ALPHA & OMEGA SEMICONDUCTOR A Al poe) B L1 ~-~e-~ RECOMMENDED LAND PATTERN 2.30 oes UNITimm NOTE - Document No. PO00109 Version B TO251 PACKAGE OUTLINE | { | fi b3 Sxbl] Fat LL b4 exbe| SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES MAX MIN NOM MAX A 6.5 6.6 0. 252 0. 256 0. 260 Al 5.4 5.5 0. 209 0. 213 0. 217 A2 4.4 4.5 0. 169 0.173 0.177 B 1.5 1. 65 0. 053 0. 059 0. 065 Ll 55 REF _O6IREF L 7.7 8 0. 291 0. 303 0. 315 D 5. 55 5.7 0. 213 0. 219 0. 224 Cc 0.6 0. 65 0. 022 0. 024 0. 026 Cl . 0. 54 0. 59 0.019 0. 021 0. 023 El . 1.77 1. 82 0. 068 0. 070 0. 072 E 2. 2.3 2.4 0. 087 0. 091 0. 094 bl 0. - 0.75 0. 024 - 0. 030 b2 0. - 0. 85 0. 028 0. 033 b3 0.8 0. 031 b4 0.9 0. 035 e 2.3 0.091 1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH SHOULD BE LESS THAN 6 MIL. 2. TOLERANCE 0.100 MILLIMETERS UNLESS OTHERWISE SPECIFIED. 3. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 4. REFER TO JEDEC TO-251D AA.