TPS852 - Toshiba - Product.Network

TPS852

2007-10-01

TOSHIBA Photo-IC Silicon Epitaxial Planar

TPS852

Mobile Phones

Notebook PCs, PDAs

Video cameras, Digital Still Cameras

Other Equipment Requiring Luminosity Adjustment

The TPS852 is an ultra-compact surface-mount photo-IC for

illuminance sensors which incorporates a photodiode and current amp

circuit in a single chip.

The sensitivity is superior to that of a phototransistor, and exhibits

little variation.

It has spectral sensitivity closer to luminous efficiency and excellent

output linearity.

With its ultra-compact surface-mount package, this photo-IC can be

used as the power-saving control for domestic appliances or for

backlighting for displays in cellular phones, this device enables low

power consumption to be achieved.

• Ultra-compact and light surface-mount package: 1.6 × 1.6 × 0.55 mm

• Excellent output linearity of illuminance

• Little fluctuation in light current and high level of sensitivity

: IL = 40 μA (typ.) @EV = 100 lx using fluorescent light

: Light current variation width: ×1.67

(when light current classification is

specified.)

: Little temperature fluctuation

• Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources

: IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.)

• Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.7 V to 5.5 V

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC −0.5 to 7 V

Output voltage VOUT

VCC V

Light current IL 5 mA

Permissible power dissipation P 35 mW

Power dissipation derating

(Ta > 25°C) ΔP/°C −0.5 mW/°C

Operating temperature range Topr −30 to 85 °C

Storage temperature range Tstg −40 to 100 °C

Soldering temperature range (Note 1) Tsol 260 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling

Precautions.

TOSHIBA ―

Weight: 0.003 g (typ.)

TPS852

2007-10-01

Electrical and Optical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Supply voltage VCC Ta=25℃ 2.7 ⎯ 5.5 V

Supply current ICC VCC = 3 V, EV = 1000 lx

RL = 1 kΩ (Note 2) ⎯ 480 950 μA

Light current (1) IL (1)

VCC = 3 V, EV = 100 lx

(Note 2), (Note 4) ⎯ 48 91.8 μA

Light current (2) IL (2)

VCC = 3 V, EV = 10 lx

(Note 3), (Note 4)

2.7 4.0 5.4 μA

Light current (3) IL (3)

VCC = 3 V, EV = 100 lx

(Note 3), (Note 4)

27 40 54 μA

Light current ratio (3)

(1)

I ⎯ ⎯ 1.2 1.7

Dark current ILEAK V

CC = 3.3 V, EV = 0 ⎯ ⎯ 0.1 μA

Saturation output voltage VO VCC = 3 V, RL = 150 kΩ, EV = 100 lx

(Note 3) 2.2 2.35 ⎯ V

Peak sensitivity wavelength λp ⎯ ⎯ 600 ⎯ nm

Rise time tr ⎯ 11 1000

Fall time tf ⎯ 400 2000

Delay time td ⎯ 250 ⎯

Switching time

Storage time ts

VCC = 3 V, RL = 5 kΩ

(Note 5)

⎯ 35 ⎯

μs

Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light).

Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.

IL classification IL (3) → A: 30 μA to 50 μA

Note 4: Light current measurement circuit

Note 5: Switching time measurement method

OUT

VCC

TPS852

Light

source

OUT

VCC

White LED

Pulse drive

TPS852

1.5 V

VOUT

GND

90%

10%

tdts

TPS852

2007-10-01

Package Dimensions

Weight: 0.003 g (typ.)

Block Diagram

1. VCC

6. OUT

2. GND

3. GND

4. GND

5. GND

Current

amp

: Light-receiving area

Size of light-receiving area:

(0.51mm x 0.12mm)

Unit: mm

Tolerance: ± 0.1

( ): Reference value

Pin connection

1. VCC

2. GND

3. GND

4. GND

5. GND

6. OUT

1.20

1.60

0.20 0.20

0.55

0.10

max0.2 max0.2 (0.8)

0.20

0.3Typ.

0.50 0.50

1.60

5°

12 3

4 56

TPS852

2007-10-01

Handling Precautions

When Vcc is turned on it takes at least 200 ms for the internal circuit to stabilize. During this time the output

signal is unstable. Please do not use the unstable signal as the output signal.

Moisture-Proof Packing

(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica

gel.

(2) Since the optical characteristics of the device can be affected during soldering by vaporization

resulting from prior absorption of moisture and they should therefore be stored under the following

conditions:

Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)

(3) Baking in taping with reel is required if the devices have been store unopened for more than six

months or if the aluminum envelope has been opened for more than 168 h.

These devices are packed on tapes; hence, please avoid baking at high temperature.

Recommended baking conditions: 60°C for 12 h or longer, Perform baking only once

Mounting Precautions

(1) Do not apply stress to the resin at high temperature.

(2) The resin part is easily scratched, so avoid friction with hard materials.

(3) When installing the assembly board in equipment, ensure that this product does not come into

contact with other components.

Mounting Methods

(1) Reflow soldering

• Package surface temperature: 260°C (max)

• Please perform reflow soldering using the following reference temperature profile.

Perform reflow soldering no more than twice.

• Please perform the first reflow soldering within 168 h after opening the package with reference to

the above temperature profile.

• Second reflow soldering

In case of second reflow soldering, it should be performed within 168 h after first reflow under the

above conditions.

Storage conditions before second reflow soldering: 30°C, 70% RH or lower

• Do not perform flow soldering.

• Make any necessary soldering correction manually.

(do not do this more than once for any given pin.)

Temperature: no more than 350°C (25 W for soldering iron)

Time: within 5 s

30 s to 50 s Heating part

Time (s) →

60 s to 120 s

Temperature (°C) →

260°C max

230°C

190°C

180°C Preheating part

TPS852

2007-10-01

(2) Recommended soldering pattern

(3) Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C × 30 s or 30°C × 3 mins

Ultrasonic cleaning: 300 W or less

Packing Specification

(1) Packing quantity

Reel (minimum packing quantity) 3,000 devices

Carton 5 reels (15,000 devices)

(2) Packing format

An aluminum envelope containing silica gel and reels is deaerated and sealed.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

• Carton specification

Carton dimensions

(W) 81 mm × (L) 280 mm × (H) 280 mm

0.5

1.35

0.5

0.3

0.45

Unit: mm

1.0

Label

TPS852

2007-10-01

Tape Packing Specifications

(1) Reel dimensions

Reel material: Plastic

φ180

φ60

11.4

9.0

Unit: mm

5.0

Enlarged view of reel center

5.0

120°

φ13 ± 0.2

2 ± 0.5

φ21 ± 0.8

TPS852

2007-10-01

(2) Tape dimensions

Tape material: Plastic (anti-electrostatic)

Product direction

Unit: mm

1.75±0.1

φ1.5 +0.1

−0

4.0±0.1

2.0±0.05

4.0±0.1 φ1.1±0.1

3.5±0.1

(2.75)

8.0±0.2

A A'

max 6°

1.7 ± 0.1

max 6°

0.25 ± 0.05

0.85 ± 0.1

1.8 ± 0.1

max 6° max 6°

TPS852

2007-10-01

Reel Label

The label markings may include product number, tape type and quantity.

P/N

TYPE TPS852

ADDC Q’TY 3,000 pcs.

NOTE

Leader and Trailer Sections of Tape

Note 1 : The leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier

tape with empty portion of 100 mm minimum.

Note 2 : The trailer portion shall consist of empty carrier of more than 10 cavities.

Position of label

Sensor hole

TPS852

2007-10-01

P – Ta

20 40 60 80 100

Ta = 25°C

1.6

3 4 5 6

1.2

0.8

0.4

VCC = 3 V

EV = 100 lx

using fluorescent light

1.40

0.60

−40

1.20

1.00

0.80

−20 0 20 40 60 80 100

0.0001

VCC = 3 V

0.1

0.01

0.001

40 60 80 100

Ta = 25°C

VCC = 3 V

A light source

Fluorescent light

10000

1000

100

0.1

1 10 100 1000 10000

0.001

0.01

0.1

110

100 1000 10000

Ta = 25°C

VCC = 3 V

Fluorescent light RL=5.1kΩ

Fluorescent light RL= 30 kΩ

Fluorescent light RL=100 kΩ

A light source RL = 5.1 kΩ

A light source RL = 30 kΩ

A light source RL = 100 kΩ

Power dissipation P (mW)

Ambient temperature Ta (°C) Ambient temperature Ta (°C)

Dark current ILEAK (μA)

ILEAK – Ta (typ.)

L – EV (typ.)

Light current IL (μA)

Luminance EV (lx)

Relative IL – Ta (typ.)

Relative light current

Ambient temperature Ta (°C)

Relative IL – VCC (typ.)

Relative light current

Supply voltage VCC (V)

O – EV (typ.)

Output voltage VO (V)

Luminance EV (lx)

TPS852

2007-10-01

100

1000

10000

0.1 110100

VCC = 3 V

EV = 100 lx

Using A light source

RL = 1 kΩ

1.40

0.60

−40

1.20

1.00

0.80

−20 0 20 40 60 80 100

Ta = 25°C

VCC = 3 V

VOUT

2 V

Using white LED

0.1

100

1000

1 10 100 1000 10000

Ta = 25°C

VCC = 3 V

using A light source

L = 5.1 kΩ

L = 50 kΩ

L = 100 kΩ

100

1000

10000

0.1 110 100

Ta = 25°C

VCC = 3 V

VOUT = 1.5 V

Using white LED

CC – EV (typ.)

Consumption current ICC (μA)

Relative ICC – Ta (typ.)

Luminance EV (lx)

Ambient temperature Ta (°C)

Relative consumption current

Switching Characteristics

(non-saturating operation) (typ.)

Switching Characteristics

(saturating operation) (typ.)

Switching time (μs)

Load resistance RL (kΩ) Load resistance RL (kΩ)

TPS852

2007-10-01

Switching Time Measurement Circuit and Waveforms

Luminosity

angle 30°

0°

60°

90° 90°

30°

60°

1.00.80.6 0.4 0.2 0

80°

70°

50°

40°

20°

10°

70°

80°

50°

40°

20°10°

Ta = 25°C

OUT

VCC

White LED

Pulse drive

TPS852

tf tr

1.5 V

VOUT

GND

90%

10%

ts td

200 400 600 1000 1200800

100

Ta = 25°C

Spectral Response (typ.)

Relative sensitivity

Wavelength λ (nm)

Radiation Pattern (typ.)

TPS852

2007-10-01

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

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