© 2011 Microchip Technology Inc. DS22268A-page 1
MCP9501/2/3/4
Features
Factory Set Temperatur e Switch
Available Temperature Switch Thresholds:
-T
SET = -35°C,-25°C, -15°C, -5°C, 5°C , 15°C,
25°C, 35°C, 45°C, 55°C, 65° C, 75° C, 85° C,
95°C, 105°C, 115°C, 125°C
Wide Operating Voltage Range: 2.7V to 5.5V
Low Supply Current: 25 µA (typical)
Temperature Switch Accuracy:
- ±1°C (typic al)
- ±4°C (maximum) -15°C to +75°C
- ±6°C (maximum) -40°C to +125°C
Switch Threshold Options (Hot/Cold):
- Rising Temp.: MCP9501/2 (Hot Option)
- Falling Temp.: MCP9503/4 (Cold Option)
Outp ut Co nfi gur atio n Opt ion s:
- Active Low, Open-Drain Ou tpu t: MCP950 1/3
– Uses Exte rnal Pull-up Resistor
- Active-High, Push-Pull Output: MCP9502/4
User Selectable Hysteresis: 2°C or 10°C (typical)
5-lead SOT-23 package
Applications
Power Supply Critical Temperature Shutdown
Temperature Alarm
Thermostat Control
•Fan Control
Base-Stations
Automotive
Typical Performance
Description
Microchip Technology’s MCP9501/2/3/4 family of
devices are temperature switches with ±1°C (typical)
accurate factory set output thresholds. These devices
are ideal for high power supply systems where an
overtemperature protection circuit is needed. These
devices do not require external components, consume
25 µA (typical), and the factory set thresholds provide
simplicity.
In addition, this family of devices provide user
selectable 2°C and 10°C (typical) switch hysteresis,
and various output configurations. The MCP9501/2
outputs switch for rising temperatures while the
MCP9503/4 switch for falling temperature, with the
relative hysteresis at the set thresholds. This family of
devices is also available with Active-High Push-Pull
and Active-Low Open-Drain outputs, the MCP9502/4
and the MCP9501/3, respectively. The Push-Pull
output is ideal for a microcontroller interface while the
Open-Drai n output can be used for leve l shifting , wired-
OR configuration, or as a heater on/off switch.
The MCP9501/2/3/4 operate from 2.7V to 5.5V su pply.
This family is available with space saving 5-lead
SOT-23 package.
Package Types
0%
10%
20%
30%
40%
50%
-4.0
-2.0
0.0
2.0
4.0
Temperature Accuracy (°C)
Occurrences
TA = -35° C to 125°C
VDD = 4.1V
32 Units
4
1
2
3
5
GND
Hyst
SOT-23-5
MCP9501/2/3/4
GND Output
VDD
Temperature Switch with Selectable Hysteresis
MCP9501/2/3/4
DS22268A-page 2 © 2011 Microchip Technology Inc.
OUTPUT FUNCTIONAL DESCRIPTION
Temperature
COLD HOT
V
Output
Hysteresis
THYST TSET
MCP9501, Hot-Option (Open-Drain, Active-Low)
Temperature
V
Output
COLD HOT
Hysteresis
THYST TSET
MCP9502, Hot-Option (Push-Pull, Active-High)
Temperature
V
Output
COLD HOT
TSET THYST
Hysteresis
MCP9503, Cold-Option (Open-Drain , Active-Low)
COLD
HOT
V
Output
Hysteresis
T
SET
T
HYST
MCP9504, Cold-Option (Push-Pull, Active-High)
Temperature
Note: Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C, +35°C,
+45°C, +55°C, +65°C, +75°C, +85°C,
+95°C, +105°C, +115°C, +125°.
Note: Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C, +35°C,
+45°C, +55°C, +65°C, +75°C, +85°C,
+95°C, +105°C, +115°C, +125°.
Note: Avai lable temperatu re thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C.
Note: Avai lable temperatu re thresholds for
Option N or for falling temperature
only: -35°C, -25°C, -15°C, -5°C.
Note: Available temperature thresholds for
Option P or for rising temperature only:
+5°C, +15°C, +25°C.
Note: Available temperature thresholds for
Option N or for falli ng temperature only :
-35°C, -25°C, -15°C, -5°C.
Note: Contact Microchip for all other
threshold options.
© 2011 Microchip Technology Inc. DS22268A-page 3
MCP9501/2/3/4
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD.................................................................................. 6.0V
Voltage at all Input/Output pins...............GND – 0.3V to 6.0V
Input/Output Current ...................................... .... ...........20 mA
Storage temperature ........... .... .. .. .. ....... .. .. .... .-65°C to +150°C
Ambient temp. with power applied................- 40°C to +125°C
Junction Temperature (TJ).......................................... +150°C
ESD protection on all pins (HBM:MM). .. .... .. ........ (4 kV/400V)
Latch-Up Current at each pin (25°C)....................... ±200 mA
†Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and
GND = Ground.
Parameters Sym Min Typ Max Unit Conditions
Sensor Accuracy
-15°C TA +75°C -4 ±1 +4 °C Note 1
-40°C TA +125°C -6 ±2 6 °C
Power Supply
Operati ng Voltage VDD 2.7 5.5 V
Operati ng Curren t IDD —2540µA
Line-Regulation Δ°C/ΔV— 0.2 °C/VV
DD = 2.7V to 5.5V
Hysteresis
Trip Point Hysteresis THYST —2°CHYST = GND
—10°CHYST = V
DD
Hysteresis Select Input VIH 0.8VDD ——V
VIL ——0.2V
DD V
ILeak —0.1µA
Open-Drain Output Leakage ILeak 0.1 10 µA MCP9501/3
Output Voltage High VOH 0.8VDD ——VI
OUT = 5 mA (MCP9502/4)
Output Voltage Low VOL ——0.2V
DD VI
OUT = 5 mA
Tu rn On Time TON —1ms
SOT23-5 tRES 1.7 s Time to 63% (89°C).
+25°C (Air) to +125°C
(oil bath)
Note 1: This sp ecifi cation is tes ted at mid s upply of 4.1V f or op timum op eration acros s the s upply volt age range o f
2.7V to 5.5V.
TEMPERATURE CHARACTE RISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, and
GND = Ground.
Parameters Sym Min Typ Max Units Conditions
Te mperature Ranges
Spec ified Temperatu re Ran ge TA-40 +125 °C (Note 1)
Operati ng Temperatu r e Range TA-40 +125 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23 θJA 220.7 °C/Ω
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
MCP9501/2/3/4
DS22268A-page 4 © 2011 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, GND = Ground, RPULL-UP = 10 kΩ
(MCP9501/3 only) and 0.1 µF bypass capacitor.
FIGURE 2-1: Temperature Accuracy.
FIGURE 2-2: Hysteresis vs. Temperature.
FIGURE 2-3: Supply Cur re nt vs.
Temperature.
FIGURE 2-4: Leaka ge vs . Tempe ra tur e.
FIGURE 2-5: VOL,VOH vs. Temperature.
FIGURE 2-6: Power On Reset Threshold
vs. Temperature.
Note: The g r ap hs and t ables prov id ed fol low i ng thi s n ote are a sta t is tical summar y b as ed on a limite d n um ber of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
-40-200 20406080100120
TA (°C )
Temperature Accuracy (°C)
Spec. Limits
+ St. Dev.
Average
- St. Dev.
VDD = 4.1V
32 units
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-40-200 20406080100120
TA (°C)
HYST = VSS, Hysteresis (°C)
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
14.0
HYST = VDD, Hysteresis (°C)
HYST = VSS
HYST = VDD
10
15
20
25
30
35
40
-40-200 20406080100120
TA (°C)
IDD (µA)
VDD = 5.5
V
VDD = 4.1
V
VDD = 2.7
V
0.00
0.02
0.04
0.06
0.08
0.10
-40-200 20406080100120
TA (°C)
Leak ag e (µA )
HY ST In put Pin
Open-Drain Output
(MCP9501 /03 only)
0%
5%
10%
15%
20%
-40-200 20406080100120
TA (°C)
VOL (% of VDD)
80%
85%
90%
95%
100%
VOH (% of VDD)
VOH, VDD = 5.5
V
VOH, VDD = 4.1
V
VOH, VDD = 2.7
V
VOL, VDD = 5.5
V
VOL, VDD = 4.1
V
VOL, VDD = 2.7
V
VPOR Hysteresis (mV)
45
55
65
75
85
95
105
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-40 -20 0 20 40 60 80 100 120
V
P
O
R
H
y
s
t
e
r
e
s
i
s
(
m
V
)
V
P
O
R
(
V
)
TA(°C)
VPOR
Hysteresis
VPOR (V)
VPOR Hysteresis (mV)
© 2011 Microchip Technology Inc. DS22268A-page 5
MCP9501/2/3/4
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, TA = -40°C to +125°C, GND = Ground, RPULL-UP = 10 kΩ
(MCP9501 only) and 0.1 µF bypas s capacitor.
FIGURE 2-7: Temperature Accuracy
Distribution at -15°C.
FIGURE 2-8: Temperature Accuracy
Distribution at 5°C.
FIGURE 2-9: Temperature Accuracy
Distribution at 65°C.
FIGURE 2-10: Temperature Accuracy
Distributi on at 105° C .
FIGURE 2-11: Temperature Accuracy
Distributi on at 115°C .
FIGURE 2-12: Temperature Accuracy
Distributi on at 125°C .
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= -15\C
VDD = 4.1V
492 Un its
°
Occurrences
TA (°C)
-4.0
-2.0
0.0
2.0
4.0
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= 5\C
VDD = 4.1V
480 Un its
Occurrences
°
-4.0
-2.0
0.0
2.0
4.0
TA (°C)
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= 65 \C
VDD = 4.1V
480 Un its
°
TA (°C)
-4.0
-2.0
0.0
2.0
4.0
Occurrences
-4.0
-2.0
0.0
2.0
4.0
TAC)
-4.0
-2.0
0.0
2.0
4.0
TAC)
°
Occurrences
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= 105\C
VDD = 4.1V
480 Un its
°
Occurrences
TAC)
-4.0
-2.0
0.0
2.0
4.0
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= 115\C
VDD = 4.1V
480 Un its
-4.0
-2.0
0.0
2.0
4.0
°
TA (°C)
Occurrences
°
0%
10%
20%
30%
40%
50%
60%
-
4
.
0
-
2
.
0
0
.
0
2
.
0
4
.
0
O
c
c
u
r
r
e
n
c
e
s
Temperature Accur acy (°C)
TA= 125\C
VDD = 4.1V
480 Un its
Occurrences
TA (°C)
-4.0
-2.0
0.0
2.0
4.0
°
MCP9501/2/3/4
DS22268A-page 6 © 2011 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
TABLE 3-1: PIN FUNCTION TABLE
3.1 Ground (GND)
The GND pin is the system ground pin. Pin 2 must be
connected to system ground. Pin 1 can also be
connected to system ground which would provide
better thermal conduction to the die.
3.2 Hysteresis Input (HYS)
This is an input pin which can be connected to VDD or
GND to select output hysteresis. Either 2°C
(HYST = GND) or 10°C (HYST = VDD) of typical
hysteresis can be selected.
3.3 Power Pin (VDD)
The operating voltage range, as specified in the DC
electrical specification table, is applied on this pin.
3.4 Switch Output (Output )
This out put i s t r igg ered when temperatu re ris es or fa ll s
beyond the programmed trip temperature threshold.
MCP9501/3 require an external pull-up resistor.
MCP9501/2/3/4 Symbol Description
SOT-23-5
1 GND Ground
2 GND Ground (must be connected to ground)
3 HYST Hysteresis Selection Input:
HYST = GND Hysteresis is 2°C (typical)
HYST = VDD Hysteresis is 10°C (typical)
4V
DD Power pin
5 Output Output Op tions:
MCP9501 Open-Drain, Active-Low Output (Hot-Option)
MCP9502 Push-Pull, Active-High Output (Hot-Op tio n)
MCP9503 Open-Drain, Act ive-Low Output (Cold-Option)
MCP9504 Push-Pull, Active -High Outpu t (Cold-Option)
© 2011 Microchip Technology Inc. DS22268A-page 7
MCP9501/2/3/4
NOTES:
MCP9501/2/3/4
DS22268A-page 8 © 2011 Microchip Technology Inc.
4.0 FUNCTIONAL DESCRIPTION
The MCP9501/2/3/4 temperature switch family
integrate s a thermal diod e, a compa rator, and a factory
selectable resistive network used to set the
temperature thresholds. The available output
thresholds range from -35°C to 125°C at 10°C
increments. There is no additional configuration
required to operate this device. The selectable output
hysteresis is controlled using a single input pin. When
this pin is connec ted to ground, the output hys teresis i s
2°C (typical) and when connected to VDD the output
hysteresis is 10°C (typical). Figure 4-1 shows the
functional block diagram.
FIGURE 4-1: Functional Block Diagram.
There are two output configurations for this family, a
push-pull and an open-drain output with active-high
and active-low as se rtions. Thes e a ssertion option s a re
referred to as Cold and Hot options, primarily due to the
direction of selected hysteresis. For the Cold option,
temperature has to fall below the threshold for the
output to assert High, and de-assert Low when the
temperature rises above the threshold plus the
hysteresis. For example, a 65°C threshold and 2°C
(typica l) hysteresis, when temperature fa lls below 65°C
the output asserts High, and the de-asserts Low when
temperature rises above 67°C. For the Hot option, the
opposite is true. When temperature rises above 65°C,
the output asserts Low, and de-asserts High when the
temperature falls below 63°C. Figure 4-2 shows a
graphical description for the Hot and Cold options.
FIGURE 4-2: Output Hysteresis.
The Push-Pull output is ideal for a microcontroller
interface using an input/output pin or an interrupt input
pin. The open-drain option can be used with multiple
sensors in a wired-OR configuration or as a level
shifter.
ISET
Rx+
-
OUT/
OUT
Thermal
Diode
Hysteresis
Select Pin
Threshold
Select
Cold Hot
TSET
THYST
Temperature
V
Output
10°C Typical Hystere si s
2°C Typical
Hysteresis
Cold Hot
TSET THYST
Temperature
V
Output
10°C Typical Hysteresis
2°C Typ ical
Hysteresis
Hot-Option (Active-Low)
Cold-Option (Active-High)
© 2011 Microchip Technology Inc. DS22268A-page 9
MCP9501/2/3/4
4.1 Application Information
The MCP9501/2/3/4 temperature switch family
integrates a temperature sensor and a comparator
circuit which outputs an alert signal when the factory
set temperature threshold is exceeded. No additional
component is required for device operation, which
provides simplicity to the system designer. The device
output options provide design flexibility for various
applications such as overtemperature protection circuit
or a closed loop temperature control unit. This device
can be interfaced to a closed loop fan controller
network without the need for a microcontroller.
FIGURE 4-3: Fan Controller Usi ng
MCP9502.
The MCP9501/2/3/4 provide Open-Drain output where
multiple sensors from multiple PCB hot-spots can be
connected to a single processor I/O input with a wired-
OR configuration. The MCP9501 requires an external
pull-up re sistor which can be used to level-shift the al ert
signal. For example, if the sensors are powered with
5VDD and the controller or processor is powered with
3VDD, the external resistor can be level-shifted by
connecting 3VDD to the pull-up resistor as shown in
Figure 4-4.
FIGURE 4-4: MCP9501 Wired-OR Output
Configuration with Level-shift.
4.1.1 LAYOUT CONSIDERATION AND
THERMAL CONSIDERATION
This family of sensors measures temperature by
monitoring the voltage level of a thermal diode located
in the die. A low-impedance thermal path between the
die and the PC B is provided by the pi ns. Therefore, the
sensor effectively monitors PCB temperature. For
efficient performance, it is recommended to layout the
device as close to the heat source as possible.
When con necting an external re sistor to th e MCP950 1/
3, the current through the pull-up resistor must be
considered to prevent self-heat due to power. This can
be determined using Equation 4-1.
EQUATION 4-1: EFFECT OF
SELF-HEATING
For example, at room temperature, when the output
asserts Active-Low and maximum IDD = 50 µA,
VDD =5.5V, V
OL = 0.3V and IOUT = 5 mA (see the
specification table), the self heating due to power
dissipation (TJ - TA) is ~0.4°C.
Output
HYST
5VDD
MCP9502
12V
M
OUT
HYST
5VDD
OUT
HYST
5VDD I/O
RPULL_UP
Micro-
controller
MCP9501
85°C
MCP9503
35°C
3VDD
Where:
TJ= Jun ction Temperature
TA= A mbient Temperature
θJA = Package Thermal Resistance
(220.7 °C/W)
VOL = Sensor Output Low Voltage
IOUT = Output Current
TJTA
θJA VDD IDD
×VOL IOUT
×+()=
MCP9501/2/3/4
DS22268A-page 10 © 2011 Microchip Technology Inc.
4.1.2 POWER SUPPL Y REJECTI ON
The MCP9501/2/3/4 family does not require any
additional components. However, it is recommended
that a decoupling capacitor of 0.1 µF to 1 µF be used
between the VDD and GND pins. A high-frequency
ceram ic c apaci t or is re co mm en ded . It i s nece s sa ry f o r
the capacitor to be located as close as possible to the
power pins in order to provide effective noise
protection.
FIGURE 4-5: Power-supply Filter using a
Single Resistor.
For applications where a switching regulator is used to
power the sensor, it is recommended to add a 200Ω
resistor in series to VDD to filter out the switcher noise.
It is also recommended to add the series resistor in
applications where a linear regulator is used to
step-down a switching regulator voltage to power the
sensor, as shown in Figure 4-5. For example, if a
linearly regu lated 3.3 V from a 5V swi tching regulato r is
used to power the sensor, add a 200Ω series resi stor.
The MCP9501/2/3/4 family of sensors is designed to
prevent false output trigger due to high frequency
power supply or system noise. Figure 4-6 shows the
device performa nce with a high f requency s ignal adde d
on VDD. The output is not triggered due to the signal
added on VDD. With some applications, it is
recommended to add a bypass capacitor of 0.1 µF to
F.
FIGURE 4-6: Power Supply Rejection.
VDD
200Ω
MCP9501/2/3/4
Switching
Regulator 0.1 µF
bypass
VDD
200Ω
MCP9501/2/3/4
Switching
Regulator 0.1 µF
bypass
Regulator
Linear 0
1
2
3
4
5
6
10 100 1000 10000 100000 1000000 10000000
O
u
t
p
u
t
V
o
l
t
a
g
e
(
V
)
Frequency (H z)
MCP9501/2/3/4 TSET = 25\C Pow er Supply Rejec tio n
No False Trigger
1
0
k
1
0
0
k
1
M1
0
M
1
k
1
0
0
1
0
VDD = 5V + 400mVAC
VDD = 5V + 400mVSQR
TSET = 25\C
TA= 23\C
°
°
°
Freq uency (Hz)
Output Voltage (V)
© 2011 Microchip Technology Inc. DS22268A-page 11
MCP9501/2/3/4
NOTES:
MCP9501/2/3/4
DS22268A-page 12 © 2011 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
123
54
5-Lead SOT-23 Example:
XXNN
123
54
XL25
Device Code Device Code
Hot Options
MCP9501PT-005E/OT WVNN MCP9502PT-005E/OT XLNN
MCP9501PT-015E/OT WWNN MCP9502PT-015E/OT XMNN
MCP9501PT-025E/OT WXNN MCP9502PT-025E/OT XPNN
MCP9501PT-035E/OT WYNN MCP9502PT-035E/OT XQNN
MCP9501PT-045E/OT WZNN MCP9502PT-045E/OT XRNN
MCP9501PT-055E/OT X1NN MCP9502PT-055E/OT XSNN
MCP9501PT-065E/OT X2NN MCP9502PT-065E/OT XTNN
MCP9501PT-075E/OT X3NN MCP9502PT-075E/OT XUNN
MCP9501PT-085E/OT X4NN MCP9502PT-085E/OT XVNN
MCP9501PT-095E/OT X5NN MCP9502PT-095E/OT XWNN
MCP9501PT-105E/OT X6NN MCP9502PT-105E/OT XXNN
MCP9501PT-115E/OT X7NN MCP9502PT-115E/OT XYNN
MCP9501PT-125E/OT X8NN MCP9502PT-125E/OT XZNN
MCP9503PT-005E/OT XHNN MCP9501PT-005E/OT Y9NN
MCP9503PT-015E/OT XJNN MCP9501PT-015E/OT YANN
MCP9503PT-125E/OT XKNN MCP9501PT-025E/OT YBNN
Cold Options
MCP9503NT-005E/OT XBNN MCP9501NT-005E/OT Y3NN
MCP9503NT-015E/OT XCNN MCP9501NT-015E/OT Y4NN
MCP9503NT-025E/OT XDNN MCP9501NT-025E/OT Y5NN
MCP9503NT-035E/OT XENN MCP9501NT-035E/OT Y6NN
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanu meric traceabil ity code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icroc hip p art numb er cann ot be mark ed on one line, it wil l
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Note: Contact Microchip for all other
threshold opt ion s.
© 2011 Microchip Technology Inc. DS22268A-page 13
MCP9501/2/3/4
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MCP9501/2/3/4
DS22268A-page 14 © 2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2011 Microchip Technology Inc. DS22268A-page 15
MCP9501/2/3/4
APPENDIX A: REVISION HISTORY
Revision A (January 2011)
Original Release of this Docu ment.
MCP9501/2/3/4
DS22268A-page 16 © 2011 Microchip Technology Inc.
NOTES:
© 2011 Microchip Technology Inc. DS22268A-page 17
MCP9501/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP9501P: Resistor Programmable T emperature Switch,
Hot Option
MCP9502P Resistor Programmable T emperature Switch,
Hot Option
MCP9503N: Resistor Programmable T emperature Switch,
Cold Option
MCP9504N Resistor Programmable T emperature Switch,
Cold Option
Temper atu re Swit ch
Threshold: 005, 015, 025, 035, 045, 055, 065, 075, 085, 095, 105,
115, 125
Temperature Range: E = -40°C to +125°C
Package: OT = Plastic Small Outline Transistor (SOT-23), 5-lead
PART NO. -XXXX /XX
PackageTemperature
Switch Threshold
Device
Examples:
a) MCP9501PT-025E/OT: Active-Low,
Open-Dr a i n Ou t p u t,
25°C Switch Th reshold,
Hot Optio n ,
Extended Temp.,
5LD SOT-23 pkg.
b) MCP9502PT-025E/OT: Active-High,
Push-Pull Output,
25°C Switch Th reshold,
Hot Optio n ,
Extended Temp.,
5LD SOT-23 pkg.
c) MCP9503NT-025E/OT: Active-Low,
Open-Dr a i n Ou t p u t,
-25°C Switch Threshold,
Cold Option,
Extended Temp.,
5LD SOT-23 pkg.
d) MCP9504NT-025E/OT: Ac tive- High ,
Push-Pull Output,
-25°C Switch Threshold,
Cold Option,
Extended Temp.,
5LD SOT-23 pkg.
e) MCP9501PT-105E/OT: Active-Low,
Open-Dr a i n Ou t p u t,
105°C Switch Threshold,
Hot Optio n ,
Extended Temp.,
5LD SOT-23 pkg.
f) MCP9502PT-105E/OT: Active-High,
Push-Pull Output,
105°C Switch Threshold,
Hot Optio n ,
Extended Temp.,
5LD SOT-23 pkg.
g) MCP9503NT-035E/OT: Ac tive- Low,
Open-Dr a i n Ou t p u t,
-35°C Switch Threshold,
Cold Option,
Extended Temp.,
5LD SOT-23 pkg.
h) MCP9504NT-035E/OT: Ac tive- High ,
Push-Pull Output,
-35°C Switch Threshold,
Cold Option,
Extended Temp.,
5LD SOT-23 pkg.
X
Temperature
Range
MCP9501/2/3/4
DS22268A-page 18 © 2011 Microchip Technology Inc.
NOTES:
© 2011 Microchip Technology Inc. DS22268A-page 19
Information contained in this publication regarding device
applications and the like is provid ed only for yo ur c onvenience
and may be superseded by u pdates. It is y our respo ns i bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPL AB, PIC , PI Cmi cro, PI CSTART,
PIC32 logo, rfPIC and UNI/O are registered trademark s of
Microchip Technology Incorporat ed in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPAS M, MPLA B Cert ified
logo, MPLIB, MPLINK, mTouch, Octopus, Om niscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporat ed in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-861-0
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal met hods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contai ned in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22268A-page 20 © 2011 Microchip Technology Inc.
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08/04/10