Product Data Sheet
Industrial
USB Flash Drive
unitedCONTRAST II
USB2.0 high speed
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USB Flash Drive unitedCONTRAST II
512MByte to 16GByte
USB Flash Drive (UFD) provides non-volatile, solid-state storage in different design options, making it perfectly
suited for OEM and industrial market. Swissbit uses high end USB 2.0 flash memory controller, providing high
data reliability and endurance. The built-in BCH-ECC engine can correct up to 8 random bit errors per sector,
while sophisticated wear leveling algorithms guarantee highest endurance.
USB Flash Drive is available with a standard USB 2.0 certified Type A connector. High performance, high
reliability and industrial requirements make the USB Flash Drive the product of choice in OEM and industrial
markets, such as embedded computing, networking equipment and industrial PCs.
Swissbit offers value-added services to OEM customers, such as customized form factors and test solutions,
custom firmware, controlled Bill of Materials (BOM), customer-specific marking and inlays.
1 Feature summary
Custom-designed, highly-integrated USB-Drive flash memory controller
o Fully compliant with USB-Specification 2.0 (High-Speed, 480Mb/s burst)
o Fully compliant with USB-Specification 1.1 (Full speed, 12Mb/s burst)
High reliability
o MTBF > 3,000,000 hours (SLC flash)
o Error correction code (ECC)
o Wear leveling
o Data reliability: < 1 non-recoverable error per 1014 bits read (SLC Flash)
Commercial and industrial temperature grade
Plug&Play
Bootable
Removeble Drive
LED indicator
FAT32 format
Unique serial number
USB-IF high speed certified
CE / FCC
RoHS compliant
WEEE
System Block Diagram
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2 Table of Contents
1 FEATURE SUMMARY ................................................................................................................................................................... 2
2 TABLE OF CONTENTS .................................................................................................................................................................. 3
3 ORDER INFORMATION ............................................................................................................................................................... 4
3.1 STANDARD PRODUCTS FOR INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGE ................................................................................. 4
3.2 OFFERED OPTIONS ................................................................................................................................................................ 4
4 SYSTEM PERFORMANCE ............................................................................................................................................................. 5
5 INTERFACE ................................................................................................................................................................................. 5
6 NAND FLASH TECHNOLOGIES .................................................................................................................................................... 5
7 ELECTRICAL SPECIFICATION ........................................................................................................................................................ 5
8 ENVIRONMENTAL SPECIFICATION AND RELIABILITY .................................................................................................................. 6
8.1 RECOMMENDED OPERATING CONDITIONS.................................................................................................................................... 6
8.2 RELIABILITY ........................................................................................................................................................................ 6
8.3 SHOCK, VIBRATION, AND HUMIDITY ........................................................................................................................................ 6
9 COMPATIBILITY & COMPLIANCE ................................................................................................................................................ 7
10 APPLICATIONS .......................................................................................................................................................................... 7
11 PERFORMANCE REFERENCE ...................................................................................................................................................... 8
11.1 TEST EQUIPMENT ................................................................................................................................................................. 8
11.2 PERFORMANCE RESULTS ........................................................................................................................................................ 8
12 DESIGN & HOUSING ................................................................................................................................................................. 9
13 DECLARATION OF CONFORMITY .............................................................................................................................................. 10
13.1 EMI TEST RESULTS IN 3M CHAMBER TBD .............................................................................................................................. 11
13.2 ESD TEST RESULTS ............................................................................................................................................................ 13
14 ROHS AND WEEE UPDATE FROM SWISSBIT ........................................................................................................................... 14
15 BEST PRACTICES ..................................................................................................................................................................... 16
15.1 WEAR LEVELING AND SPARE BLOCK MANAGEMENT .................................................................................................................. 16
15.1 DEVICE REMOVAL & POWER FAILURE .................................................................................................................................... 16
15.2 LIFETIME END HANDLING .................................................................................................................................................... 16
16 PART NUMBER DECODER ....................................................................................................................................................... 17
16.1 MANUFACTURER ............................................................................................................................................................... 17
16.2 MEMORY TYPE ................................................................................................................................................................. 17
16.3 PRODUCT TYPE ................................................................................................................................................................. 17
16.4 DENSITY ......................................................................................................................................................................... 17
16.5 PLATFORM ...................................................................................................................................................................... 17
16.6 PRODUCT GENERATION ...................................................................................................................................................... 17
16.7 MEMORY ORGANIZATION .................................................................................................................................................... 17
16.8 TECHNOLOGY ................................................................................................................................................................... 17
16.9 NUMBER OF FLASH CHIP / CHANNELS ................................................................................................................................... 17
16.10 FLASH CODE .................................................................................................................................................................. 17
16.11 TEMP. OPTION ................................................................................................................................................................ 18
16.12 DIE CLASSIFICATION......................................................................................................................................................... 18
16.13 PIN MODE .................................................................................................................................................................... 18
16.14 UFD XYZ ...................................................................................................................................................................... 18
16.15 OPTION ......................................................................................................................................................................... 18
17 REVISION HISTORY ................................................................................................................................................................. 19
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3 Order Information
3.1 Standard products for Industrial and Commercial temperature range
Density
Part Number
512MB
SFU20512EgBP2xx-t-xx-1f1-STD
1GB
SFU21024EgBP2xx-t-xx-1f1-STD
2GB
SFU22048EgBP2xx-t-xx-1f1-STD
4GB
SFU24096EgBP2xx-t-xx-1f1-STD
8GB
SFU28192EgBP2xx-t-xx-1f1-STD
16GB
SFU216GBEgBP2xx-t-xx-1f1-STD
g = hardware generation
t = temperature range (C=0°C to 70°C, I=-40°C to +85°C)
f = firmware generation per product generation
Table 1: Product list for standard products
3.2 Offered options
Customized logo
Removable or fixed drive
Customer specified strings and IDs
FAT16, FAT32 format or customer file system, default FAT32
Preload service
CD partition
Auto run option
Other software tools for synchronization password detection on request
Dongle functionality
Secured area (password protected, API available)
SDK for developers
Industrial and Commercial Temperature range
Please ask our sales for more details and additional features.
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4 System performance
Speed
High Speed mode (max)
Full Speed mode (max)
unit
Burst
480
12
Mbit/s
Read
32 1)
1.0
MByte/s
Write
23 1)
0.9
1)
measured speed in Chapter 11
Effective speed varies with controller, number and type of flash, host, file size, file system and operating system
The USB drive could be busy for max. 320ms during operation due to internal data organization.
5 Interface
USB-A connector
USB 2.0 high speed interface, USB1.1 compatible
USB-IF high speed certified
Pin
Signal
Comment
1
V_Bus
Operating voltage
2
D-
Data signal pair
3
D+
4
Gnd
Ground
Shield
Shield
should be connected with host shield
6 NAND Flash technologies
SLC and MLC flash
o Single-level-cell (SLC) flash, 1 bit (1 level) is stored in each memory cell
o Multi-level-cell (MLC) flash, 2 bit (3 level) are stored in each memory cell
Differences
SLC
MLC1)
comment
Endurance
~100,000
~5,000
physical write/erase cycles
Write Performance
fast write
slow write
MLC write is more time consuming because of 4
states
Read Performance
fast read
fast read
MLC and SLC technology is similar in the read
performance
Reliability
high
normal
errors are more likely, because the 4 states
Price
expensive
cheap
the same density can be stored in less silicon
1) Not recommended for OEM market or industrial applications
7 Electrical Specification
Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
Power Supply Voltage
V_Bus
-0.5
6.0
V
Voltage on D+ and D-
V_Data
-0.5
3.6
Commercial Operating Temperature
T_A
0
70
°C
Industrial Operating Temperature
-40
85
DC characteristics for Full-Speed operation (T=25°C, V_Bus=5V)
Parameter
Symbol
Test condition
Min
Typ
Max
Unit
Supply Voltage
V_Bus
4.75
5.00
5.25
V
Operating current
I_CC
V_Bus=5.0V
60
90
mA
Suspend current
I_CCS
350
500
µA
Input LOW Voltage
V_IL
0.8
V
Input HIGH Voltage
V_IH
2
Output LOW Voltage
V_OL
RL of 1.5kΩ to 3.6 V
0.3
Output HIGH Voltage
V_OH
RL of 15kΩ to GN D
2.8
3.6
Output Signal Crossover Voltage
V_CRS
1.3
2.0
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DC characteristics for High-Speed operation (T=25°C, V_Bus=5V)
Parameter
Symbol
Test condition
Min
Typ
Max
Unit
Supply Voltage
V_Bus
4.75
5.00
5.25
V
Operating current
I_CC
V_Bus=5.0V
80
120
mA
Suspend current
I_CCS
350
500
µA
High Speed Idle Level
V_HSOI
-10
10
mV
High Speed Data Signaling LOW
V_HSOL
-10
10
High Speed Data Signaling HIGH
V_HSOH
360
440
Chirp J Level (differential)
V_CHIRPJ
360
440
Chirp K Level (differential)
V_CHIRPK
-440
-360
Low-power CMOS technology
Suspend mode 500uA (max)
Operation mode 120mA (max)
Operation Voltage 5V (± 5%)
Hot swappable
8 Environmental Specification and Reliability
8.1 Recommended operating conditions
Parameter
Symbol
Min
Typ
Max
Unit
Commercial Operating Temperature
T_A
0
25
70
°C
Industrial Operating Temperature
-40
85
Storage Temperature
T_S
-50
100
8.2 Reliability
Parameter
Value
Endurance (SLC NAND Flash)
2’000’000 cycles1)
Data reliability
1 in 1014 bits, read
Error correction code (ECC)
correct up to 8 random bit errors per sector
MTBF / MTTF
> 3,000,000 hours
Data retention
10 years @ 10% life time / 1 years @ life end
Durability
> 1500 insertions / removals
1)
100’000 program/erase cycles NAND Flash cell endurance / average file size written = 5% of device capacity (50MB for 1GB device)/no
static data
8.3 Shock, Vibration, and Humidity
Parameter
Value
Shock
1500G Peak, 0.5m pulse duration, 5 pulses, 6 axes
(JESD22-B110)
Vibration
20G Peak, 20-2000 Hz, 4 cycles per direction (X, Y and Z)
(JESD22-B103)
Humidity
85°C, 85% RH, Vmax for 500 hrs
(JESD22-A101)
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9 Compatibility & Compliance
Configurable as boot-drive
Operating Systems:
o Windows 7
o Windows Vista
o WinXP, 2000, ME
o Win98 SE (driver available)
o Mac 9.0 and newer
o Mac 8.6 (with driver) and newer
o Linux 2.4 and newer
o Windows CE
o All USB mass-storage host systems (guarantee on all USB-IF certified systems)
CE – EN 55022/55024
FCC class B for information technology
USB-IF high speed certified
RoHS
UL60950 compliant PCB
WEEE
10 Applications
Gaming
Industrial PCs
Point-Of-Sale (POS)
Industrial Automation
Networking Equipment
Medical Equipment
Data Recorders
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11 Performance reference
11.1 Test Equipment
Mainboard:
ASUS P5LD2
CPU:
Intel Core 2 4400 @2.0GHz
OS:
Win XP Prof. V.2002 SP3
Testsoftware:
Swissbit FlashTest 1.2.1/1.3.0 / Script „Performance“
Firmware:
I0112 / K1128 BB
Prod.Tool:
SPT 1.0.22/23 SDK: 1.0.24
Filesystem:
Low level
11.2 Performance results
The effective speed depends on Controller, Number and type of flash, File system and file size, Test tool & OS.
Random Read [kByte/sec]
Random Write [kByte/sec]
8 sector - 4kByte
128 sector - 64kByte
8 sector - 4kByte
128 sector - 64kByte
SFU*1024E1BP2TO-t-MS*
~5800
~24800
~100
~1600
SFU*2048E1BP2TO-t-MS*
~5800
~26500
~75
~1200
SFU*4096E1BP2TO-t-DT*
~5800
~26000
~75
~1150
SFU*8192E1BP2TO-t-QT*
~5400
~25900
~75
~1150
SFU*16GBE1BP2MT-t-QT*
~5100
~25900
~40
~650
Sequential Read [kByte/sec]
Sequential Write [kByte/sec]
8 sector - 4kByte
128 sector - 64kByte
8 sector - 4kByte
128 sector - 64kByte
SFUI1024E1BP2TO-t-MS*
~7800
~26200
~6500
~8100
SFUI2048E1BP2TO-t-MS*
~8100
~28500
~4600
~11800
SFUI4096E1BP2TO-t-DT*
~8100
~28700
~4600
~20800
SFUI8192E1BP2TO-t-QT*
~8000
~28900
~4600
~20800
SFU*16GBE1BP2MT-t-QT*
~7800
~28700
~4000
~20950
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12 Design & Housing
D 5.0
67.85±0.2-1°
8.35±0.2
17.97±0.2-1°
general tolerance ±0.2mm
46.2±0.2-1°
12.2±0.1
21.6±0.2-1°
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13 Declaration of Conformity
Product Type: USB Flash Drive – unitedCONTRAST II
Brand Name: SWISSMEMORYTM unitedCONTRAST II
Model Designation: SFU2xxxxExBPxxx-x-xx-xxx-xxx
Manufacturer: Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
The product complies with the requirements of the following directives:
CENELEC EN 55022B :2000 + CISPR22B :2000
CENELEC EN 55024 :2001 + CISPR24 :2001
FCC47 Part 15 Subpart B
The product was tested according all EMC requirements necessary for -mark
Year of the first marking: 2009
Silvio Muschter
Vice President
Engineering & Development
Bronschhofen, Oct 15, 2009
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13.1 EMI Test results in 3m Chamber TBD
*) 920MHz signal from the Host-System, not from the USB-Stick
*)
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Combined measurement with CFAST cards
*) 3GHz signal from SATA interface, but not from USB-Stick
*)
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13.2 ESD Test results
Test specification to EN 55024: 1998
Contact discharge to connector and indirect (tested with and without cable at a PC)
Testlevel to EN 61000-4-2: 1995: 4kV
Upto ±5kV tested Criteria A no influence
Air discharge to non conductive surfaces
Testlevel to EN 61000-4-2: 1995: 8kV
Upto ±9kV tested Criteria A no influence, discharge is not possible due to isolation
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14 RoHS and WEEE update from Swissbit
Dear Valued Customer,
We at Swissbit place great value on the environment and thus pay close attention to the diverse aspects of
manufacturing environmentally and health friendly products. The European Parliament and the Council of the
European Union have published two Directives defining a European standard for environmental protection. This
states that CompactFlash Cards must comply with both Directives in order for them to be sold on the European
market:
RoHS – Restriction of Hazardous Substances
WEEE – Waste Electrical and Electronic Equipment
Swissbit would like to take this opportunity to inform our customers about the measures we have implemented
to adapt all our products to the European norms.
What is the WEEE Directive (2002/96/EC)?
The Directive covers the following points:
Prevention of WEEE
Recovery, recycling and other measures leading to a minimization of wastage of electronic and
electrical equipment
Improvement in the quality of environmental performance of all operators involved in the EEE
life cycle, as well as measures to incorporate those involved at the EEE waste disposal points
What are the key elements?
The WEEE Directive covers the following responsibilities on the part of producers:
Producers must draft a disposal or recovery scheme to dispose of EEE correctly.
Producers must be registered as producers in the country in which they distribute the goods.
They must also supply and publish information about the EEE categories.
Producers are obliged to finance the collection, treatment and disposal of WEEE.
Inclusion of WEEE logos on devices
In reference to the Directive, the WEEE logo must be printed directly on all devices that have sufficient space.
«In exceptional cases where this is necessary because of the size of the product, the symbol of the WEEE
Directive shall be printed on the packaging, on the instructions of use and on the warranty»
(WEEE Directive 2002/96/EC)
When does the WEEE Directive take effect?
The Directive came into effect internationally on 13 August, 2005.
What is RoHS (2002/95/EC)?
The goals of the Directive are to:
Place less of a burden on human health and to protect the environment by restricting the use of
hazardous substances in new electrical and electronic devices
To support the WEEE Directive (see above)
RoHS enforces the restriction of the following 6 hazardous substances in electronic and electrical devices:
Lead (Pb) – no more than 0.1% by weight in homogeneous materials
Mercury (Hg) – no more than 0.1% by weight in homogeneous materials
Cadmium (Cd) – no more than 0.01% by weight in homogeneous materials
Chromium (Cr6+) – no more than 0.1% by weight in homogeneous materials
PBB, PBDE – no more than 0.1% by weight in homogeneous materials
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Swissbit is obliged to minimize the hazardous substances in the products.
According to part of the Directive, manufacturers are obliged to make a self-declaration for all devices with
RoHS. Swissbit carried out intensive tests to comply with the self-declaration. We have also already taken steps
to have the analyses of the individual components guaranteed by third-party companies.
Swissbit carried out the following steps during the year with the goal of offering our customers products that
are fully compliant with the RoHS Directive.
Preparing all far-reaching directives, logistical enhancements and alternatives regarding the
full understanding and introduction of the RoHS Directive’s standards
Checking the components and raw materials:
o Replacing non-RoHS-compliant components and raw materials in the supply chain
o Cooperating closely with suppliers regarding the certification of all components and raw
materials used by Swissbit
Modifying the manufacturing processes and procedures
o Successfully adapting and optimizing the new management-free integration process in
the supply chain
o Updating existing production procedures and introducing the new procedures to support
the integration process and the sorting of materials
Carrying out the quality process
o Performing detailed function and safety tests to ensure the continuous high quality of
the Swissbit product line
When does the RoHS Directive take effect?
As of 1 July, 2006, only new electrical and electronic devices with approved quantities of RoHS will be put on the
market.
When will Swissbit be offering RoHS-approved products?
Swissbit’s RoHS-approved products are available now. Please contact your Swissbit contact person to find out
more about exchanging your existing products for RoHS-compliant devices.
For your attention
We understand that packaging and accessories are not EEE material and are therefore not subject to the WEEE or
RoHS Directives.
Contact details:
Swissbit AG
Industriestrasse 4
CH 9552 Bronschhofen
Tel: +41 71 913 72 72 – Fax: +41 71 913 74 50
E-mail: info@swissbit.com – Website: www.swissbit.com
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15 Best Practices
There are a number of best practices to reach the maximum life time.
15.1 Wear Leveling and Spare Block Management
The device uses zone based flash management (zones also called as management units). This means that the
user accessible data range (LBA area) is evenly divided into multiple zones, which are all managed separately
for both, wear leveling (dynamic and static) and for spare & bad block management.
USB HOST INTERFACE
USB FLASH DRIVE
FIRST SECTOR (LBA 0)
LAST SECTOR
ZONE 1 (MU1)
ZONE 2 (MU2)
ZONE 3 (MU3)
ZONE 4 (MU4)
*MU=Management Unit
The number of zones is depending on the device
capacity and can be read out using the Swissbit
Life Time Monitoring tool. The tool will show the
number of available spare blocks per
management unit (zone). The devices need a
minimum number of 2 spare blocks per unit to
work with. If the first unit reaches this value,
the device will be write-protected by the
firmware.
To get optimal life time, write accesses must be
evenly distributed over all zones. This can, for
example, be achieved by using multiple partitions and by then distributing the data between the partitions.
15.1 Device Removal & Power Failure
User data can be lost or corrupted if power is interrupted while the UFD is writing data. To avoid data loss, it is
necessary to avoid power interruption while the device is busy. This can be made sure by always using the host
(e.g. Windows) shutdown mechanisms or by detaching the device in the operating system before unplugging it.
Swissbit also offers an Application Note “Design-In Guide” that describes techniques to reduce data loss on
power failure, if power failure absolutely can’t be avoided.
15.2 Lifetime end handling
If the flash reaches its end of life, the number of bad blocks will increase (bad flash blocks will be replaced
with spare blocks). There exist different side effects with negative data influence by degraded flash cells.
Sometimes bit errors can occur because of effects that are not immediately detected by the flash, e.g. effects
like program disturb or read disturb, which means that the bad block recognition does not always prevent data
loss.
When the number of bit errors in a sector exceeds the ECC correcting capabilities, invalid (uncorrected) data can
be reported back to the host. Because of these effects it is strongly recommended to replace devices that are
nearing their end of life. One good indicator would be the current spare blocks per unit should not be reducing
below 5. It is in the responsibility of the system integrator to account for the flash usage per zone. Swissbit
offers support for calculating expected life time if the exact use case is provided (e.g. by providing low level
[USB interface] write statistics).
For notes on reducing flash stress, Swissbit offers an Application Note called “Design-In Guide”.
Please contact your sales channel for more information or send a mail to sales@swissbit.com.
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16 Part Number Decoder
S
F
U2
4096
E
1
B
P
2
TO
-
I
-
D
1
-
111
-
STD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Manuf.
Option
Memory Type.
Configuration
Product Type
Manuf. Code: Flash Mode
Density
Manuf. Code: Flash Package
Platform
Temp. Option
Product Generation
Flash vendor Code
Memory Organization
Number of flash chips
Technology
16.1 Manufacturer
Swissbit code
S
16.2 Memory Type
Flash
F
16.3 Product Type
USB Flash Drive 2.0
U2
16.4 Density
512 MB
0512
1 GB
1024
2 GB
2048
4 GB
4096
8 GB
8192
16 GB
16GB
16.5 Platform
unitedCONTRAST
E
16.6 Product Generation
16.7 Memory Organization
x8
B
16.8 Technology
unitedCONTRAST II
P
16.9 Number of Flash Chip / channels
1 Flash
1
2 Flash
2
16.10 Flash Code
SAMSUNG
SA
TOSHIBA
TO
Micron
MT
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16.11 Temp. Option
Industrial Temp. Range
-40°C to 85°C
I
Industrial Temp. Range
-25°C to 85°C
E
Standard Temp. Range
0°C to 70°C
C
16.12 DIE Classification
SLC MONO
(single die package)
M
SLC DDP
(dual die package)
D
SLC QDP
(quad die package)
Q
16.13 PIN Mode
Normal nCE & R/nB
0/S
Dual nCE & Dual R/nB
1/T
16.14 UFD XYZ
X Setting
Removable
1
Y Firmware revision per product generation
Revision 1
1
Revision 2
2
Z
Optional setting
default
1
16.15 Option
Swissbit / Standard
STD
Customized
XXX
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.20
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17 Revision History
Date
Revision
Revision Details
11-January-2010
1.00
First release
28-October-2010
1.10
General part numbers update, speed values for Toshiba flash
18-June-2012
1.20
Add 16GB UFD, add best practices
Table 2: Document Revision History
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