ASMT-QYBB-NGH0E - Avago Technologies

ASMT-QYBB-Nxxxx

Super 0.5W Warm White Power PLCC-4

Surface Mount LED Indicator

Data Sheet

CAUTION: ASMT-QYBB-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions

during handling and processing. Refer to Avago Application Note AN-1142 for additional details.

Description

The Super 0.5W Warm White Power PLCC-4 SMT LED is

Warm white mid-Power PLCC-4 SMT LEDs using InGaN

chip technology. The package can be driven at high

current due to its superior package design. The product

is able to dissipate the heat more eﬃciently compared to

the Power PLCC-4 SMT LEDs. These LEDs produce higher

light output with better ﬂux performance compared to

the Power PLCC-4 SMT LED.

The Super 0.5W Warm White Power PLCC-4 SMT LEDs are

designed for higher reliability, better performance, and

operate under a wide range of environmental conditions.

The performance characteristics of these new mid-power

LEDs make them uniquely suitable for use in harsh condi-

tions such as in automotive applications, and in electronics

signs and signals.

To facilitate easy pick and place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel is

shipped in single intensity and color bin, to provide close

uniformity.

Features

• Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)

• High reliability package with enhanced silicone resin

encapsulation

• High brightness with optimum ﬂux performance

using InGaN chip technologies

• Available in Warm White

• Available in 8mm carrier tape & 7 inch reel

• Low Thermal Resistance 40°C/W

• Wide viewing angle at 120 degree

• JEDEC MSL 2

Applications

1. Interior automotive

a. Instrument panel backlighting

b. Central console backlighting

c. Navigation and audio system backlighting

d. Dome/Map lighting

e. Push button backlighting

f. Puddle lamp

g. Glove compartment illumination

2. Exterior automotive

a. Number plate illumination

3. Electronic signs and signals

a. Decorative lighting

4. Oﬃce automation, home appliances, industrial equipment

a. Panel/button backlighting

b. Display backl-ighting

Package Drawing

Table 1. Device Selection Guide (TJ = 25 °C)

Color Part Number

Luminous Flux, ΦV[1] (lm)

Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)

Warm White ASMT-QYBB-NFG0E 15.0 22.5 25.5 150 InGaN

Notes:

1. ΦV is the total luminous ﬂux output as measured with an integrating sphere at mono pulse conditions.

2. Tolerance = ±12%

Part Numbering System

Note:

1. All Dimensions in millimeters.

2. Lead Polarity as shown in Figure 12.

3. Terminal Finish: Ag plating

4. Encapsulation material: Silicone resin

Figure 1. Package Drawing

3.6 ± 0.2

0.7

3.2 ± 0.2

2.8 ± 0.2

2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3

A A

0.79 ± 0.3

CATHODE

MARKING

Ø 2.4

1.15 ± 0.2

0.41 (TYP.)

0.56 (TYP.)

0.97

A S M T - Q X1B B – N X2X3X4X5

Packaging Option

Colour Bin Selection

Max. Flux Bin Selection

Min. Flux Bin Selection

Color

Y - Warm White

Table 2. Absolute Maximum Ratings (TA = 25°C)

Parameters ASMT-QYBB-Nxxxx

DC Forward Current [1] 150 mA

Peak Forward Current [2] 300 mA

Power Dissipation 615 mW

Reverse Voltage Not Recommended

Junction Temperature 125°C

Operating Temperature -40°C to +110°C

Storage Temperature -40°C to +110°C

Notes:

1. Derate Linearly as shown in Figure 6.

2. Duty Factor = 10%, Frequency = 1kHz

Table 3. Optical Characteristics (TJ = 25°C)

Color Part Number

Dice

Technology

Typical

Chromaticity

Coordinates

Viewing

Angle 2θ½[1]

(Degrees)

Luminous

Eﬃciency

ηe (lm/W)

Total Flux /

Luminous Intensity

ΦV (lm) / IV (cd)

x y Typ. Typ. Typ.

Warm White ASMT-QYBB-Nxxxx InGaN 0.41 0.39 120 43 2.85

Notes:

1. θ½ is the oﬀ-axis angle where the luminous intensity is ½ the peak intensity.

Table 4. Electrical Characteristics (TJ = 25°C)

Part Number

Forward Voltage VF (Volts) @ IF = 150 mA

Thermal Resistance RθJ-P (°C/W)Typ. Max.

ASMT-QYBB-NxxxE 3.5 4.1 40

100

120

140

160

0 20 40 60 80 100 120

TEMPERATURE (°C)

CURRENT - mA

RθJA = 90°C/W

RθJA = 110°C/W

0.0

0.2

0.4

0.6

0.8

1.0

0 25 50 75 100 125 150

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS FLUX

(NORMALIZED AT 150 mA)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

-50 -25 0 25 50 75 100

TJ - JUNCTION TEMPERATURE - °C

RELATIVE LUMINOUS FLUX

(NORMALIZED AT 25°C)

0.00

0.10

0.20

0.30

0.40

0.00001 0.0001 0.001 0.01 0.1 0 10 100

tp - Time - (s)

CURRENT - A

0.00001 0.0001 0.001 0.01 0.1 0 10 100

tp - Time - (s)

0.00

0.10

0.20

0.30

0.40

D = tp

D =

0.05

0.10

0.25

0.50

D =

0.05

0.10

0.25

0.50

D = tp

100

120

140

160

0 20 40 60 80 100 120

TEMPERATURE (°C)

CURRENT - mA

RθJP = 40°C/W

Figure 4. Relative Flux vs. Forward Current Figure 5. Relative Flux Vs. Temperature

Figure 6a. Maximum Forward Current Vs. Ambient Temperature.

Derated Based on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W.

Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.

Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.

Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage.

100

150

200

250

300

0 1 2 3 4

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

380 430 480 530 580 630 680 730 780

WAVELENGTH - nm

RELATIVE INTENSITY

Figure 8. Forward Voltage Shift Vs. Temperature. Figure 9. Radiation Pattern

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0.10

0.15

0.20

-50 -25 0 25 50 75 100

TJ - JUNCTION TEMPERATURE - °C

FORWARD VOLTAGE SHIFT - V

-0.008

-0.006

-0.004

-0.002

0.000

0.002

0.004

0.006

-0.004 -0.003 -0.002 -0.001 0.000 0.001 0.002

x COORDINATE

y COORDINATE

2mA

5mA

10mA

50mA

100mA

150mA

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

100

120

140

160

0 20 40 60 80 100 120

TEMPERATURE (°C)

CURRENT - mA

RθJA = 90°C/W

RθJA = 110°C/W

0.0

0.2

0.4

0.6

0.8

1.0

0 25 50 75 100 125 150

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS FLUX

(NORMALIZED AT 150 mA)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

-50 -25 0 25 50 75 100

TJ - JUNCTION TEMPERATURE - °C

RELATIVE LUMINOUS FLUX

(NORMALIZED AT 25°C)

0.00

0.10

0.20

0.30

0.40

0.00001 0.0001 0.001 0.01 0.1 0 10 100

tp - Time - (s)

CURRENT - A

0.00001 0.0001 0.001 0.01 0.1 0 10 100

tp - Time - (s)

0.00

0.10

0.20

0.30

0.40

D = tp

D =

0.05

0.10

0.25

0.50

D =

0.05

0.10

0.25

0.50

D = tp

100

120

140

160

0 20 40 60 80 100 120

TEMPERATURE (°C)

CURRENT - mA

RθJP = 40°C/W

Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.

Derated Based on TA = 25°C, RθJ-A=110°C/W.

Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.

Derated Based on TA= 85°C, RθJ-P=110°C/W.

Figure 12. Recommended Soldering Pad Pattern

Figure 10. Recommended Pick and Place Nozzle Size Figure 11. Recommended Pb-free Reﬂow Soldering Proﬁle

Note: For detail information on reﬂow soldering of Avago surface mount

LEDs, do refer to Avago Application Note AN 1060 Surface Mounting

SMT LED Indicator Components.

Note: Diameter "D" should be smaller than 2.2mm

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

100 SEC. MAX.

10 to 30 SEC.

TIME

TEMPERATURE

CATHODE

MARKING

CATHODE

MARKING

A A

C C

SOLDER MASK

ANODE

CATHODE

0.4

0.3

MINIMUM 55 mm2 OF CATHODE PAD

FOR IMPROVED HEAT DISSIPATION

2.4

0.6

0.9 X 6

4.6

1.1

1.3 x 6

A A

C C

Figure 14. Tape Dimensions

Figure 15. Reeling Orientation

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

Figure 13. Tape Leader and Trailer Dimensions

3.8 ± 0.1

2.29 ± 0.1

0.229 ± 0.01

ALL DIMENSIONS IN mm.

2 ± 0.054 ± 0.1 4 ± 0.1

3.05 ± 0.1

3.5 ± 0.05

8+0.3

–0.1

1.75 ± 0.1

Ø1.5 +0.1

–0

8°

Ø1+0.1

–0

A A

C C

200 mm MIN. FOR Ø180 REEL.

200 mm MIN. FOR Ø330 REEL.

TRAILER COMPONENT LEADER

480 mm MIN. FOR Ø180 REEL.

960 mm MIN. FOR Ø330 REEL.

USER FEED DIRECTION

Handling Precaution

The encapsulation material of the product is made of

silicone for better reliability of the product. As silicone is a

soft material, please do not press on the silicone or poke

a sharp object onto the silicone. These might damage the

product and cause premature failure. During assembly

or handling, the unit should be held on the body only.

Please refer to Avago Application Note AN 5288 for detail

information.

Moisture Sensitivity

This product is qualiﬁed as Moisture Sensitive Level 2

per Jedec J-STD-020. Precautions when handling this

moisture sensitive product is important to ensure the reli-

ability of the product. Do refer to Avago Application Note

AN5305 Handling of Moisture Sensitive Surface Mount

Devices for details.

A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored

at <40°C/90%RH for 12 months. If the actual shelf

life has exceeded 12 months and the HIC indicates

that baking is not required, then it is safe to reﬂow

the LEDs per the original MSL rating.

- It is not recommended to open the MBB prior to

assembly (e.g. for IQC).

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all time

and all high temperature related process including

soldering, curing or rework need to be completed

within 1 year.

C. Control for unﬁnished reel

- For any unuse LEDs, they need to be stored in

sealed MBB with desiccant or desiccator at <5%RH.

D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, the PCB

need to be stored in sealed MBB with desiccant

or desiccator at <5%RH to ensure no LEDs have

exceeded their ﬂoor life of 1 year.

E. Baking is required if:

- “60%” HIC indicator is NOT blue.

- The LEDs are exposed to condition of >30°C / 60%

RH at any time.

- The LEDs ﬂoor life exceeded 1 year.

Recommended baking condition: 60±5°C for 20 hours.

Device Color (X1)

Y Warm White

Flux Bin Select (X2X3)

Individual reel will contain parts from one bin only

X2Min Flux Bin

X3Max Flux Bin

Flux Bin Limits

Bin ID Min. (lm) Max. (lm)

B 5.50 7.00

C 7.00 9.00

D 9.00 11.50

E 11.50 15.00

F 15.00 19.50

G 19.50 25.50

H 25.50 33.00

J 33.00 43.00

K 43.00 56.00

L 56.00 73.00

J 43.00 56.00

K 56.00 73.00

Tolerance of each bin limit = ± 12%

Color Bin Select (X4)

Individual reel will contain parts from one sub bin only.

0 Full Distribution

A H, J and K only

B H, J, K, L and M only

C L and M only

D L, M, N and P only

E N and P only

F N, P, Q and R only

G Q and R only

Z Special Color Bin

Color Bin Limits

Bin ID Sub Bin ID Limits (Chromaticity Coordinates)

H H3 x 0.348 0.360 0.364 0.350

y 0.332 0.341 0.358 0.348

H4 x 0.350 0.364 0.367 0.352

y 0.348 0.358 0.376 0.365

H5 x 0.352 0.367 0.371 0.354

y 0.365 0.376 0.392 0.381

J J3 x 0.360 0.373 0.378 0.364

y 0.341 0.350 0.368 0.358

J4 x 0.364 0.378 0.383 0.367

y 0.358 0.368 0.386 0.376

J5 x 0.367 0.383 0.388 0.371

y 0.376 0.386 0.403 0.392

K K3 x 0.373 0.387 0.393 0.378

y 0.350 0.358 0.376 0.368

K4 x 0.378 0.393 0.399 0.383

y 0.368 0.376 0.395 0.386

K5 x 0.383 0.399 0.405 0.388

y 0.386 0.395 0.412 0.403

L L3 x 0.387 0.400 0.407 0.393

y 0.358 0.366 0.384 0.376

L4 x 0.393 0.407 0.414 0.399

y 0.376 0.384 0.402 0.395

L5 x 0.399 0.414 0.421 0.405

y 0.395 0.402 0.420 0.412

M M3 x 0.400 0.413 0.421 0.407

y 0.366 0.372 0.390 0.384

M4 x 0.407 0.421 0.429 0.414

y 0.384 0.390 0.409 0.402

M5 x 0.414 0.429 0.436 0.421

y 0.402 0.409 0.426 0.420

N N3 x 0.413 0.425 0.434 0.421

y 0.372 0.378 0.396 0.390

N4 x 0.421 0.434 0.443 0.429

y 0.390 0.396 0.414 0.409

N5 x 0.429 0.443 0.451 0.436

y 0.409 0.414 0.430 0.426

Bin ID Sub Bin ID Limits (Chromaticity Coordinates)

P P3 x 0.425 0.438 0.447 0.434

y 0.378 0.382 0.400 0.396

P4 x 0.434 0.447 0.456 0.443

y 0.396 0.400 0.417 0.414

P5 x 0.443 0.456 0.465 0.451

y 0.414 0.417 0.434 0.430

Q Q3 x 0.438 0.450 0.460 0.447

y 0.382 0.386 0.403 0.400

Q4 x 0.447 0.460 0.470 0.456

y 0.400 0.403 0.420 0.417

Q5 x 0.456 0.470 0.479 0.465

y 0.417 0.420 0.436 0.434

R R3 x 0.450 0.462 0.472 0.460

y 0.386 0.389 0.405 0.403

R4 x 0.460 0.472 0.482 0.470

y 0.403 0.405 0.422 0.420

R5 x 0.470 0.482 0.491 0.479

y 0.420 0.422 0.437 0.436

Tolerance of each bin limit = ±0.02.

VF Bin Limits

Bin ID Min. Max.

S5 3.20 3.50

S6 3.50 3.80

S7 3.80 4.10

Tolerance of each bin limit = ±0.1V

Packaging Option (X5)

Option Test Current Package Type Reel Size

E 150mA Top Mount 7 Inch

0.31

0.33

0.35

0.37

0.39

0.41

0.43

0.45

0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50

X-COORDINATE

Y-COORDINATE

4800K - 3650K

3650K - 3150K

3150K - 2800K

2800K - 2500K

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

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AV02-1323EN - September 28, 2009