Approval sheet
Page 6 of 7 WR18-20-25X(W)_V17 DEC - 2016
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56 (rated
temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The
testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness
testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1,
subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST PROCEDURE REQUIREMENT
DC resistance
Clause 4.5 DC resistance values measured at the test voltages specified below :
<10Ω@0.1V,<100Ω@0.3V, <1KΩ@1.0V, <10KΩ@3V,
<100KΩ@10V, <1MΩ@25V, <10MΩ@30V
Within the specified
tolerance
Temperature
Coefficient of
Resistance(T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Refer to
“QUICK REFERENCE
DATA”
Short time overload
(S.T.O.L) Clause
Clause 4.13
Permanent resistance change after a 5second application of a voltage
2.5 times RCWV or the maximum overload voltage specified in the
above list, whichever is less.
∆R/R max. ±(2%+0.1Ω)
Resistance to
soldering heat(R.S.H)
Clause 4.18
Un-mounted chips completely immersed for 10±1second in a SAC
solder bath at 260℃±5ºC no visible damage
∆ R/R max. ±(1%+0.05Ω)
Solderability
Clause 4.17
Un-mounted chips completely immersed for 2±0.5 second in a SAC
solder bath at 235℃±5℃ good tinning (>95%
covered)
no visible damage
Temperature cycling
Clause 4.19 30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes
at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous
cycles
no visible damage
∆R/R max. ±(1%+0.05Ω)
Load life (endurance)
Clause 4.25
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller
70±2ºC, 1.5 hours on and 0.5 hours off
∆R/R max. ±(3%+0.1Ω)
Load life in Humidity
Clause 4.24
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber
controller at 40°C±2°C and 90~95% relative humidity, 1.5hours on and
0.5 hours off
∆R/R max. ±(3%+0.1Ω)
Bending strength
Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4);
bending : 2 mm, once for 10 seconds ∆R/R max. ±(1%+0.05Ω)
Adhesion
Clause 4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or
removal of the terminations
Insulation Resistance
Clause 4.6 Apply the maximum overload voltage (DC) for 1minute R≧10GΩ
Dielectric Withstand
Voltage
Clause 4.7
Apply the maximum overload voltage (AC) for 1 minute No breakdown or flashover