RT9292
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DS9292-02 April 2011 www.richtek.com
Ordering Information
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Pin Configurations
WDFN-8L 2x2
(TOP VIEW)
General Description
The RT9292 is a high frequency and high efficiency
asynchronous boost converter for WLED driving
a pplication. It integrates a 28V MOSFET to support up to
6 White LEDs for panel backlighting and OLED power
applications. Besides, an internal soft start function is
integrated to reduce the inrush current. Moreover, the
device operates with 1MHz fixed switching frequency for
the use of small external components and better EMI
performance. For lower voltage a pplication, the IC provides
a 26V over voltage protection function for using the low-
cost and small output capacitors. The LED current is
initially set by the extern al sense resistor (RSET), and the
feedback voltage for the RT9292 series will be 104mV
and 330mV respectively . The RT9292 is available in TSOT-
23-6 and WDFN-8L 2x2 tiny packages to achieve best
solution for PCB space and total BOM cost saving
considerations.
Small Package, High Performance, Asyn-Boost Converter
for 6 White LEDs
Marking Information
For marking information, conta ct our sales representative
directly or through a Richtek distributor located in your
area.
Features
zz
zz
zVIN Operating Range : 2.5V to 5.5V
zz
zz
z28V Internal Power N-MOSFET Switch
zz
zz
zWide Range PWM Dimming (200Hz to 200kHz)
zz
zz
zMinimize the External Component Counts
zz
zz
zInternal Soft Start
zz
zz
zInternal Compensation
zz
zz
zUnder Voltage Protection
zz
zz
zOver Voltage Protection
zz
zz
zOver Temperature Protection
zz
zz
zInternal Schottky Diode
zz
zz
zSmall TSOT-23-6 and 8-Lead WDFN Packages
zz
zz
zRoHS Compliant and Halogen Free
Applications
zCellular Phones
zDigital Ca meras
zPDAs a nd Smart Phones a nd MP3 and OLED.
zPortable Instruments
TSOT-23-6
GND
VIN LX
NC
FB
VOUT 7
6
5
1
2
3
4
8
EN GND
9
GND
LX GND FB
VIN VOUT EN
4
23
56
RT9292 Package Type
J6 : TSOT-23-6
QW : WDFN-8L 2x2 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Feedback Reference Voltage
B : 104mV
D : 330mV
RT9292
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Function Block Diagram
Functional Pin Description
Pin No.
RT9292□GJ6 RT9292□GQW Pin Name Pin Function
1 8 LX Switching Pin.
2 1, 5,
9 (Exposed pad) GND Ground Pin. T he exposed pad must be soldered to a large
PCB and connected to GND for maximum power dissipation.
3 6 FB Feed Back Pin, put a resistor to GND to set the current.
4 4 E N Chip Enable (Active High).
5 3 V OUT Output Voltage Pin.
6 2 VIN Input Supply.
-- 7 NC No Internal Connection, keep floating.
Typical Application Circuit
Logic Control,
Minimum On
Time Current-
Sense
OCP
Driver
-
+
+
Slope
Compensation
+
-
PWM
EA
GM
LPF 10ms Shutdown
Enable
Logic
OVP
OTP
UVLO
VREF 1uA
LX
GND
FB
VOUT
VIN
EN
VF = 0.7V
VIN
EN FB
VOUT
GND
RT9292
CIN
2.2uF
RSET
Chip Enable
L
22uH
COUT
0.22uF
6 WLEDs
LX
Optional
RT9292
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DS9292-02 April 2011 www.richtek.com
Electrical Characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Input Vo ltage VIN 2.5 -- 5.5 V
Under Voltage Lock Out V UVLO 2.0 2.2 2.4 V
UVLO Hysteresis -- 0.1 -- V
Qu iescent Curr ent IQ FB = 1.5V, No Switching -- 400 600 uA
Supply Current IIN FB = 0V, Switching -- 2 mA
Shu tdo wn Curren t ISHDN V
EN < 0.4V -- 1 4 uA
Line Regulation VIN = 3.0 to 4.3V -- 1 -- %
Load Regulation 1mA to 20mA -- 1 -- %
Operation Frequency fOSC 0.75 1.0 1.25 MHz
Maximum Duty Cycle 90 92 -- %
RT9292B 94 104 114
Feedback
Reference
Voltage RT9292D VREF 313 330 347
mV
On Resistance RDS(ON) -- 0.5 1.0 Ω
Logic-High Voltage VIH 1.4 -- --
EN
Threshold Logic-Low Voltage V IL -- -- 0.5
V
To be continued
Recommended Operating Conditions (Note 4)
zJunction T emperature Range-------------------------------------------------------------------------------------------- −40°C to 125°C
zAmbient T emperature Range-------------------------------------------------------------------------------------------- −40°C to 85°C
Absolute Maximum Ratings (Note 1)
zSupply Input Voltage, VIN ------------------------------------------------------------------------------------------------ −0.3V to 6V
zLX, VOUT Pins ------------------------------------------------------------------------------------------------------------- −0.3V to 28V
zOther Pins------------------------------------------------------------------------------------------------------------------- −0.3V to 6V
zPower Dissipation, PD @ TA = 25°C
TSOT-23-6 ------------------------------------------------------------------------------------------------------------------- 0.392W
WDFN−8L 2x2-------------------------------------------------------------------------------------------------------------- 0.606W
zPa ckage Thermal Resista nce (Note 2)
TSOT -23-6, θJA ------------------------------------------------------------------------------------------------------------- 255°C/W
WDFN−8L 2x2, θJA -------------------------------------------------------------------------------------------------------- 165°C/W
zLead T emperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 260 °C
zJunction T emperature----------------------------------------------------------------------------------------------------- 150°C
zStorage T emperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
zESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Ma chine Mode) ------------------------------------------------------------------------------------------------------ 200V
(VIN = 3.7V, CIN = 2.2uF, COUT = 0.22uF, IOUT = 20mA, L = 22uH, TA = 25°C, unless otherwise specified)
RT9292
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Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Parameter Symbol Test Conditions Min Typ Max Unit
EN Sink Current IIH -- 1 -- uA
EN Low Time to Shutdown TSHDN -- 10 -- ms
Di mming Freq uency 0 .2 -- 200 kHz
Over -V o ltage Thre sh old VOVP 25 26 28 V
Over-Voltage Hysteresis -- 1 -- V
Over-Current Thr eshold IOCP 500 700 -- mA
OTP TOTP -- 160 --
°C
OTP Hysteresis -- 30 -- °C
Schottky Forward Voltage VF I
Diode = 100m A -- 0.7 -- V
RT9292
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Quiesce nt Current vs. Input Voltage
200
250
300
350
400
450
500
550
600
650
700
2.6 3.1 3.6 4.1 4.6 5.1
In put Volt age (V)
Quiescent C urrent (uA)
Output Voltage vs . Output Current
10
12
14
16
18
20
22
5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30
Output Current (mA)
Output V olt age (V)
VIN = 3.7V
Typical Operating Characteristics
Efficiency vs. Input Voltage
50
55
60
65
70
75
80
85
90
2.533.544.555.5
In put Vol tage (V)
Efficiency (%)
Load = 30mA
Load = 20mA Load = 10mA
VOUT = 20V, L = 22uH
Efficiency vs. Output Current
50
55
60
65
70
75
80
85
90
0 0.005 0.01 0.015 0.02 0.025 0.03
Output Current (A)
Efficiency (%)
VIN = 3.7V
VIN = 3V
VIN = 4.2V
0 5 10 15 20 25 30
Output Current (mA)
VOUT = 20V, L = 22uH
Efficiency vs. Output Current
50
55
60
65
70
75
80
85
90
0 0.005 0.01 0.015 0.02 0.025 0.03
Output Current (A)
Eff iciency ( %)
VIN = 3.7V
VIN = 3V
VIN = 4.2V
VOUT = 20V, L = 33uH
Efficiency v s . Input Voltage
40
45
50
55
60
65
70
75
80
85
90
2.5 3 3.5 4 4.5 5 5.5
Inp ut V o ltage (V)
Eff iciency ( %)
Load = 30mA
Load = 20mA
Load = 10mA
VOUT = 20V, L = 33uH
RT9292
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Switching Frequency vs. Input Voltage
930
940
950
960
970
980
990
1000
2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Swit ching Fr equency (kHz)
6WLED, ILED = 20mA
Switching Frequency vs. Temperature
800
850
900
950
1000
1050
1100
-40 -20 0 20 40 60 80 100 120
Temperature
Swit ching Frequency ( kH z)
6WLED, ILED = 20mA, V IN = 3.7V
(°C)
Enable Threshold Voltage vs . Input Voltage
0.86
0.88
0.90
0.92
0.94
0.96
0.98
1.00
2.6 3.1 3.6 4.1 4.6 5.1
In put Voltage (V)
Enabl e Threshold Vol tage (V)
Rising
Falling
Reference Voltage vs. Input Voltage
0.330
0.332
0.334
0.336
0.338
0.340
2.5 3 3.5 4 4.5 5 5.5
In put Voltage ( V )
Refer ence V olt age (V)
6WLED, ILED = 20mA
Reference Voltage vs. Output Current
0.330
0.332
0.334
0.336
0.338
0.340
0 5 10 15 20 25 30
Output Current (mA)
Refer ence Voltage ( V )
VIN = 3.7V VIN = 3V
VIN = 4.2V
VOUT = 20V
Reference Voltage vs. Temperature
0.320
0.324
0.328
0.332
0.336
0.340
-40 -20 0 20 40 60 80 100 120
Temperature
Refer ence Volt age (V)
6WLED, ILED = 20mA
VIN = 4.2V
VIN = 3.7V
VIN = 3V
(°C)
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OVP Voltage vs. Input Voltage
24.0
24.5
25.0
25.5
26.0
26.5
27.0
2.533.544.555.5
In put Volt age (V)
OVP Vol tage ( V)
6WLED, ILED = 20mA, V IN = 3.7V
Power Off from EN
Time (1ms/Div)
ILX
(200mA/Div)
VOUT
(20V/Div)
VEN
(2V/Div)
COUT = 0.22uF, ILED = 20mA, VIN = 3.7V
Ripple Voltage
Time (500ns/Div)
VOUT
(100mV/Div)
VIN
(20mV/Div)
COUT = 1uF, I LED = 20mA, VIN = 3.7V
Ripple Voltage
Time (500ns/Div)
VOUT
(100mV/Div)
VIN
(20mV/Div)
6WLED, ILED = 20mA, V IN = 3.7V
Power On from EN
Time (500us/Div)
IIN
(100mA/Div)
VOUT
(10V/Div)
VEN
(2V/Div)
LE D Curre nt vs . Dut y
0
5
10
15
20
25
0 102030405060708090100
Duty (%)
LED Current (mA)
f = 200Hz
f = 2kHz
f = 20kHz
f = 200kHz
6WLED, ILED = 20mA, V IN = 3.7V
RT9292
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f= 20kHz, ILED = 20mA, VIN = 3.7V
PWM Dimming from EN
Time (10us/Div)
ILED
(10mA/Div)
VEN
(2V/Div)
f= 200Hz, ILED = 20mA, VIN = 3.7V
PWM Dimming from EN
Time (1ms/Div)
ILED
(10mA/Div)
VEN
(2V/Div)
RT9292
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Applications Information
LED Current Setting
The loop of Boost structure will keep the FB pin voltage
equal to the reference voltage VREF. Therefore, when RSET
connects FB pin and GND, the current flows from VOUT
through LED and RSET to GND will be decided by the current
on RSET, which is equal to following Equation :
REF
LED SET
V
I =
R
Figure 1. Block Diagram of Progra mma ble FB Voltage
Using PWM Signal
Dimming Control
a. Using a PWM Signal to EN Pin
For the brightness dimming control of the RT9292, the IC
provides typically 330mV feedba ck voltage when the EN
pin is pulled constantly high. However, EN pin allows a
PWM signal to reduce this regulation voltage by changing
the PWM duty cycle to a chieve LED brightness di mming
control. The relationshi p between the duty cycle and FB
voltage can be calculated a s following equation.
VFB = Duty x 330mV
Where
Duty = duty cycle of the PWM signal
330mV = internal reference voltage
As shown in Figure 1, the duty cycle of the PWM signal
is used to cut the internal 330mV reference voltage. An
internal low pass filter is used to filter the pulse signal.
And then the reference voltage can be made by connecting
the output of the filter to the error amplifier for the FB pin
voltage regulation.
However, the internal low pass filter 3db frequency is
500Hz. When the dimming frequency is lower then 500Hz,
VA is also a PWM signal a nd the LED current is controlled
directly by this signal. When the frequency is higher than
500Hz, PWM is filtered by the internal low pass filter a nd
the VA a pproach a DC signal. And the LED current is a DC
current which elimate the audio noise. Two figures of PWM
Dimming from EN are shown in Typical Operating
Characteristics section and the PWM dimming frequency
is 200Hz a nd 20kHz respectively .
But there is an offset in error amplifier which will cause
the VA variation. In low PWM duty signal situation, the
b. Using a DC Voltage
Using a varia ble DC voltage to a djust the brightness is a
popular method in some applications. The dimming control
using a DC voltage circuit is shown in Figure 2. As the DC
voltage increa ses, the current pass through R3 increa singly
and the voltage drop on R3 increa se, i.e. the LED current
decreases. For example, if the VDC range is from 0V to
2.8V and assume the RT9292 is selected which VREF is
equal to 0.33V, the selection of resistors in Figure 2 sets
the LED current from 20.55mA to 0mA. The LED current
ca n be calculated by the f ollowing Equation :
DC REF
REF
LED SET
R3 (V V )
VR4
I = R
×−
−
Figure 2. Dimming Control Using a DC Voltage for the
RT9292
filtered reference voltage is low a nd the offset ca n cause
bigger variation of the output current. So RT9292B is not
recommend to be dimming by EN pin. For RT9292D the
minimum duty vs frequency is list in following table.
Duty Minimum
Dimming frequency < 500Hz 4%
Dimming frequency > 500Hz 12%
LX
FB
VIN
EN
VOUT
RT9292
GND
CIN
2.2uF
L
COUT
VIN
2.5V to 5.5V
1uF
VOUT
RSET
WLEDs
R3
10k
R4
75k 18.2
VDC Dimming
0V to 2.8V
Chip Enable
+
-EA
FB
To Controller
330mV
EN VA
RT9292
10 DS9292-02 April 2011www.richtek.com
c. Using a Filtered PWM signal
Another common application is using a filtered PWM
signal a s an adjustable DC voltage for LED dimming control.
A filtered PWM sign al a cts as the DC voltage to regulate
the output current. The recommended application circuit
is shown as Figure 3. In this circuit, the output ripple
depends on the frequency of PWM signal. For smaller
output voltage ripple (<100mV), the recommended
frequency of 2.8V PWM signal should be above 2kHz. To
fix the frequency of PWM signal and change the duty cycle
of PWM signal ca n get different output current. The LED
current ca n be calculated by the following Equation :
PWM REF
REF DC
LED SET
R3 (V Duty V )
VR4 + R
I = R
××−
−
Figure 3. Filtered PWM Signal f or LED Di mming Control
of the RT9292
LX
FB
VIN
EN
VOUT
RT9292
GND
L
COUT
VIN
2.5V to 5.5V
1uF
VOUT
RSET
WLEDs
R3
10k
R4
6.8k 18.2
RDC
68k CDC
1uF
PWM Signal
0V
2.8V
Ch ip E n a ble
CIN
2.2uF
By the above equation and the application circuit shown
in Figure 3, a nd assume the R T9292D is selected which
VREF is equal to 0.33V. Figure 4 shows the relationship
between the LED current and PWM duty cycle. For
example, when the PWM duty is equal to 60%, the LED
current will be equal to 8.2mA. When the PWM duty is
equal to 40%, the LED current will be equal to 12.3mA.
Figure 4. LED Current Vari ation with the PWM Di mming
on FB
Con stant Output Voltage Control
The output voltage of RT9292 can be adjusted by the divider
circuit on FB pin. Figure 5 shows the application circuit
for the constant output voltage. The output voltage can be
calculated by the following Equations :
;
OUT REF R1 R2
V = V R2 > 10k
R2
+
×
Figure 5. Application for Con sta nt Output Voltage
LX
FB
VIN
EN
VOUT
RT9292
GND
CIN
2.2uF
L
COUT
VIN
2.5V to 5.5V
1uF
VOUT
R2
R1
Ch ip Ena b le
0
2
4
6
8
10
12
14
16
18
20
0 20406080100
PWM Duty (%)
LED Curr ent (mA)
Soft-Start
The function of soft-start is made for suppressing the inrush
current to an acceptable value at the beginning of power-
on. The soft-start function is built-in the RT9292 by
clamping the output voltage of error amplifier so that the
duty cycle of the PWM will be increased gradually in the
soft-start period.
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and temperature difference between junction to a mbient.
The maximum power dissipation can be calculated by
following formula :
PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the a mbient temperature and the θJAis
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9292, the maximum junction temperature of the die is
125°C. The junction to ambient thermal resista nce θJA is
layout dependent. The junction to ambient thermal
resistance for TSOT-23-6 package is 255°C/W and W DF N-
8L 2x2 package is 165°C/W on the standard JEDEC 51-3
single-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by following
formula :
PD(MAX) = (125°C − 25°C) / (165°C/W) = 0.606W for
WDF N-8L 2x2 pa ckages
PD(MAX) = (125°C − 25°C) / (255°C/W) = 0.392W for
TSOT-23-6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9292 packages, the Figure 6 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 6. Derating Curves for RT9292 Packages
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 25 50 75 100 125
Ambient Tem perat ure ( °C )
Maximum Po wer Dissipat ion (W)
Single Layer PCB
WDFN-8L 2x2
TSOT-23-6
Current Limiting
The current flow through inductor as charging period is
detected by a current sensing circuit. As the value comes
a cross the current limiting threshold, the N-MOSFET will
be turned off so that the inductor will be forced to leave
charging stage and enter discharging stage. Therefore,
the inductor current will not increase over the current
limiting threshold.
OVP/UVLO/OTP
The Over Voltage Protection is detected by a junction
breakdown detecting circuit. Once VOUT goes over the
detecting voltage, LX pin stops switching a nd the power
N-MOSFET will be turned off. Then, the VOUT will be
cla mped to be near VOVP. As the output voltage is higher
than a specified value or input voltage is lower than a
specified value, the chip will enter protection mode to
prevent abnormal function. As the die temperature >
160°C, the chip also will enter protection mode. The power
MOSFET will be turned off during protection mode to
prevent abnormal operation.
Inductor Selection
The recommended value of inductor for 6 WLEDs
a pplication s is from 10uH to 33uH. Small size and better
efficiency are the major concerns for portable devices,
such a s the RT9292 used for mobile phone. The inductor
should have low core loss at 1MHz and low DCR for better
efficiency. The inductor saturation current rating should
be considered to cover the inductor pea k current.
Capacitor Selection
Input ceramic capacitor of 2.2uF and output ceramic
capacitor of 1uF are recommended for the RT9292
a pplications for driving 6 series WLEDs. For better voltage
filtering, ceramic capacitors with low ESR are
recommended. X5R and X7R types are suitable because
of their wider voltage and temperature ranges.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum operation junction temperature. The maximum
power dissipation depends on the thermal resistance of
IC pa ckage, PCB layout, the rate of surroundings airflow
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Layout Consideration
For best performance of the RT9292, the following
guidelines must be strictly followed.
`Input and Output capacitors should be placed close to
the IC a nd connected to ground pla ne to reduce noise
coupling.
`The GND and Exposed Pad should be connected to a
strong ground plane for heat sinking and noise protection.
`Keep the main current traces as possible a s short and
wide.
`LX node of DC-DC converter is with high frequency
voltage swing. It should be kept at a small area.
`Place the feedback components as close as possible
to the IC a nd keep away from the noisy devices.
Figure 7. Layout Consideration Recommended
RSET
L
CIN
COUT
VIN
GND
WLEDs
The inductor should be placed as close as
possible to the sw itch pin to minimize the
noise coupling into other circuits.
LX node copper area should be minimized
for reducing E M I.
FB node copper area should be
minimized and keep far away
from noise sources (LX pin) and
RS should be as close as
possible to FB pin.
CIN should be placed as
closed as possible to
VIN pin for good filtering.
The COUT should be connected
directly from the Pin 5 to ground
rather than across the LE Ds
4
2
3
5
61 VIN
VOUT
EN
LX
GND
FB
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Outline Dimension
TSOT-23-6 Surface Mount Package
Dimensions In Millimeters Dimen s ions In Inches
Symbol Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
AA1
e
b
B
D
C
H
L
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Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing)
5F, No. 95, Minchiuan Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com
W-Type 8L DFN 2x2 Package
Dimensions In Millimeters Dimensio ns In Inches
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.300 0.008 0.012
D 1.950 2.050 0.077 0.081
D2 1.000 1.250 0.039 0.049
E 1.950 2.050 0.077 0.081
E2 0.400 0.650 0.016 0.026
e 0.500 0.020
L 0.300 0.400
0.012 0.016
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID a nd T ie Bar M ark Options
D
1
E
A3
A
A1
D2
E2
L
b
e
SEE DETAIL A
