PC847XJ0000F Series DIP 16pin (4-channel) General Purpose Photocoupler PC847XJ0000F Series 1-channel package type is also available. (model No. PC817XJ0000F Series) Description Agency approvals/Compliance PC847XJ0000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-channel package, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC817) 2. Package resin : UL flammability grade (94V-0) Applications 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different potentials and impedances Features 1. 16pin DIP 4-channnel package 2. Double transfer mold package (ldeal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 80V) 4. Current transfer ratio (CTR : MIN. 50% at IF=5mA, VCE=5V) 5. Several CTR ranks available 6. High isolation voltage between input and output (Viso(rms) : 5.0kV) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A03202EN Date Jun. 30. 2005 (c) SHARP Corporation PC847XJ0000F Series Internal Connection Diagram 16 15 14 13 12 11 10 9 Anode Cathode 9 11 13 15 Emitter 10 12 14 16 Collector 1 3 5 7 2 4 6 8 1 2 3 4 5 6 7 8 Outline Dimensions (Unit : mm) 1.20.3 1 13 12 4 5 PC817 2 3 2.540.25 11 10 9 6 7 6.50.5 14 PC817 15 PC817 16 PC817 8 19.820.5 7.620.3 2.70.5 3.00.5 0.5 TYP. Date code 0.60.2 3.50.5 Anode mark Factory identification mark 1. Through-Hole [ex. PC847XJ0000F] Epoxy resin 0.50.1 : 0 to 13 Product mass : approx. 1.0g 0.60.2 1 2 3 13 12 4 5 11 10 6 PC817 9 7 6.50.5 14 PC817 15 PC817 16 PC817 Date code 1.20.3 8 2.540.25 19.820.5 1.0+0.4 -0 0.350.25 0.260.1 7.620.3 3.50.5 Anode mark Factory identification mark 2. SMT Gullwing Lead-Form [ex. PC847XIJ000F] Epoxy resin 1.0+0.4 -0 10.0+0 -0.5 Product mass : approx. 0.9g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A03202EN 2 PC847XJ0000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A03202EN 3 PC847XJ0000F Series Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation *2 Isolation voltage Viso (rms) Topr Operating temperature Tstg Storage temperature *3 Soldering temperature Tsol Rating 50 1 6 70 80 6 50 150 200 5.0 -30 to +100 -55 to +125 260 (Ta=25C) Unit mA A V mW V V mA mW mW kV C C C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Forward voltage Peak forward voltage Reverse current Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Cutt-off frequency Rise time Response time Fall time Symbol VF VFM IR Ct ICEO BVCEO BVECO IC VCE (sat) RISO Cf fC tr tf Conditions IF=20mA IFM=0.5A VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100, -3dB VCE=2V, IC=2mA, RL=100 MIN. - - - - - 80 6 2.5 - 5x1010 - - - - TYP. 1.2 - - 30 - - - - 0.1 1x1011 0.6 80 4 3 MAX. 1.4 3.0 10 250 100 - - 30.0 0.2 - 1.0 - 18 18 (Ta=25C) Unit V V A pF nA V V mA V pF kHz s s Sheet No.: D2-A03202EN 4 PC847XJ0000F Series Model Line-up Lead Form Package Model No. Through-Hole SMT Gullwing Sleeve 25pcs/sleeve PC847XJ0000F PC847XIJ000F PC847X5J000F PC847XI5J00F PC847X6J000F PC847XI6J00F PC847X7J000F PC847XI7J00F PC847X8J000F PC847XI8J00F PC847X9J000F PC847XI9J00F PC847X0J000F PC847XI0J00F IC [mA] (IF=5mA, VCE=5V, Ta=25C) 2.5 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.0 to 30.0 4.0 to 30.0 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A03202EN 5 PC847XJ0000F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -30 0 25 50 55 75 100 80 70 60 40 20 0 -30 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature 25 50 55 75 100 125 Fig.4 Total Power Dissipation vs. Ambient Temperature 250 Total Power dissipation Ptot (mW) 250 Collector power dissipation PC (mW) 0 Ambient temperature Ta (C) Ambient temperature Ta (C) 200 150 100 50 0 -30 0 25 50 75 100 200 150 100 50 0 -30 125 0 25 50 75 100 125 Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Current Transfer Ratio vs. Forward Current 10 000 800 Pulse width100s Ta=25C VCE=5V Ta=25C Current transfer ratio CTR (%) Peak forward current IFM (mA) 700 1 000 100 10 600 500 400 300 200 100 10-3 10-2 10-1 0 0.1 1 Duty ratio 1 10 Forward current IF (mA) Sheet No.: D2-A03202EN 6 PC847XJ0000F Series Fig.7 Forward Current vs. Forward Voltage Fig.8 Collector Current vs. Collector-emitter Voltage 30 Ta=75C IF=30mA 25 25C 0C Collector current IC (mA) Forward current IF (mA) 50C 100 -25C 10 Ta=25C 20mA PC (MAX.) 20 15 10mA 10 5mA 5 1 0 0 0.5 1 1.5 2 2.5 3 0 3.5 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 5 6 7 0.14 IF=1mA,VCE=5V IF=5mA,VCE=5V 100 50 -20 0 20 40 8 9 60 80 IF=20mA IC=1mA 0.12 0.1 0.08 0.06 0.04 0.02 0 -40 100 Ambient temperature Ta (C) -20 0 20 40 60 80 100 Ambient temperature Ta (C) Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Collector-emitter Saturation Voltage vs. Forward Current 10-5 6 Collector-emitter saturation voltage VCE (sat) (V) VCE=50V 10-6 Collector dark current ICEO (A) 4 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 10-7 10-8 10-9 10-10 10-11 -30 3 Collector-emitter voltage VCE (V) Forward voltage VF (V) 0 -40 2 1 Ta=25C 5 IC=0.5mA 1mA 4 3mA 5mA 3 7mA 2 1 0 0 20 40 60 80 Ambient temperature Ta (C) 0 100 5 10 15 Forward current IF (mA) Sheet No.: D2-A03202EN 7 PC847XJ0000F Series Fig.13 Response Time vs. Load Resistance 100 Fig.14 Test Circuit for Response Time VCE=2V IC=2mA Ta=25C Output Response time (s) tr Input RD RL 10% Output tf 90% VCE 10 ts td tr tf td ts 1 0.1 0.01 Please refer to the conditions in Fig.13. 0.1 1 10 Load resistance RL (k) Fig.15 Frequency Response Fig.16 Test Circuit for Frequency Response VCC VCE=5V IC=2mA Ta=25C 0 Voltage gain Av (dB) Input VCC RD RL Output 100 1k -10 Please refer to the conditions in Fig.15. RL=10k -20 1 10 100 Frequency f (kHz) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A03202EN 8 PC847XJ0000F Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 1.7 2.54 2.54 2.54 2.54 2.54 2.54 2.54 8.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A03202EN 9 PC847XJ0000F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A03202EN 10 PC847XJ0000F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A03202EN 11 PC847XJ0000F Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A03202EN 12 PC847XJ0000F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E189] Sheet No.: D2-A03202EN 13