Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=-250uA -30 - - V
ΔBVDSS/ΔTjBreakdown Voltage Temperature Coefficient Reference to 25℃, ID=-1mA - -0.015 -V/℃
RDS(ON) Static Drain-Source On-Resistance2VGS=-10V, ID=-10A - - 14 mΩ
VGS=-4.5V, ID=-5A - - 20 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V
gfs Forward Transconductance VDS=-10V, ID=-10A - 13 - S
IDSS Drain-Source Leakage Current (Tj=25oC) VDS=-30V, VGS=0V - - -1 uA
Drain-Source Leakage Current (Tj=70oC) VDS=-24V, VGS=0V - - -25 uA
IGSS Gate-Source Leakage VGS=--
nA
QgTotal Gate Charge2ID=-10.7A - 29 46 nC
Qgs Gate-Source Charge VDS=-24V - 6 - nC
Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 14 - nC
td(on) Turn-on Delay Time2VDS=-15V - 15 - ns
trRise Time ID=-1A - 12 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=-10V - 100 - ns
tfFall Time RD=15Ω-70-ns
Ciss Input Capacitance VGS=0V - 2600 4100 pF
Coss Output Capacitance VDS=-25V - 500 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 370 - pF
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2IS=-10.7A, VGS=0V - - -1.2 V
trr Reverse Recovery Time IS=-10.7A, VGS=0V, - 31 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 25 - nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in2 copper pad of FR4 board ; 125 ℃/W when mounted on min. copper pad.
AP4407GM
± 25V ±100