1 PF
1 PF
37.4:
Coaxial Cable
75:
LMH0044 Adaptive
Cable Equalizer
SDI SDO
SDI
AEC+
AEC-
SDO
CD
MUTEREF
MUTE
BYPASS
4.7 PF
4.7 PF
Outputs
MUTEREF
MUTE
BYPASS
1 PF
75:
6.8 nH
CD
LMH0044
www.ti.com
SNLS216E APRIL 2006REVISED APRIL 2013
LMH0044 SMPTE 292M / 259M Adaptive Cable Equalizer
Check for Samples: LMH0044
1FEATURES DESCRIPTION
The LMH0044 SMPTE 292M / 259M adaptive cable
2 SMPTE 292M, SMPTE 344M and SMPTE 259M equalizer is a monolithic integrated circuit for
Compliant equalizing data transmitted over cable (or any media
Supports DVB-ASI at 270 Mbps with similar dispersive loss characteristics). The
Data rates: 125 Mbps to 1.485 Gbps equalizer operates over a wide range of data rates
from 125 Mbps to 1.485 Gbps and supports SMPTE
Equalizes up to 200 Meters of Belden 1694A at 292M, SMPTE 344M and SMPTE 259M.
1.485 Gbps or up to 400 meters of Belden
1694A at 270 Mbps The LMH0044 implements DC restoration to correctly
handle pathological data conditions (DC restoration
Manual Bypass and Output Mute with a may be bypassed for low data rate applications). The
Programmable Threshold equalizer may be driven in either a single ended or
Single-Ended or Differential Input differential configuration.
50Differential Outputs Additional features include separate carrier detect
Single 3.3V Supply Operation and output mute pins which may be tied together to
208 mW Typical Power Consumption with 3.3V mute the output when no signal is present. A
programmable mute reference is provided to mute the
Supply output at a selectable level of signal degradation.
Replaces the GS1574 and GS1574A
APPLICATIONS
SMPTE 292M, SMPTE 344M, and SMPTE 259M
Serial Digital Interfaces
Serial Digital Data Equalization and Reception
Data Recovery Equalization
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMH0044
SNLS216E APRIL 2006REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage 0.5V to 3.6V
Input Voltage (all inputs) 0.3V to VCC+0.3V
Storage Temperature Range 65°C to +150°C
Junction Temperature +150°C
Lead Temperature (Soldering 4 Sec) +260°C
Package Thermal Resistance θJA 16-pin WQFN +43°C/W
θJC 16-pin WQFN +9°C/W
ESD Rating (HBM) 8kV
ESD Rating (MM) 250V
(1) "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of "Electrical Characteristics" specifies acceptable device operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Recommended Operating Conditions
Supply Voltage (VCC VEE) 3.3V ±5%
Input Coupling Capacitance 1.0 µF
AEC Capacitor (Connected between AEC+ and AEC-) 1.0 µF
Operating Free Air Temperature (TA) 0°C to +85°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1)(2).
Parameter Test Conditions Reference Min Typ Max Units
VCMIN Input Common Mode Voltage SDI, SDI 1.9 V
VSDI Input Voltage Swing At LMH0044 input(3)(4) 720 800 950 mVPP
VCMOUT Output Common Mode Voltage SDO, SDO VCC V
VSDO/2
VSDO Output Voltage Swing 50load, differential 750 mVP-P
MUTEREF DC Voltage (floating) MUTEREF 1.3 V
MUTEREF Range 0.7 V
CD Output Voltage Carrier not present CD 2.6 V
Carrier present 0.4 V
MUTE Input Voltage Min to mute outputs MUTE 3.0 V
Max to force outputs active 0.8 V
ICC Supply Current See(5) 63 77 mA
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +3.3V and TA= +25°C.
(3) Specification is ensured by characterization.
(4) The maximum input voltage swing assumes a nonstressing, DC-balance signal; specifically, the SMPTE-recommended color bar test
signal. Pathological or other stressing signals may not be used. This specification is for 0m cable only.
(5) Supply current depends on the amount of cable being equalized. The current is highest for short cable and decreases as the cable
length is increased. Refer to Figure 2 and Figure 3.
2Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0044
1
4
3
2LMH0044
(top view)
12
9
10
11
85 6 7
1316 15 14
VEE
VEE
SDI
SDI SDO
SDO
VEE
VEE
AEC+
AEC-
BYPASS
MUTEREF
CD
VCC
VCC
MUTE
LMH0044
www.ti.com
SNLS216E APRIL 2006REVISED APRIL 2013
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1).
Parameter Test Conditions Reference Min Typ Max Units
BRMIN Minimum Input Data Rate SDI, SDI 125 Mbps
BRMAX Maximum Input Data Rate 1485 Mbps
Jitter for various Cable Lengths 270 Mbps, Belden 1694A, 0.2 UI
(with equalizer pathological) 400 meters(2)
270 Mbps, Belden 8281, 0.2 UI
280 meters(2)
1.485 Gbps, Belden 1694A, 0.25 UI
140 meters(2)
1.485 Gbps, Belden 8281, 0.25 UI
100 meters(2)
1.485 Gbps, Belden 1694A, 0.3 UI
200 meters(2)
tr,tfOutput Rise Time, Fall Time 20% 80%(2) SDO, SDO 100 220 ps
Mismatch in Rise/Fall Time See(2) 2 15 ps
tOS Output Overshoot See(2) 1 5 %
ROUT Output Resistance Single-Ended(3) 50
RLIN Input Return Loss See(4) SDI, SDI 15 18-20 dB
RIN Input Resistance Single-Ended 1.3 k
CIN Input Capacitance Single-Ended(3) 1 pF
(1) Typical values are stated for VCC = +3.3V and TA= +25°C.
(2) Specification is ensured by characterization.
(3) Specification is ensured by design.
(4) Input return loss is dependent on board design. The LMH0044 meets this specification on the SD044 evaluation board from 5 MHz to
1.5 GHz.
Connection Diagram
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 1. 16-Pin WQFN Package
See Package Number RUM0016A
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMH0044
AEC+
Equalizer
Filter
AEC-
MUTE
MUTEREF
DC
Restoration/
Level Control
Automatic
Equalization
Control
SDI
SDI SDO
SDO
BYPASS
Output
Driver
6
Carrier
Detect/
Mute
Energy
Detect Energy
Detect
CD
LMH0044
SNLS216E APRIL 2006REVISED APRIL 2013
www.ti.com
Table 1. Pin Descriptions
Pin No. Name Description
1 VEE Negative power supply (ground).
2 SDI Serial data true input.
3 SDI Serial data complement input.
4 VEE Negative power supply (ground).
5 AEC+ AEC loop filter external capacitor (1µF) positive connection.
6 AEC- AEC loop filter external capacitor (1µF) negative connection.
7 BYPASS Bypasses equalization and DC restoration when high. No equalization occurs in this mode.
8 MUTEREF Mute reference. Sets the threshold for CD and (with CD tied to MUTE) determines the maximum cable
to be equalized before muting. MUTEREF may be unconnected for maximum equalization.
9 VEE Negative power supply (ground).
10 SDO Serial data complement output.
11 SDO Serial data true output.
12 VEE Negative power supply (ground).
13 VCC Positive power supply (+3.3V).
14 MUTE Output mute. To disable the mute function and enable the output, MUTE must be tied to GND or a low
level signal. To force the outputs to a muted state, tie to VCC. CD may be tied to this pin to inhibit the
output when no input signal is present. MUTE has no function in BYPASS mode.
15 CD Carrier detect. CD is high when no signal is present. CD has no function in BYPASS mode.
16 VCC Positive power supply (+3.3V).
DAP VEE Connect exposed DAP to negative power supply.
Block Diagram
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LMH0044
www.ti.com
SNLS216E APRIL 2006REVISED APRIL 2013
Device Operation
BLOCK DESCRIPTION
The Equalizer Filter block is a multi-stage adaptive filter. If Bypass is high, the equalizer filter is disabled.
The DC Restoration / Level Control block receives the differential signals from the equalizer filter block. This
block incorporates a self-biasing DC restoration circuit to fully DC restore the signals. If Bypass is high, this
function is disabled.
The signals before and after the DC Restoration / Level Control block are used to generate the Automatic
Equalization Control (AEC) signal. This control signal sets the gain and bandwidth of the equalizer filter. The
loop response in the AEC block is controlled by an external 1µF capacitor placed across the AEC+ and AEC-
pins.
The Carrier Detect / Mute block generates the carrier detect signal and controls the mute function of the output.
This block utilizes the CD and MUTE signals along with Mute Reference (MUTEREF).
The Output Driver produces SDO and SDO.
MUTE REFERENCE (MUTEREF)
The mute reference sets the threshold for CD and (with CD tied to MUTE) determines the amount of cable to
equalize before automatically muting the outputs. This is set by applying a voltage inversely proportional to the
length of cable to equalize. As the applied MUTEREF voltage is increased, the amount of cable that can be
equalized before carrier detect is de-asserted and the outputs are muted is decreased. MUTEREF may be left
unconnected for maximum equalization before muting.
CARRIER DETECT (CD) AND MUTE
Carrier detect CD indicates if a valid signal is present at the LMH0044 input. If MUTEREF is used, the carrier
detect threshold will be altered accordingly. CD provides a high voltage when no signal is present at the
LMH0044 input. CD is low when a valid input signal is detected.
MUTE can be used to manually mute or enable SDO and SDO. Applying a high input to MUTE will mute the
LMH0044 outputs. Applying a low input will force the outputs to be active.
CD and MUTE may be tied together to automatically mute the output when no input signal is present.
INPUT INTERFACING
The LMH0044 accepts either differential or single-ended input. The input must be AC coupled. Transformer
coupling is not supported.
The LMH0044 correctly handles equalizer pathological signals for standard definition and high definition serial
digital video, as described in SMPTE RP 178 and RP 198, respectively.
OUTPUT INTERFACING
The SDO and SDO outputs are internally loaded with 50. They produce a 750 mVP-P differential output, or a
375 mVP-P single-ended output.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMH0044
SUPPLY CURRENT (mA)
75
55
BELDEN 1694A CABLE LENGTH (m)
0 200100
50 150
60
65
70
LMH0044
SNLS216E APRIL 2006REVISED APRIL 2013
www.ti.com
APPLICATION INFORMATION
PCB LAYOUT RECOMMENDATIONS
Refer to the following Application Note on TI's website: AN-1372, “LMH0034 PCB Layout Techniques.” The PCB
layout techniques in the application note apply to the LMH0044 as well.
REPLACING THE GENNUM GS1574A
The LMH0044 is footprint compatible with the Gennum GS1574A.
SUPPLY CURRENT VS. CABLE LENGTH
The supply current (ICC) depends on the amount of cable being equalized. The current is highest for short cable
and decreases as the cable length is increased. Figure 2 shows supply current vs. Belden 1694A cable length for
1.485 Gbps data and Figure 3 shows supply current vs. Belden 1694A cable length for 270 Mbps data.
Figure 2. Supply Current vs. Belden 1694A Cable Length, 1.485 Gbps
6Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0044
SUPPLY CURRENT (mA)
75
55
BELDEN 1694A CABLE LENGTH (m)
0 400200
100 300
60
65
70
LMH0044
www.ti.com
SNLS216E APRIL 2006REVISED APRIL 2013
Figure 3. Supply Current vs. Belden 1694A Cable Length, 270 Mbps
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LMH0044
LMH0044
SNLS216E APRIL 2006REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMH0044
PACKAGE OPTION ADDENDUM
www.ti.com 8-Oct-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH0044SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 L044
LMH0044SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 L044
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Oct-2015
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMH0044SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LMH0044SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH0044SQ/NOPB WQFN RUM 16 1000 210.0 185.0 35.0
LMH0044SQE/NOPB WQFN RUM 16 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
www.ti.com
SQB16A (Rev A)
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