NJL5901R-1
-
1
–
21-Feb-06
1.6
(0.29)(0.42) 0.45
0.2
0.07
0.6
0.07
(0.42)
1.3
±0.1
±0.1
±0.15
±0.15
(0.42)
±0.15
0.45
0.40.4 0.07
0.07
±0.1
±0.1
±0.1
0.2
±0.1
LED Center
PTx Center
COBP PHOTO REFLECTOR
GENERAL DESCRIPTION
NJL5901R-1 is the compact surface mount t ype photo reflector, which miniaturized outsid e dimension compared with the
current COBP reflector, NJL5901R. Compared with the NJL5901R, the mounting area of NJL5901R-1 is reduced to 5 4%.
Moreover, the output current is 400µA typ. and is raised 180% compared with the NJL5901R.
FEATURES OUTLINE (ty p.) Unit : mm
• Miniature, thi n package : 1.3mm × 1.6mm × 0.6mm
• High output : 400µA typ.
• Pb free solde r re-flowing permitted : 260°C, 2times
• Built-in visible light cut-off filter
APPLICATIONS
• Detectin g the location of Lens unit for Cellular Phone’ s
camera module
• Detecting the location of CD/DVD optical pickup head
• Detecting the rotation of various motors
• Paper ed ge detection and mechanism timing detection of
facsimile, copy machine etc
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER SYMBOL RATINGS UNIT
Emitter
Forward Current (Continuous)
Reverse Volt age (Continuous)
Power Dissipation
I
F
VR
PD
30
6
45
mA
V
mW
Detector
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
Collector Power Dissipation
V
CEO
VECO
IC
PC
16
6
10
25
V
V
mA
mW
Coupled
Total Power Dissipation
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
P
tot
T
opr
T
stg
T
sol
60
-20 to +85
-40 to +85
260
mW
°C
°C
°C
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER SYMBOL TEST CONDITION MIN TYP MAX UNIT
Emitter
Forward Voltage
Reverse Current
Capacitance
V
F
IR
Ct
IF=4mA
VR=6V
VR=0V,f=1MHz
—
—
—
—
—
25
1.3
10
—
V
µA
pF
Detector
Dark Current
Collector-Emitter Voltage
I
CEO
VCEO
VCE=10V
IC=100µA
—
16
—
—
0.2
—
µA
V
Coupled
Output Current
Operating Dark Current *1
Rise Time
Fall Time
I
O
ICEOD
tr
t
f
IF=4mA,VCE=2V,d=0.7mm
IF=4mA,VCE=2V
IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm
IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm
280
—
—
—
—
—
30
30
700
5
—
—
µA
µA
µs
µs
*1 Icoed may increase according to the periphery situation of the surface mounted product.
0.65 0.35 0.65
0.36 0.40.4
A:anode
K:cathode
C:collector
E:emitter PCB pattern
K
E
C
A
NJL5901R-1
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2
–
21-Feb-06
Aluminum
Evaporation
Surface
Light Sealed Dark Box
IF Io
VCE
IF
VCE
Iceod
0.7mm
I
F
R
D
P.G
Input
Output
tr tf
10%
90%
Aluminum
Evapolation
Surface
Io
V+
R
L
OSC
Aluminum
Evaporation
Surface
Aluminum
Evaporation
Surface
0.7mm 0.7mm
l=0mm l=0mm
Direction X Direction Y
OUTPUT CURRENT TEST CONDITION DARK CURRENT TEST CONDITION
The infrared signal from LED is reflected at the aluminum surface
RESPONSE TIME TEST CONDITION
EDGE RESPONSE TEST CONDITION
NJL5901R-1
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3
–
21-Feb-06
Power Dissipation vs. Tempe rature
0
10
20
30
40
50
60
70
80
90
100
020406080100
Ambient Temperature Ta(°C)
Power Dissipation P(mW)
Forward Current vs. Temperat ure
0
5
10
15
20
25
30
35
40
45
50
0 20406080100
Ambient Temperature Ta(°C)
Forward Current IF(mA)
Forward Voltage vs. Forward Current
1
10
100
012
Forward Voltage VF(V)
Forward Curre nt IF(mA)
Forward Voltage vs. Temperature
0.8
1
1.2
1.4
1.6
-40-200 20406080100
Ambient Temperature Ta(°C)
Forward Voltage VF(V)
Dark Current vs. Temperature
0.001
0.01
0.1
1
10
100
1000
10000
-40-200 20406080100
Ambient Temperature Ta(°C)
Dark Current Iceo(nA)
Operating Dark Current vs. Temperatur e
0.01
0.1
1
10
-40-200 20406080100
Ambient Temperature Ta(°C)
Operating Dark Current Iceod(µA)
TYPICAL CHARACTERISTICS
Total Power
Dissipation
Collector Power
Dissipation
IF=30mA
IF=4mA
VCE=10V IF=4mA , VCE=2V
NJL5901R-1
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4
–
21-Feb-06
Output Current vs. Forward Current
(Ta=25°C)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
0246810
Forward Current IF(mA)
Output Current Io(µA)
Output Current v s. T emp eratu re
0
20
40
60
80
100
120
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta(°C)
Relative Output Current Io/Io(25°C)(%)
Output Characteristics (Ta=25°C)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
012345
Collector-Emitter Voltage Vce(V)
Output Current Io(µA)
Vce Saturation (Ta=25°C)
0
0.1
0.2
0.3
0.4
0.5
0.1 1 10
Forward Current IF(mA)
Collector-Emitter Voltage Vce(V)
Output Current vs. Distance (Ta=25°C)
0
20
40
60
80
100
120
012345
Reflector Distance d(mm)
Relative Output Current Io/Io(max.)(%)
Output Current vs. Edge Distance (Ta=25°C)
0
20
40
60
80
100
120
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Edge Distance l(mm)
Relative Output Current Io/Io(max.)(%)
IF=4mA , VCE=2V
VCE=2V , d=0.7mm
IF=4mA
IF=2mA
IF=6mA
IF=8mA
IF=10mA
Io=100µA
Io=300µA
Io=400µA
Io=500µA
IF=4mA , VCE=2V
IF=4mA , VCE=2V , d=0.7mm
Direction X
Direction Y
NJL5901R-1
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5
–
21-Feb-06
Spectral Response (Ta=25°C)
0
20
40
60
80
100
120
500 600 700 800 900 1000
Wavelength λ(nm)
Relative Response (%)
Switching Time vs. Load Resistance
(Ta=25°C)
1
10
100
1000
0.1 1 10
Load Resista nce RL(kΩ)
Switchi ng Time t(
µ
s)
VCE=2V
VCE=2V , Io=100µA
tr
tf
td
NJL5901R-1
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6
–
21-Feb-06
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
The surface temperat ure of plastic p ackage is lower than 260 °C.
Soldering Method
1) Reflow Method
Soldering to be done within twice under the recommended condition mentioned below
2) Reflow Method (In case of infrared heating)
The temperature profile is same as the above
Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its surface
temperature will be higher than the lead.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
Solder the device in short time as soon as possible.
If the device is heated and kept in high temperature for lon ger time, it s reliability would be af fected.
2. Cleaning
Avoid washing the device af ter soldering by re flow method.
3. Attention in handling
1) T reat not to touch the lens surface.
2) Avoid dust and any other foreign materials on the lens surf ace such as paint , bonding material, etc.
3) Never to apply reverse voltage (VEC) of more than 6V on the photo transistor when measuring the characteristics or
adjusting the system. If applied, it causes to low er the sensitivity.
4) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device t o the optimum position to the object.
4. Storage
Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the moisture at
the reflow process, the device is cont ained in deaeration p ackaging.
a b c g
e
150°C
260°C
Room
Temp.
f
180°C
230°C
220°C d
a : Temperature ramping rate : 1 to 4°C/s
b : Pre-heating temperature
time : 150 to 180°C
: 60 to 120s
c : Temperature ramping rate : 1 to 4°C /s
d : 220°C or hi gher time : Shorter than 60s
e : 230°C or hi gher time : Shorter than 40s
f : Peak temperature : Lower than 260°C
g : Temperature ramping rate : 1 to 6°C /s
The temperature of the surface of mold p ackage
NJL5901R-1
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7
–
21-Feb-06
8.5
φ
13
φ
60
φ
180
Label
0.25
0.85
Cover Tape
Carrier Tape
4.0
2.0
1.45
4.0
3.5
8.0
1.75
1.8
φ
1.5
NJL5901R-1 Taping Specification (TE1)
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic .
2) Cover tape i s used with electro statistically prevention treated Polyester type t ape.
3) Product tapi ng direction is to place the index mark against the pull out direction of the t ape as in the drawing.
Pull out direction of tape UNIT : mm
2. Taping Strength
Pull up the cover tape from the carrier t ape, and w hen the opening angle comes around 10 to 15°, and the peeling-off
strength is to be within the pow er of 20 to 70g.
3. Packaging
1) The t aped product s are to be rolled up o n the t aping reel as on the drawing.
2) Rolling up specification
2-1) S t art rolling : Carrier tape o pen space more than 20 Piec es.
2-2) End of rolling : Carrier tape o pen space more than 20 Piec es, and 2 round of reel sp ace at the cover t ape only.
3) Taping quantity : 2,000 Pieces.
4) Seal off af ter putting each reels in a damp proof bag w ith silica gel (3 bags).
[CAUTION]
The specific ations on t his data book are o nly
given for i nformation , without any guar antee
as regards either mi stakes or omissi ons. The
applicatio n circuits i n this dat abook ar e
described only to show represent ative usag es
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
