LM4881
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LM4881 Dual 200 mW Headphone Amplifier with
Shutdown Mode
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1FEATURES DESCRIPTION
The LM4881 is a dual audio power amplifier capable
23• VSSOP Surface Mount Packaging of delivering 200mW of continuous average power
• Unity-gain Stable into an 8Ωload with 0.1% THD+N from a 5V power
• External Gain Configuration Capability supply.
• Thermal Shutdown Protection Circuitry Boomer™ audio power amplifiers were designed
• No Bootstrap Capacitors, or Snubber Circuits specifically to provide high quality output power with a
minimal amount of external components using
are Necessary surface mount packaging. Since the LM4881 does
not require bootstrap capacitors or snubber networks,
APPLICATIONS it is optimally suited for low-power portable systems.
• Headphone Amplifier The LM4881 features an externally controlled, low
• Personal Computers power consumption shutdown mode which is virtually
• Microphone Preamplifier clickless and popless, as well as an internal thermal
shutdown protection mechanism.
KEY SPECIFICATIONS The unity-gain stable LM4881 can be configured by
• THD+N at 1kHz at 125mW Continuous Average external gain-setting resistors.
Output Power into 8Ω0.1% (max)
• THD+N at 1kHz at 75mW Continuous
0.02% (typ)
• Output Power at 10% THD+N at 1kHz into 8Ω
300 mW (typ)
• Shutdown Current 0.7µA (typ)
• Supply Voltage Range 2.7V to 5.5 V
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Boomer is a trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1997–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4881
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Typical Application
*Refer to Application Information for information concerning proper selection of the input and output coupling
capacitors.
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagrams
Figure 2. VSSOP Package
Top View
See Package Number DGK0008A
Figure 3. SOIC and PDIP Package
Top View
See Package Number D0008A, or P0008E
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD + 0.3V
Power Dissipation(3) Internally limited
ESD Susceptibility(4) 2000V
ESD Susceptibility(5) 200V
Junction Temperature 150°C
Soldering Information Small Outline Package Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
Thermal Resistance θJC (VSSOP) 56°C/W
θJA (VSSOP) 210°C/W
θJC (SOIC) 35°C/W
θJA (SOIC) 170°C/W
θJC (PDIP) 37°C/W
θJA (PDIP) 107°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is P DMAX = (TJMAX −TA) / θJA. For the LM4881, TJMAX = 150°C, and the typical junction-
to-ambient thermal resistance, when board mounted, is 210°C/W for the VSSOP Package and 107°C/W for package P0008E.
(4) Human body model, 100 pF discharged through a 1.5 kΩresistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
Operating Ratings
Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤85°C
Supply Voltage 2.7V ≤VDD ≤5.5V
Electrical Characteristics(1)(2)
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA= 25C.
Symbol Parameter Conditions LM4881 Units
(Limits)
Typ(3) Limit(4)
VDD Power Supply Voltage 2.7 V (min)
5.5 V (max)
IDD Quiescent Current VIN = 0V, IO= 0A 3.6 6.0 mA (max)
ISD Shutdown Current VPIN1 = VDD 0.7 5 µA (max)
VOS Offset Voltage VIN = 0V 5 50 mV (max)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
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Electrical Characteristics(1)(2) (continued)
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA= 25C.
Symbol Parameter Conditions LM4881 Units
(Limits)
Typ(3) Limit(4)
POOutput Power THD = 0.1% (max); f = 1 kHz;
RL= 8Ω200 125 mW (min)
RL= 16Ω150 mW
RL= 32Ω85 mW
THD + N = 10%; f = 1 kHz;
RL= 8Ω300 mW
RL= 16Ω200 mW
RL= 32Ω110 mW
THD+N Total Harmonic Distortion + Noise RL= 16Ω, P O= 120 mWrms; 0.025 %
RL= 32Ω, PO= 75 mWrms; f = 1 0.02 %
kHz
PSRR CB= 1.0 µF, VRIPPLE = 200 mVrms, f 50 dB
= 120Hz
IDD Quiescent Current VIN = 0V, IO= 0A 1.1 mA
ISD Shutdown Current VPIN1 = VDD 0.7 µA
VOS Offset Voltage VIN = 0V 5 mV
POOutput Power THD = 1% (max); f = 1 kHz;
RL= 8Ω70 mW
RL= 16Ω65 mW
RL= 32Ω30 mW
THD + N = 10%; f = 1 kHz;
RL= 8Ω95 mW
RL= 16Ω65 mW
RL= 32Ω35 mW
THD+N Total Harmonic Distortion + Noise RL= 16Ω, P O= 60 mWrms; 0.2 %
RL= 32Ω, PO= 25 mWrms; f = 1 kHz 0.03 %
PSRR Power Supply Rejection Ratio CB= 1.0 µF, VRIPPLE = 200 mVrms, f 50 dB
= 100 Hz
External Components Description
(Figure 1)
Components Functional Description
1. RiInverting input resistance which sets the closed-loop gain in conjuction with Rf. This resistor also forms a
high pass filter with Ciat fc= 1 / (2πRiCi).
2. CiInput coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a
highpass filter with Riat fc= 1 / (2πRiCi). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of Ci.
3. RfFeedback resistance which sets closed-loop gain in conjuction with Ri.
4. CSSupply bypass capacitor which provides power supply filtering. Refer to the Application Information section
for proper placement and selection of the supply bypass capacitor.
5. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
6. COOutput coupling capacitor which blocks the DC voltage at the amplifier's output. Forms a high pass filter
with RLat fO= 1/(2πRLCO)
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Typical Performance Characteristics
THD+N vs Frequency THD+N vs Frequency
Figure 4. Figure 5.
THD+N vs Frequency THD+N vs Frequency
Figure 6. Figure 7.
THD+N vs Frequency THD+N vs Frequency
Figure 8. Figure 9.
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Typical Performance Characteristics (continued)
THD+N vs Output Power THD+N vs Output Power
Figure 10. Figure 11.
THD+N vs Output Power THD+N vs Output Power
Figure 12. Figure 13.
THD+N vs Output Power THD+N vs Output Power
Figure 14. Figure 15.
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Typical Performance Characteristics (continued)
Output Power vs Supply Voltage Output Power vs Supply Voltage
Figure 16. Figure 17.
Output Power vs Supply Voltage Power Dissipation vs Output Power
Figure 18. Figure 19.
Output Power vs Load Resistance Output Power vs Load Resistance
Figure 20. Figure 21.
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Typical Performance Characteristics (continued)
Power Dissipation vs Output Power Clipping Voltage vs Supply Voltage
Figure 22. Figure 23.
Clipping Voltage vs Supply Voltage Channel Separation
Figure 24. Figure 25.
Output Attenuation in Shutdown Mode Supply Current vs Supply Voltage
Figure 26. Figure 27.
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Typical Performance Characteristics (continued)
Power Supply Rejection Ratio Open Loop Frequency Response
Figure 28. Figure 29.
Noise Floor Frequency Response vs Output Capacitor Size
Figure 30. Figure 31.
Frequency Response vs Output Capacitor Size Frequency Response vs Output Capacitor Size
Figure 32. Figure 33.
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Typical Performance Characteristics (continued)
Typical Application Frequency Response Typical Application Frequency Response
Figure 34. Figure 35.
Power Derating Curve
Figure 36.
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APPLICATION INFORMATION
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4881 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch
between ground and supply to provide maximum device performance. By switching the shutdown pin to the VDD,
the LM4881 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown
pin voltages less than VDD, the idle current may be greater than the typical value of 0.7 µA. In either case, the
shutdown pin should be tied to a definite voltage because leaving the pin floating may result in an unwanted
shutdown condition. In many applications, a microcontroller or microprocessor output is used to control the
shutdown circuitry which provides a quick, smooth transition into shutdown. Another solution is to use a single-
pole, single-throw switch in conjunction with an external pull-up resistor. When the switch is closed, the shutdown
pin is connected to ground and enables the amplifier. If the switch is open, then the external pull-up resistor will
disable the LM4881. This scheme ensures that the shutdown pin will not float which will prevent unwanted state
changes.
POWER DISSIPATION
Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to
ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier
operating at a given supply voltage and driving a specified output load.
PDMAX = (VDD)2/ (2π2RL) (1)
Since the LM4881 has two operational amplifiers in one package, the maximum internal power dissipation point
is twice that of the number which results from Equation 1. Even with the large internal power dissipation, the
LM4881 does not require heat sinking over a large range of ambient temperature. From Equation 1, assuming a
5V power supply and an 8Ωload, the maximum power dissipation point is 158 mW per amplifier. Thus the
maximum package dissipation point is 317 mW. The maximum power dissipation point obtained must not be
greater than the power dissipation that results from Equation 2:
PDMAX = (TJMAX −TA) / θJA (2)
For package DGK0008A, θJA = 230°C/W, and for package D0008A, θJA = 170°C/W, and for package P0008E, θ
JA = 107°C/W. TJMAX = 150°C for the LM4881. Depending on the ambient temperature, TA, of the system
surroundings, Equation 2 can be used to find the maximum internal power dissipation supported by the IC
packaging. If the result of Equation 1 is greater than that of Equation 2, then either the supply voltage must be
decreased, the load impedance increased or TAreduced. For the typical application of a 5V power supply, with
an 8Ωload, the maximum ambient temperature possible without violating the maximum junction temperature is
approximately 96°C provided that device operation is around the maximum power dissipation point. Power
dissipation is a function of output power and thus, if typical operation is not around the maximum power
dissipation point, the ambient temperature may be increased accordingly. Refer to the Typical Performance
Characteristics curves for power dissipation information for lower output powers.
POWER SUPPLY BYPASSING
As with any power amplifer, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in the Typical Performance Characteristics section, the effect of a larger half supply
bypass capacitor is improved low frequency PSRR due to increased half-supply stability. Typical applications
employ a 5V regulator with 10 µF and a 0.1 µF bypass capacitors which aid in supply stability, but do not
eliminate the need for bypassing the supply nodes of the LM4881. The selection of bypass capacitors, especially
CB, is thus dependent upon desired low frequency PSRR, click and pop performance as explained in Proper
Selection of External Components system cost, and size constraints.
PROPER SELECTION OF EXTERNAL COMPONENTS
Selection of external components when using integrated power amplifiers is critical to optimize device and
system performance. While the LM4881 is tolerant of external component combinations, consideration to
component values must be used to maximize overall system quality.
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The LM4881 is unity gain stable and this gives a designer maximum system flexibility. The LM4881 should be
used in low gain configurations to minimize THD+N values, and maximum the signal-to-noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to the section, Audio Power Amplifier
Design, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed loop bandwidth of the amplifier. To a large extent, the
bandwidth is dicated by the choice of external components shown in Figure 1. Both the input coupling capacitor,
Ci, and the output coupling capacitor, Co, form first order high pass filters which limit low frequency response.
These values should be chosen based on needed frequency response for a few distinct reasons.
Selection of Input and Output Capacitor Size
Large input and output capacitors are both expensive and space hungry for portable designs. Clearly a certain
sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the
speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 150
Hz. Thus using large input and output capacitors may not increase system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
1/2 VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn on pops can be
minimized.
Besides minimizing the input and output capacitor sizes, careful consideration should be paid to the bypass
capacitor value. Bypass capacitor CBis the most critical component to minimize turn on pops since it determines
how fast the LM4881 turns on. The slower the LM4881's outputs ramp to their quiescent DC voltage (nominally
1/2 VDD), the smaller the turn on pop. Thus choosing CBequal to 1.0 µF along with a small value of Ci(in the
range of 0.1 µF to 0.39 µF), the shutdown function should be virtually clickless and popless. While the device will
function properly, (no oscillations or motorboating), with C Bequal to 0.1 µF, the device will be much more
susceptible to turn on clicks and pops. Thus, a value of CBequal to 0.1 µF or larger is recommended in all but
the most cost sensitive designs.
AUDIO POWER AMPLIFIER DESIGN
Design a Dual 200mW/8ΩAudio Amplifier
Given:
Power Output 200 mWrms
Load Impedance 8Ω
Input Level 1 Vrms (max)
Input Impedance 20 kΩ
Bandwidth 100 Hz–20 kHz ± 0.50 dB
A designer must first determine the needed supply rail to obtain the specified output power. Calculating the
required supply rail involves knowing two parameters, VOPEAK and also the dropout voltage. The latter is typically
530 mV and can be found from the graphs in the Typical Performance Characteristics. VOPEAK can be determined
from Equation 3.
(3)
For 200 mW of output power into an 8Ωload, the required VOPEAK is 1.79 volts. A minimum supply rail of 2.32V
results from adding VOPEAK and VOD. Since 5V is a standard supply voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that allows the LM4881 to reproduce peaks in excess of
200 mW without clipping the signal. At this time, the designer must make sure that the power supply choice
along with the output impedance does not violate the conditions explained in the Power Dissipation section.
Remember that the maximum power dissipation point from Equation 1 must be multiplied by two since there are
two independent amplifiers inside the package.
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Once the power dissipation equations have been addressed, the required gain can be determined from
Equation 4.
(4)
AV= Rf/Ri(5)
From Equation 4, the minimum gain is: AV= 1.26
Since the desired input impedance was 20 kΩ, and with a gain of 1.26, a value of 27 kΩis designated for Rf,
assuming 5% tolerance resistors. This combination results in a nominal gain of 1.35. The final design step is to
address the bandwidth requirements which must be stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response assuming a single pole roll-off. As stated in the
External Components Description section, both Riin conjunction with C i, and Cowith RL, create first order
highpass filters. Thus to obtain the desired frequency low response of 100 Hz within ±0.5 dB, both poles must be
taken into consideration. The combination of two single order filters at the same frequency forms a second order
response. This results in a signal which is down 0.34 dB at five times away from the single order filter −3 dB
point. Thus, a frequency of 20 Hz is used in the following equations to ensure that the response is better than 0.5
dB down at 100 Hz.
Ci≥1 / (2π* 20 kΩ* 20 Hz) = 0.397 µF; use 0.39 µF. (6)
Co≥1 / (2π* 8Ω* 20 Hz) = 995 µF; use 1000 µF. (7)
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the closed-loop
gain, A V. With a closed-loop gain of 1.35 and fH= 100 kHz, the resulting GBWP = 135 kHz which is much
smaller than the LM4881 GBWP of 18 MHz. This figure displays that if a designer has a need to design an
amplifier with a higher gain, the LM4881 can still be used without running into bandwidth limitations.
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REVISION HISTORY
Changes from Revision C (May 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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