MICROCIRCUIT DATA SHEET Original Creation Date: 09/06/95 Last Update Date: 09/22/00 Last Major Revision Date: 08/16/00 MNLM2991-X REV 1A1 NEGATIVE LOW DROPOUT ADJUSTABLE REGULATOR General Description The LM2991 is a low dropout adjustable negative regulator with a output voltage range between -2V to -25V. The LM2991 provides up to 1A of load current and features a ON/Off pin for remote shutdown capability. The LM2991 uses new circuit design techniques to provide a low dropout voltage, low quiescent current and low temperature coefficient precision reference. The dropout voltage at 1A load current is typically 0.6V and a guaranteed worst-case maximum of 1V over the entire operating temperature range. The quiescent current is typically 1mA with a 1A load current and an input-output voltage differential greater than 3V. A unique circuit design of the internal bias supply limits the quiescent current to only 9mA (typical) when the regulator is in the dropout mode (Vout - Vin < 3V). The LM2991 is short-circuit proof, and thermal shutdown includes hysteresis to enhance the reliability of the device when inadvertently overloaded for extended periods. Industry Part Number NS Part Numbers LM2991 LM2991J-QML LM2991J-QMLV LM2991WG-QML Prime Die LM2991 Controlling Document SEE FEATURES SECTION Processing Subgrp Description MIL-STD-883, Method 5004 1 2 3 4 5 6 7 8A 8B 9 10 11 Quality Conformance Inspection MIL-STD-883, Method 5005 1 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 Features - Output voltage adjustable from -2V to -25V Output current in excess of 1A Dropout voltage typically 0.6V at 1A load Low quiescent current Internal short circuit current limit Internal thermal shutdown with hysteresis TTL, CMOS compatible ON/OFF switch Functional complement to the LM2941 series CONTROLLING DOCUMENTS: LM2991J-QML 5962-9650501QEA LM2991J-QMLV 5962-9650501VEA LM2991WG-QML 5962-9650501QXA Applications - Post switcher regulator - Local, on-card, regulation - Battery operated equipment 2 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 (Absolute Maximum Ratings) (Note 1) Input Voltage -26V to +0.3V Power Dissipation (Note 2, 3) Internally Limited Operating Temperature Range (Tj) -55 C to +125 C Maximum Junction Temperature (Tjmax) 150 C Storage Temperature Range -65 C < Ta < +150 C Thermal Resistance (Note 3) ThetaJA CERAMIC DIP CERAMIC SOIC (Still Air (500LF/Min (Still Air (500LF/Min @ 0.5 C/W) Air flow @ 0.5 C/W) @ 0.5 C/W) Air flow @ 0.5 C/W) ThetaJC CERAMIC DIP CERAMIC SOIC Package Weight (Typical) Lead Temperature (Soldering, 10 seconds) ESD Susceptibility (Note 4) 75 35 119 73 C/W C/W C/W C/W 5 C/W 3 C/W TBD 260 C 1.5kV Note 1: Note 2: Note 3: Note 4: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specification apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax -TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. If this dissipation is exceeded, the die temperature will rise above 125 C and the LM2991 will go into thermal shutdown. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 100pF discharge through a 1.5K Ohms resistor. 3 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 Recommended Operating Conditions (Note 1) Maximum Input Voltage (Operational) -26V Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 4 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 Electrical Characteristics DC PARAMETERS (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -10V, Vo = -3V, Io = 1A, Co = 47uF, R1 = 2.7K, Tj = 25 C SYMBOL Vref Vout PARAMETER Reference Voltage CONDITIONS NOTES PINNAME MIN MAX UNIT SUBGROUPS 5mA < Io < 1A -1.234 -1.186 V 1 5mA < Io < 1A, Vo - 1V > Vin > -26V -1.27 -1.15 V 2, 3 -3 V 1 -24 V 1 +25 V 2, 3 Output Voltage Range Vin = -26V VRLN Line Regulation Io = 5mA, Vo - 1V > Vin > -26V -26 +26 mV 1, 2, 3 VRLD Load Regulation 50mA < Io < 1A -12 +12 mV 1 -15 +15 mV 2, 3 0.2 V 1 0.3 V 2, 3 0.8 V 1 1 V 2, 3 V DO Dropout Voltage Io = 0.1A, Delta Vo < 100mV Io = 0.1A, Delta Vo < 100mV Io = 1A, Delta Vo < 100mV Io = 1A, Delta Vo < 100mV I q Quiescent Current Io < 1A 5 mA 1, 2, 3 Dropout Quiescent Current Vin = Vo, Io < 1A 50 mA 1, 2, 3 R R Ripple Rejection Vripple = 1Vrms, Fripple = 1KHz, Io = 5mA dB 1 V O N Output Noise 10Hz - 100KHz, Io = 5mA 450 uV 1 500 uV 2, 3 0.8 V 1, 2, 3 V 1, 2, 3 I l 50 ON/OFF Input Voltage (Vout:ON) ON/OFF Input Voltage (Vout:OFF) ON/OFF Input Current VON/OFF = 0.8V (Vout:ON) 10 uA 1 ON/OFF Input Current VON/OFF = 0.8V (Vout:ON) 25 uA 2, 3 ON/OFF Input Current VON/OFF = 2.4V (Vout:OFF) 100 uA 1 ON/OFF Input Current VON/OFF = 2.4V (Vout:OFF) 150 uA 2, 3 Output Leakage Current Vin = -26V, VON/OFF = 2.4V, Vout = 0V 250 uA 1 300 uA 2, 3 2.4 5 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 Electrical Characteristics DC PARAMETERS(Continued) (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -10V, Vo = -3V, Io = 1A, Co = 47uF, R1 = 2.7K, Tj = 25 C SYMBOL I Limit PARAMETER Current Limit CONDITIONS NOTES Vout = 0V PINNAME MIN MAX UNIT SUBGROUPS 1.5 2.5 A 1 1.0 4.0 A 2, 3 DC PARAMETERS: DRIFT VALUES (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -10V, Vo = -3V, Io = 1A, Co = 47uF, R1 = 2.7K, Tj = 25 C "Deltas not required on B-Level product. Deltas required for S-Level product ONLY as specified on Internal Processing Instructions (IPI)" Vref Reference Voltage 5mA < Io < 1A + 20 Graphics and Diagrams GRAPHICS# DESCRIPTION 06323HRB3 CERDIP (J), 16 LEAD (B/I CKT) 06349HRA2 CERPACK (W), 16 LEAD (B/I CKT) J16ARL CERDIP (J), 16 LEAD (P/P DWG) P000384A CERAMIC SOIC (WG), 16 LEAD (PINOUT) P000388A CERDIP (J), 16 LEAD (PINOUT) WG16ARC CERAMIC SOIC (WG), 16 LEAD (P/P DWG) See attached graphics following this page. 6 mV 1 N/C 1 16 INPUT ADJUST 2 15 N/C ON/OFF 3 14 N/C GROUND 4 13 N/C N/C 5 12 N/C N/C 6 11 N/C OUTPUT 7 10 N/C N/C 8 9 N/C LM2991WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000384A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C 1 16 N/C N/C 2 15 N/C INPUT 3 14 ADJ ON/OFF 4 13 N/C GND 5 12 N/C OUTPUT 6 11 N/C N/C 7 10 N/C N/C 8 9 N/C LM2991J 16 - LEAD DIP CONNECTION DIAGRAM TOP VIEW P000388A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 MICROCIRCUIT DATA SHEET MNLM2991-X REV 1A1 Revision History Rev ECN # Originator Changes 0B0 M0001490 05/19/98 Rel Date Barbara Lopez Changed: MNLM2991-X Rev. 0A0 to MNLM2991-X Rev. 0B0. Added power dissipation note for Aluminum Nitride package. 0C1 M0002862 12/15/98 Barbara Lopez Updated MDS: MNLM2991-X Rev. 0B0 to MNLM2991-X Rev. 0C1. Added WG package to MDS. Updated B/I CKT and Pinout for J package. Added WG package graphics. Added Package Weight to Absolute section. 0D1 M0003138 09/22/00 Rose Malone Update MDS: MNLM2991-X, Rev. 0C1 to MNLM2991-X, Rev. 0D1. 1A1 M0003741 09/22/00 Rose Malone Updated MDS: MNLM2991-X, Rev. 0D1 to MNLM2991-X, Rev. 1A1. Re-format to Features Section, Absolute Section. Added Drift Value Table to Electrical Section. 7