bit 0 of this location is
programmed to 0 at the Intel factory to protect the
unique device number. This bit is set using the
Protection Program command to program “FFFD” to
the PR-LOCK location. After these bits have been
programmed, no further changes can be made to
the values stored in the protection register.
Protection Program commands to a locked section
will result in a status register error (Program Error
bit SR.4 and Lock Error bit SR.1 will be set to 1).
Protection register lockout state is not reversible.
4 Words
Factory Programmed
4 Words
User Programmed
1 Word Lock
88H
85H
84H
81H
80H
0645_05
Figure 5. Protection Register Memory Map
3.5 VPP Program and Erase
Voltages
Intel’s 3 Volt Advanced+ Boot Block products
provide in-system writes plus a VPP pin for 12 V
production programming and complete write
protection.
3.5.1 EASY-12 V OPERATION FOR FAST
MANUFACTURING PROGRAMMING
Intel’s 3 Volt Advanced+ Boot Block products
provide in-system programming and erase in the
2.7 V–3.6 V range. For fast production
programming, 3 Volt Advanced+ Boot Block
includes a low-cost, backward-compatible 12 V
programming feature.
When VPP is bet ween 1.65 V and 3.6 V, all program
and erase current is drawn through the VCC pin.
Note that if VPP is driven by a logic signal,
VIH = 1.65 V. That is, VPP m ust remai n above 1.65 V
to perform in-system flash modifications. When VPP
is connected to a 12 V power supply, the device
draws program and erase current directly from the
VPP pin. This eliminates the need for an external
switching transistor to control the voltage VPP.
Figure 6 shows examples of how the flash power
supplies can be configured for various usage
models.
The 12 V VPP mode enhances programming
performance duri ng the short peri od of time t y pi cally
found in manufacturing processes; however, it is
not intended f or ext ended use. 12 V may be appl ied
to VPP during program and erase operations for a
maximum of 1000 cycles on the main blocks and
2500 cycles on the parameter blocks. VPP may be
connect ed to 12 V for a total of 80 hours maxim um.
Stressing the dev i ce beyond these limi ts may cause
permanent damage.
3.5.2 VPP ≤ VPPLK FOR COMPLETE
PROTECTION
In addition to the flexible block locking, the VPP
programming voltage can be held low for absolute
hardware write protection of all blocks in the flash
device. When VPP is below VPPLK, any program or
erase operation will result in a error, prompting the
corresponding status register bit (SR.3) to be set.
3.5.3 VPP USAGE
The VPP pin is used for two f unctions : Absolute data
protection and fast production programming.
When VPP ≤ V
PPLK, then all program or erase
operations to the device are inhibited, providing
absolute data protection.
E3 VOLT ADVANCED+ BOOT BLOCK
23
PRODUCT PREVIEW
V
CC
V
PP
12 V Fast Programming
Complete Write Protection When V
PP
≠
12 V
System Supply
12 V Supply
10 K
Ω
V
CC
V
PP
System Supply
12 V Supply
12 V Fast Programming
Full Array Protection Unavailable
V
CC
V
PP
System Supply
Prot#
(Logic Signal)
V
CC
V
PP
System Supply
Low-Voltage Programming Only
Full Array Protection Unavailable
Low-Voltage Programming Only
Logic Control of Complete Device Protection
(Note 1)
0645_06
NOTE:
1. A resistor can be used if the VCC supply can sink adequate current based on resistor value. See AP-657
Designing with
the Advanced+ Boot Block Flash Memory Architecture
for details.
Figure 6. Example Power Supply Configurations
When VPP is raised to 12 V, such as in a
manufact uring situat ions, t he device di rectly applies
the high voltage to achieve faster program and
erase.
Designing for in-system writes to the flash memory
requires special consideration of power supply
traces by the printed circuit board designer.
Adequate power supply traces, and decoupling
capacitors placed adjacent to the component, will
decrease spikes and overshoots.
3.6 Power Consumption
Intel’s flash devices have a tiered approach to
power savings that can significantly reduce overall
system power consumption. The Automatic Power
Savings (APS) feature reduces power consumption
when the device is selected but idle. If the CE# is
deasserted, the flash enters its standby mode,
where current consumption is even lower. The
combination of these features can minimize
memory power consumption, and therefore, overall
system power consumption.
3.6.1 ACTIVE POWER
(Program/Erase/Read)
With CE# at a logic
-
low level and RP# at a logic
-
high level, the devi ce i s in t he act iv e mode. Ref er to
the DC Characteristic tables for ICC current values.
Active power is the largest contributor to overall
system power consumption. Minimizing the active
current could have a profound effect on system
power consumption, especially for battery
-
operated
devices.
3.6.2 AUTOMATIC POWER SAVINGS (APS)
Automatic Power Savings provides low
-
power
operation during read mode. After dat a is read from
the memory array and the address lines are
quiescent, APS circuitry places the device in a
mode where typical current is comparable to ICCS.
The flash s tays in this stati c st ate with out puts valid
until a new location is read.
3.6.3 STANDBY POWER
With CE# at a logic
-
high level (VIH) and device in
read mode, the flash memory is in standby mode,
which disables much of the device’s circuitry and
3 VOLT ADVANCED+ BOOT BLOCK E
24 PRODUCT PREVIEW
substantially reduces power consumption. Outputs
are placed in a high
-
impedance state independent
of the status of the OE# signal . If CE# transi tions t o
a logic
-
high level during erase or program
operations, the device will continue to perform the
operation and cons ume c orresponding ac tiv e power
until the operation is completed.
Syst em engi neers s hould analy ze t he break down of
standby time versus active time and quantify the
respective power consumption in each mode for
their specific application. This will provide a more
accurat e measure of applic ation
-
specif ic power and
energy requirements.
3.6.4 DEEP POWER-DOWN MODE
The deep power-down mode is activated when
RP# = VIL (GND ± 0.2 V). During read modes , RP#
going low de-selects the memory and places the
outputs in a high impedance state. Recovery from
deep power-down requires a mini mum t ime of tPHQV
for read operations and tPHWL/tPHEL for write
operations.
During program or erase modes, RP# transitioning
low will abort the in-progress operation. The
memory content s of the addres s bei ng programmed
or the block being erased are no longer v alid as t he
data integrity has been compromised by the abort.
During deep power-down, all internal circuits are
switched to a low power savings mode (RP#
transit i oni ng to VIL or turning of f power to t he device
clears the status register).
3.7 Power-Up/Down Operation
The device is protected against accidental block
erasure or programming during power transitions.
Power supply sequencing is not required, since the
device is indifferent as to which power supply, VPP
or VCC, powers-up first.
3.7.1 RP# CONNECTED TO SYSTEM
RESET
The use of RP# during system reset is important
with automated program/erase devices since the
system expects to read from the flash memory
when it comes out of reset. If a CPU reset occurs
without a flash memory reset, proper CPU
initialization will not occur because the flash
memory may be providing status information
instead of array data. Int el recommends c onnecting
RP# to the system CPU RESET# signal to allow
proper CPU/flash initialization following system
reset.
System designers must guard against spurious
writes when VCC voltages are above VLKO. Since
both WE# and CE# must be low for a command
write, dri ving either s ignal to VIH will inhibit writes to
the device. The CUI archit ect ure provides addit ional
protection since alteration of memory contents can
only occur after successful completion of the two-
step command sequences. The device is also
disabled until RP# is brought to VIH, regardless of
the stat e of its c ontrol inputs . By holding the devic e
in reset (RP# connected to system PowerGood)
during power-up/down, inval id bus c ondit ions during
power-up can be masked, providing yet another
level of memory protection.
3.7.2 VCC, VPP AND RP# TRANSITIONS
The CUI latches commands as issued by system
software and is not altered by VPP or CE#
transitions or WSM actions. Its default state upon
power-up, after exit from reset mode or after VCC
transitions above VLKO (Lockout voltage), is read
array mode.
After any program or block erase operation is
complete (even after VPP transitions down to
VPPLK), the CUI must be reset to read array mode
via the Read Array command if access to the flash
memory array is desired.
3.8 Power Supply Decoupling
Flash memory’s power switching characteristics
require careful device decoupling. System
designers should consider three supply current
issues:
1. Standby current levels (ICCS)
2. Read current levels (ICCR)
3. Transient peaks produced by falling and rising
edges of CE#.
Transient c urrent magnit udes depend on the device
outputs’ capacitive and inductive loading. Two-line
control and proper decoupling capacitor selection
will suppress these transient voltage peaks. Each
flash device should have a 0.1 µF ceramic
capacitor connected between each VCC and GND,
and between its VPP and GND. These high-
frequency, inherently low-inductance capacitors
should be placed as close as possible to the
package leads.
E3 VOLT ADVANCED+ BOOT BLOCK
25
PRODUCT PREVIEW
4.0 ABSOLUTE MAXIMUM
RATINGS*
Extended Operating Temperature
During Read.......................... –40 °C to +85 °C
During Block Erase
and Program.......................... –40 °C to +85 °C
Temperature Under Bias ....... –40 °C to +85 °C
Storage Temperature................. –65 °C to +125 °C
Voltage on Any Pin
(except VCC and VPP)
with Respect to GND.............–0.5 V to +5.0 V1
VPP Voltage (for Block
Erase and Program)
with Respect to GND.......–0.5 V to +13.5 V1,2,4
VCC and VCCQ Supply Voltage
with Respect to GND.............–0.2 V to +5.0 V1
Output Short Circuit Current...................... 100 mA3
NOTICE: This datasheet contains preliminary information on
products in the design phase of development. The
specifications are subject to change without notice. Verify
with your local Intel Sales office that you have the latest
datasheet before finalizing a design.
* WARNING: Stressing the device beyond the "Absolute
Maximum Ratings" may cause permanent damage. These
are stress ratings only. Operation beyond the "Operating
Conditions" is not recommended and extended exposure
beyond the "Operating Conditions" may effect device
reliability.
NOTES:
1. Minimum DC voltage is –0.5 V on input/output pins.
During transitions, this level may undershoot to –2.0 V
for periods < 20 ns. Maximum DC voltage on
input/output pins is VCC + 0.5 V which, during
transitions, may overshoot to VCC + 2.0 V for periods
< 20 ns.
2. Maximum DC voltage on VPP may overshoot to +14.0 V
for periods < 20 ns.
3. Output shorted for no more than one second. No more
than one output shorted at a time.
4. VPP voltage is normally 1.65 V–3.6 V. Connection to
supply of 11.4 V–12.6 V can only be done for 1000
cycles on the main blocks and 2500 cycles on the
parameter blocks during program/erase. VPP may be
connected to 12 V for a total of 80 hours maximum.
See Section 3.5 for details.
4.2 Operating Conditions
Table 10. Temperature and Voltage Operating Conditions
Symbol Parameter Notes Min Max Units
TAOperating Temperature –40 +85 °C
VCC1 VCC Supply Voltage 1 2.7 3.6 Volts
VCC2 1 3.0 3.6
VCCQ1 I/O Supply Voltage 1 2.7 3.6 Volts
VPP1 Supply Voltage 1 1.65 3.6 Volts
VPP2 1, 2 11.4 12.6 Volts
Cycling Block Erase Cycling 2 100,000 Cycles
NOTES:
1. VCC and VCCQ must share the same supply when they are in the VCC1 range.
2. Applying VPP = 11.4 V–12.6 V during a program/erase can only be done for a maximum of 1000 cycles on the main blocks
and 2500 cycles on the parameter blocks. VPP may be connected to 12 V for a total of 80 hours maximum. See Section
3.5 for details.
3 VOLT ADVANCED+ BOOT BLOCK E
26 PRODUCT PREVIEW
4.3 Capacitance
TA = 25 °C, f = 1 MHz
Sym Parameter Notes Typ Max Units Conditions
CIN Input Capacitance 1 6 8 pF VIN = 0 V
COUT Output Capacitance 1 10 12 pF VOUT = 0 V
NOTE:
1. Sampled, not 100% tested.
4.4 DC Characteristics
VCC 2.7 V–3.6 V
VCCQ 2.7 V–3.6 V
Sym Parameter Note Typ Max Unit Test Conditions
ILI Input Load Current 1,7 ± 1 µA VCC = VCCMax
VCCQ = VCCQMax
VIN = VCCQ or GND
ILO Output Leakage Current 1,7 0.2
± 10 µA VCC = VCCMax
VCCQ = VCCQMax
VIN = VCCQ or GND
ICCS VCC Standby Current 1 10 25 µA VCC = VCCMax
CE# = RP# = VCC
ICCD VCC Deep Power-Down
Current 1,7 7 20 µA VCC = VCCMax
VCCQ = VCC
Q
Max
VIN = VCCQ or GND
RP# = GND ± 0.2 V
ICCR VCC Read Current 1,5,7 9 18 mA VCC = VCCMax
VCCQ = VCCQMax
OE# = VIH , CE# = VIL
f = 5 MHz, IOUT = 0 mA
Inputs = VIL or VIH
ICCW VCC Program Current 1,4 18 55 mA VPP = VPP1
Program in Progress
815mA
VPP = VPP2 (12 V)
Program in Progress
ICCE VCC Erase Current 1,4 16 45 mA VPP = VPP1
Erase in Progress
815mA
VPP = VPP2 (12 V)
Erase in Progress
ICCES VCC Erase Suspend
Current 1,2,4 10 25 µA CE# = VIH, Erase Suspend in
Progress
ICCWS VCC Program Suspend
Current 1,2,4 10 25 µA CE# = VIH, Program
Suspend in Progress
E3 VOLT ADVANCED+ BOOT BLOCK
27
PRODUCT PREVIEW
4.4 DC Characteristics, Continued
VCC 2.7 V–3.6 V
VCCQ 2.7 V–3.6 V
Sym Parameter Note Typ Max Unit Test Conditions
IPPD V
PP
Deep Power-Down
Current 1 0.2 5 µA RP# = GND ± 0.2 V
IPPS VPP Standby Current 1 0.2 5 µA VPP ≤ VCC
IPPR VPP Read Current 1 2 ±15 µA VPP ≤ VCC
1,4 50 200 µA VPP ≥ VCC
IPPW VPP Program Current 1,4 0.05 0.1 mA VPP =VPP1
Program in Progress
822mA
VPP = VPP2 (12 V)
Program in Progress
IPPE VPP Erase Current 1,4 0.05 0.1 mA VPP = VPP1
Program in Progress
822mA
VPP = VPP2 (12 V)
Program in Progress
IPPES VPP Erase Suspend Current 1,4 0.2 5 µA VPP = VPP1
Erase Suspend in Progress
50 200 µA VPP = VPP2 (12 V)
Erase Suspend in Progress
IPPWS VPP Program Suspend Current 1,4 0.2 5 µA VPP = VPP1
Program Suspend in
Progress
50 200 µA V
PP
= VPP2 (12 V)
Program Suspend in
Progress
3 VOLT ADVANCED+ BOOT BLOCK E
28 PRODUCT PREVIEW
4.4 DC Characteristics, Continued
VCC 2.7 V–3.6 V
VCCQ 2.7 V–3.6 V
Sym Parameter Note Min Max Unit Test Conditions
VIL Input Low Voltage -0.4 0.4 V
VIH Input High Voltage VCCQ -
0.4 V V
VOL Output Low Voltage 7 -0.10 0.10 V VCC = VCCMin
VCCQ = VCCQMin
IOL = 100 µA
VOH Output High Voltage 7 VCCQ -
0.1 V VVCC = VCCMin
VCCQ = VCCQMin
IOH = –100 µA
VPPLK VPP Lock-Out Voltage 3 1.0 V Complete Write Protection
VPP1 VPP during Program / Erase 3 1.65 3.6 V
VPP2 Operations 3,6 11.4 12.6
VLKO VCC Prog/Erase Lock Voltage 1.5 V
VLKO2 VCCQ Prog/Erase Lock
Voltage 1.2 V
NOTES:
1. All currents are in RMS unless otherwise noted. Typical values at nominal VCC, TA = +25 °C.
2. ICCES and ICCWS are specified with device de-selected. If device is read while in erase suspend, current draw is sum of
ICCES and ICCR. If the device is read while in program suspend, current draw is the sum of ICCWS and ICCR.
3. Erase and Program are inhibited when VPP < VPPLK and not guaranteed outside the valid VPP ranges of VPP1 and VPP2.
4. Sampled, not 100% tested.
5. Automatic Power Savings (APS) reduces ICCR to approximately standby levels in static operation (CMOS inputs).
6. Applying VPP = 11.4 V–12.6 V during program/erase can only be done for a maximum of 1000 cycles on the main blocks
and 2500 cycles on the parameter blocks. VPP may be connected to 12 V for a total of 80 hours maximum. See Section
3.4 for details.
7. The test conditions VCCMax, VCCQMax, VCCMin, and VCCQMin refer to the maximum or minimum VCC or VCCQ voltage
listed at the top of each column.
E3 VOLT ADVANCED+ BOOT BLOCK
29
PRODUCT PREVIEW
INPUT OUTPUT
TEST POINTS
V
CCQ
0.0
V
CCQ
2V
CCQ
2
0645_07
Figure 7. Input Range and Measurement Points
Device
Under Test Out
R
1
V
CCQ
C
L
R
2
0645_08
Figure 8. Test Configuration
Test Configuration Component Values Table
Test Configuration CL (pF) R1 (Ω)R
2 (Ω)
2.7 V–3.6 V Standard
Test 50 25K 25K
NOTE:
CL includes jig capacitance.
3 VOLT ADVANCED+ BOOT BLOCK E
30 PRODUCT PREVIEW
4.5 AC Characteristics—Read Operations(1)—Extended Temperature
Product –90 –110
VCC 3.0 V–3.6 V 2.7 V–3.6 V 3.0 V–3.6 V 2.7 V–3.6 V
# Sym Parameter Note Min Max Min Max Min Max Min Max Unit
R1 tAVAV Read Cycle Time 80 90 100 110 ns
R2 tAVQV Address to
Output Delay 80 90 100 110 ns
R3 tELQV CE# to Output
Delay 2 80 90 100 110 ns
R4 tGLQV OE# to Output
Delay 2 30303030ns
R5 tPHQV RP# to Output
Delay 150 150 150 150 ns
R6 tELQX CE# to Output in
Low Z 30000ns
R7 tGLQX OE# to Output in
Low Z 30000ns
R8 tEHQZ CE# to Output in
High Z 3 20202020ns
R9 tGHQZ OE# to Output in
High Z 3 20202020ns
R10 tOH Output Hold from
Address, CE#, or
OE# Change,
Whichever
Occurs First
30000ns
NOTES:
1. See
AC Waveform: Read Operations
.
2. OE# may be delayed up to tELQV–tGLQV after the falling edge of CE# without impact on tELQV.
3. Sampled, but not 100% tested.
4. See Test Configuration (Figure 8).
E3 VOLT ADVANCED+ BOOT BLOCK
31
PRODUCT PREVIEW
Address Stable
Device and
Address Selection
IH
V
IL
V
ADDRESSES (A)
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
CE# (E)
OE# (G)
WE# (W)
DATA (D/Q)
IH
V
IL
V
RP#(P)
OL
V
OH
VHigh Z Valid Output
Data
Valid Standby
High Z
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
Figure 9. AC Waveform: Read Operations
3 VOLT ADVANCED+ BOOT BLOCK E
32 PRODUCT PREVIEW
4.6 AC Characteristics—Write Operations(1)—Extended Temperature
Product -90 -110
3.0 V – 3.6 V 80 100
2.7 V – 3.6 V 90 110
# Symbol Parameter Note Min Min Min Min Unit
W1 tPHWL /
tPHEL
RP# High Recovery to WE#
(CE#) Going Low 150 150 150 150 ns
W2 tELWL /
tWLEL
CE# (WE#) Setup to WE#
(CE#) Going Low 0000ns
W3 tELEH /
tWLWH
WE# (CE#) Pulse Width 4 50 60 70 70 ns
W4 tDVWH /
tDVEH
Data Setup to WE# (CE#)
Going High 2 50506060ns
W5 tAVWH /
tAVEH
Address Setup to WE# (CE#)
Going High 2 50607070ns
W6 tWHEH /
tEHWH
CE# (WE#) Hold Time from
WE# (CE#) High 0000ns
W7 tWHDX /
tEHDX
Data Hold Time from WE#
(CE#) High 20000ns
W8 tWHAX /
tEHAX
Address Hold Time from WE#
(CE#) High 20000ns
W9 tWHWL /
tEHEL
WE# (CE#) Pulse Width High 4 30 30 30 30 ns
W10 tVPWH /
tVPEH
V
PP
Setup to WE# (CE#) Going
High 3 200 200 200 200 ns
W11 tQVVL VPP Hold from Valid SRD 30000ns
NOTES:
1. Write timing characteristics during erase suspend are the same as during write-only operations.
2. Refer to Table 5 for valid AIN or DIN.
3. Sampled, but not 100% tested.
4. Write pulse width (tWP) is defined from CE# or WE# going low (whichever goes low last) to CE# or WE# going high
(whichever goes high first). Hence, tWP = tWLWH = tELEH = tWLEH = tELWH. Similarly, Write pulse width high (tWPH) is defined
from CE# or WE# going high (whichever goes high first) to CE# or WE# going low (whichever goes low first). Hence,
tWPH = tWHWL = tEHEL = tWHEL = tEHWL.
5. See Test Configuration (Figure 8).
E3 VOLT ADVANCED+ BOOT BLOCK
33
PRODUCT PREVIEW
4.7 Erase and Program Timings(1)
VPP 1.65 V–3.6 V 11.4 V–12.6 V
Symbol Parameter Note Typ(1) Max Typ(1) Max Unit
tBWPB 8-KB Parameter Block
Program Time (Byte) 2, 3 0.16 0.48 0.08 0.24 s
4-KW Parameter Block
Program Time (Word) 2, 3 0.10 0.30 0.03 0.12 s
tBWMB 64-KB Main Block
Program Time (Byte) 2, 3 1.2 3.7 0.6 1.7 s
32-KW Main Block
Program Time(Word) 2, 3 0.8 2.4 0.24 1 s
tWHQV1 / tEHQV1 Byte Program Time 2, 3 17 165 8 185 µs
Word Program Time 2, 3 22 200 8 185 µs
tWHQV2 / tEHQV2 8-KB Parameter Block
Erase Time (Byte) 2, 3 1 5 0.8 4.8 s
4-KW Parameter Block
Erase Time (Word) 2, 3 0.5 5 0.4 4.8 s
tWHQV3 / tEHQV3 64-KB Main Block
Erase Time (Byte) 2, 3 1 8 1 7 s
32-KW Main Block
Erase Time (Word) 2, 3 1 8 0.6 7 s
tWHRH1 / tEHRH1 Program Suspend Latency 3 5 10 5 10 µs
tWHRH2 / tEHRH2 Erase Suspend Latency 3 5 20 5 20 µs
NOTES:
1. Typical values measured at TA = +25 °C and nominal voltages.
2. Excludes external system-level overhead.
3. Sampled, but not 100% tested.
3 VOLT ADVANCED+ BOOT BLOCK E
34 PRODUCT PREVIEW
ADDRESSES [A]
CE#(WE#) [E(W)]
OE# [G]
WE#(CE#) [W(E)]
DATA [D/Q]
RP# [P]
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IL
V
IL
V
IN
D
IN
AIN
A
Valid
SRD
IN
D
IH
V
High Z
IH
V
IL
V
V [V]
PP
PPH
V
PPLK
VPPH
V1
2
WP# IL
V
IH
V
IN
D
AB C D E F
W8
W6
W9
W3
W4
W7
W1
W5
W2
W10 W11
(Note 1)
(Note 1)
NOTES:
1. CE# must be toggled low when reading Status Register Data. WE# must be inactive (high) when reading Status Register
Data.
A. VCC Power-Up and Standby.
B. Write Program or Erase Setup Command.
C. Write Valid Address and Data (for Program) or Erase Confirm Command.
D. Automated Program or Erase Delay.
E. Read Status Register Data (SRD): reflects completed program/erase operation.
F. Write Read Array Command.
Figure 10. AC Waveform: Program and Erase Operations
E3 VOLT ADVANCED+ BOOT BLOCK
35
PRODUCT PREVIEW
4.8 Reset Operations
IH
V
IL
V
RP# (P)
PLPH
t
IH
V
IL
V
RP# (P)
PLPH
t
(A) Reset during Read Mode
Abort
Complete PHQV
tPHWL
tPHEL
t
PHQV
tPHWL
tPHEL
t
(B) Reset during Program or Block Erase, <
PLPH
tPLR
H
t
PLRH
t
IH
V
IL
V
RP# (P)
PLPH
t
Abort
Complete PHQV
tPHWL
tPHEL
t
PLRH
t
Deep
Power-
Down
(C) Reset Program or Block Erase, >
PLPH
tPLRH
t
Figure 11. AC Waveform: Reset Operation
Table 11. Reset Specifications(1)
VCC 2.7V–3.6V
Symbol Parameter Notes Min Max Unit
tPLPH RP# Low to Reset during Read
(If RP# is tied to VCC, this specification is not
applicable)
2,4 100 ns
tPLRH1 RP# Low to Reset during Block Erase 3,4 22 µs
tPLRH2 RP# Low to Reset during Program 3,4 12 µs
NOTES:
1. See Section 3.1.4 for a full description of these conditions.
2. If tPLPH is < 100 ns the device may still reset but this is not guaranteed.
3. If RP# is asserted while a block erase or word program operation is not executing, the reset will complete within 100 ns.
4. Sampled, but not 100% tested.
3 VOLT ADVANCED+ BOOT BLOCK E
36 PRODUCT PREVIEW
5.0 ORDERING INFORMATION
T E 2 8 F 3 2 0 C 3 T 9 0
Package
TE = 48-Lead TSOP
GT = 48-Ball µBGA* CSP
Product line designator
for all Intel
®
Flash products
Access Speed (ns)
(90, 110)
Product Family
C3 = Advanced+ Boot Block
V
CC
= 2.7 V - 3.6 V
V
PP
= 2.7 V - 3.6 V or 11.4 V - 12.6 V
Device Density
320 = x16 (32 Mbit)
032 = x8 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
016 = x8 (16 Mbit)
008 = x8 (8 Mbit)
T =
Top Blocking
B =
Bottom Blocking
VALID COMBINATIONS (All Extended Temperature)
40-Lead TSOP 48-Ball µBGA* CSP(1) 48-Lead TSOP 48-Ball µBGA CSP(1)
Extended 32M GT28F032C3T90 TE28F320C3T90 GT28F320C3T90
GT28F032C3B90 TE28F320C3B90 GT28F320C3B90
GT28F032C3T110 TE28F320C3T110 GT28F320C3T110
GT28F032C3B110 TE28F320C3B110 GT28F320C3B110
Extended 16M TE28F016C3T90 GT28F016C3T90 TE28F160C3T90 GT28F160C3T90
TE28F016C3B90 GT28F016C3B90 TE28F160C3B90 GT28F160C3B90
TE28F016C3T110 GT28F016C3T110 TE28F160C3T110 GT28F160C3T110
TE28F016C3B110 GT28F016C3B110 TE28F160C3B110 GT28F160C3B110
Extended 8M TE28F008C3T90 TE28F800C3T90
TE28F008C3B90 TE28F800C3B90
TE28F008C3T110 TE28F800C3T110
TE28F008C3B110 TE28F800C3B110
NOTE:
1. The 48-Ball µBGA package top side mark reads FX X0C3 where XX i s the device density. This mark is identi cal for both
x8 and x16 products. All product shipping boxes or trays provide the correct information regarding bus architecture,
however once the devices are removed from the shipping media, it may be difficult to differentiate based on the top si de
mark. The device identifier (accessible through the D evice ID command: see Section 3.2.2 for further details) enables x8
and x16 µBGA package product differentiation.
E3 VOLT ADVANCED+ BOOT BLOCK
37
PRODUCT PREVIEW
6.0 ADDITIONAL INFORMATION(1,2)
Order Number Document/Tool
210830
1998 Flash Memory Databook
292216
AP-658 Designing for Upgrade to the Advanced+ Boot Block Flash Memory
292215
AP-657 Designing with the Advanced+ Boot Block Flash Memory
Architecture
3 Volt Advanced+ Boot Block Algorithms (‘C’ and assembly)
http://developer.intel.com/design/flcomp
Contact your Intel
Representative
Flash Data Integrator (FDI) Software Developer’s Kit
297874
FDI Interactive: Play with Intel’s Flash Data Integrator on Your PC
NOTES:
1. Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should
contact their local Intel or distribution sales office.
2. Visit Intel’s World Wide Web home page at http://www.Intel.com or http://developer.intel.com for technical documentation
and tools.
3 VOLT ADVANCED+ BOOT BLOCK E
38 PRODUCT PREVIEW
APPENDIX A
WSM CURRENT/NEXT STATES
Command Input (and Next State)
Current
State SR.7 Data
When
Read
Read
Array
(FFH)
Program
Setup
(10/40H)
Erase
Setup
(20H)
Erase
Confirm
(D0H)
Prog/Ers
Suspend
(B0H)
Prog/Ers
Resume
(D0)
Read
Status
(70H)
Clear
Status
(50H)
Read Array “1” Array Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Read Status “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Read
Config. “1” Config Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Read Query “1” CFI Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Lock Setup “1” Status Lock Command Error Lock
(Done) Lock
Cmd. Error Lock
(Done) Lock Cmd. Error
Lock Cmd.
Error “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Lock Oper.
(Done) “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Prot. Prog.
Setup “1” Status Protection Register Program
Prot. Prog.
(Not Done) “0” Status Protection Register Program (Not Done)
Prot. Prog.
(Done) “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Prog. Setup “1” Status Program
Program
(Not Done) “0” Status Program (Not Done) Prog. Sus.
Status Program (Not Done)
Prog. Susp.
Status “1” Status Prog. Sus.
Read Array Program Suspend
Read Array Program
(Not Done) Prog. Sus.
Rd. Array Program
(Not Done) Prog. Sus.
Status Prog. Sus.
Rd. Array
Prog. Susp.
Read Array “1” Array Prog. Sus.
Read Array Program Suspend
Read Array Program
(Not Done) Prog. Sus.
Rd. Array Program
(Not Done) Prog. Sus.
Status Prog. Sus.
Rd. Array
Prog. Susp.
Read Config “1” Config Prog. Sus.
Read Array Program Suspend
Read Array Program
(Not Done) Prog. Sus.
Rd. Array Program
(Not Done) Prog. Sus.
Status Prog. Sus.
Rd. Array
Prog. Susp.
Read Query “1” CFI Prog. Sus.
Read Array Program Suspend
Read Array Program
(Not Done) Prog. Sus.
Rd. Array Program
(Not Done) Prog. Sus.
Status Prog. Sus.
Rd. Array
Program
(Done) “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Erase Setup “1” Status Erase Command Error Erase
(Not Done) Erase
Cmd. Error Erase
(Not Done) Erase Command Error
Erase Cmd.
Error “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
Erase
(Not Done) “0” Status Erase (Not Done) Erase Sus.
Status Erase (Not Done)
Ers. Susp.
Status “1” Status Erase Sus.
Read Array Program Setup Ers. Sus.
Rd. Array Erase Ers. Sus.
Rd. Array Erase Erase Sus.
Status Ers. Sus.
Rd. Array
Erase Susp.
Array “1” Array Erase Sus.
Read Array Program Setup Ers. Sus.
Rd. Array Erase Ers. Sus.
Rd. Array Erase Erase Sus.
Status Ers. Sus.
Rd. Array
Ers. Susp.
Read Config “1” Config Erase Sus.
Read Array Program Setup Ers. Sus.
Rd. Array Erase Ers. Sus.
Rd. Array Erase Erase Sus.
Status Ers. Sus.
Rd. Array
Ers. Susp.
Read Query “1” CFI Erase Sus.
Read Array Program Setup Ers. Sus.
Rd. Array Erase Ers. Sus.
Rd. Array Erase Erase Sus.
Status Ers. Sus.
Rd. Array
Erase
(Done) “1” Status Read Array Program Setup Erase
Setup Read Array Read
Status Read
Array
E3 VOLT ADVANCED+ BOOT BLOCK
39
PRODUCT PREVIEW
APPENDIX A
WSM CURRENT/NEXT STATES (Continued)
Command Input (and Next State)
Current State Read Config
(90H) Read Query
(98H) Lock Setup
(60H) Prot. Prog.
Setup (C0H) Lock Confirm
(01H) Lock Down
Confirm
(2FH)
Unlock
Confirm
(D0H)
Read Array Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Read Status Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Read Config. Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Read Query Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Lock
Setup Locking Command Error Lock Operation (Done)
Lock Cmd.
Error Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Lock Operation
(Done) Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Prot. Prog.
Setup Protection Register Program
Prot. Prog.
(Not Done) Protection Register Program (Not Done)
Prot. Prog.
(Done) Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Prog. Setup Program
Program
(Not Done) Program (Not Done)
Prog. Susp.
Status Prog. Susp.
Read Config. Prog. Susp.
Read Query Program Suspend Read Array Program
(Not Done)
Prog. Susp.
Read Array Prog. Susp.
Read Config. Prog. Susp.
Read Query Program Suspend Read Array Program
(Not Done)
Prog. Susp.
Read Config. Prog. Susp.
Read Config. Prog. Susp.
Read Query Program Suspend Read Array Program
(Not Done)
Prog. Susp.
Read Query. Prog. Susp.
Read Config. Prog. Susp.
Read Query Program Suspend Read Array Program
(Not Done)
Program
(Done) Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Erase
Setup Erase Command Error Erase
(Not Done)
Erase Cmd.
Error Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
Erase
(Not Done) Erase (Not Done)
Erase Suspend
Status Erase Suspend
Read Config. Erase Suspend
Read Query Lock Setup Erase Suspend Read Array Erase
(Not Done)
Erase Suspend
Array Erase Suspend
Read Config. Erase Suspend
Read Query Lock Setup Erase Suspend Read Array Erase
(Not Done)
Eras Sus. Read
Config Erase Suspend
Read Config. Erase Suspend
Read Query Lock Setup Erase Suspend Read Array Erase
(Not Done)
Eras Sus. Read
Query Erase Suspend
Read Config. Erase Suspend
Read Query Lock Setup Erase Suspend Read Array Erase
(Not Done)
Ers.(Done) Read Config. Read Query Lock Setup Prot. Prog.
Setup Read Array
3 VOLT ADVANCED+ BOOT BLOCK E
40 PRODUCT PREVIEW
APPENDIX B
PROGRAM/ERASE FLOWCHARTS
Start
Write 40H
Program Address/Data
Read Status Register
SR.7 = 1?
Full Status
Check if Desired
Program Complete
Read Status Register
Data (See Above)
V
PP
Range Error
Programming Error
Attempted Program to
Locked Block - Aborted
Program Successful
SR.3 =
SR.4 =
SR.1 =
FULL STATUS CHECK PROCEDURE
Bus Operation
Write
Write
Standby
Repeat for subsequent programming operations.
SR Full Status Check can be done after each program or after a sequence of
program operations.
Write FFH after the last program operation to reset device to read array mode.
Bus Operation
Standby
Standby
SR.3 MUST be cleared, if set during a program attempt, before further
attempts are allowed by the Write State Machine.
SR.1, SR.3 and SR.4 are only cleared by the Clear Staus Register Command,
in cases where multiple bytes are programmed before full status is checked.
If an error is detected, clear the status register before attempting retry or other
error recovery.
No
Yes
1
0
1
0
1
0
Command
Program Setup
Program
Comments
Data = 40H
Data = Data to Program
Addr = Location to Program
Check SR.7
1 = WSM Ready
0 = WSM Busy
Command Comments
Check SR.3
1 = V
PP
Low Detect
Check SR.1
1 = Attempted Program to
Locked Block - Program
Aborted
Read Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Standby Check SR.4
1 = V
PP
Program Error
Figure 12. Automated Word Programming Flowchart
E3 VOLT ADVANCED+ BOOT BLOCK
41
PRODUCT PREVIEW
Start
Write B0H
Read Status Register
No
Comments
Data = B0H
Addr = X
Data = FFH
Addr = X
SR.7 =
SR.2 =
1
Write FFH
Read Array Data
Program Completed
Done
Reading
Yes
Write FFHWrite D0H
Program Resumed Read Array Data
0
1
Read array data from block
other than the one being
programmed.
Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Addr = X
Check SR.7
1 = WSM Ready
0 = WSM Busy
Check SR.2
1 = Program Suspended
0 = Program Completed
Data = D0H
Addr = X
Bus
Operation
Write
Write
Read
Read
Standby
Standby
Write
Command
Program
Suspend
Read Array
Program
Resume
0
Write 70H
Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Addr = X
Write
Write
Write
Read
Read
Standby
Standby
Write
Data=70H
Addr=X
Command
Program
Suspend
Read Array
Program
Resume
Program
Suspend
Read Status
Read Array
Program
Resume
Figure 13. Program Suspend/Resume Flowchart
3 VOLT ADVANCED+ BOOT BLOCK E
42 PRODUCT PREVIEW
Start
Write 20H
Write D0H and
Block Address
Read Status Register
SR.7 =
Full Status
Check if Desired
Block Erase Complete
FULL STATUS CHECK PROCEDURE
Bus Operation
Write
Write
Standby
Repeat for subsequent block erasures.
Full Status Check can be done after each block erase or after a sequence of
block erasures.
Write FFH after the last write operation to reset device to read array mode.
Bus Operation
Standby
SR. 1 and 3 MUST be cleared, if set during an erase attempt, before further
attempts are allowed by the Write State Machine.
SR.1, 3, 4, 5 are only cleared by the Clear Staus Register Command, in cases
where multiple bytes are erased before full status is checked.
If an error is detected, clear the status register before attempting retry or other
error recovery.
No Yes
Suspend Erase
Suspend
Erase Loop
1
0
Standby
Command
Erase Setup
Erase Confirm
Comments
Data = 20H
Addr = Within Block to Be
Erased
Data = D0H
Addr = Within Block to Be
Erased
Check SR.7
1 = WSM Ready
0 = WSM Busy
Command Comments
Check SR.3
1 = V
PP
Low Detect
Check SR.4,5
Both 1 = Command Sequence
Error
Read Status Register
Data (See Above)
V
PP
Range Error
Command Sequence
Error
Block Erase
Successful
SR.3 =
SR.4,5 =
1
0
1
0
Block Erase ErrorSR.5 = 1
0
Attempted Erase of
Locked Block - Aborted
SR.1 = 1
0
Read Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Standby Check SR.5
1 = Block Erase Error
Standby Check SR.1
1 = Attempted Erase of
Locked Block - Erase Aborted
Figure 14. Automated Block Erase Flowchart
E3 VOLT ADVANCED+ BOOT BLOCK
43
PRODUCT PREVIEW
Start
Write B0H
Read Status Register
No
Comments
Data = B0H
Addr = X
Data = FFH
Addr = X
SR.7 =
SR.6 =
1
Write FFH
Read Array Data
Erase Completed
Done
Reading
Yes
Write FFHWrite D0H
Erase Resumed Read Array Data
0
1
Read array data from block
other than the one being
erased.
Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Addr = X
Check SR.7
1 = WSM Ready
0 = WSM Busy
Check SR.6
1 = Erase Suspended
0 = Erase Completed
Data = D0H
Addr = X
Bus
Operation
Write
Write
Read
Read
Standby
Standby
Write
Command
Program
Suspend
Read Array
Program
Resume
0
Write 70H
Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Addr = X
Write
Write
Write
Read
Read
Standby
Standby
Write
Data=70H
Addr=X
Command
Program
Suspend
Read Array
Program
Resume
Erase Suspend
Read Status
Read Array
Erase Resume
Figure 15. Erase Suspend/Resume Flowchart
3 VOLT ADVANCED+ BOOT BLOCK E
44 PRODUCT PREVIEW
Start
Write 60H
(Configuration Setup)
Read Status Register
No
Comments
Data = 60H
Addr = X
SR.4, SR.5 =
Write 90H
(Read Configuration)
Read Block Lock Status
Locking
Change
Confirmed?
Locking Change
Complete
0,0
Check Status Register
80H = no error
30H = Lock Command
Sequence Error
Bus
Operation
Write
Command
Program
Suspend
1,1
Write
01H, D0H, or 2FH
Status Register Data
Addr = X
Write
Write
Read
(Optional)
Standby
(Optional)
Data= 01H (Lock Block)
D0H (Unlock Block)
2FH (Lockdown Block)
Addr=Within block to lock
Command
Program
Suspend
Config. Setup
Lock, Unlock,
or Lockdown
Write 70H
(Read Status Register)
Lock Command
Sequence Error
Data = 70H
Addr = X
Write
(Optional) Read
Status Register
Data = 90H
Addr = X
Write
(Optional) Read
Configuration
Block Lock Status Data
Addr = Second addr of block
Read
(Optional) Block Lock
Status
Confirm Locking Change on
DQ
1
, DQ
0
. (See Block Locking
State Table for valid
combinations.)
Standby
(Optional)
Figure 16. Locking Operations Flowchart
E3 VOLT ADVANCED+ BOOT BLOCK
45
PRODUCT PREVIEW
Start
Write C0H
(Protection Reg.
Program Setup)
Write Protect. Register
Address/Data
Read Status Register
SR.7 = 1?
Full Status
Check if Desired
Program Complete
Read Status Register
Data (See Above)
V
PP
Range Error
Protection Register
Programming Error
Attempted Program to
Locked Register -
Aborted
Program Successful
SR.3, SR.4 =
SR.1, SR.4 =
SR.1, SR.4 =
FULL STATUS CHECK PROCEDURE
Bus Operation
Write
Write
Standby
Protection Program operations can only be addressed within the protection
register address space. Addresses outside the defined space will return an
error.
Repeat for subsequent programming operations.
SR Full Status Check can be done after each program or after a sequence of
program operations.
Write FFH after the last program operation to reset device to read array mode.
Bus Operation
Standby
Standby
SR.3 MUST be cleared, if set during a program attempt, before further
attempts are allowed by the Write State Machine.
SR.1, SR.3 and SR.4 are only cleared by the Clear Staus Register Command,
in cases of multiple protection register program operations before full status is
checked.
If an error is detected, clear the status register before attempting retry or other
error recovery.
No
Yes
1, 1
0,1
1,1
Command
Protection Program
Setup
Protection Program
Comments
Data = C0H
Data = Data to Program
Addr = Location to Program
Check SR.7
1 = WSM Ready
0 = WSM Busy
Command Comments
SR.1 SR.3 SR.4
0 1 1 V
PP
Low
0 0 1 Prot. Reg.
Prog. Error
1 0 1 Register
Locked:
Aborted
Read Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Standby
Figure 17. Protection Register Programming Flowchart
3 VOLT ADVANCED+ BOOT BLOCK E
46 PRODUCT PREVIEW
APPENDIX C
COMMON FLASH INTERFACE QUERY STRUCTURE
This appendix defines the data s tructure or “database” returned by t he Common Flash Interface (CFI) Query
command. System sof tware should pars e t hi s structure to gai n critical inform ation suc h as block siz e, densit y,
x8/x16, and electrical specifications. Once this information has been obtained, the software will know which
command sets to use to enable flash writes, block erases, and otherwise control the flash component. The
Query is part of an overall specification for multiple command set and control interface descriptions called
Common Flash Interface, or CFI.
C.1 QUERY STRUCTURE OUTPUT
The Query “databas e” allows system software to gain critical information for controlling the flash component.
This section describes the device’s CFI-compliant interface that allows the host system to access Query data.
Query data are always present ed on the lowes t-order dat a output s (DQ0-7) only . The num erical off set value i s
the address relative t o the max imum bus wi dth supported by the devi ce. On thi s fami ly of dev ices, the Query
table device starting address is a 10h, which is a word address for x16 devices or a byte address for x8
devices.
For a word-wide (x16) device, the first two bytes of the Query structure, “Q”, ”R”, and “Y” in ASCII, appear on
the low byte at word addresses 10h, 11h, and 12h. This CFI-compliant device outputs 00H data on upper
bytes. Thus, the device outputs ASCII “Q” in the low byte (DQ0-7) and 00h in the high byte (DQ8-15).
At Query addres ses containing t wo or more bytes of inf ormation, the leas t significant data byt e is present ed
at the lower address, and the most significant data byte is presented at the higher address.
In all of the following tables, addresses and data are represented in hexadecimal notation, so the “h” suffix
has been dropped. In addition, since the upper byte of word-wide devices is always “00h,” the leading “00”
has been dropped from t he table notat i on and onl y the lower by te value is shown. Any x16 device out puts can
be assumed to have 00h on the upper byte in this mode.
Table C1. Summary of Query Structure Output As a Function of Device and Mode
Device Location Quer
y
Data
(Hex, ASCII)
8-Mbit x8/8-Mbit x 16, 16-Mbit x 8/16-Mbit x 16 10 51 “Q”
(Word or Byte Addresses) 11 52 “R”
12 59 “Y”
E3 VOLT ADVANCED+ BOOT BLOCK
47
PRODUCT PREVIEW
Table C2. Example of Query Structure Output of x16 and x8 Devices
Device
Address Word Addressin
g
:
Query Data B
y
te
Address
Byte Addressing:
Query Data
A16–A1D15–D0A7–A0D7–D0
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
...
0051h “Q”
0052h “R”
0059h “Y”
P_IDLO PrVendor ID# (Lo byte)
P_IDHI PrVendor ID# (HI byte)
PLO PrVendor TblAddr (Lo)
PHI PrVendor TblAddr (Hi)
A_IDLO AltVendor ID# (Lo)
A_IDHI AltVendor ID# (Hi)
...
10h
11h
12h
13h
14h
15h
16h
17h
18h
...
51h “Q”
52h “R”
59h “Y”
P_IDLO PrVendor ID# (Lo)
P_IDHI PrVendor ID# (Hi)
PLO PrVndr TblAdr (Lo)
PHI PrVndr TblAdr (Hi)
A_IDLO AltVndr ID# (Lo)
A_IDHI AltVndr ID# (Hi)
C.2 QUERY STRUCTURE OVERVIEW
The Query command causes the flash component to display the Common Flash Interface (CFI) Query
structure or “database.” The structure sub-sections and address locations are summarized in Table D3.
The following sections describe the Query structure sub-sections in detail.
Table C3. Query Structure(1)
Offset Sub-Section Name Description
00h Manufacturer Code
01h Device Code
02-0Fh
Reserved Reserved for vendor-specific information
10h CFI Query Identification String Command set ID and vendor data offset
1Bh System Interface Information Device timing & voltage information
27h Device Geometry Definition Flash device layout
P(3) Primary Intel
-
specific Extended Query
table Vendor
-
defined additional information
specific to the Primary Vendor Algorithm
NOTES:
1. Refer to Section D.1 and Table D1 for the detailed definition of offset address as a function of device bus width and mode.
2. BA = The beginning location of a Block Address (e.g., 08000h is the beginning location of block 1 when the block size is
32 Kword).
3. Offset 15 defines “P” which points to the Primary Intel
-
specific Extended Query Table.
3 VOLT ADVANCED+ BOOT BLOCK E
48 PRODUCT PREVIEW
C.3 BLOCK LOCK STATUS
The Block Lock Status indicates the locking settings of a block.
Table C4. Block Lock Status Register
Offset Len
g
th
(bytes) Description C3
x16 Device/Mode
(BA+2)h(1) 01h Block Lock Status BA+2:
(see Section 3.3)
NOTE:
1. BA = The beginning location of a Block Address (i.e., 008000h is the beginning location of block 1 in word mode.)
C.4 CFI QUERY IDENTIFICATION STRING
The Identification String provides verification that the component supports the Common Flash Interface
specif ication. A dditionally , it indic ates which v ersion of the spec and which vendor
-
specif ied command set(s )
is (are) supported.
Table C5. CFI Identification
Offset Len
g
th
(Bytes) Description 8-Mbit, 16-Mbit, 32-Mbit
10h 03h Query
-
Unique ASCII string “QRY“ 10: 51
11: 52
12: 59
13h 02h Primary Vendor Command Set and Control Interface
ID Code
16
-
bit ID Code for Vendor
-
Specified Algorithms
13: 03
14: 00
15h 02h Address for Primary Algorithm Extended Query
Table
Offset value =
P
= 35h
15: 35
16: 00
17h 02h Alternate Vendor Command Set and Control
Interface ID Code
Second Vendor
-
Specified Algorithm Supported
Note: 0000h means none exists
17: 00
18: 00
19h 02h Address for Secondary Algorithm Extended Query
Table
Note: 0000h means none exists
19: 00
1A: 00
E3 VOLT ADVANCED+ BOOT BLOCK
49
PRODUCT PREVIEW
C.5 SYSTEM INTERFACE INFORMATION
The following device information can be useful in optimizing system interface software
Table C6. System Interface Information
Offset Len
g
th
(bytes) Description 8-Mbit, 16-Mbit, 32-Mbit
1Bh 01h VCC Logic Supply Minimum Program/Erase Voltage
bits 7–4 BCD volts
bits 3–0 BCD 100 mv
1B:27
1Ch 01h VCC Logic Supply Maximum Program/Erase Voltage
bits 7–4 BCD volts
bits 3–0 BCD 100 mv
1C:36
1Dh 01h VPP [Programming] Supply Minimum Program/Erase
Voltage
bits 7–4 HEX volts
bits 3–0 BCD 100 mv
1D:B4
1Eh 01h VPP [Programming] Supply Maximum
Program/Erase Voltage
bits 7–4 HEX volts
bits 3–0 BCD 100 mv
1E:C6
1Fh 01h Typical Time
-
Out per Single Byte/Word Program,
2N µ-sec 1F:05
20h 01h Typical Time
-
Out for Max. Buffer Write, 2N µ-sec 20:00
21h 01h Typical Time
-
Out per Individual Block Erase,
2N m-sec 21:0A
22h 01h Typical Time
-
Out for Full Chip Erase, 2N m-sec 22:00
23h 01h Maximum Time
-
Out for Byte/Word Program,
2N Times Typical 23:04
24h 01h Maximum Time
-
Out for Buffer Write, 2N Times
Typical 24:00
25h 01h Maximum Time
-
Out per Individual Block Erase,
2N Times Typical 25:03
26h 01h Maximum Time
-
Out for Chip Erase, 2N Times
Typical 26:00
3 VOLT ADVANCED+ BOOT BLOCK E
50 PRODUCT PREVIEW
C.6 DEVICE GEOMETRY DEFINITION
This field provides critical details of the flash device geometry.
Table C7. Device Geometry Definition
Offset Length (bytes) Description
27h 01h Device Size = 2N in Number of Bytes
28h 02h Flash Device Interface Description
value meaning
28:00, 29:00 x8 asynch
28:01,29:00 x16 asynch
2Ah 02h Maximum Number of Bytes in Write Buffer = 2N
2Ch 01h Number of Erase Block Regions within Device:
bits 7–0 = x = # of Erase Block Regions
2Dh 04h Erase Block Region Information
bits 15–0 = y, Where y+1 = Number of Erase Blocks of Identical
Size within Region
bits 31–16 = z, Where the Erase Block(s) within This Region are
(z) × 256 Bytes
Device Geometry Definition
Offset 8 Mbit 16 Mbit 32 Mbit
-T -B -T -B -T -B
27h 27:14 27:14 27:15 27:15 27:16 27:16
28h 28:00 (008)
29:00 (008)
28:01 (800)
29:00 (800)
28:00 (008)
29:00 (008)
28:01 (800)
29:00 (800)
28:00 (016)
29:00 (016)
28:01 (160)
29:00 (160)
28:00 (016)
29:00 (016)
28:01 (160)
29:00 (160)
28:00 (032)
29:00 (032)
28:01 (320)
29:00 (320)
28:00 (032)
29:00 (032)
28:01 (320)
29:00 (320)
2Ah 2A:00
2B:00 2A:00
2B:00 2A:00
2B:00 2A:00
2B:00 2A:00
2B:00 2A:00
2B:00
2Ch 2C:02 2C:02 2C:02 2C:02 2C:02 2C:02
2Dh 2D:0E
2E:00
2F:00
30:01
31:07
32:00
33:20
34:00
2D:07
2E:00
2F:20
30:00
31:0E
32:00
33:00
34:01
2D:1E
2E:00
2F:00
30:01
31:07
32:00
33:20
34:00
2D:07
2E:00
2F:20
30:00
31:1E
32:00
33:00
34:01
2D:3E
2E:00
2F:00
30:01
31:07
32:00
33:20
34:00
2D:07
2E:00
2F:20
30:00
31:3E
32:00
33:00
34:01
E3 VOLT ADVANCED+ BOOT BLOCK
51
PRODUCT PREVIEW
C.7 INTEL-SPECIFIC EXTENDED QUERY TABLE
Certain fl as h features and commands are opt i onal . The Intel
-
Specif ic Ext ended Query t able s peci fies thi s and
other similar types of information.
Table C8. Primary-Vendor Specific Extended Query
Offset(1) Len
g
th
(bytes) Description 8-Mbit, 16-Mbit,
32-Mbit
(P)h 03h Primary Extended Query Table
Unique ASCII String “PRI“ 35: 50
36: 52
37: 49
(P+3)h 01h Major Version Number, ASCII 38: 31
(P+4)h 01h Minor Version Number, ASCII 39: 30
(P+5)h 04h Optional Feature & Command Support
bit 0 Chip Erase Supported (1=yes, 0=no)
bit 1 Suspend Erase Supported (1=yes, 0=no)
bit 2 Suspend Program Supported (1=yes, 0=no)
bit 3 Lock/Unlock Supported (1=yes, 0=no)
bit 4 Queued Erase Supported (1=yes, 0=no)
bits 5–31 reserved for future use; undefined bits
are “0”
3A: 06
3B: 00
3C: 00
3D: 00
(P+9)h 01h Supported Functions after Suspend
Read Array, Status, and Query are always supported
during suspended Erase or Program operation. This field
defines other operations supported.
bit 0 Program Supported after Erase Suspend
(1=yes, 0=no)
bits 1-7 reserved for future use; undefined bits are “0”
3E: 01
(P+A)h 02h Block Lock Status
Defines which bits in the Block Status Register section of
the Query are implemented.
bit 0 Block Lock Status Register Lock/Unlock bit
(bit 0) active
(1=yes, 0=no)
bit 1 Block Lock Status Register Lock-Down bit
(bit 1) active
(1=yes, 0=no)
Bits 2—15 reserved for future use. Undefined bits
are 0.
3F: 03
40: 00
3 VOLT ADVANCED+ BOOT BLOCK E
52 PRODUCT PREVIEW
Table C8. Primary-Vendor Specific Extended Query (Continued)
Offset(1) Len
g
th
(bytes) Description 8-Mbit, 16-Mbit,
32-Mbit
(P+C)h 01h VCC Logic Supply Optimum Program/Erase voltage
(highest performance)
bits 7–4 BCD value in volts
bits 3–0 BCD value in 100 mv
41: 27
(P+D)h 01h VPP [Programming] Supply Optimum Program/Erase
voltage
bits 7–4 HEX value in volts
bits 3–0 BCD value in 100 mv
42: C0
(P+E)h
Reserved Reserved for future use
NOTE:
1. The variable P is a pointer which is defined at offset 15h in Table D5.
E3 VOLT ADVANCED+ BOOT BLOCK
53
PRODUCT PREVIEW
APPENDIX D
ARCHITECTURE BLOCK DIAGRAM
Output
Multiplexer
4-KWord
Parameter Block
32-KWord
Main Block
32-KWord
Main Block
4-KWord
Parameter Block
Y-Gating/Sensing Write State
Machine Program/Erase
Voltage Switch
Data
Comparator
Status
Register
Identifier
Register
Data
Register
I/O Logic
Address
Latch
Address
Counter
X-Decoder
Y-Decoder
Power
Reduction
Control
Input Buffer
Output Buffer
GND
V
CC
V
PP
CE#
WE#
OE#
RP#
Command
User
Interface
Input Buffer
A
0
-A
19
DQ
0
-DQ
15
V
CCQ
WP#
TEMP
3 VOLT ADVANCED+ BOOT BLOCK E
54 PRODUCT PREVIEW
APPENDIX E
WORD-WIDE MEMORY MAP DIAGRAMS
8-Mbit, 16-Mbit, and 32-Mbit Word-Wide Memory Addressing
Top Boot Bottom Boot
Size
(KW) 8M 16M 32M Size
(KW)
8M 16M 32M
4 7F000-7FFFF FF000-FFFFF 1FF000-1FFFFF 32 1F8000-1FFFFF
4 7E000-7EFFF FE000-FEFFF 1FE000-1FEFFF 32 1F0000-1F7FFF
4 7D000-7DFFF FD000-FDFFF 1FD000-1FDFFF 32 1E8000-1EFFFF
4 7C000-7CFFF FC000-FCFFF 1FC000-1FCFFF 32 1E0000-1E7FFF
4 7B000-7BFFF FB000-FBFFF 1FB000-1FBFFF 32 1D8000-1DFFFF
4 7A000-7AFFF FA000-FAFFF 1FA000-1FAFFF 32 1D0000-1D7FFF
4 79000-79FFF F9000-F9FFF 1F9000-1F9FFF 32 1C8000-1CFFFF
4 78000-78FFF F8000-F8FFF 1F8000-1F8FFF 32 1C0000-1C7FFF
32 70000-77FFF F0000-F7FFF 1F0000-1F7FFF 32 1B8000-1BFFFF
32 68000-6FFFF E8000-EFFFF 1E8000-1EFFFF 32 1B0000-1B7FFF
32 60000-67FFF E0000-E7FFF 1E0000-1E7FFF 32 1A8000-1AFFFF
32 58000-5FFFF D8000-DFFFF 1D8000-1DFFFF 32 1A0000-1A7FFF
32 50000-57FFF D0000-D7FFF 1D0000-1D7FFF 32 198000-19FFFF
32 48000-4FFFF C8000-CFFFF 1C8000-1CFFFF 32 190000-197FFF
32 40000-47FFF C0000-C7FFF 1C0000-1C7FFF 32 188000-18FFFF
32 38000-3FFFF B8000-BFFFF 1B8000-1BFFFF 32 180000-187FFF
32 30000-37FFF B0000-B7FFF 1B0000-1B7FFF 32 178000-17FFFF
32 28000-2FFFF A8000-AFFFF 1A8000-1AFFFF 32 170000-177FFF
32 20000-27FFF A0000-A7FFF 1A0000-1A7FFF 32 168000-16FFFF
32 18000-1FFFF 98000-9FFFF 198000-19FFFF 32 160000-167FFF
32 10000-17FFF 90000-97FFF 190000-197FFF 32 158000-15FFFF
32 08000-0FFFF 88000-8FFFF 188000-18FFFF 32 150000-157FFF
32 00000-07FFF 80000-87FFF 180000-187FFF 32 148000-14FFFF
32 78000-7FFFF 178000-17FFFF 32 140000-147FFF
32 70000-77FFF 170000-177FFF 32 138000-13FFFF
32 68000-6FFFF 168000-16FFFF 32 130000-137FFF
32 60000-67FFF 160000-167FFF 32 128000-12FFFF
32 58000-5FFFF 158000-15FFFF 32 120000-127FFF
32 50000-57FFF 150000-157FFF 32 118000-11FFFF
32 48000-4FFFF 148000-14FFFF 32 110000-117FFF
32 40000-47FFF 140000-147FFF 32 108000-10FFFF
32 38000-3FFFF 138000-13FFFF 32 100000-107FFF
32 30000-37FFF 130000-137FFF 32 F8000-FFFFF 0F8000-0FFFFF
32 28000-2FFFF 128000-12FFFF 32 F0000-F7FFF 0F0000-0F7FFF
32 20000-27FFF 120000-127FFF 32 E8000-EFFFF 0E8000-0EFFFF
32 18000-1FFFF 118000-11FFFF 32 E0000-E7FFF 0E0000-0E7FFF
32 10000-17FFF 110000-117FFF 32 D8000-DFFFF 0D8000-0DFFFF
32 08000-0FFFF 108000-10FFFF 32 D0000-D7FFF 0D0000-0D7FFF
32 00000-07FFF 100000-107FFF 32 C8000-CFFFF 0C8000-0CFFFF
E3 VOLT ADVANCED+ BOOT BLOCK
55
PRODUCT PREVIEW
8-Mbit, 16-Mbit, and 32-Mbit Word-Wide Memory Addressing (Continued)
Top Boot Bottom Boot
Size
(KW) 8M 16M 32M Size
(KW)
8M 16M 32M
32 0F8000-0FFFFF 32 C0000-C7FFF 0C0000-0C7FFF
32 0F0000-0F7FFF 32 B8000-BFFFF 0B8000-0BFFFF
32 0E8000-0EFFFF 32 B0000-B7FFF 0B0000-0B7FFF
32 0E0000-0E7FFF 32 A8000-AFFFF 0A8000-0AFFFF
32 0D8000-0DFFFF 32 A0000-A7FFF 0A0000-0A7FFF
32 0D0000-0D7FFF 32 98000-9FFFF 098000-09FFFF
32 0C8000-0CFFFF 32 90000-97FFF 090000-097FFF
32 0C0000-0C7FFF 32 88000-8FFFF 088000-08FFFF
32 0B8000-0BFFFF 32 80000-87FFF 080000-087FFF
32 0B0000-0B7FFF 32 78000-7FFFF 78000-7FFFF 78000-7FFFF
32 0A8000-0AFFFF 32 70000-77FFF 70000-77FFF 70000-77FFF
32 0A0000-0A7FFF 32 68000-6FFFF 68000-6FFFF 68000-6FFFF
32 098000-09FFFF 32 60000-67FFF 60000-67FFF 60000-67FFF
32 090000-097FFF 32 58000-5FFFF 58000-5FFFF 58000-5FFFF
32 088000-08FFFF 32 50000-57FFF 50000-57FFF 50000-57FFF
32 080000-087FFF 32 48000-4FFFF 48000-4FFFF 48000-4FFFF
32 078000-07FFFF 32 40000-47FFF 40000-47FFF 40000-47FFF
32 070000-077FFF 32 38000-3FFFF 38000-3FFFF 38000-3FFFF
32 068000-06FFFF 32 30000-37FFF 30000-37FFF 30000-37FFF
32 060000-067FFF 32 28000-2FFFF 28000-2FFFF 28000-2FFFF
32 058000-05FFFF 32 20000-27FFF 20000-27FFF 20000-27FFF
32 050000-057FFF 32 18000-1FFFF 18000-1FFFF 18000-1FFFF
32 048000-04FFFF 32 10000-17FFF 10000-17FFF 10000-17FFF
32 040000-047FFF 32 08000-0FFFF 08000-0FFFF 08000-0FFFF
32 038000-03FFFF 4 07000-07FFF 07000-07FFF 07000-07FFF
32 030000-037FFF 4 06000-06FFF 06000-06FFF 06000-06FFF
32 028000-02FFFF 4 05000-05FFF 05000-05FFF 05000-05FFF
32 020000-027FFF 4 04000-04FFF 04000-04FFF 04000-04FFF
32 018000-01FFFF 4 03000-03FFF 03000-03FFF 03000-03FFF
32 010000-017FFF 4 02000-02FFF 02000-02FFF 02000-02FFF
32 008000-00FFFF 4 01000-01FFF 01000-01FFF 01000-01FFF
32 000000-007FFF 4 00000-00FFF 00000-00FFF 00000-00FFF
3 VOLT ADVANCED+ BOOT BLOCK E
56 PRODUCT PREVIEW
APPENDIX F
BYTE-WIDE MEMORY MAP DIAGRAMS
Byte-Wide Memory Addressing
Top Boot Bottom Boot
Size
(KB) 8M 16M 32M Size
(KB) 8M 16M 32M
8 FE000-FFFFF 1FE000-1FFFFF 3FE000-3FFFFF 64 3F0000-3FFFFF
8 FC000-FDFFF 1FC000-1FDFFF 3FC000-3FDFFF 64 3E0000-3EFFFF
8 FA000-FBFFF 1FA000-1FBFFF 3FA000-3FBFFF 64 3D0000-3DFFFF
8 F8000-F9FFF 1F8000-1F9FFF 3F8000-3F9FFF 64 3C0000-3CFFFF
8 F6000-F7FFF 1F6000-1F7FFF 3F6000-3F7FFF 64 3B0000-3BFFFF
8 F4000-F5FFF 1F4000-1F5FFF 3F4000-3F5FFF 64 3A0000-3AFFFF
8 F2000-F3FFF 1F2000-1F3FFF 3F2000-3F3FFF 64 390000-39FFFF
8 F0000-F1FFF 1F0000-1F1FFF 3F0000-3F1FFF 64 380000-38FFFF
64 E0000-EFFFF 1E0000-1EFFFF 3E0000-3EFFFF 64 370000-37FFFF
64 D0000-DFFFF 1D0000-1DFFFF 3D0000-3DFFFF 64 360000-36FFFF
64 C0000-CFFFF 1C0000-1CFFFF 3C0000-3CFFFF 64 350000-35FFFF
64 B0000-BFFFF 1B0000-1BFFFF 3B0000-3BFFFF 64 340000-34FFFF
64 A0000-AFFFF 1A0000-1AFFFF 3A0000-3AFFFF 64 330000-33FFFF
64 90000-9FFFF 190000-19FFFF 390000-39FFFF 64 320000-32FFFF
64 80000-8FFFF 180000-18FFFF 380000-38FFFF 64 310000-31FFFF
64 70000-7FFFF 170000-17FFFF 370000-37FFFF 64 300000-30FFFF
64 60000-6FFFF 160000-16FFFF 360000-36FFFF 64 2F0000-2FFFFF
64 50000-5FFFF 150000-15FFFF 350000-35FFFF 64 2E0000-2EFFFF
64 40000-4FFFF 140000-14FFFF 340000-34FFFF 64 2D0000-2DFFFF
64 30000-3FFFF 130000-13FFFF 330000-33FFFF 64 2C0000-2CFFFF
64 20000-2FFFF 120000-12FFFF 320000-32FFFF 64 2B0000-2BFFFF
64 10000-1FFFF 110000-11FFFF 310000-31FFFF 64 2A0000-2AFFFF
64 00000-0FFFF 100000-10FFFF 300000-30FFFF 64 290000-29FFFF
64 0F0000-0FFFFF 2F0000-2FFFFF 64 280000-28FFFF
64 0E0000-0EFFFF 2E0000-2EFFFF 64 270000-27FFFF
64 0D0000-0DFFFF 2D0000-2DFFFF 64 260000-26FFFF
64 0C0000-0CFFFF 2C0000-2CFFFF 64 250000-25FFFF
64 0B0000-0BFFFF 2B0000-2BFFFF 64 240000-24FFFF
64 0A0000-0AFFFF 2A0000-2AFFFF 64 230000-23FFFF
64 090000-09FFFF 290000-29FFFF 64 220000-22FFFF
64 080000-08FFFF 280000-28FFFF 64 210000-21FFFF
64 070000-07FFFF 270000-27FFFF 64 200000-20FFFF
64 060000-06FFFF 260000-26FFFF 64 1F0000-1FFFFF 1F0000-1FFFFF
64 050000-05FFFF 250000-25FFFF 64 1E0000-1EFFFF 1E0000-1EFFFF
64 040000-04FFFF 240000-24FFFF 64 1D0000-1DFFFF 1D0000-1DFFFF
64 030000-03FFFF 230000-23FFFF 64 1C0000-1CFFFF 1C0000-1CFFFF
64 020000-02FFFF 220000-22FFFF 64 1B0000-1BFFFF 1B0000-1BFFFF
64 010000-01FFFF 210000-21FFFF 64 1A0000-1AFFFF 1A0000-1AFFFF
64 000000-00FFFF 200000-20FFFF 64 190000-19FFFF 190000-19FFFF
E3 VOLT ADVANCED+ BOOT BLOCK
57
PRODUCT PREVIEW
Byte-Wide Memory Addressing (Continued)
Top Boot Bottom Boot
Size
(KB) 8M 16M 32M Size
(KB) 8M 16M 32M
64 1F0000-1FFFFF 64 180000-18FFFF 180000-18FFFF
64 1E0000-1EFFFF 64 170000-17FFFF 170000-17FFFF
64 1D0000-1DFFFF 64 160000-16FFFF 160000-16FFFF
64 1C0000-1CFFFF 64 150000-15FFFF 150000-15FFFF
64 1B0000-1BFFFF 64 140000-14FFFF 140000-14FFFF
64 1A0000-1AFFFF 64 130000-13FFFF 130000-13FFFF
64 190000-19FFFF 64 120000-12FFFF 120000-12FFFF
64 180000-18FFFF 64 110000-11FFFF 110000-11FFFF
64 170000-17FFFF 64 100000-10FFFF 100000-10FFFF
64 160000-16FFFF 64 F0000-FFFFF 0F0000-0FFFFF 0F0000-0FFFFF
64 150000-15FFFF 64 E0000-EFFFF 0E0000-0EFFFF 0E0000-0EFFFF
64 140000-14FFFF 64 D0000-DFFFF 0D0000-0DFFFF 0D0000-0DFFFF
64 130000-13FFFF 64 C0000-CFFFF 0C0000-0CFFFF 0C0000-0CFFFF
64 120000-12FFFF 64 B0000-BFFFF 0B0000-0BFFFF 0B0000-0BFFFF
64 110000-11FFFF 64 A0000-AFFFF 0A0000-0AFFFF 0A0000-0AFFFF
64 100000-10FFFF 64 90000-9FFFF 090000-09FFFF 090000-09FFFF
64 0F0000-0FFFFF 64 80000-8FFFF 080000-08FFFF 080000-08FFFF
64 0E0000-0EFFFF 64 70000-7FFFF 070000-07FFFF 070000-07FFFF
64 0D0000-0DFFFF 64 60000-6FFFF 060000-06FFFF 060000-06FFFF
64 0C0000-0CFFFF 64 50000-5FFFF 050000-05FFFF 050000-05FFFF
64 0B0000-0BFFFF 64 40000-4FFFF 040000-04FFFF 040000-04FFFF
64 0A0000-0AFFFF 64 30000-3FFFF 030000-03FFFF 030000-03FFFF
64 090000-09FFFF 64 20000-2FFFF 020000-02FFFF 020000-02FFFF
64 080000-08FFFF 64 10000-1FFFF 010000-01FFFF 010000-01FFFF
64 070000-07FFFF 8 0E000-0FFFF 00E000-00FFFF 00E000-00FFFF
64 060000-06FFFF 8 0C000-0DFFF 00C000-00DFFF 00C000-00DFFF
64 050000-05FFFF 8 0A000-0BFFF 00A000-00BFFF 00A000-00BFFF
64 040000-04FFFF 8 08000-09FFF 008000-009FFF 008000-009FFF
64 030000-03FFFF 8 06000-07FFF 006000-007FFF 006000-007FFF
64 020000-02FFFF 8 04000-05FFF 004000-005FFF 004000-005FFF
64 010000-01FFFF 8 02000-03FFF 002000-003FFF 002000-003FFF
64 000000-00FFFF 8 00000-01FFF 000000-001FFF 000000-001FFF
3 VOLT ADVANCED+ BOOT BLOCK E
58 PRODUCT PREVIEW
APPENDIX G
DEVICE ID TABLE
Read Configuration Addresses and Data
Item Address Data
Manufacturer Code x16 00000 0089
x8 00000 89
Device Code
8-Mbit x 16-T x16 00001 88C0
8-Mbit x 16-B x16 00001 88C1
16-Mbit x 16-T x16 00001 88C2
16-Mbit x 16-B x16 00001 88C3
32-Mbit x 16-T x16 00001 88C4
32-Mbit x 16-B x16 00001 88C5
8-Mbit x 8-T x8 00001 C0
8-Mbit x 8-B x8 00001 C1
16-Mbit x 8-T x8 00001 C2
16-Mbit x 8-B x8 00001 C3
32-Mbit x 8-T x8 00001 C4
32-Mbit x 8-B x8 00001 C5
NOTE: Other locations within the configuration address space are reserved by Intel for future use.
E3 VOLT ADVANCED+ BOOT BLOCK
59
PRODUCT PREVIEW
APPENDIX H
PROTECTION REGISTER ADDRESSING
Word-Wide Protection Register Addressing
Word Use A7 A6 A5 A4 A3 A2 A1 A0
LOCK Both 10000000
0 Factory 10000001
1 Factory 10000010
2 Factory 10000011
3 Factory 10000100
4 User 10000101
5 User 10000110
6 User 10000111
7 User 10001000
Byte-Wide Protection Register Addressing
Byte Use A11 A7 A6 A5 A4 A3 A2 A1 A0
LOCK Both 010000000
0 Factory 010000001
1 Factory 110000001
2 Factory 010000010
3 Factory 110000010
4 Factory 010000011
5 Factory 110000011
6 Factory 010000100
7 Factory 110000100
8 User 010000101
9 User 110000101
10 User 010000110
11 User 110000110
12 User 010000111
13 User 110000111
14 User 010001000
15 User 110000000
