PS2566L-1-F4-A - Renesas Electronics

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DESCRIPTION

The PS2566-1 is optically coupled isolators containing GaAs light emitting diodes and an NPN silicon darlington

connected phototransistor.

The PS2566-1 is in a plastic DIP (Dual In-line Package) and the PS2566L-1 is lead bending type (Gull-wing) for

surface mount.

The PS2566L1-1 is lead bending type for long creepage distance.

The PS2566L2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.

FEATURES

• AC input response

• High Isolation voltage (BV = 5 000 Vr.m.s.)

• High current transfer ratio (CTR = 2 000% TYP.)

• High-speed switching (tr, tf = 100

s TYP.)

• Ordering number of taping product: PS2566L-1-E3, E4, F3, F4, PS2566L2-1-E3, E4

• Safety standards

• UL approved: File No. E72422

• CSA approved: No. CA 101391

• BSI approved: No. 7112/7420

• SEMKO approved: No. 303059

• NEMKO approved: No. P03200272

• DEMKO approved: No. 312341

• FIMKO approved: No. FI 10620

• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)

APPLICATIONS

• Telephone/FAX.

• FA/OA equipment

• Programmable logic controller

DATA SHEET

The information in this document is subject to change without notice. Before using this document, please confirm that

this is the latest version.

Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices

representative for availability and additional information.

HIGH ISOLATION VOLTAGE

AC INPUT, DARLINGTON TRANSISTOR TYPE

MULTI PHOTOCOUPLER SERIES −NEPOC Series−

The mark  shows major revised points.

Document No. PN10237EJ03V0DS (3rd edition)

Date Published March 2006 CP(K)

Printed in Japan

PHOTOCOUPLER

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1



NEC Compound Semiconductor Devices, Ltd. 1991, 2006

PACKAGE DIMENSIONS (UNIT : mm)

DIP Type (New package)

PS2566-1

3.5±0.3

4.15±0.43.2±0.4

2.54

1.25±0.15

0.50±0.10

0.25

4.6±0.35

6.5±0.5

0 to 15˚

7.62

0.25

+0.1

–0.05

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

DIP Type

PS2566-1

4.6±0.5

6.5±0.5

3.5±0.3

4.15±0.43.3±0.5

2.54

1.25±0.15 0.50±0.10

0.25

0 to 15˚

7.62

0.25

+0.1

–0.05

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Lead Bending Type (New package)

PS2566L-1

0.25

4.6±0.35

6.5±0.5

3.5±0.3

2.54

1.25±0.15

0.15

0.9±0.25

9.60±0.4

0.25

+0.1

–0.05

0.1

+0.1

–0.05

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

Lead Bending Type

PS2566L-1

4.6±0.5

6.5±0.5

0.25

3.5±0.3

2.54

1.25±0.15

0.15

0.9±0.25

9.60±0.4

0.25

+0.1

–0.05

0.1

+0.1

–0.05

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

Data Sheet PN10237EJ03V0DS 3

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Lead Bending Type For Long Creepage Distance (New Package)

PS2566L1-1

0 to 15˚

0.25

+0.1

–0.05

10.16

2.54

0.25 M

0.50±0.1

1.25±0.15

3.85

±0.4

3.15

±0.35

3.5

±0.3 6.5±0.5

4.6±0.35

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

Lead Bending Type For Long Creepage Distance

PS2566L1-1

10.16

0.25

+0.1

–0.05

0 to 15˚

4.6±0.5

6.5±0.5

3.5±0.3

3.15±0.35 3.85±0.4

2.54

1.25±0.15

0.50±0.10

0.25

TOP VIEW

1. Anode, Cathode

2. Cathode, Anode

3. Emitter

4. Collector

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Lead Bending Type For Long Creepage Distance (Gull-Wing) (New Package)

PS2566L2-1

0.25 M

0.25

2.54

1.25±0.15

3.5±0.3

6.5±0.5

4.6±0.35

11.8

+0.2

–0.5

0.25

+0.1

–0.05

0.25±0.2

0.9±0.25

10.16

TOP VIEW

1. Anode,

Cathode

2. Cathode,

Anode

3. Emitter

4. Collector

Lead Bending Type For Long Creepage Distance (Gull-Wing)

PS2566L2-1

4.6±0.5

6.5±0.5

3.5±0.3

2.54 0.25

1.25±0.15

0.25

0.9±0.25

0.25

+0.1

–0.05

10.16

11.8

+0.2

–0.5

0.25±0.2

TOP VIEW

1. Anode, Cathode

2. Cathode, Anode

3. Emitter

4. Collector

Data Sheet PN10237EJ03V0DS 5

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

MARKING EXAMPLE

2566

NL601

Assembly Lot

Week Assembled

Year Assembled

(Last 1 Digit)

In-house Code

CTR Rank Code

No. 1 pin

Mark

Package

New PKG

Standard PKG

Made in Japan Made in Taiwan

N601

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

ORDERING INFORMATION

Part Number Order Number Solder Plating

Specification

Packing Style Safety Standard

Approval

Application Part

Number *1

PS2566-1 PS2566-1-A Pb-Free Magazine case 100 pcs Standard products PS2566-1

PS2566L-1 PS2566L-1-A (UL, CSA, BSI,

PS2566L1-1 PS2566L1-1-A NEMKO, SEMKO,

PS2566L2-1 PS2566L2-1-A DEMKO, FIMKO

PS2566L-1-E3 PS2566L-1-E3-A Embossed Tape 1 000 pcs/reel approved)

PS2566L-1-E4 PS2566L-1-E4-A

PS2566L-1-F3 PS2566L-1-F3-A Embossed Tape 2 000 pcs/reel

PS2566L-1-F4 PS2566L-1-F4-A

PS2566L2-1-E3 PS2566L2-1-E3-A Embossed Tape 1 000 pcs/reel

PS2566L2-1-E4 PS2566L2-1-E4-A

PS2566-1-V PS2566-1-V-A Magazine case 100 pcs

DIN EN60747-5-2

PS2566L-1-V PS2566L-1-V-A

(VDE0884 Part2)

PS2566L1-1-V PS2566L1-1-V-A

approved products

PS2566L2-1-V PS2566L2-1-V-A (option)

PS2566L-1-V-E3 PS2566L-1-V-E3-A Embossed Tape 1 000 pcs/reel

PS2566L-1-V-E4 PS2566L-1-V-E4-A

PS2566L-1-V-F3 PS2566L-1-V-F3-A Embossed Tape 2 000 pcs/reel

PS2566L-1-V-F4 PS2566L-1-V-F4-A

PS2566L2-1-V-E3

PS2566L2-1-V-E3-A

Embossed Tape 1 000 pcs/reel

PS2566L2-1-V-E4

PS2566L2-1-V-E4-A

*1 For the application of the Safety Standard, following part number should be used.

Data Sheet PN10237EJ03V0DS 7

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Diode Forward Current (DC) IF 80 mA

Power Dissipation Derating

∆

PD/°C 1.5 mW/°C

Power Dissipation PD 150 mW

Peak Forward Current*1 IFP 1 A

Transistor Collector to Emitter Voltage VCEO 40 V

Emitter to Collector Voltage VECO 6 V

Collector Current IC 200 mA

Power Dissipation Derating

∆

PC/°C 2.0 mW/°C

Power Dissipation PC 200 mW

Isolation Voltage*2 BV 5 000 Vr.m.s.

Operating Ambient Temperature TA –55 to +100 °C

Storage Temperature Tstg –55 to +150 °C

*1 PW = 100

s, Duty Cycle = 1%

*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output

Pins 1-2 shorted together, 3-4 shorted together.

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Diode Forward Voltage VF IF = ±10 mA 1.17 1.4 V

Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 100 pF

Transistor Collector to Emitter Dark

Current

ICEO VCE = 40 V, IF = 0 mA 400 nA

Coupled Current Transfer Ratio

(IC/IF)

CTR IF = ±1 mA, VCE = 2 V 200 2 000 %

CTR Ratio*1 CTR1/

CTR2

IF = 1 mA, VCE = 2 V 0.3 1.0 3.0

Collector Saturation

Voltage

VCE (sat) IF = ±1 mA, IC = 2 mA 1.0 V

Isolation Resistance RI-O VI-O = 1.0 kVDC 1011 Ω

Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF

Rise Time*2 tr VCC = 10 V, IC = 10 mA, RL = 100 Ω 100

Fall Time*2 tf 100

*1 CTR1 = IC1/IF1, CTR2 = IC2/IF2

IF1

IF2

IC1

IC2

VCE

*2 Test circuit for switching time

OUT

= 100 Ω

50 Ω

Pulse Input

PW = 1 ms

Duty Cycle = 1/10

Data Sheet PN10237EJ03V0DS 9

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)

150

100

02550

75 100 125 150

100

1000

10 000

–50 –25 0 25 50 75 100

0.2

0.5

200

0.4

100

0.6 0.8 1.0 1.2 1.4 1.6

10 mA

5 mA

1 mA

0.5 mA

= 0.1 mA

0.2 mA

1.5 mW/˚C

= 2 V

5 V

10 V

24 V

40 V

–1.0

–1.5

–40

–80

–60

0–0.5 0.5 1.51.0

–20

0.5

0.1

100

0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5

0˚C

–25˚C

–55˚C

+60˚C

+25˚C

= +100˚C

Diode Power Dissipation PD (mW)

Transistor Power Dissipation PC (mW)

Ambient Temperature T

(˚C)

Forward Current IF (mA)

Forward Voltage V

(V)

Collector to Emitter Dark Current ICEO (nA)

Collector Saturation Voltage V

CE(sat)

(V)

Ambient Temperature T

(˚C)

Ambient Temperature T

(˚C)

DIODE POWER DISSIPATION vs.

AMBIENT TEMPERATURE

TRANSISTOR POWER DISSIPATION

vs. AMBIENT TEMPERATURE

FORWARD CURRENT vs.

FORWARD VOLTAGE

COLLECTOR TO EMITTER DARK

CURRENT vs. AMBIENT TEMPERATURE

COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

Collector Current IC (mA) Forward Current IF (mA)

Forward Voltage V

(V)

FORWARD CURRENT vs.

FORWARD VOLTAGE

150

100

02550

75 100 125 150

2 mW/˚C

200

Remark The graphs indicate nominal characteristics.

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

1.4

1.2

1.0

0.8

0.6

0.4

0.2

–50 0–25 50 75 100

8 000

1 000

2 000

3 000

4 000

5 000

6 000

7 000

VCE = 2 V

0.1 0.5 1 5 10 30

1 000

500

100

50 500 1 k 5 k

= 5 V,

= 2 mA,

CTR = 2 280%

500

1 k300

100

1 000

5 000

10 000

5 k 10 k 50 k

1 500

2 000

2 500

3 000

500

1 000

= 2 V

50 10010 500

= 5 V,

= 1 mA,

CTR = 2 280%

30 500 100 k

100

120

140

160

246810

5 mA

2 mA

1 mA

= 0.5 mA

Normalized to 1.0

at T

= 25˚C,

= 1 mA, V

= 2 V

Forward Current I

(mA)

Ambient Temperature T

(˚C)

Load Resistance R

(Ω)

Normalized Current Transfer Ratio CTR

Current Transfer Ratio CTR (%)

Load Resistance R

(Ω)

Switching Time t ( s)

NORMALIZED CURRENT TRANSFER

RATIO vs. AMBIENT TEMPERATURE

CURRENT TRANSFER RATIO vs.

FORWARD CURRENT

SWITCHING TIME vs.

LOAD RESISTANCE

SWITCHING TIME vs.

LOAD RESISTANCE

Switching Time t ( s)

Forward Current I

( A)

Current Transfer Ratio CTR (%)

CURRENT TRANSFER RATIO vs.

FORWARD CURRENT

Collector Current IC (mA)

Collector to Emitter Voltage V

(V)

COLLECTOR CURRENT vs.

COLLECTOR TO EMITTER VOLTAGE

Sample A

DSample A

Remark The graphs indicate nominal characteristics.

Data Sheet PN10237EJ03V0DS 11

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

10 10

0.6

0.2

0.4

0.8

1.0

1.2

= 25

= 60

510

0.2 0.5 1 2 20 50 100 200

= 1 mA,

= 2 V

–20

–15

–10

–5

= 100 Ω

Time (Hr)

CTR (Relative Value)

LONG TERM CTR DEGRADATION

Frequency f (kHz)

Normalized Gain G

FREQUENCY RESPONSE

= 1 mA (TYP.)

Remark The graphs indicate nominal characteristics.

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

TAPING SPECIFICATIONS (UNIT : mm)

Tape Direction

Outline and Dimensions (Tape)

Outline and Dimensions (Reel)

PS2566L-1-E3 PS2566L-1-E4

1.55±0.1

2.0±0.1

4.0±0.1

1.75±0.1

4.5 MAX.

4.0±0.1

0.4

5.3±0.1

8.0±0.1

7.5±0.1

16.0±0.3

10.3±0.1

1.5

+0.1

–0

Packing: 1 000 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

21.0±0.8

254±2.0

80.0±1.0

2.0±0.5

15.9 to 19.4

Outer edge of

flange

21.5±1.0

17.5±1.0

Data Sheet PN10237EJ03V0DS 13

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Tape Direction

PS2566L-1-F3 PS2566L-1-F4

Outline and Dimensions (Tape)

1.55±0.1

2.0±0.1

4.0±0.1

1.75±0.1

4.5 MAX.

4.0±0.1

0.4

5.3±0.1

8.0±0.1

7.5±0.1

16.0±0.3

10.3±0.1

1.5

+0.1

–0

Outline and Dimensions (Reel)

Packing: 2 000 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

21.0±0.8

330±2.0

100±1.0

2.0±0.5

15.9 to 19.4

Outer edge of

flange

21.5±1.0

17.5±1.0

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Tape Direction

PS2565L2-1-E3 PS2565L2-1-E4

Outline and Dimensions (Tape)

2.05±0.1

2.0±0.1

4.0±0.1 1.55±0.1

1.75±0.1

4.4±0.2

12.35±0.15

0.38

11.5±0.1

24.0±0.3

6.6±0.2

12.0±0.1

Outline and Dimensions (Reel)

Packing: 1 000 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

21.0±0.8

330±2.0

100±1.0

2.0±0.5

29.5±1.0

25.5±1.0

23.9 to 27.4

Outer edge of

flange

Data Sheet PN10237EJ03V0DS 15

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

120±30 s

(preheating)

220˚C

180˚C

Package Surface Temperature T (˚C)

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260˚C MAX.

120˚C

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by soldering iron

• Peak temperature (lead part temperature) 350°C or below

• Time (each pins) 3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.

(b) Please be sure that the temperature of the package would not be heated over 100°C.

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between

collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute

maximum ratings.

3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler

Check the setting values before use, since the forward current conditions at CTR measurement differ according

to product.

When using products other than at the specified forward current, the characteristics curves may differ from the

standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual

operating conditions and thoroughly take variations or the like into consideration before use.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature and high humidity.

Data Sheet PN10237EJ03V0DS 17

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

Parameter Symbol Speck Unit

Application classification (DIN VDE 0109)

for rated line voltages ≤ 300 Vr.m.s.

for rated line voltages ≤ 600 Vr.m.s.

III

Climatic test class (DIN IEC 68 Teil 1/09.80) 55/100/21

Dielectric strength

maximum operating isolation voltage

Test voltage (partial discharge test, procedure a for type test and random test)

Upr = 1.2 × UIORM, Pd < 5 pC

UIORM

Upr

890

1 068

Vpeak

Test voltage (partial discharge test, procedure b for all devices test)

Upr = 1.6 × UIORM, Pd < 5 pC

Upr 1 424 Vpeak

Highest permissible overvoltage UTR 8 000 Vpeak

Degree of pollution (DIN VDE 0109) 2

Clearance distance > 7.0 mm

Creepage distance > 7.0 mm

Comparative tracking index (DIN IEC 112/VDE 0303 part 1) CTI 175

Material group (DIN VDE 0109) III a

Storage temperature range Tstg –55 to +150 °C

Operating temperature range TA –55 to +100 °C

Isolation resistance, minimum value

VIO = 500 V dc at TA = 25°C

VIO = 500 V dc at TA MAX. at least 100°C

Ris MIN.

1012

1011

Ω

Safety maximum ratings (maximum permissible in case of fault, see thermal

derating curve)

Package temperature

Current (input current IF, Psi = 0)

Power (output or total power dissipation)

Isolation resistance

VIO = 500 V dc at TA = 175°C (Tsi)

Tsi

Isi

Psi

Ris MIN.

175

400

700

109

°C

Ω

Data Sheet PN10237EJ03V0DS

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority

having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.

M8E 00. 4 - 0110

The information in this document is current as of March, 2006. The information is subject to change

without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data

books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products

and/or types are available in every country. Please check with an NEC sales representative for

availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of NEC semiconductor products listed in this document or any other

liability arising from the use of such products. No license, express, implied or otherwise, is granted under any

patents, copyrights or other intellectual property rights of NEC or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of customer's equipment shall be done under the full

responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third

parties arising from the use of these circuits, software and information.

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers

agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize

risks of damage to property or injury (including death) to persons arising from defects in NEC

semiconductor products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment, and anti-failure features.

NEC semiconductor products are classified into the following three quality grades:

"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products

developed based on a customer-designated "quality assurance program" for a specific application. The

recommended applications of a semiconductor product depend on its quality grade, as indicated below.

Customers must check the quality grade of each semiconductor product before using it in a particular

application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's

data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not

intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness

to support a given application.

(Note)

(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.

and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

•

Data Sheet PN10237EJ03V0DS 19

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1

Caution GaAs Products This product uses gallium arsenide (GaAs).

GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe

the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws

and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.

NEC Compound Semiconductor Devices Hong Kong Limited

E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)

Hong Kong Head Office

Taipei Branch Office

Korea Branch Office

TEL: +852-3107-7303

TEL: +886-2-8712-0478

TEL: +82-2-558-2120

FAX: +852-3107-7309

FAX: +886-2-2545-3859

FAX: +82-2-558-5209

NEC Electronics (Europe) GmbH http://www.ee.nec.de/

TEL: +49-211-6503-0 FAX: +49-211-6503-1327

California Eastern Laboratories, Inc. http://www.cel.com/

TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504

NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/

E-mail: salesinfo@ml.ncsd.necel.com (sales and general)

techinfo@ml.ncsd.necel.com (technical)

Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579

For further information, please contact

PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1